AVAGO AMMC-5620

AMMC-5620
6 - 20 GHz High Gain Amplifier
Data Sheet
Chip Size: 1410 x 1010 µm (55.5 x 39.7 mils)
Chip Size Tolerance: ± 10 µm (± 0.4 mils)
Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils)
Pad Dimensions: 80 x 80 µm (3.1 x 3.1 mils or larger)
Description
Features
Avago Technologies’ AMMC-5620 MMIC is a GaAs wideband amplifier designed for medium output power and
high gain over the 6 - 20 GHz frequency range. The 3
cascaded stages provide high gain while the single bias
supply offers ease of use. It is fabricated using a PHEMT
integrated circuit process. The RF input and output ports
have matching circuitry for use in 50-Ω environments.
The backside of the chip is both RF and DC ground. This
helps simplify the assembly process and reduces assembly
related performance variations and costs. For improved
reliability and moisture protection, the die is passivated
at the active areas. The MMIC is a cost effective alternative
to hybrid (discrete FET) amplifiers that require complex
tuning and assembly processes.
• Frequency Range: 6 - 20 GHz
• High Gain: 19 dB Typical
• Output Power: 15dBm Typical
• Input and Output Return Loss: < -10 dB
• Positive Gain Slope: + 0.21dB/GHz Typical
• Single Supply Bias: 5 V @ 95 mA Typical
Applications
• General purpose, wide-band amplifier in communication systems or microwave instrumentation
• High gain amplifier
AMMC-5620 Absolute Maximum Ratings[1]
Symbol
Parameters/Conditions
Units
Min.
Max.
VDD
Drain Supply Voltage
V
7.5
IDD
Total Drain Current
mA
135
PDC
DC Power Dissipation
W
1.0
Pin
RF CW Input Power
dBm
20
Tch
Channel Temp.
°C
+150
Tb
Operating Backside Temp.
°C
- 55
Tstg
Storage Temp.
°C
- 65
Tmax
Maximum Assembly Temp.
(60 sec max)
°C
+165
+300
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to this device.
Note: These devices are ESD sensitive. The following precautions are strongly recommended.
Ensure that an ESD approved carrier is used when dice are transported from one destination to
another. Personal grounding is to be worn at all times when handling these devices
AMMC-5620 DC Specifications/Physical Properties [1]
Symbol
Parameters and Test Conditions
Units
Min.
Typical
VDD
Recommended Drain Supply Current
V
IDD
Total Drain Supply Current ( VDD = 5V)
mA
IDD
Total Drain Supply Current ( VDD = 7V)
mA
105
qch-b
Thermal Resistance [3]
(Backside temperature (Tb) = 25 °C
°C/W
33
Max.
5
70
95
130
Notes:
1. Backside temperature Tb = 25°C unless otherwise noted
2. Channel-to-backside Thermal Resistance (qch-b) = 47°C/W at Tchannel (Tc) = 150°C as measured using infrared microscopy. Thermal Resistance
at backside temperature (Tb) = 25°C calculated from measured data.
AMMC-5620 RF Specifications [3]
Tb = 25°C, VDD=5V, IDD=95 mA, Zo=50 Ω
Symbol
Parameters and Test Conditions
Units
Min.
Typical
Max.
S21 2
Small-signal Gain
dB
16
19
22
Gain Slope
Positive Small-signal Gain Slope
dB/GHz
RLin
Input Return Loss
dB
10
13
RLout
Output Return Loss
dB
10
14
S12 2
Reverse Isolation
dB
P-1dB
Output Power at 1 dB Gain Compression @ 20 GHz
dBm
12.5
15
Psat
Saturated Output Power (3dB Gain Compression) @ 20 GHz
dBm
14.5
17
OIP3
Output 3rd Order Intercept Point @ 20 GHz
dBm
23.5
NF
Noise Figure @ 20 GHz
dB
4.2
Notes:
3. 100% on-wafer RF test is done at frequency = 6, 13 and 20 GHz, except as noted.
+0.21
- 55
5.0
AMMC-5620 Typical Performances (Tchuck=25°C, VDD=5V, IDD = 95 mA,
0
25
-10
15
10
-10
-20
INPUT RL (dB)
ISOLATION (dB)
20
GAIN (dB)
0
-30
-40
-50
5
0
-30
-60
4
7
10
13
16
19
-70
22
4
7
FREQUENCY (GHz)
10
13
16
19
-40
22
4
7
FREQUENCY (GHz)
Figure 1. Gain
19
22
19
22
15
P1dB (dBm)
NF (dB)
16
18
8
-20
13
Figure 3. Input Return Loss
10
-10
10
FREQUENCY (GHz)
Figure 2. Isolation
0
OUTPUT RL (dB)
-20
6
4
12
9
6
-30
-40
2
4
7
10
13
16
19
0
22
3
4
7
FREQUENCY (GHz)
10
13
16
19
0
22
4
7
FREQUENCY (GHz)
Figure 4.Output Return Loss
10
13
16
FREQUENCY (GHz)
Figure 5. Noise Figure
Figure 6. Output Power at 1dB Gain Compression
AMMC-5620 Typical Performances vs. Supply Voltage (Tb = 25°C, Zo=50W)
25
10
Vdd=4V
Vdd=5V
Vdd=6V
4
7
10
13
16
FREQUENCY (GHz)
Figure 7. Gain and Voltage
19
-10
INPUT RL (dB)
15
-40
-60
5
Vdd=4V
Vdd=5V
Vdd=6V
-20
ISOLATION (dB)
GAIN (dB)
20
0
0
0
22
-80
-20
-30
Vdd=4V
Vdd=5V
Vdd=6V
-40
4
7
10
13
16
FREQUENCY (GHz)
Figure 8. Isolation and Voltage
19
22
-50
4
7
10
13
16
19
FREQUENCY (GHz)
Figure 9. Input Return Loss and Voltage
22
AMMC-5620 Typical Performances vs. Supply Voltage (cont.) (Tb = 25°C, Zo=50W)
20
0
16
P1dB (dBm)
OUTPUT RL (dB)
-10
-20
Vdd=4V
Vdd=5V
Vdd=6V
-30
-40
4
7
10
13
16
19
12
8
Vdd=4V
Vdd=5V
Vdd=6V
4
0
22
4
7
10
13
16
19
22
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 10. Output Return Loss and Voltage
Figure 11. Output Power and Voltage
AMMC-5620 Typical Performance vs. Temperature (VDD = 5V, Zo=50W)
24
0
20
-10
12
-40 C
25 C
85 C
8
-20
-30
-40
4
7
10
13
16
19
-70
22
-30
4
7
7
-5
6
-10
5
-15
4
-20
-25
7
10
13
16
16
19
-40
22
4
7
19
FREQUENCY (GHz)
Figure 15. Output Return Loss and Temperature
16
19
22
19
22
Figure 14. Input Return Loss and Temperature
15
12
3
0
13
18
9
-40 C
25 C
85 C
6
-40 C
25 C
85 C
1
22
10
FREQUENCY (GHz)
2
-40 C
25 C
85 C
4
13
P1dB (dB)
0
-30
10
Figure 13. Isolation and Temperature
NF (dB)
OUTPUT RL (dB)
-40 C
25 C
85 C
FREQUENCY (GHz)
Figure 12. Gain and Temperature
-20
-60
FREQUENCY (GHz)
-35
-10
-50
4
0
-40 C
25 C
85 C
INPUT RL (dB)
ISOLATION (dB)
GAIN (dB)
16
0
4
7
10
13
16
19
FREQUENCY (GHz)
Figure 16. Noise Figure and Temperature
3
22
0
4
7
10
13
16
FREQUENCY (GHz)
Figure 17. Output Power and Temperature
AMMC-5620 Typical Scattering Parameters [1] (Tb = 25°C, VDD =5 V, IDD = 107 mA)
S11
S21
S12
S22
Freq GHz
dB
Mag
Phase
dB
Mag
Phase
dB
Mag
Phase
dB
Mag
Phase
2.00
-2.9
0.72
-147
-23.3
0.07
-176
-50.0
0
46
-1.5
0.85
-72
2.50
-3.3
0.69
-168
-16.1
0.16
146
-46.1
0
-1
-2.5
0.75
-89
3.00
-3.5
0.67
173
-10.0
0.31
114
-44.0
0.01
-46
-3.6
0.66
-104
3.50
-3.7
0.65
154
-4.6
0.59
87
-42.9
0.01
-89
-4.5
0.6
-118
4.00
-3.8
0.64
134
0.8
1.1
62
-42.1
0.01
-132
-5.3
0.54
-136
4.50
-4.0
0.63
111
6.6
2.15
34
-41.5
0.01
-179
-6.7
0.46
-158
5.00
-5.0
0.56
81
12.0
3.96
-5
-42.1
0.01
128
-9.6
0.33
175
5.50
-7.7
0.41
49
15.2
5.73
-50
-44.7
0.01
72
-15.2
0.17
157
6.00
-12.0
0.25
23
16.7
6.84
-91
-49.0
0
19
-21.8
0.08
165
6.50
-16.9
0.14
5
17.0
7.06
-123
-53.7
0
-30
-24.8
0.06
-173
7.00
-21.9
0.08
-8
17.2
7.28
-150
-58.0
0
-78
-26.4
0.05
-164
7.50
-27.2
0.04
-18
17.4
7.41
-173
-60.6
0
-123
-30.0
0.03
-155
8.00
-32.8
0.02
-17
17.9
7.81
164
-61.9
0
-160
-34.5
0.02
-102
8.50
-33.4
0.02
-5
18.2
8.12
142
-64.4
0
-178
-28.3
0.04
-61
9.00
-30.9
0.03
-15
18.4
8.29
121
-64.4
0
-179
-23.8
0.06
-60
9.50
-27.7
0.04
-32
18.4
8.34
101
-63.1
0
-169
-21.2
0.09
-65
10.00
-24.9
0.06
-50
18.4
8.35
83
-63.5
0
157
-19.3
0.11
-72
10.50
-22.6
0.07
-66
18.5
8.37
65
-64.4
0
144
-18.1
0.12
-78
11.00
-20.7
0.09
-80
18.5
8.36
48
-64.4
0
145
-17.1
0.14
-84
11.50
-19.3
0.11
-92
18.5
8.37
32
-64.2
0
130
-16.3
0.15
-90
12.00
-18.2
0.12
-103
18.5
8.38
16
-62.1
0
127
-15.7
0.16
-95
12.50
-17.3
0.14
-113
18.5
8.4
1
-63.3
0
126
-15.1
0.18
-101
13.00
-16.6
0.15
-123
18.5
8.43
-14
-64.4
0
125
-14.7
0.18
-105
13.50
-16.0
0.16
-131
18.6
8.48
-29
-62.1
0
118
-14.4
0.19
-110
14.00
-15.6
0.17
-140
18.6
8.53
-44
-61.9
0
107
-14.2
0.2
-115
14.50
-15.3
0.17
-148
18.7
8.6
-58
-62.1
0
107
-14.0
0.2
-120
15.00
-15.1
0.18
-156
18.8
8.71
-73
-62.9
0
98
-13.7
0.21
-126
15.50
-15.0
0.18
-164
18.9
8.81
-87
-64.1
0
82
-13.6
0.21
-131
16.00
-14.9
0.18
-172
19.1
8.97
-101
-61.2
0
94
-13.4
0.21
-136
16.50
-14.9
0.18
179
19.2
9.11
-116
-60.0
0
95
-13.3
0.22
-140
17.00
-15.0
0.18
170
19.3
9.25
-131
-61.8
0
60
-13.3
0.22
-145
17.50
-15.0
0.18
160
19.5
9.43
-145
-62.1
0
80
-13.2
0.22
-150
18.00
-14.9
0.18
149
19.7
9.62
-161
-61.9
0
70
-13.2
0.22
-154
18.50
-14.7
0.18
137
19.9
9.84
-176
-62.7
0
67
-13.3
0.22
-159
19.00
-14.3
0.19
122
20.0
10
168
-61.9
0
70
-13.4
0.21
-166
19.50
-13.8
0.2
106
20.1
10.2
151
-61.9
0
61
-13.6
0.21
-171
20.00
-13.1
0.22
89
20.2
10.3
134
-60.0
0
45
-14.0
0.2
-177
20.50
-11.9
0.25
72
20.3
10.4
117
-60.9
0
41
-14.1
0.2
179
21.00
-10.5
0.3
53
20.3
10.3
99
-64.1
0
38
-14.6
0.19
173
21.50
-9.0
0.35
36
20.2
10.2
80
-67.5
0
13
-15.1
0.18
168
22.00
-7.5
0.42
19
19.9
9.88
60
-67.5
0
5
-15.5
0.17
162
Note:
Data obtained from on-wafer measurements.
Biasing and Operation
Assembly Techniques
The AMMC-5620 is normally biased with a single positive
drain supply connected to the VDD bond pads shown in
Figure 19. The recommended supply voltage is 5 V, which
results in IDD = 95 mA (typical).
The backside of the AMMC-5620 chip is RF ground. For
microstripline applications, the chip should be attached
directly to the ground plane (e.g., circuit carrier or heatsink) using electrically conductive epoxy[1].
No ground wires are required because all ground connections are made with plated through-holes to the
backside of the device.
For best performance, the topside of the MMIC should be
brought up to the same height as the circuit surrounding
it. This can be accomplished by mounting a gold plated
metal shim (same length and width as the MMIC) under
the chip, which is of the correct thickness to make the
chip and adjacent circuit coplanar.
Refer the Absolute Maximum Ratings table for allowed
DC and thermal conditions.
The amount of epoxy used for chip and or shim attachment should be just enough to provide a thin fillet
around the bottom perimeter of the chip or shim. The
ground plane should be free of any residue that may
jeopardize electrical or mechanical attachment.
The location of the RF bond pads is shown in Figure
20. Note that all the RF input and output ports are in a
Ground-Signal-Ground configuration.
RF connections should be kept as short as reasonable to
minimize performance degradation due to undesirable
series inductance. A single bond wire is sufficient for signal connections, however double-bonding with 0.7 mil
gold wire or the use of gold mesh[2] is recommended
for best performance, especially near the high end of the
frequency range.
Thermosonic wedge bonding is the preferred method
for wire attachment to the bond pads. Gold mesh can
be attached using a 2 mil round tracking tool and a tool
force of approximately 22 grams with an ultrasonic power of roughly 55 dB for a duration of 76 ± 8 mS. A guided
wedge at an ultrasonic power level of 64 dB can be used
for the 0.7 mil wire. The recommended wire bond stage
temperature is 150 ± 2 ° C.
Caution should be taken to not exceed the Absolute
Maximum Rating for assembly temperature and time.
The chip is 100 µm thick and should be handled with
care. This MMIC has exposed air bridges on the top
surface and should be handled by the edges or with a
custom collet (do not pick up die with vacuum on die
center.)
This MMIC is also static sensitive and ESD handling precautions should be taken.
Notes:
1. Ablebond 84-1 LM1 silver epoxy is recommended.
2. Buckbee-Mears Corporation, St. Paul, MN, 800-262-3824
VD1
Feedback
network
RF Output
Matching
Matching
RF Input
Matching
Matching
Figure 18. AMMC-5620 Schematic
To power supply
100 pF chip capacitor
Gold plated shim
RF Input
AMMC-5620
Figure 19. AMMC-5620 Assembly Diagram
Feedback
network
Feedback
network
RF Output
875 (VDD)
1010
910
350 (RFOut)
350 (RFIn)
0
0
90
1315
Figure 20. AMMC-5620 Bond Pad Locations.
(dimensions in microns)
Ordering Information:
AMMC-5620-W10 = 10 devices per tray
AMMC-5620-W50 = 50 devices per tray
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, AV02-0528EN in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0222EN
AV02-0528EN - June 19, 2007
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