VISHAY SI8411DB-T1

Si8411DB
Vishay Siliconix
New Product
P-Channel 20-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
−20
rDS(on) (W)
ID (A)
0.054 @ VGS = −4.5 V
−5.9
0.075 @ VGS = −2.5 V
−5.0
D TrenchFETr Power MOSFET
D New MICRO FOOTr Chipscale Packaging
Reduces Footprint Area Profile (0.62 mm) and
On-Resistance Per Footprint Area
APPLICATIONS
D
D
D
D
Load Switch
Battery Switch
Charger Switch
PA Switch
S
MICRO FOOT
Bump Side View
3
Backside View
G
2
D
S
4
8411
xxx
D
G
Device Marking: 8411
xxx = Date/Lot Traceability Code
D
Ordering Information: Si8411DB-T1
1
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
5 secs
Steady State
Drain-Source Voltage
VDS
−20
Gate-Source Voltage
VGS
"12
Continuous Drain Current (TJ = 150_C)a
TA = 25_C
TA = 70_C
Pulsed Drain Current
ID
IS
TA = 25_C
Maximum Power Dissipationa
TA = 70_C
Operating Junction and Storage Temperature Range
Package Reflow Conditionsb
PD
V
−4.3
−5.9
−4.7
−3.4
IDM
continuous Source Current (Diode Conduction)a
−25
−2.5
−1.3
2.77
1.47
1.77
0.94
TJ, Tstg
Unit
A
W
−55 to 150
VPR
215
IR/Convection
220
_C
THERMAL RESISTANCE RATINGS
Parameter
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Foot (drain)
Symbol
t v 5 sec
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
35
45
72
85
16
20
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
b. Refer to IPC/JEDEC (J-STD-020A), no manual or hand soldering.
Document Number: 72444
S-32349—Rev. A, 17-Nov-03
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Si8411DB
Vishay Siliconix
New Product
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = −250 mA
−0.6
Typ
Max
Unit
−1.4
V
"100
nA
Static
Gate Threshold Voltage
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain Source On-State
Drain-Source
On State Resistancea
VDS = 0 V, VGS = "12 V
Diode Forward Voltagea
−1
VDS = −20 V, VGS = 0 V, TJ = 70_C
−5
VDS v −5 V, VGS = −4.5 V
rDS(on)
DS( )
Forward Transconductancea
VDS = −20 V, VGS = 0 V
mA
−5
A
VGS = −4.5 V, ID = −1 A
0.045
0.054
VGS = −2.5 V, ID = −1 A
0.065
0.075
gfs
VDS = −10 V, ID = −1 A
7
VSD
IS = −1 A, VGS = 0 V
−0.8
−1.1
14
21
VDS = −10 V, VGS = −4.5 V, ID = −1 A
1.7
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
5.1
Gate Resistance
Rg
18
td(on)
31
tr
50
75
105
160
90
135
85
130
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
VDD = −10 V, RL = 10 W
ID ^ −1 A, VGEN = −4.5 V, RG = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
IF = −1 A, di/dt = 100 A/ms
nC
W
50
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
25
VGS = 5 thru 3.5 V
3V
20
15
I D − Drain Current (A)
20
I D − Drain Current (A)
Transfer Characteristics
25
2.5 V
10
2V
5
15
10
TC = 125_C
5
25_C
1.5 V
−55_C
0
0
1
2
3
4
VDS − Drain-to-Source Voltage (V)
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2
5
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VGS − Gate-to-Source Voltage (V)
Document Number: 72444
S-32349—Rev. A, 17-Nov-03
Si8411DB
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
Capacitance
2000
Ciss
1600
0.16
C − Capacitance (pF)
r DS(on) − On-Resistance ( W )
0.20
0.12
VGS = 2.5 V
0.08
VGS = 4.5 V
1200
800
Coss
0.04
400
0.00
0
Crss
0
5
10
15
20
25
0
4
Gate Charge
r DS(on) − On-Resistance (W)
(Normalized)
V GS − Gate-to-Source Voltage (V)
3
2
1
20
VGS = 4.5 V
ID = 1 A
1.3
1.2
1.1
1.0
0.9
0
0
3
6
9
12
0.8
−50
15
−25
0
Qg − Total Gate Charge (nC)
Source-Drain Diode Forward Voltage
50
75
100
125
150
On-Resistance vs. Gate-to-Source Voltage
0.20
r DS(on) − On-Resistance ( W )
TJ = 150_C
10
TJ = 25_C
1
0.0
25
TJ − Junction Temperature (_C)
30
I S − Source Current (A)
16
On-Resistance vs. Junction Temperature
1.4
VDS = 10 V
ID = 1 A
4
12
VDS − Drain-to-Source Voltage (V)
ID − Drain Current (A)
5
8
0.16
0.12
ID = 1 A
0.08
0.04
0.00
0.2
0.4
0.6
0.8
1.0
1.2
VSD − Source-to-Drain Voltage (V)
Document Number: 72444
S-32349—Rev. A, 17-Nov-03
1.4
1.6
0
1
2
3
4
5
VGS − Gate-to-Source Voltage (V)
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Si8411DB
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power, Juncion-To-Ambient
0.4
80
ID = 250 mA
0.3
0.2
Power (W)
V GS(th) Variance (V)
60
0.1
40
0.0
20
−0.1
−0.2
−50
−25
0
25
50
75
100
125
0
150
0.001
0.01
0.1
TJ − Temperature (_C)
10
1
100
600
Time (sec)
Safe Operating Area
100
IDM Limited
rDS(on) Limited
I D − Drain Current (A)
10
P(t) = 0.001
1
ID(on)
Limited
P(t) = 0.01
P(t) = 0.1
0.1
P(t) = 1
TA = 25_C
Single Pulse
P(t) = 10
dc
BVDSS Limited
0.01
0.1
1
10
100
VDS − Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 72_C/W
3. TJM − TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10−4
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4
10−3
10−2
10−1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 72444
S-32349—Rev. A, 17-Nov-03
Si8411DB
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10−4
Document Number: 72444
S-32349—Rev. A, 17-Nov-03
10−3
10−2
10−1
Square Wave Pulse Duration (sec)
1
10
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Si8411DB
Vishay Siliconix
New Product
PACKAGE OUTLINE
MICRO FOOT: 4-BUMP (2 X 2, 0.8-mm PITCH)
4
O 0.30 X 0.31
Note 3
Solder Mask O X 0.40
e
A
A2
Silicon
A1
Bump Note 2
b Diamerter
e
S
Recommended Land
E
e
8411
XXX
e
S
D
Mark on Backside of Die
NOTES (Unless Otherwise Specified):
1.
Laser mark on the silicon die back, coated with a thin metal.
2.
Bumps are Eutectic solder 63/57 Sn/Pb.
3.
Non-solder mask defined copper landing pad.
4.
The flat side of wafers is oriented at the bottom.
MILLIMETERS*
INCHES
Dim
Min
Max
Min
Max
A
0.600
0.650
0.0236
0.0256
A1
0.260
0.290
0.0102
0.0114
A2
0.340
0.360
0.0134
0.0142
b
0.370
0.410
0.0146
0.0161
D
1.520
1.600
0.0598
0.0630
E
1.520
1.600
0.0598
0.0630
e
0.750
0.850
0.0295
0.0335
S
0.370
0.380
0.0146
0.0150
* Use millimeters as the primary measurement.
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Document Number: 72444
S-32349—Rev. A, 17-Nov-03