VISHAY SI9933BDY-E3

Si9933BDY
Vishay Siliconix
New Product
Dual P-Channel 2.5-V (G-S) MOSFET
PRODUCT SUMMARY
VDS (V)
−20
rDS(on) (W)
ID (A)
0.06 @ VGS = −4.5 V
−4.7
0.10 @ VGS = −2.5 V
−3.7
S1
SO-8
S1
1
8
D1
G1
2
7
D1
S2
3
6
D2
G2
4
5
D2
S2
G1
G2
Top View
Ordering Information: Si9933BDY—E3 (Lead Free)
Si9933BDY-T1—E3 (Lead Free with Tape and Reel)
D1
D2
P-Channel MOSFET
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 secs
Steady State
Drain-Source Voltage
VDS
−20
Gate-Source Voltage
VGS
"12
Continuous Drain Current (TJ = 150_C)a
TA = 25_C
TA = 70_C
Pulsed Drain Current
ID
continuous Source Current (Diode Conduction)a
IS
TA = 25_C
Maximum Power Dissipationa
TA = 70_C
Operating Junction and Storage Temperature Range
PD
V
−4.7
−3.6
−3.8
−2.8
IDM
−20
−1.7
−0.9
2.0
1.1
1.3
0.7
TJ, Tstg
Unit
−55 to 150
A
W
_C
THERMAL RESISTANCE RATINGS
Parameter
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Foot (Drain)
Symbol
t v 10 sec
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
55
62.5
90
110
33
40
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
For SPICE model information via the Worldwide Web: http://www.vishay.com/www/product/spice.htm
Document Number: 72748
S-40237—Rev. A, 16-Feb-04
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Si9933BDY
Vishay Siliconix
New Product
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = −250 mA
−0.6
Typ
Max
Unit
−1.4
V
"100
nA
Static
Gate Threshold Voltage
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain Source On-State
Drain-Source
On State Resistancea
VDS = 0 V, VGS = "12 V
Diode Forward Voltagea
−1
VDS = −20 V, VGS = 0 V, TJ = 55_C
−5
VDS v −5 V, VGS = −4.5 V
rDS(on)
DS( )
Forward Transconductancea
VDS = −20 V, VGS = 0 V
mA
−20
A
VGS = −4.5 V, ID = −4.7 A
0.048
0.06
VGS = −2.5 V, ID = −1 A
0.08
0.10
gfs
VDS = −10 V, ID = −4.7 A
11
VSD
IS = −1.7 A, VGS = 0 V
−0.75
−1.2
6
9
VDS = −10 V, VGS = −4.5 V, ID = −4.7 A
1.4
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
nC
1.9
f = 1 MHz
9.5
W
td(on)
22
35
tr
35
55
45
70
25
40
25
50
VDD = −10 V, RL = 10 W
ID ^ −1 A, VGEN = −4.5 V, Rg = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
IF = −1.7 A, di/dt = 100 A/ms
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
20
20
VGS = 5 thru 3.5 V
25_C
16
I D − Drain Current (A)
16
I D − Drain Current (A)
TC = −55_C
3V
12
2.5 V
8
2V
4
125_C
12
8
4
1.5 V
0
0
1
2
3
4
VDS − Drain-to-Source Voltage (V)
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2
5
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VGS − Gate-to-Source Voltage (V)
Document Number: 72748
S-40237—Rev. A, 16-Feb-04
Si9933BDY
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Capacitance
1000
0.16
800
C − Capacitance (pF)
r DS(on) − On-Resistance ( W )
On-Resistance vs. Drain Current
0.20
0.12
VGS = 2.5 V
0.08
VGS = 4.5 V
400
0.04
200
0.00
0
0
4
8
12
16
Ciss
600
20
Coss
Crss
0
4
ID − Drain Current (A)
Gate Charge
16
20
On-Resistance vs. Junction Temperature
1.6
VDS = 10 V
ID = 4.7 A
VGS = 10 V
ID = 4.7 A
4
1.4
rDS(on) − On-Resiistance
(Normalized)
V GS − Gate-to-Source Voltage (V)
12
VDS − Drain-to-Source Voltage (V)
5
3
2
1
1.2
1.0
0.8
0
0
1
2
3
4
5
6
7
0.6
−50
8
−25
0
Qg − Total Gate Charge (nC)
Source-Drain Diode Forward Voltage
50
75
100
125
150
On-Resistance vs. Gate-to-Source Voltage
0.20
r DS(on) − On-Resistance ( W )
TJ = 150_C
10
TJ = 25_C
1
0.0
25
TJ − Junction Temperature (_C)
30
I S − Source Current (A)
8
0.16
ID = 1 A
0.12
ID = 4.7 A
0.08
0.04
0.00
0.2
0.4
0.6
0.8
1.0
VSD − Source-to-Drain Voltage (V)
Document Number: 72748
S-40237—Rev. A, 16-Feb-04
1.2
1.4
0
1
2
3
4
5
VGS − Gate-to-Source Voltage (V)
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Si9933BDY
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Single Pulse Power
50
0.4
40
ID = 250 mA
0.2
30
Power (W)
V GS(th) Variance (V)
Threshold Voltage
0.6
0.0
20
−0.2
10
−0.4
−50
−25
0
25
50
75
100
125
0
10−2
150
10−1
TJ − Temperature (_C)
1
10
100
600
Time (sec)
Safe Operating Area
100
IDM Limited
rDS(on) Limited
I D − Drain Current (A)
10
P(t) = 0.001
1
ID(on)
Limited
P(t) = 0.01
P(t) = 0.1
0.1
P(t) = 1
P(t) = 10
dc
TA = 25_C
Single Pulse
BVDSS Limited
0.01
0.1
1
10
100
VDS − Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 90_C/W
3. TJM − TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10−4
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4
10−3
10−2
10−1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 72748
S-40237—Rev. A, 16-Feb-04
Si9933BDY
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10−4
Document Number: 72748
S-40237—Rev. A, 16-Feb-04
10−3
10−2
10−1
Square Wave Pulse Duration (sec)
1
10
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Notice
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Document Number: 91000
Revision: 08-Apr-05
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