AP15P10GH/J
Pb Free Plating Product
Advanced Power
Electronics Corp.
P-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ Lower On-resistance
D
▼ Simple Drive Requirement
▼ Fast Switching Characteristic
-100V
RDS(ON)
210mΩ
ID
G
▼ RoHS Compliant
BVDSS
-16A
S
Description
G
The TO-252 package is universally preferred for all commercialindustrial surface mount applications and suited for low voltage
applications such as high efficiency switching DC/DC converters and
DC motor control. The through-hole version (AP15P10GJ) is available
for low-profile applications.
G
D
D S
S
TO-252(H)
TO-251(J)
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
-100
V
VGS
Gate-Source Voltage
±20
V
ID@TC=25℃
Continuous Drain Current, VGS @ 10V
-16
A
ID@TC=100℃
Continuous Drain Current, VGS @ 10V
-9.8
A
1
IDM
Pulsed Drain Current
64
A
PD@TC=25℃
Total Power Dissipation
96
W
Linear Derating Factor
0.77
W/℃
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
Value
Units
Rthj-c
Thermal Resistance Junction-case
Max.
1.3
℃/W
Rthj-a
Thermal Resistance Junction-ambient
Max.
110
℃/W
Data and specifications subject to change without notice
200810051-1/4
AP15P10GH/J
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ.
-100
-
-
V
-
-0.1
-
V/℃
VGS=-10V, ID=-9A
-
-
210
mΩ
BVDSS
Drain-Source Breakdown Voltage
ΔBVDSS/ΔTj
Breakdown Voltage Temperature Coefficient Reference to 25℃, ID=-1mA
VGS=0V, ID=-1mA
2
Max. Units
RDS(ON)
Static Drain-Source On-Resistance
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=-250uA
-1
-
-3
V
gfs
Forward Transconductance
VDS=-10V, ID=-9A
-
8
-
S
IDSS
Drain-Source Leakage Current (Tj=25oC)
VDS=-100V, VGS=0V
-
-
-25
uA
Drain-Source Leakage Current (Tj=150oC)
VDS=-80V, VGS=0V
-
-
-100
uA
Gate-Source Leakage
VGS= ±20V
-
-
±100
nA
ID=-9A
-
37
60
nC
IGSS
2
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDS=-80V
-
5
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=-10V
-
15
-
nC
VDS=-50V
-
11
-
ns
2
td(on)
Turn-on Delay Time
tr
Rise Time
ID=-9A
-
25
-
ns
td(off)
Turn-off Delay Time
RG=10Ω,VGS=-10V
-
56
-
ns
tf
Fall Time
RD=5.6Ω
-
36
-
ns
Ciss
Input Capacitance
VGS=0V
-
1180 1900
pF
Coss
Output Capacitance
VDS=-25V
-
250
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
75
-
pF
Rg
Gate Resistance
f=1.0MHz
-
3.6
5
Ω
Min.
Typ.
IS=-9A, VGS=0V
-
-
-1.3
V
IS=-9A, VGS=0V,
-
95
-
ns
dI/dt=-100A/µs
-
410
-
nC
Source-Drain Diode
Symbol
VSD
Parameter
2
Forward On Voltage
2
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Test Conditions
Max. Units
Notes:
1.Pulse width limited by safe operating area.
2.Pulse width <300us , duty cycle <2%.
2/4
AP15P10GH/J
30
30
-10V
-10V
TC=150oC
T C =25 o C
-7.0V
-ID , Drain Current (A)
-ID , Drain Current (A)
-7.0V
20
-5.0V
10
-4.5V
20
-5.0V
10
-4.5V
V G = - 3 .0V
V G = - 3 .0V
0
0
0
5
10
15
20
25
0
Fig 1. Typical Output Characteristics
10
15
20
25
Fig 2. Typical Output Characteristics
550
2.4
I D = -9 A
T C =25 ℃
I D = -9 A
V G = - 10V
1.9
Normalized RDS(ON)
450
RDS(ON) (mΩ )
5
-V DS , Drain-to-Source Voltage (V)
-V DS , Drain-to-Source Voltage (V)
350
1.4
0.9
250
0.4
150
2
4
6
8
-50
10
0
50
100
150
T j , Junction Temperature ( o C)
-V GS , Gate-to-Source Voltage (V)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
1.5
10
T j =150 o C
6
Normalized -VGS(th) (V)
-IS(A)
8
T j =25 o C
4
2
1.1
0.7
0.3
0
0
0.4
0.8
-V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.2
-50
0
50
100
150
T j , Junction Temperature ( o C)
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3/4
AP15P10GH/J
f=1.0MHz
12
10000
I D = -9A
V DS = -80V
8
C iss
1000
C (pF)
-VGS , Gate to Source Voltage (V)
10
6
C oss
100
4
C rss
2
10
0
0
10
20
30
1
40
5
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
13
17
21
25
29
Fig 8. Typical Capacitance Characteristics
100
1
Normalized Thermal Response (Rthjc)
-ID (A)
9
-V DS , Drain-to-Source Voltage (V)
10ms
10
100ms
o
T C =25 C
Single Pulse
1s
DC
Duty factor=0.5
0.2
0.1
0.1
0.05
PDM
t
0.02
T
0.01
Duty factor = t/T
Peak Tj = PDM x Rthjc + T C
Single Pulse
0.01
1
0.1
1
10
100
1000
0.00001
0.0001
-V DS , Drain-to-Source Voltage (V)
0.001
0.01
0.1
1
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
10
VG
V DS =-5V
T j =25 o C
-ID , Drain Current (A)
8
T j =150 o C
QG
-10V
6
QGS
QGD
4
2
Charge
Q
0
0
2
4
6
8
-V GS , Gate-to-Source Voltage (V)
Fig 11. Transfer Characteristics
Fig 12. Gate Charge Waveform
4/4