MICROSEMI MSAGX60F60A

2830 S. Fairview St.
Santa Ana, CA 92704
PH: (714) 979-8220
FAX: (714) 966-5256
MSAGX60F60A
MSAHX60F60A
Features
•
•
•
•
•
•
•
•
600 Volts
60 Amps
2.9 Volts vce(sat)
Rugged polysilicon gate cell structure
high current handling capability, latch-proof
Hermetically sealed, surface mount power package
Low package inductance
Very low thermal resistance
Reverse polarity available upon request: MSAH(G)60F60B
high frequency IGBT, low switching losses
anti-parallel FREDiode (MSAHX60F60A only)
N-CHANNEL
INSULATED GATE
BIPOLAR TRANSISTOR
Maximum Ratings @ 25°°C (unless otherwise specified)
DESCRIPTION
Collector-to-Emitter Breakdown Voltage (Gate Shorted to Emitter)
@ TJ ≥ 25°C
Collector-to-Gate Breakdown Voltage @ TJ ≥ 25°C, RGS= 1 MΩ
Continuous Gate-to-Emitter Voltage
Transient Gate-to-Emitter Voltage
Continuous Collector Current
Tj= 25°C
Tj=
90°C
Peak Collector Current, pulse width limited by Tjmax,
Safe Operating Area (RBSOA) @ VGE= 15V, L= 100µH (clamped inductive
SYMBOL
MAX.
UNIT
BVCES
600
Volts
BVCGR
VGES
VGEM
IC25
IC90
600
+/-20
+/-30
60
32
Volts
Volts
Volts
Amps
ICM
Imax
120
64
Amps
Amps
PD
Tj
Tstg
IS
ISM
θJC
300
-55 to +150
-55 to +150
32
100
0.4
Watts
°C
°C
Amps
Amps
°C/W
load), RG= 4.7Ω, Tj= 125°C, VCE= 0.8 x VCES
Power Dissipation
Junction Temperature Range
Storage Temperature Range
Continuous Source Current (Body Diode, MSAHX60F60A only)
Pulse Source Current (Body Diode, MSAHX60F60A only)
Thermal Resistance, Junction to Case
Mechanical Outline
COLLECTOR
EMITTER
(MS…A)
GATE (MS…B)
.A)
EMITTER (MS…B)
Datasheet# MSC0298A
MSAGX60F60A
MSAHX60F60A
Electrical Parameters @ 25°°C (unless otherwise specified)
DESCRIPTION
Collector-to-Emitter Breakdown Voltage
(Gate Shorted to Emitter)
Gate Threshold Voltage
Gate-to-Emitter Leakage Current
SYMBOL
CONDITIONS
BVCES
VGS = 0 V, I C = 250 µA
VGE(th)
VCE = VGE, IC = 250 µA
VGE = ± 20VDC, VCE = 0
IGES
Collector-to-Emitter Leakage Current (Zero Gate
Voltage Collector Current)
Collector-to-Emitter Saturation Voltage (1)
ICES
VCE(sat)
Forward Transconductance (1)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
INDUCTIVE LOAD, Tj= 25°°C
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Off Energy
INDUCTIVE LOAD, Tj= 125°°C
Turn-on Delay Time
Rise Time
On Energy
Turn-off Delay Time
Fall Time
Off Energy
Total Gate Charge
Gate-to-Emitter Charge
Gate-to-Collector (Miller) Charge
Antiparallel diode forward voltage (MSAHX60F60A
only)
Antiparallel diode reverse recovery time
(MSAHX60F60A only)
Antiparallel diode reverse recovery charge
(MSAHX60F60A only)
Antiparallel diode peak recovery current
(MSAHX60F60A only)
gfs
VCE =0.8•BVCES
VGE = 0 V
VGE= 15V, I C= 30A
I C= 60A
I C= 30A
VCE ≥ 10 V; I C = 30 A
TYP.
MAX
600
15
UNIT
V
2.5
T J = 25°C
T J = 125°C
TJ = 25°C
T J = 125°C
T J = 25°C
T J = 25°C
T J = 125°C
2.2
3.5
2.2
20
5.0
±100
±200
200
1000
2.9
V
nA
µA
V
S
Cies
Coes
Cres
VGE = 0 V, V CE = 25 V, f = 1 MHz
2500
230
70
pF
td(on)
tri
td(off)
tfi
Eoff
VGE = 15 V, V CE = 480 V,
IC = 30 A, R G = 4.7 Ω,
L= 100 µH note 2, 3
25
30
175
125
1.3
ns
ns
ns
ns
mJ
td(on)
tri
Eon
td(off)
tfi
Eoff
Qg
Qge
Qgc
VF
VGE = 15 V, V CE = 480 V,
IC = 30 A, R G = 4.7 Ω,
L= 100 µH note 2, 3
trr
Qrr
IRM
VGE = 15 V, V CE = 300V, I C = 30A
IE= 15 A
IE= 15 A
IE= 30 A
IE= 50 A
IE= 10 A,
IE= 30 A,
IE= 10 A,
IE= 30 A,
IE= 10 A,
IE= 30 A,
T J = 25 °C
T J = 150 °C
T J = 25 °C
T J = 25 °C
dIE/dt= 100 A/us, T J= 25°C
dIE/dt= 100 A/us, T J= 25°C
dIE/dt= 100 A/us, T J= 25°C
dIE/dt= 100 A/us, T J= 25°C
dIE/dt= 100 A/us, T J= 25°C
dIE/dt= 100 A/us, T J= 25°C
Notes
(1)
(2)
(3)
(4)
MIN
Pulse test, t ≤ 300 µ s, duty cycle δ ≤ 2%
switching times and losses may increase for larger V CE and/or R G values or higher junction temperatures.
switching losses include “tail” losses
Microsemi Corp. does not manufacture the igbt die; contact company for details.
25
35
1
250
260
4
125
23
50
175
150
35
75
1.5
1.3
1.7
1.9
100
140
160
320
3
4.2
ns
ns
mJ
ns
ns
mJ
nC
V
V
V
V
ns
ns
nC
nC
A
A