AVAGO AMMP-6220

AMMP-6220
6-20 GHz Low Noise Amplifier
Data Sheet
Description
Features
Avago’s AMMP-6220 is a high gain, low-noise amplifier that operates from 6 GHz to 20 GHz. The LNA is
designed to be a easy-to-use component for any surface
mount PCB application. The broad and unconditionally stable performance makes this LNA ideal for primary, sub-sequential or driver low noise gain stages.
Intended applications include microwave radios,
802.16, automotive radar, VSAT, and satellite receivers.
Since one part can cover several bands, the AMMP-6220
can reduce part inventory and increase volume purchase
options. The LNA has integrated 50 W I/O match, DC blocking, self-bias and choke to eliminate complex tuning and
assembly processes typically required by hybrid (discreteFET) amplifiers. The package is full SMT compatible with
backside grounding and I/O to simplify assembly.
• 5x5 mm surface mount package
• Broad Band performance 6-20 GHz
• Low 2.5 dB typical noise figure
• High 22 dB typical gain
• 50 W input and output match
• Single 3 V (55 mA) supply bias
Applications
• Microwave radio systems
• Satellite VSAT, DBS up/down link
• LMDS & Pt-Pt mmW Long Haul
• Broadband Wireless Access (including 802.16 and
802.20 WiMax)
Functional Diagram
• WLL and MMDS loops
• Commercial grade military
1
2
3
8
4
100 pF
7
100 pF
6
PIN
1
2
3
4
5
6
7
8
FUNCTION
Vd
RFout
RFin
5
PACKAGE
BASE
GND
Attention: Observe precautions for handling electrostatic sensitive devices.
ESD Machine Model (Class 1A)
ESD Human Body Model (Class 0)
Refer to Avago Application Note A004R: Electrostatic Discharge Damage and Control.
AMMP-6220 Absolute Maximum Ratings [1]
Symbol
Parameters/Conditions
Vd Positive Drain Voltage
Id
Drain Current
Pin
CW Input Power
Tch
Operating Channel Temp.
Tstg
Storage Case Temp.
Tmax
Maximum Assembly Temp.
(60 sec max.)
Units
Min.
V
mA
dBm
°C
°C
-65
°C
Max.
7
100
15
+150
+150
+300
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to this
device.
AMMP-6220 DC Specifications/Physical Properties [1]
Symbol Parameters and Test Conditions
Units
Min.
Typ.
Max.
Id
Drain Supply Current (under any mA
55 70
RF power drive and temperature)
(Vd = 3.0 V)
qch-b
Thermal Resistance[2] (Backside temperature, Tb = 25°C) °C/W
27
Notes:
1. Ambient operational temperature TA = 25°C unless otherwise noted.
2. Channel-to-backside Thermal Resistance (Tchannel (Tc) = 34°C) as measured using infrared microscopy. Thermal Resistance at backside temperature (Tb) = 25°C calculated from measured
data.
AMMP-6220 RF Specifications [3, 4, 6]
TA= 25°C, Vd = 3.0 V, Id(Q) = 55 mA, Zo = 50 W
Symbol
Parameters and Test Conditions
Gain
Small-signal Gain[5]
NF
Noise Figure into 50 W[5] P-1dB
Output Power at 1dB Gain Compression
OIP3
Third Order Intercept Point; ∆f = 100 MHz; Pin = -20 dBm
RLin
Input Return Loss
RLout
Output Return Loss
Isol
Reverse Isolation
Units
dB
dB
dBm
dBm
Typical
22
2.5
+10
+20
Sigma
0.5
0.2
0.8
1.1
dB
dB
dB
-12
-16
-45
0.3
0.7
0.5
Notes:
3. Small/Large -signal data measured in a fully de-embedded test fixture form TA = 25°C.
4. Pre-assembly into package performance verified 100% on-wafer per AMMC-6220 published specifications.
5. This final package part performance is verified by a functional test correlated to actual performance at one or more frequencies.
6. Specifications are derived from measurements in a 50 W test environment. Aspects of the amplifier performance may be improved over a more
narrow bandwidth by application of additional conjugate, linearity, or low noise (Gopt) matching.
AMMP-6220 Typical Performances (TA = 25°C, Vd =3 V, ID = 55 mA, Zin = Zout = 50 W unless otherwise stated)
Note: These measurements are in 50 W test environment. Aspects of the amplifier performance may be improved over a narrower bandwidth by application of additional conjugate, linearity or low noise (Gopt) matching.
0
25
0
-10
20
-5
10
S11 (dB)
15
S21 (dB)
S21 (dB)
-20
-30
-10
-40
-15
5
0
-50
4
6
8
10
12
14
16
18
20
-60
22
4
6
8
10
12
14
16
18
20
0
12
14
16
18
20
22
3.5
20
OP-1dB & OIP3 (dBm)
-10
2.5
NF (dB)
S22 (dB)
10
25
3.0
-15
2.0
1.5
-20
1.0
-25
15
10
P-1dB
5
OIP3
0.5
4
6
8
10
12
14
16
18
20
0
22
6
8
10
FREQUENCY (GHz)
12
14
16
18
0
20
30
0
25
-10
+25°C
10
12
14
16
FREQUENCY (GHz)
Figure 7. Gain over temperature.
18
20
18
20
+25°C
-40°C
+85°C
+85°C
-30
-10
-40
-15
-50
+85°C
8
16
-5
-40°C
6
14
+25°C
S11 (dB)
15
12
0
-20
S12 (dB)
20
4
10
Figure 6. Typical power, OP-1dB and OIP3.
-40°C
5
8
FREQUENCY (GHz)
Figure 5. Noise figure.
10
6
FREQUENCY (GHz)
Figure 4. Output return loss.
S21 (dB)
8
Figure 3. Input return loss.
4.0
-5
6
FREQUENCY (GHz)
Figure 2. Isolation.
Figure 1. Gain.
0
4
FREQUENCY (GHz)
FREQUENCY (GHz)
-30
-20
22
22
-60
4
6
8
10
12
14
16
FREQUENCY (GHz)
Figure 8. Isolation over temperature.
18
20
22
-20
4
6
8
10
12
14
16
18
FREQUENCY (GHz)
Figure 9. Input return loss over temperature.
20
22
AMMP-6220 Typical Performances (TA = 25°C, Vd = 3 V, ID = 55 mA, Zin = Zout = 50 W unless otherwise stated)
Note: These measurements are in 50 W test environment. Aspects of the amplifier performance may be improved over a narrower bandwidth by
application of additional conjugate, linearity or low noise (Gopt) matching.
4.0
0
+25°C
-5
-40°C
-10
+25°C
-40°C
3.0
+85°C
+85°C
+85°C
58
Idd (mA)
-15
2.0
1.5
-20
-40°C
60
2.5
NF (dB)
S22 (dB)
62
+25°C
3.5
56
54
1.0
-25
-30
52
0.5
4
6
8
10
12
14
16
18
20
0
22
6
8
10
12
14
16
18
Figure 10. Output return loss over temperature.
-50
5V
10
12
14
16
18
20
-10
-15
4V
8
-30
5V
-40
3V
5
4V
-5
5V
S11 (dB)
S12 (dB)
S21 (dB)
10
3V
4V
-20
15
5.0
0
3V
-10
20
4.5
Figure 12. Bias current over temperature.
0
6
4.0
Vdd (V)
Figure 11. NF over temperature.
25
4
3.5
FREQUENCY (GHz)
FREQUENCY (GHz)
0
50
3.0
20
-60
22
4
6
8
FREQUENCY (GHz)
10
12
14
16
18
20
-20
22
4
6
8
FREQUENCY (GHz)
Figure 13. Gain over Vdd.
Figure 14. Isolation over Vdd.
0
10
12
14
16
18
20
22
FREQUENCY (GHz)
Figure 15. Input RL over Vdd.
25
3.0
3V
4V
-5
2.5
20
5V
-15
-20
OIP3 (dBm)
2.0
NF (dB)
S22 (dB)
-10
1.5
3V
1.0
-30
0.5
4
6
8
10
12
14
16
18
20
FREQUENCY (GHz)
Figure 16. Output return loss over temperature.
22
0
8
10
12
14
16
FREQUENCY (GHz)
Figure 17. Noise figure over Vdd.
18
3V
5V
5
5V
6
10
4V
4V
-25
15
20
0
6
8
10
12
14
16
FREQUENCY (GHz)
Figure 18. OIP3 over Vdd.
18
20
AMMP-6220 Typical Scattering Parameters[1] (TA = 25°C, Vd = 3 V, Zo = 50 W)
S11
S21
S12
Freq GHz
DB
Mag
Phase
dB
Mag
Phase
dB
Mag
Phase
S22
dB
Mag
Phase
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
10.0
10.5
11.0
11.5
12.0
12.5
13.0
13.5
14.0
14.5
15.0
15.5
16.0
16.5
17.0
17.5
18.0
18.5
19.0
19.5
20.0
20.5
21.0
21.5
22.0
22.5
23.0
23.5
24.0
24.5
-1.46
-1.03
-0.40
-4.65
-1.67
-1.39
-2.80
-1.59
-4.66
-8.62
-11.96
-14.57
-15.90
-16.48
-16.49
-16.53
-16.56
-16.19
-15.63
-14.36
-13.22
-12.30
-11.45
-10.83
-10.47
-10.32
-10.53
-10.62
-10.79
-10.97
-11.25
-11.47
-12.36
-13.30
-13.86
-13.77
-12.94
-11.42
-9.73
-8.00
-6.54
-5.44
-5.12
-4.72
-4.17
-3.40
0.845
0.888
0.955
0.585
0.825
0.851
0.724
0.832
0.585
0.370
0.252
0.187
0.160
0.150
0.150
0.149
0.149
0.155
0.165
0.191
0.218
0.242
0.268
0.287
0.299
0.305
0.297
0.294
0.289
0.283
0.274
0.267
0.241
0.217
0.203
0.205
0.225
0.268
0.326
0.398
0.471
0.534
0.554
0.581
0.618
0.675
65.6
-4.4
-83.9
-150.2
153.6
72.8
18.7
-65.0
-144.6
148.4
93.4
48.4
12.5
-21.7
-58.8
-100.8
-147.1
161.1
108.2
54.8
3.0
-50.7
-102.0
-154.6
153.2
101.7
52.2
8.9
-33.2
-67.4
-109.8
-152.2
168.0
132.5
99.5
67.3
32.0
-6.3
-49.1
-94.4
-140.6
173.4
128.5
86.1
44.3
0.9
-28.9
-10.6
6.1
10.6
6.2
16.6
19.6
22.8
23.5
23.6
23.6
23.3
23.2
23.1
23.1
23.2
23.2
23.3
23.4
23.6
23.8
23.7
23.7
23.6
23.2
22.7
22.3
22.1
21.9
21.5
21.4
21.0
20.9
20.6
20.4
20.1
19.8
19.4
18.5
18.2
17.7
16.9
16.3
15.3
13.7
12.6
0.036
0.292
2.027
3.420
2.051
6.764
9.563
13.836
15.077
15.218
15.198
14.717
14.575
14.429
14.408
14.455
14.462
14.624
14.926
15.226
15.497
15.483
15.450
15.143
14.518
13.724
13.168
12.858
12.536
11.970
11.796
11.331
11.208
10.720
10.474
10.158
9.847
9.413
8.500
8.140
7.703
7.055
6.535
5.881
4.894
4.288
-62.0
-147.1
96.8
-71.3
-104.2
-178.3
93.3
9.3
-72.4
-145.1
150.4
90.5
33.6
-20.9
-74.7
-126.9
-178.2
131.2
80.4
29.4
-20.8
-72.0
-122.8
-173.1
135.7
87.2
38.7
-8.5
-56.2
-102.6
-151.3
162.1
115.8
69.0
21.3
-25.9
-74.5
-121.1
-169.0
142.8
93.3
45.0
-3.1
-54.0
-102.8
-147.1
-60
-51
-46
-56
-61
-49
-45
-44
-50
-55
-58
-54
-52
-51
-47
-47
-46
-45
-43
-44
-42
-41
-41
-40
-40
-39
-40
-40
-42
-40
-39
-38
-38
-38
-38
-39
-38
-39
-39
-40
-40
-41
-43
-45
-47
-49
0.001
0.003
0.005
0.001
0.001
0.003
0.005
0.006
0.003
0.002
0.001
0.002
0.002
0.003
0.004
0.004
0.005
0.006
0.007
0.006
0.008
0.008
0.008
0.010
0.009
0.010
0.009
0.009
0.008
0.009
0.011
0.012
0.012
0.012
0.012
0.011
0.012
0.011
0.011
0.010
0.010
0.009
0.007
0.005
0.004
0.003
70.9
12.1
-72.
136.7
143.5
-86.3
140.2
26.4
-66.8
-116.2
153.4
89.9
33.2
-16.5
-46.2
-85.8
-121.8
-155.9
159.4
130.7
88.0
49.2
14.5
-26.9
-66.8
-104.7
-146.3
174.6
138.1
116.4
77.9
38.0
-5.3
-40.0
-82.3
-118.5
-161.5
162.1
124.7
79.8
35.1
2.9
-41.2
-84.6
-136.3
-162.8
-4.8
-9.6
-8.8
-6.3
-6.1
-9.3
-10.8
-15.5
-16.9
-16.7
-17.5
-19.5
-22.7
-24.6
-23.7
-21.9
-21.0
-21.3
-22.6
-23.8
-23.4
-21.3
-19.7
-17.8
-16.0
-14.4
-13.5
-13.2
-13.6
-12.7
-12.1
-12.1
-13.1
-14.2
-15.4
-16.5
-16.8
-16.8
-16.5
-16.1
-16.5
-17.3
-21.9
-18.0
-11.5
-9.0
0.570
0.330
0.361
0.483
0.491
0.342
0.286
0.166
0.141
0.146
0.132
0.106
0.073
0.059
0.065
0.080
0.089
0.086
0.074
0.064
0.067
0.086
0.102
0.127
0.157
0.189
0.211
0.218
0.208
0.231
0.247
0.246
0.220
0.194
0.170
0.148
0.144
0.143
0.148
0.156
0.149
0.136
0.080
0.126
0.265
0.355
85.5
38.7
18.1
-46.1
-118.9
174.4
125.8
79.4
64.2
31.4
-8.7
-51.8
-103.7
-172.2
119.7
70.3
31.0
-3.6
-29.9
-46.2
-59.0
-90.7
-130.4
179.7
128.3
79.9
34.8
-4.6
-38.0
-65.0
-101.8
-140.0
179.3
139.1
94.9
44.7
-5.1
-51.5
-92.9
-132.8
-167.4
159.4
138.2
178.1
141.6
100.9
25.0
-2.65
0.737
-44.6
11.6
3.822
168.3
-50
0.003
134.1
-7.7
0.409
61.8
Note: Data obtained from ICM fixture measurements fully de-embedded to package edge.
INPUT REFERENCE
PLANE FOR
S-PARAMETERS
OUTPUT REFERENCE
PLANE FOR
S-PARAMETERS
(VIEW FROM
PACKAGE BOTTOM)
Biasing and Operation
The AMMC-6220 is normally biased with a single positive
drain supply connected to both VD pin through bypass
capacitors as shown in Figure 19. The recommended
supply voltage is 3 V. It is important to have 0.1 µF bypass
capacitor, and the capacitor should be placed as close to
the component as possible.
The AMMC-6220 does not require a negative gate voltage
to bias any of the three stages. No ground wires are
needed because all ground connections are made with
plated through-holes to the backside of the package.
Refer the Absolute Maximum Ratings table for allowed
DC and thermal conditions.
VD (TYP. 3 V)
1
0.1 µF
2
VD
3
RFout
RFin
RFout
8
4
100 pF
7
RFin
100 pF
6
5
PACKAGE
BASE
GND
Figure 19. Typical application.
Figure 21. Demonstration board (available upon request).
Figure 20. Simplified MMIC schematic.
Outline Drawing
1
3
AMMP
XXXX
YWWDNN
8
A
2
7
SYMBOL
A
B
6
4
5
A
B
FRONT VIEW
SIDE VIEW
MIN.
0.198 (5.03)
0.0685 (1.74)
MAX.
0.213 (5.4)
0.088 (2.25)
DIMENSIONS ARE IN INCHES (MM)
0.114 (2.90)
0.011 (0.28)
0.018 (0.46)
3
2
0.014 (0.365)
1
*
0.126
(3.2)
8
4
0.059
(1.5)
0.016 (0.40)
0.100 (2.54)
0.012 (0.30)
0.029 (0.75)
5
6
7
0.016 (0.40)
0.028 (0.70)
0.100 (2.54)
0.93 (2.36)
BACK VIEW
DIMENSIONAL TOLERANCE FOR BACK VIEW: 0.002" (0.05 mm)
NOTES:
1. * INDICATES PIN 1
2. DIMENSIONS ARE IN INCHES (MILLIMETERS)
3. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND
Figure 22. Outline Drawing.
Recommended SMT Attachment
The AMMP Packaged Devices are compatible with high
volume surface mount PCB assembly processes.
The PCB material and mounting pattern, as defined in the
data sheet, optimizes RF performance and is strongly recommended. An electronic drawing of the land pattern
is available upon request from Avago Sales & Application
Engineering.
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 24. The stencil has a solder paste deposition opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste
smear or bridging across the I/O pads. Considering the
fact that solder paste thickness will directly affect the
quality of the solder joint, a good choice is to use a laser
cut stencil composed of 0.127 mm (5 mils) thick stainless
steel which is capable of producing the required fine
stencil outline. The combined PCB and stencil layout is
shown in Figure 25.
Figure 23. Suggested PCB Land Pattern and Stencil Layout
Figure 24. Stencil Outline Drawing (mm)
Figure 25. Combined PCB and Stencil Layouts
Solder Reflow Profile
The most commonly used solder reflow method is accomplished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated
reflow processes is shown in Figure 26. This profile is
designed to ensure reliable finished joints. However, the
profile indicated in Figure 26 will vary among different
solder pastes from different manufacturers and is shown
here for reference only.
300
PEAK = 250 ± 5 C
250
TEMPERATURE ( C)
Manual Assembly
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers.
3. Recommended attachment is conductive solder paste.
Please see recommended solder reflow profile. Conductive epoxy is not recommended. Hand soldering
is not recommended.
4. Apply solder paste using a stencil printer or dot placement. The volume of solder paste will be dependent on
PCB and component layout and should be controlled
to ensure consistent mechanical and electrical performance.
5. Follow solder paste and vendor’s recommendations
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due
to thermal shock.
6. Packages have been qualified to withstand a peak
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
MELTING POINT = 218 C
200
150
100
50
RAMP 1
0
0
PREHEAT
50
RAMP 2
100
REFLOW
150
COOLING
200
250
TIME (SECONDS)
Figure 26. Suggested lead-free reflow profile for SnAgCu solder paste.
AMMP-6220 Part Number Ordering Information
Part Number
Devices Per Container
Container
AMMP-6220-BLK
10
Antistatic bag
AMMP-6220-TR1
100
7” Reel
AMMP-6220-TR2
500
7” Reel
300
Device Orientation (Top View)
4 mm
12 mm
AMMP
XXXX
AMMP
XXXX
AMMP
XXXX
Carrier Tape and Pocket Dimensions
4.00 ± 0.10
SEE NOTE #2
∅1.55 ± 0.05
2.00 ± 0.05
B
R 0.50 TYP.
Ao
1.75 ± 0.10
5.50 ± 0.05
12.00 ± 0.10
Bo
A
Ko
Bo
A
B
8.00 ± 0.10
SECTION B-B
∅1.50 (MIN.)
Ko
Ao
0.30 ± 0.05
SECTION A-A
A o:
B o:
K o:
PITCH:
WIDTH:
5.30
5.30
2.20
8.00
12.00
NOTES:
1. Ao AND Bo MEASURED AT 0.3 mm ABOVE BASE OF POCKET.
2. 10 PITCHES CUMULATIVE TOLERANCE IS ± 0.2 mm.
3. DIMENSIONS ARE IN MILLIMETERS (mm).
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Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4517EN
AV02-0515EN - June 14, 2007
Ao
Bo
Ko
5.20
5.20
2.10
NOM. 5.30
5.30
2.20
MAX. 5.40
5.40
2.30
MIN.