HI-SINCERITY Spec. No. : HN200302 Issued Date : 2003.03.01 Revised Date : 2005.01.14 Page No. : 1/6 MICROELECTRONICS CORP. HUN2211 / HUN2212 / HUN2213 / HUN2214 / HUN2215 HUN2216 / HUN2230 / HUN2231 / HUN2232 / HUN2233 HUN2234 / HUN2235 / HUN2236 / HUN2237 / HUN2238 HUN2240 / HUN2241 NPN Silicon Surface Mount Transistor with Monolithic Bias Resistor Network SOT-23 Description Symbol: This new series of digital transistors is designed to replace a single device and its external resistor bias network. The BRT (Bias Resistor Transistor) contains a single transistor with a monolithic bias network consisting of two resistors; a series base resistor and a base-emitter resistor. The BRT eliminates these individual components by integrating them into a single device. The use of a BRT can reduce both system cost and board space. The device is housed in the SOT-23 package which is designed for low power surface Mount applications. Pin 1 Base (Input) R1 Pin 3 Collector (Output) R2 Pin 2 Emitter (Ground) • Simplifies Circuit Design • Reduces Board Space • Reduces Component Count • Moisture Sensitivity Level: 1 • ESD Rating: Human Body Model: Class1, Machine Model: Class B • The SOT-23 package can be soldered using wave or reflow. (The modified gull-winged leads absorb thermal stress during soldering eliminating the possibility of damage to the die.) • Available in 8mm embossed tape and reel. Use the device number to order the 7 inch / 3,000 unit reel. Maximum Ratings (TA=25oC unless otherwise noted) Rating Symbol Value Unit Collector-Base Voltage VCBO 50 Vdc Collector-Emitter Voltage VCEO 50 Vdc IC 100 mAdc 200 mW 1.6 mW/°C Collector Curretn Total Power Dissipation @ TA=25°C Derate above 25°C (Note1) PD Note1: Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint. Thermal Characteristics Rating Thermal Resistance-Junction-to-Ambient Operating and Storage Temperature Range Maximum Temperature for Soldering Purposes Time in Solder Bath HUN22XX Series Symbol Value Unit RθJA 625 °C/W TJ, Tstg -65 to +150 °C 260 °C 10 Sec TL HSMC Product Specification HI-SINCERITY Spec. No. : HN200302 Issued Date : 2003.03.01 Revised Date : 2005.01.14 Page No. : 2/6 MICROELECTRONICS CORP. Device Marking and Resistor Values Device HUN2211 HUN2212 HUN2213 HUN2214 HUN2215 Package SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 Marking A8A A8B A8C A8D A8E R1(K) 10 22 47 10 10 R2(K) 10 22 47 47 Shipping 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel HUN2216 HUN2230 HUN2231 HUN2232 HUN2233 HUN2234 HUN2235 HUN2236 HUN2237 HUN2238 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 A8F A8G A8H A8J A8K A8L A8M A8N A8P A8R 4.7 1 2.2 4.7 4.7 22 2.2 100 47 2.2 ∞ 1 2.2 4.7 47 47 47 100 22 ∞ 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel HUN2240 SOT-23 A8T 47 ∞ 3000/Tape & Reel HUN2241 SOT-23 A8U 100 ∞ 3000/Tape & Reel ∞ Electrical Characteristics (TA=25°C unless otherwise noted) Characteristic Symbol Min. Typ. Max. Unit ICBO ICEO 50 50 - 100 500 0.5 0.2 0.1 0.2 0.9 1.9 4.3 2.3 1.5 0.18 0.13 0.2 0.05 0.13 4 0.2 0.1 - nAdc nAdc Off Characteristics Collector-Base Cutoff Current (VCB=50V, IE=0) Collector-Emitter Cutoff Current (VCE=50V, IB=0) HUN2211 HUN2212 HUN2213 HUN2214 HUN2215 HUN2216 HUN2230 HUN2231 Emitter-Base Cutoff Current HUN2232 (VEB=6V, IC=0) HUN2233 HUN2234 HUN2235 HUN2236 HUN2237 HUN2238 HUN2240 HUN2241 Collector-Base Breakdown Voltage (IC=10uA, IE=0) Collector-Emitter Breakdown Voltage (IC=2mA, IB=0) IEBO V(BR)CBO *V(BR)CEO mAdc Vdc Vdc *Pulse Test: Pulse Width ≤300us, Duty Cycle≤2% HUN22XX Series HSMC Product Specification HI-SINCERITY Spec. No. : HN200302 Issued Date : 2003.03.01 Revised Date : 2005.01.14 Page No. : 3/6 MICROELECTRONICS CORP. Electrical Characteristics (TA=25°C unless otherwise noted) Characteristic Symbol Min. Typ. Max. hFE 35 60 80 80 160 160 3 8 15 80 80 80 80 80 160 160 160 60 100 140 140 350 350 5 15 30 200 150 140 150 140 350 350 350 - - - 0.25 - - 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 Unit *On Characteristics DC Current Gain (VCE=10V, IC=5mA) HUN2211 HUN2212 HUN2213 HUN2214 HUN2215 HUN2216 HUN2230 HUN2231 HUN2232 HUN2233 HUN2234 HUN2235 HUN2236 HUN2237 HUN2238 HUN2240 HUN2241 Collector-Emitter Saturation Voltage (IC=10mA, IB=0.3mA) (IC=10mA, IB=5mA) HUN2230/HUN2231 (IC=10mA, IB=1mA) HUN2215/HUN2216/HUN2232/HUN2233 HUN2234/HUN2235/HUN2238 VCE(sat) - Vdc *On Characteristics (VCC=5V, VB=5.5V, RL=1kΩ) HUN2211 HUN2212 HUN2214 HUN2215 HUN2216 HUN2230 HUN2231 HUN2232 HUN2233 HUN2234 HUN2235 HUN2238 HUN2213 HUN2240 HUN2236 (VCC=5V, VB=4.0V, RL=1kΩ) HUN2237 - - 0.2 (VCC=5V, VB=5V, RL=1kΩ) HUN2241 - - 0.2 Output Voltage (on) (VCC=5V, VB=2.5V, RL=1kΩ) (VCC=5V, VB=3.5V, RL=1kΩ) VOL Vdc *Pulse Test: Pulse Width ≤300us, Duty Cycle≤2% HUN22XX Series HSMC Product Specification HI-SINCERITY Spec. No. : HN200302 Issued Date : 2003.03.01 Revised Date : 2005.01.14 Page No. : 4/6 MICROELECTRONICS CORP. Electrical Characteristics (TA=25°C unless otherwise noted) Characteristic Symbol Min. Typ. Max. Unit VOH 4.9 - - Vdc 7 15.4 32.9 7 7 3.3 0.7 1.5 3.3 3.3 15.4 1.54 32.9 70 1.54 32.9 70 0.8 0.17 0.8 0.055 0.38 0.038 1.7 10 22 47 10 10 4.7 1 2.2 4.7 4.7 22 2.2 47 100 2.2 47 100 1 0.21 1 0.1 0.47 0.047 2.1 13 28.6 61.1 13 13 6.1 1.3 2.9 6.1 6.1 28.6 2.86 61.1 130 2.88 61.1 130 1.2 0.25 1.2 0.185 0.56 0.056 2.6 *On Characteristics Output Voltage (off) (VCC=5V, VB=0.5V, RL=1kΩ) HUN2215 HUN2216 HUN2233 (VCC=5V, VB=0.25V, RL=1kΩ) HUN2238 HUN2240 HUN2230 (VCC=5V, VB=0.05V, RL=1kΩ) HUN2211 HUN2212 HUN2213 HUN2214 HUN2215 HUN2216 HUN2230 HUN2231 Input Resistor HUN2232 HUN2233 HUN2234 HUN2235 HUN2236 HUN2237 HUN2238 HUN2240 HUN2241 Resistor Ratio HUN2211/HUN2212/HUN2213 /HUN2236 HUN2214 HUN2215/HUN2216/HUN2238/HUN2240 HUN2241 HUN2230/HUN2231/HUN2232 HUN2233 HUN2234 HUN2235 HUN2237 R1 R1/R2 kΩ *Pulse Test: Pulse Width ≤300us, Duty Cycle≤2% HUN22XX Series HSMC Product Specification HI-SINCERITY Spec. No. : HN200302 Issued Date : 2003.03.01 Revised Date : 2005.01.14 Page No. : 5/6 MICROELECTRONICS CORP. SOT-23 Dimension DIM A B C D G H J K L S V Marking: A Series Code L (See Page 2) A 8 Pb Free Mark 3 Pb-Free: " " (Note) Normal: None B S 1 V 2 Note: Pb-free product can distinguish by the green label or the extra description on the right side of the label. G Pin Style: 1.Base 2.Emitter 3.Collector D H K Max. 3.04 1.60 1.30 0.50 2.30 0.10 0.177 0.67 1.15 2.75 0.65 *: Typical, Unit: mm Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 C Min. 2.80 1.20 0.89 0.30 1.70 0.013 0.085 0.32 0.85 2.10 0.25 J 3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HUN22XX Series HSMC Product Specification HI-SINCERITY Spec. No. : HN200302 Issued Date : 2003.03.01 Revised Date : 2005.01.14 Page No. : 6/6 MICROELECTRONICS CORP. Soldering Methods for HSMC’s Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface-mount devices Figure 1: Temperature profile tP Critical Zone TL to TP TP Ramp-up TL tL Temperature Tsmax Tsmin tS Preheat Ramp-down 25 t 25oC to Peak Time Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly <3 C/sec <3oC/sec - Temperature Min (Tsmin) 100oC 150oC - Temperature Max (Tsmax) 150oC 200oC 60~120 sec 60~180 sec <3oC/sec <3oC/sec 183oC 217oC Average ramp-up rate (TL to TP) o Preheat - Time (min to max) (ts) Tsmax to TL - Ramp-up Rate Time maintained above: - Temperature (TL) - Time (tL) 60~150 sec Peak Temperature (TP) Time within 5oC of actual Peak Temperature (tP) Ramp-down Rate Time 25oC to Peak Temperature o o 60~150 sec 240 C +0/-5 C 260oC +0/-5oC 10~30 sec 20~40 sec <6oC/sec <6oC/sec <6 minutes <8 minutes Peak temperature Dipping time 245 C ±5 C 5sec ±1sec 3. Flow (wave) soldering (solder dipping) Products Pb devices. Pb-Free devices. HUN22XX Series o o o o 260 C +0/-5 C 5sec ±1sec HSMC Product Specification