AVAGO AMMC-6231

AMMC-6231
16–32 GHz Low Noise Amplifier
Data Sheet
Chip Size: 1900 x 800 µm (74.8 x 31.5 mils)
Chip Size Tolerance: ± 10 µm (± 0.4 mils)
Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils)
RF Pad Dimensions: 110 x 90 µm (4.33 x 3.54 mils)
DC Pad Dimensions: 100 x 100 µm (3.94 x 3.94 mils)
Description
Features
• Wide frequency range: 16 - 32 GHz
Avago Technologies AMMC-6231 is a high gain,
low-noise amplifier that operates from 16 GHz
to 32 GHz. This LNA provides a wide-band
solution for system design since it covers several
bands, thus, reduces part inventory. The device
has input / output match to 50 Ohm, is
unconditionally stable and can be used as either
primary or sub-sequential low noise gain stage.
By eliminating the complex tuning and assembly
processes typically required by hybrid (discreteFET) amplifiers, the AMMC-6231 is a costeffective alternative in the 16 - 32 GHz
communications receivers. The backside of the
chip is both RF and DC ground. This helps
simplify the assembly process and reduces
assembly related performance variations and
costs. It is fabricated in a PHEMT process to
provide exceptional noise and gain performance.
For improved reliability and moisture protection,
the die is passivated at the active areas.
• High gain: 22 dB
• Low 50 Ω Noise Figure: 2.6 dB
• 50 Ω Input and Output Match
• Flat Gain Response
• Single 3V Supply Bias
Applications
• Microwave Radio systems
• Satellite VSAT, DBS Up/Down Link
• LMDS & Pt-Pt mmW Long Haul
• Broadband Wireless Access (including 802.16 and
802.20 WiMax)
• WLL and MMDS loops
• Commercial Grade Military
AMMC-6231 Absolute Maximum Ratings[1]
Symbol
Parameters/Conditions
Units
Min.
Vd
Positive Drain Voltage
V
7
Vg
Gate Supply Voltage
V
NA
Id
Drain Current
mA
100
Pin
CW Input Power
dBm
15
Tch
Operating Channel Temp.
°C
+150
Tstg
Storage Case Temp.
°C
Tmax
Maximum Assembly
Temp (60 sec max)
°C
-65
Note:
1. Operation in excess of any one of these conditions may result in
permanent damage to this device.
Max.
+150
+300
Note: These devices are ESD
sensitive. The following precautions
are strongly recommended. Ensure
that an ESD approved carrier is used
when dice are transported from one
destination to another. Personal
grounding is to be worn at all times
when handling these devices.
For more details, refer to Avago Technologies
Application Note A004R:
Electrostatic Discharge Damage and Control.
ESD Machine Model (Class A)
ESD Human Body Model (Class 0)
AMMC-6231 DC Specifications/Physical Properties [1]
Symbol
Parameters and Test Conditions
Units Min. Typ.
Max.
Id
Drain Supply Current (under any RF power drive and temperature) (V d=3.0 V)
mA
60
80
°C/W
25
θch-b
[2]
Thermal Resistance (Backside temperature, Tb = 25°C)
AMMC-6231 RF Specifications [3, 4, 5]
TA= 25°C, Vd=3.0 V, Id(Q)=60 mA, Zin=Zo=50 Ω
Symbol
Parameters and Test Conditions
Units Minimum
Typical
Gain
Small-signal Gain[6]
dB
22
NF
Noise Figure into 50 Ω
dB
18-28 GHz = 2.5
28-32 GHz = 2.7
P-1dB
Output Power at 1dB Gain Compression
dBm
+8.5
OIP3
Third Order Intercept Point; ∆f=100MHz;
Pin=-35dBm
dBm
+19
RLin
Input Return Loss[6]
dB
RLout
Output Return Loss[6]
dB
20
Maximum
Sigma
0.4
18-28 GHz = 2.8
28-32 GHz = 2.9
0.1
-9
-8
0.3
-16
-12
0.5
Notes:
1. Ambient operational temperature TA=25°C unless otherwise noted.
2. Channel-to-backside Thermal Resistance (qch-b) = 26°C/W at Tchannel (T c) = 34°C as measured using infrared microscopy. Thermal Resistance at
backside temperature (Tb) = 25°C calculated from measured data.
3. Small/Large -signal data measured in wafer form TA = 25°C.
4. 100% on-wafer RF test is done at frequency =18, 26, and 31 GHz.
5. Specifications are derived from measurements in a 50 Ω test environment. Aspects of the amplifier performance may be improved over a more
narrow bandwidth by application of additional conjugate, linearity, or low noise (Gopt) matching.
6. As derived from measured s-parameters
USL
2.5
2.6
2.7
Noise Figure at 31 GHz
2.8
2.9
LSL
21
USL
21.2 21.4 21.6 21.8
Noise Figure at 26 GHz
22
22.2 22.4
-10
-9
-8
S11 at 31GHz
Typical distribution of Small Signal Gain, Noise Figure, and Return Loss. Based on 1500 part sampled over several
production lots.
2
AMMC-6231 Typical Performances
(TA = 25°C, Vd1 = Vd2 =3.0 V, Itotal = 60 mA, Zin = Zout = 50 Ω unless otherwise stated)
NOTE: These measurements are in a 50 Ω test environment. Aspects of the amplifier performance may be improved over
a narrower bandwidth by application of additional conjugate, linearity, or low noise (Gopt) matching
25
0
-5
15
10
S11 (dB)
-20
S12 (dB)
S21 (dB)
20
0
-40
-10
-15
-60
-20
5
-80
0
14
18
22
26
Frequency (GHz)
30
Figure 1. Typical Gain
-25
14
34
18
22
26
30
Frequency (GHz)
34
Figure 2. Typical Isolation
0
14
22
26
30
Frequency (GHz)
34
Figure 3 Typical Input Return Loss
21
3
18
OP-1dB & OIP3 (dBm)
-5
2.5
NF(dB)
-10
S22 (dB)
18
-15
2
-20
OP-1dB
OIP3
15
12
9
6
1.5
-25
3
-30
14
18
22
26
30
Frequency (GHz)
0
34
1
16
20
24
28
Frequency (GHz)
Figure 5. Typical Noise Figure into a 50 Ω load.
Figure 4. Typical Output Return Loss
30
16
32
20
24
28
Frequency (GHz)
32
Figure 6. Typical Output P -1dB and 3rd Order
Intercept Pt.
0
0
25C
-40C
+85C
25
-20
25C
-40C
+85C
-5
15
S11 (dB)
S12 (dB)
S21 (dB)
20
-40
-10
10
5
-15
-60
25C
-40C
+85C
0
16
20
24
28
Frequency (GHz)
Figure 7. Gain Over Temperature
3
32
-80
16
-20
20
24
28
Frequency (GHz)
Figure 8. Isolation Over Temperature
32
16
20
24
28
Frequency (GHz)
Figure 9. Typical Input Return Loss Over
Temperature
32
AMMC-6231 Typical Performances
(TA = 25°C, Vd1=Vd2 =3.0 V, Itotal = 60 mA, Zin = Zout = 50 Ω unless otherwise stated)
NOTE: These measurements are in a 50Ω test environment. Aspects of the amplifier performance may be improved over
a narrower bandwidth by application of additional conjugate, linearity, or low noise (Gopt) matching.
68
30
66
25
3V
4V
5V
-20
64
62
60
S12 (dB)
20
S21 (dB)
Total Idd (mA)
0
15
-40
10
58
-40C
25C
+85C
56
54
3
3.5
4
Vdd (V)
4.5
0
5
Figure 10: Total Idd Over Temperature
-60
3V
4V
5V
5
16
20
24
28
Frequency (GHz)
-80
16
32
Figure 11: Gain Over Vdd
3V
4V
5V
3
-5
2.5
S22 (dB)
NF(dB)
-10
S11 (dB)
32
3.5
3V
4V
5V
-5
-10
24
28
Frequency (GHz)
Figure 12: Isolation over Vdd
0
0
20
-15
2
1.5
-20
1
-15
-25
-20
16
20
24
28
Frequency (GHz)
32
Figure 13: Input Return Loss Over Vdd
OP1dB (dBm)
20
15
10
0
16
3V
4V
5V
20
24
28
Frequency (GHz)
Figure 16: Output IP3 Over Vdd
4
20
24
28
Frequency (GHz)
Figure 14: Output Return Loss Over Vdd
25
5
-30
16
32
3V
4V
5V
0.5
32
0
16
20
24
28
Frequency (GHz)
Figure 15: Noise Figure Over Vdd
32
AMMC-6231 Typical Scattering Parameters[1] (Tc=25°C, VD1=VD2= 3 V, Itotal = 60 mA Zin = Zout = 50 Ω)
Note: Data obtained from on-wafer measurements
S11
S21
S12
S22
Freq GHz
dB
Mag
Phase
dB
Mag
Phase
dB
Mag
Phase
dB
Mag
Phase
11.0
-1.224
0.869
169.751
-2.168
0.779
47.164
-68.269
0.000
-45.116
-4.672
0.584
-131.790
12.0
-1.520
0.839
149.847
7.264
2.308
-28.780
-64.182
0.001
178.210
-6.096
0.496
-143.113
13.0
-2.670
0.735
123.576
14.773
5.479
-106.707
-69.718
0.000
-1.991
-7.796
0.408
-153.930
14.0
-6.127
0.494
98.304
18.596
8.507
171.105
-68.541
0.000
179.486
-9.961
0.318
-161.328
15.0
-10.264
0.307
84.852
19.615
9.566
103.508
-64.621
0.001
148.061
-12.266
0.244
-166.179
16.0
-14.521
0.188
65.726
20.236
10.276
49.585
-65.844
0.001
125.856
-14.301
0.193
-165.809
16.5
-17.105
0.140
52.122
20.627
10.749
24.834
-66.450
0.000
39.923
-15.351
0.171
-164.958
17.0
-21.512
0.084
23.785
20.979
11.193
0.992
-63.247
0.001
162.790
-16.452
0.150
-161.912
17.5
-23.536
0.067
-18.771
21.237
11.531
-21.976
-66.021
0.001
0.751
-17.137
0.139
-156.931
18.0
-20.946
0.090
-71.637
21.524
11.918
-44.291
-63.950
0.001
112.065
-17.399
0.135
-154.425
18.5
-17.139
0.139
-99.620
21.779
12.273
-65.931
-58.189
0.001
76.722
-17.706
0.130
-152.650
19.0
-14.086
0.198
-121.971
21.917
12.470
-87.850
-62.310
0.001
53.429
-18.078
0.125
-149.878
19.5
-12.981
0.224
-138.557
21.941
12.504
-108.946
-63.387
0.001
-27.327
-18.219
0.123
-145.515
20.0
-12.151
0.247
-148.771
21.873
12.407
-128.605
-65.475
0.001
-71.930
-17.911
0.127
-143.752
20.5
-11.537
0.265
-158.049
21.776
12.269
-147.868
-63.841
0.001
19.483
-17.733
0.130
-142.200
21.0
-11.306
0.272
-168.343
21.632
12.067
-166.171
-67.516
0.000
21.783
-17.612
0.132
-143.646
21.5
-11.563
0.264
-174.869
21.433
11.793
177.010
-65.795
0.001
-9.861
-17.270
0.137
-144.727
22.0
-11.914
0.254
-178.065
21.430
11.789
160.276
-61.616
0.001
-168.107
-17.431
0.134
-148.407
22.5
-12.017
0.251
179.655
21.456
11.825
144.048
-59.172
0.001
-157.925
-18.073
0.125
-147.601
23.0
-11.999
0.251
177.242
21.377
11.718
127.893
-59.916
0.001
173.807
-18.298
0.122
-145.456
23.5
-12.322
0.242
175.484
21.348
11.679
112.058
-57.137
0.001
159.917
-18.148
0.124
-144.058
24.0
-12.532
0.236
173.191
21.248
11.546
96.990
-57.535
0.001
148.235
-18.008
0.126
-141.442
24.5
-12.530
0.236
171.601
21.258
11.558
82.291
-60.568
0.001
125.011
-17.361
0.136
-142.706
25.0
-12.744
0.231
172.328
21.257
11.557
67.060
-62.987
0.001
136.388
-17.249
0.137
-145.709
25.5
-12.883
0.227
171.212
21.218
11.506
52.687
-56.686
0.001
137.081
-17.278
0.137
-146.019
26.0
-12.891
0.227
171.982
21.251
11.550
38.166
-63.159
0.001
93.342
-16.853
0.144
-147.033
26.5
-12.850
0.228
172.072
21.236
11.529
23.556
-58.666
0.001
131.485
-16.682
0.147
-150.378
27.0
-13.013
0.224
171.665
21.201
11.483
9.169
-57.833
0.001
131.410
-16.552
0.149
-152.151
27.5
-12.893
0.227
172.970
21.190
11.468
-4.750
-59.860
0.001
117.672
-16.393
0.151
-155.696
28.0
-12.895
0.227
174.430
21.178
11.453
-18.352
-58.302
0.001
140.189
-16.364
0.152
-156.583
28.5
-12.636
0.233
178.289
21.259
11.560
-32.627
-56.608
0.001
111.274
-15.830
0.162
-160.401
29.0
-12.387
0.240
176.849
21.316
11.636
-46.562
-57.721
0.001
112.031
-16.138
0.156
-164.619
29.5
-12.143
0.247
177.181
21.331
11.656
-60.321
-52.001
0.003
120.164
-15.957
0.159
-166.799
30.0
-11.576
0.264
178.961
21.372
11.711
-74.237
-50.993
0.003
116.245
-15.438
0.169
-172.729
30.5
-11.248
0.274
179.288
21.403
11.753
-88.063
-52.041
0.003
81.089
-15.872
0.161
-179.133
31.0
-10.636
0.294
178.610
21.393
11.739
-102.278
-50.028
0.003
90.796
-16.260
0.154
175.844
32.0
-9.902
0.320
176.368
21.353
11.685
-130.188
-52.610
0.002
45.032
-17.652
0.131
170.562
33.0
-9.350
0.341
171.820
21.083
11.327
-158.564
-51.333
0.003
57.174
-18.373
0.121
167.809
34.0
-8.813
0.363
171.094
20.755
10.908
175.593
-54.399
0.002
65.576
-18.344
0.121
170.267
35.0
-8.125
0.392
172.451
20.532
10.632
149.898
-55.336
0.002
20.730
-18.098
0.124
168.084
36.0
-6.991
0.447
171.322
20.410
10.484
124.130
-63.736
0.001
34.727
-17.898
0.127
158.553
37.0
-5.494
0.531
167.843
20.277
10.324
97.564
-58.775
0.001
-10.016
-17.799
0.129
151.639
38.0
-4.281
0.611
160.315
19.935
9.925
69.896
-49.909
0.003
43.736
-18.436
0.120
147.104
39.0
-3.260
0.687
152.777
19.443
9.379
42.889
-50.435
0.003
30.726
-18.590
0.118
144.621
40.0
-2.305
0.767
144.157
18.863
8.773
15.719
-47.535
0.004
-7.216
-17.849
0.128
136.198
41.0
-1.513
0.840
134.565
18.019
7.960
-11.114
-47.208
0.004
-6.051
-17.478
0.134
122.522
42.0
-0.772
0.915
123.324
17.035
7.108
-38.077
-48.230
0.004
-16.155
-18.008
0.126
115.316
43.0
-0.343
0.961
112.897
15.871
6.216
-63.626
-48.224
0.004
-64.239
-18.233
0.123
103.928
44.0
-0.275
0.969
100.290
14.549
5.339
-88.002
-51.952
0.003
-98.825
-18.451
0.120
93.181
45.0
-0.349
0.961
89.671
13.180
4.560
-111.566
-47.621
0.004
-132.254
-18.869
0.114
83.605
5
AMMC-6231 Typical Scattering Parameters[1] (Tc=25°C, VD1=VD2= 5 V, Itotal = 65 mA ,Zin = Zout = 50 Ω)
Note: Data obtained from on-wafer measurements
S11
S21
S12
S22
Freq GHz
dB
Mag
Phase
dB
Mag
Phase
dB
Mag
Phase
dB
Mag
Phase
11.0
-1.274
0.864
170.496
-4.446
0.599
46.906
-62.427
0.001
-156.271
-4.570
0.591
-136.719
12.0
-1.686
0.824
150.794
5.539
1.892
-27.167
-70.070
0.000
146.571
-6.069
0.497
-150.437
13.0
-2.969
0.710
124.827
13.758
4.874
-105.528
-73.152
0.000
-24.365
-7.930
0.401
-164.641
14.0
-6.818
0.456
99.979
18.140
8.073
167.923
-68.541
0.000
-112.644
-10.618
0.295
-177.769
15.0
-11.381
0.270
88.861
19.224
9.146
96.994
-63.748
0.001
177.801
-13.733
0.206
171.930
16.0
-16.706
0.146
71.089
19.888
9.872
40.549
-64.261
0.001
-105.733
-17.456
0.134
165.294
16.5
-21.130
0.088
54.844
20.214
10.249
14.975
-66.021
0.001
-177.622
-19.798
0.102
164.208
17.0
-28.509
0.038
10.753
20.589
10.702
-10.127
-75.948
0.000
-69.734
-22.575
0.074
163.370
17.5
-24.565
0.059
-80.986
20.863
11.044
-34.405
-62.673
0.001
87.684
-25.784
0.051
169.587
18.0
-19.254
0.109
-106.949
21.114
11.369
-58.160
-63.899
0.001
99.296
-29.307
0.034
-174.356
18.5
-15.649
0.165
-121.039
21.269
11.573
-80.967
-66.548
0.000
-57.445
-31.860
0.026
-153.056
19.0
-13.321
0.216
-133.732
21.308
11.625
-103.642
-64.119
0.001
65.134
-31.679
0.026
-116.209
19.5
-11.950
0.253
-145.615
21.266
11.570
-125.723
-62.304
0.001
25.072
-29.276
0.034
-95.762
20.0
-11.351
0.271
-156.055
21.076
11.319
-146.826
-62.298
0.001
105.846
-26.317
0.048
-84.659
20.5
-10.896
0.285
-164.209
20.839
11.014
-166.524
-59.782
0.001
99.542
-24.464
0.060
-85.624
21.0
-10.743
0.290
-171.309
20.536
10.636
174.575
-58.005
0.001
29.812
-23.189
0.069
-86.727
21.5
-10.995
0.282
-176.013
20.292
10.342
156.985
-69.607
0.000
-57.692
-23.002
0.071
-89.283
22.0
-11.414
0.269
-177.861
20.125
10.145
140.534
-58.866
0.001
-72.244
-23.362
0.068
-91.514
22.5
-11.291
0.273
-179.031
19.998
9.998
124.072
-60.086
0.001
-161.093
-23.220
0.069
-82.171
23.0
-11.171
0.276
178.842
19.869
9.851
106.958
-63.378
0.001
-147.709
-21.875
0.081
-75.780
23.5
-11.240
0.274
177.701
19.674
9.632
90.996
-57.019
0.001
-168.211
-20.509
0.094
-75.352
24.0
-11.442
0.268
175.886
19.483
9.423
75.675
-57.313
0.001
142.759
-19.265
0.109
-77.135
24.5
-11.413
0.269
174.866
19.354
9.283
60.442
-57.907
0.001
160.988
-18.723
0.116
-82.146
25.0
-11.331
0.271
174.630
19.221
9.142
45.490
-65.563
0.001
148.737
-18.542
0.118
-83.347
25.5
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0.270
173.890
19.095
9.011
30.836
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0.001
148.202
-17.909
0.127
-84.462
26.0
-11.248
0.274
173.447
19.023
8.936
16.186
-64.895
0.001
147.000
-17.342
0.136
-87.417
26.5
-11.148
0.277
172.027
18.884
8.794
1.694
-60.673
0.001
116.872
-17.060
0.140
-90.365
27.0
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0.279
172.311
18.776
8.686
-12.139
-59.647
0.001
127.765
-16.797
0.145
-92.536
27.5
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0.281
171.687
18.637
8.548
-26.291
-62.419
0.001
173.035
-16.657
0.147
-93.932
28.0
-10.934
0.284
170.556
18.538
8.451
-40.108
-58.100
0.001
154.113
-16.245
0.154
-95.894
28.5
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0.293
171.414
18.422
8.339
-53.711
-64.651
0.001
89.451
-16.140
0.156
-98.652
29.0
-10.658
0.293
169.830
18.308
8.230
-67.235
-58.638
0.001
118.727
-16.071
0.157
-98.432
29.5
-10.470
0.300
170.126
18.206
8.134
-80.621
-56.694
0.001
155.781
-15.706
0.164
-100.324
30.0
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0.303
170.606
18.106
8.041
-93.727
-58.675
0.001
136.937
-15.384
0.170
-103.635
30.5
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0.314
170.547
17.957
7.904
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-54.652
0.002
106.666
-15.240
0.173
-104.558
31.0
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0.323
169.344
17.835
7.794
-119.437
-57.676
0.001
119.455
-15.011
0.178
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32.0
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0.341
166.637
17.654
7.633
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0.002
95.531
-14.522
0.188
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33.0
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0.357
164.399
17.262
7.296
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-53.735
0.002
32.768
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0.204
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34.0
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0.366
163.933
16.940
7.031
166.626
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0.000
164.557
-12.655
0.233
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35.0
36.0
37.0
38.0
39.0
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0.381
0.416
0.479
0.551
0.624
164.222
166.305
164.858
161.864
158.245
16.819
16.920
17.196
17.375
17.715
6.934
7.015
7.241
7.392
7.687
144.945
122.970
99.591
75.612
50.891
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0.001
0.001
0.002
0.002
0.003
153.048
129.804
128.707
120.920
77.587
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0.241
0.243
0.255
0.269
0.286
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40.0
41.0
42.0
43.0
44.0
45.0
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0.732
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0.917
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121.916
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91.299
18.141
18.403
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8.321
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6.400
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155.893
6
Biasing and Operation
The AMMC-6231 is normally biased with a positive
supply connected to both VD1 and VD2 bond pads
through the 100pF bypass capacitor as shown in
Figure 21. The recommended supply voltage is 3
V. It is important to place the bypass capacitor as
close to the die as possible. No negative gate bias
voltage is needed for the AMMC-6231. Input and
output matching are achieved on-die, therefore no
other external component is required besides one
100pF bypass capacitor for the main supply. The
input and output are DC-blocked with internal
coupling capacitors.
No ground wires are needed because all ground
connections are made with plated through-holes
to the backside of the device.
Refer the Absolute Maximum Ratings table for
allowed DC and thermal conditions.
Assembly Techniques
The backside of the MMIC chip is RF ground. For
microstrip applications the chip should be attached
directly to the ground plane (e.g. circuit carrier or
heatsink) using electrically conductive epoxy [1]
For best performance, the topside of the MMIC
should be brought up to the same height as the
circuit surrounding it. This can be accomplished
by mounting a gold plate metal shim (same length
and width as the MMIC) under the chip which is
of correct thickness to make the chip and adjacent
circuit the same height. The amount of epoxy
used for the chip and/or shim attachment should
be just enough to provide a thin fillet around the
bottom perimeter of the chip or shim. The ground
plan should be free of any residue that may
jeopardize electrical or mechanical attachment.
VD1
The location of the RF bond pads is shown in
Figure 12. Note that all the RF input and output
ports are in a Ground-Signal-Ground configuration.
RF connections should be kept as short as
reasonable to minimize performance degradation
due to undesirable series inductance. A single
bond wire is normally sufficient for signal
connections, however double bonding with 0.7 mil
gold wire or use of gold mesh [2] is recommended
for best performance, especially near the high end
of the frequency band.
Thermosonic wedge bonding is preferred method
for wire attachment to the bond pads. Gold mesh
can be attached using a 2 mil round tracking tool
and a tool force of approximately 22 grams and a
ultrasonic power of roughly 55 dB for a duration
of 76 +/- 8 mS. The guided wedge at an untrasonic
power level of 64 dB can be used for 0.7 mil
wire. The recommended wire bond stage
temperature is 150 +/- 2C.
Caution should be taken to not exceed the Absolute
Maximum Rating for assembly temperature and
time.
The chip is 100um thick and should be handled
with care. This MMIC has exposed air bridges on
the top surface and should be handled by the
edges or with a custom collet (do not pick up the
die with a vacuum on die center).
This MMIC is also static sensitive and ESD
precautions should be taken
Notes:
[1] Ablebond 84-1 LM1 silver epoxy is recommended.
[2] Buckbee-Mears Corporation, St. Paul, MN, 800-262-3824
VD2
RFout
RFin
Figure 17. AMMC-6231 Simplified Schematic
7
VD1
760
800
VD2
1070
1410
700
400
400
RFin
0
RFout
0
90
1810
Figure 18. AMMC-6231 Bonding pad locations
To VDD DC supply
100 pF Capacitor
V D1
RF INPUT
VD2
AMMC-6231
RF OUTPUT
Gold Plated Shim (Optional)
Figure 19. AMMC-6231 Assembly diagram
Ordering Information:
AMMC-6231-W10 = 10 devices per tray
AMMC-6231-W50 = 50 devices per tray
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. Obsoletes 5989-3234EN
5989-3942EN - April 12, 2006
1900