HSMC HMJE13009A

HI-SINCERITY
Spec. No. : HE200206
Issued Date : 2002.02.01
Revised Date : 2006.07.04
Page No. : 1/6
MICROELECTRONICS CORP.
HMJE13009A
12 AMPERE NPN SILICON POWER TRANSISTOR
Description
The HMJE13009A is designed for high-voltage, high-speed power switching
inductive circuits where fall time is critical. They are particularly suited for 115 and
220V switch-controls, Solenoid/Relay drivers and Deflectioncircuits.
TO-220AB
Specification Features
• VCEO(sus)=400V
• Reverse Bias SOA with Inductive Loads @TC=100°C
• Inductive Switching Matrix 3 to 12 Amp., 25 and 100°C…tc@8A, 100°C is 120ns(Typ.)
• 700V Blocking Capability
• SOA and Switching Applications Information
Absolute Maximum Ratings
Characteristic
Symbol
Max.
Unit
VCEO(sus)
400
Vdc
Collector-Base Voltage
VCBO
700
Vdc
Emitter-Base Voltage
VEBO
9
Vd
Collector Current-Continuous
IC
12
Adc
Collector Current-Peak*
ICM
24
Adc
Base Current-Continuous
IB
6
Adc
Base Current-Peak*
IBM
12
Adc
Emitter Current-Continuous
IE
18
Adc
Emitter Current-Peak
IEM
36
Adc
2
Watts
16
mW/°C
100
Watts
800
mW/°C
-65 to +150
°C
Collector-Emitter Voltage
Total Power Dissipation@TA=25°C
Derate above 25°C
Total Power Dissipation@TC=25°C
Derate above 25°C
Operating and Storage Junction Temperature Range
PD
PD
TJ, Tstg
*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%
Thermal Characteristics
Characteristic
Symbol
Max.
Unit
Thermal Resistance, Junction to Case
RθJC
1.25
°C/W
Thermal Resistance, Junction to Ambient
RθJA
62.5
°C/W
TL
275
°C
Maximum Lead Temperature for Soldering Purposes:
1/8” from Case for 5 Seconds
HMJE13009A
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE200206
Issued Date : 2002.02.01
Revised Date : 2006.07.04
Page No. : 2/6
MICROELECTRONICS CORP.
Electrical Characteristics (TA=25°C unless otherwise noted)
Characteristic
Symbol
Min.
Typ.
Max.
Unit
VCEO(sus)
400
-
-
Vdc
Collector Cutoff Current
(VCEV=Rated Value, VBE(off)=1.5Vdc
(VCEV=Rated Value, VBE(off)=1.5Vdc, TC=100°C)
ICEV
-
-
1
5
mAdc
Emitter Cutoff Current (VEB=9Vdc, IC=0)
IEBO
-
-
1
mAdc
• Off Characteristics
Collector-Emitter Sustaining Voltage
(IC=10mA, IB=0)
• Second Breakdown
Second Breakdown Collector Current with base forward biased
Clamped Inductive SOA with Base Reverse Biased
See Figure 1
See Figure 2
Is/b
• On Characteristics
DC Current Gain (IC=0.5Adc, VCE=5Vdc)
DC Current Gain (IC=5Adc, VCE=5Vdc)
DC Current Gain (IC=8Adc, VCE=5Vdc)
DC Current Gain (IC=12Adc, VCE=5Vdc)
*hFE1
*hFE2
*hFE3
*hFE4
15
13
8
5
-
22
-
Collector-Emitter Saturation Voltage
(IC=5Adc, IB=1Adc)
(IC=8Adc, IB=1.6Adc)
(IC=12Adc, IB=3Adc)
(IC=8Adc, IB=1.6Adc, TC=100°C)
*VCE(sat)1
*VCE(sat)2
*VCE(sat)3
*VCE(sat)4
-
-
1
1.5
3
2
Base-Emitter Saturation Voltage
(IC=5Adc, IB=1Adc)
(IC=8Adc, IB=1.6Adc)
(IC=8Adc, IB=1.6Adc, TC=100°C)
*VBE(sat)1
*VBE(sat)2
*VBE(sat)3
-
-
1.3
1.6
1.5
fT
4
-
-
MHz
Cob
-
180
-
pF
td
-
0.06
0.1
uS
tr
-
0.45
1
uS
ts
-
1.3
3
uS
tf
-
0.2
0.7
uS
tsv
-
0.92
2.3
uS
tc
-
0.12
0.7
uS
Vdc
Vdc
• Dynamic Characteristics
Current Gain Bandwidth Product
(IC=500mAdc, VCE=10Vdc, f=1MHz)
Output Capacitance
(VCB=10Vdc, IE=0, f=0.1MHz)
• Switching Characteristics
Delay Time
Rise Time
Storage Time
(VCC=125Vdc, IC=8A)
IB1=IB2=1.6A, tp=25uS
Duty Cycle≤1%
Fall Time
• Inductive Load, Clamped
Voltage Storage Time
Crossover Time
(IC=8Adc, Vclamp=300Vdc)
(IB1=1.6Adc,VBE(off)=5Vdc, TC=100°C)
*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%
HMJE13009A
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE200206
Issued Date : 2002.02.01
Revised Date : 2006.07.04
Page No. : 3/6
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
Saturation Voltage & Collector Current
10
100
VCE=5V
VBE(sat) @ IC=5IB
o
75 C
o
Saturation Voltage (V)
125 C
o
hFE
25 C
10
1
0.001
0.01
0.1
1
10
100
o
o
25 C
1
75 C
o
125 C
0.1
0.001
0.01
Collector Current (A)
Saturation Voltage & Collector Current
1
10
100
Saturation Voltage & Collector Current
10
10
VCE(sat) @ IC=4IB
VCE(sat) @ IC=5IB
Saturation Voltage (V)
Saturation Voltage (V)...
0.1
Collector Current (A)
1
o
125 C
o
75 C
0.1
1
o
75 C
o
125 C
0.1
o
25 C
o
25 C
0.01
0.001
0.01
0.1
1
10
100
0.01
0.001
Collector Current (A)
0.01
0.1
1
10
100
Collector Current (A)
Switching Time & Collector Current
Capacitance & Reverse-Biased Voltage
10
1000
Switching Time (us)...
Capacitance (pF)
VC=125V, IC=5IB1 , IB1=-IB2
100
10
Tstg
1
Ton
Tf
0.1
1
0.1
1
10
Reverse-Biased Voltage (V)
HMJE13009A
100
0.1
1
10
100
Collector Current (A)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE200206
Issued Date : 2002.02.01
Revised Date : 2006.07.04
Page No. : 4/6
Safe Ooperating Area
Collector Current-Ic (A)...
100
10
100ms
1s
1
1ms
0.1
1
10
100
1000
Forward Voltage-VCB (V)
HMJE13009A
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE200206
Issued Date : 2002.02.01
Revised Date : 2006.07.04
Page No. : 5/6
MICROELECTRONICS CORP.
TO-220AB Dimension
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Marking:
A
F
B
Pb Free Mark
Pb-Free: " . " (Note)
Normal: None
H
E
MJ E
13009A
C
D
Date Code
H
M
I
K
3
G
N
2
1
Tab
O
P
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Base 2.Collector 3.Emitter
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
J
L
Min.
5.58
8.38
4.40
1.15
0.35
2.03
9.66
3.00
0.75
2.54
1.14
12.70
14.48
Max.
7.49
8.90
4.70
1.39
0.60
2.92
10.28
*16.25
*3.83
4.00
0.95
3.42
1.40
*2.54
14.27
15.87
*: Typical, Unit: mm
3-Lead TO-220AB
Plastic Package
HSMC Package Code: E
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056
Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMJE13009A
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE200206
Issued Date : 2002.02.01
Revised Date : 2006.07.04
Page No. : 6/6
MICROELECTRONICS CORP.
Soldering Methods for HSMC’s Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Figure 1: Temperature profile
tP
Critical Zone
TL to TP
TP
Ramp-up
TL
tL
Temperature
Tsmax
Tsmin
tS
Preheat
Ramp-down
25
t 25oC to Peak
Time
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
<3 C/sec
<3oC/sec
- Temperature Min (Tsmin)
100oC
150oC
- Temperature Max (Tsmax)
150oC
200oC
60~120 sec
60~180 sec
<3oC/sec
<3oC/sec
183oC
217oC
Average ramp-up rate (TL to TP)
o
Preheat
- Time (min to max) (ts)
Tsmax to TL
- Ramp-up Rate
Time maintained above:
- Temperature (TL)
- Time (tL)
60~150 sec
260oC +0/-5oC
10~30 sec
20~40 sec
<6oC/sec
<6oC/sec
<6 minutes
<8 minutes
Peak temperature
Dipping time
Pb devices.
245 C ±5 C
10sec ±1sec
Pb-Free devices.
260 C ±5 C
10sec ±1sec
Time within 5oC of actual Peak
Temperature (tP)
Ramp-down Rate
Time 25oC to Peak Temperature
o
60~150 sec
240 C +0/-5 C
Peak Temperature (TP)
o
3. Flow (wave) soldering (solder dipping)
Products
HMJE13009A
o
o
o
o
HSMC Product Specification