LRC L2SC5658M3T5G

LESHAN RADIO COMPANY, LTD.
General Purpose Amplifier
NPN Silicon Transistor
L2SC5658M3T5G
This NPN transistor is designed for general purpose amplifier
applications. This device is housed in the SOT-723 package which is
designed for low power surface mount applications, where board
space is at a premium.
• Reduces Board Space
• High hFE, 210 −460 (typical)
• Low VCE(sat), < 0.5 V
• ESD Performance: Human Body Model; u 2000 V,
Machine Model; u 200 V
• Available in 8 mm, 7-inch/3000 Unit Tape and Reel
• This is a Pb−Free Device
3
2
1
SOT-723
3
COLLECT OR
1
B ASE
2
EMIT T ER
MAXIMUM RATINGS (TA = 25°C)
Symbol
Value
Unit
Collector-Base Voltage
V(BR)CBO
50
Vdc
Collector-Emitter Voltage
V(BR)CEO
50
Vdc
Emitter-Base Voltage
V(BR)EBO
5.0
Vdc
IC
100
mAdc
Symbol
Max
Unit
Power Dissipation (Note 1)
PD
260
mW
Junction Temperature
TJ
150
°C
Storage Temperature Range
Tstg
−55 ~ + 150
°C
Rating
Collector Current − Continuous
MARKING
DIAGRAM
XX M
THERMAL CHARACTERISTICS
Rating
1. Device mounted on a FR-4 glass epoxy printed circuit board using the
minimum recommended footprint.
Version 1.0
XX = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device
Package
Shipping
L2SC5658M3T5G
SOT-723
3000/Tape & Reel
L2SC5658M3T5G-1/4
LESHAN RADIO COMPANY, LTD.
L2SC5658M3T5G
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Characteristic
Symbol
Min
Typ
Max
Unit
Collector-Base Breakdown Voltage (IC = 50 mAdc, IE = 0)
V(BR)CBO
50
−
−
Vdc
Collector-Emitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0)
V(BR)CEO
50
−
−
Vdc
Emitter-Base Breakdown Voltage (IE = 50 mAdc, IE = 0)
V(BR)EBO
5.0
−
−
Vdc
ICBO
−
−
0.5
mA
IEBO
−
−
0.5
Collector-Base Cutoff Current (VCB = 30 Vdc, IE = 0)
Emitter-Base Cutoff Current (VEB = 4.0 Vdc, IB = 0)
Collector-Emitter Saturation Voltage (Note 2)
(IC = 60 mAdc, IB = 5.0 mAdc)
DC Current Gain (Note 2)
(VCE = 6.0 Vdc, IC = 1.0 mAdc)
Transition Frequency (VCE = 12 Vdc, IC = 2.0 mAdc, f = 30 MHz)
Output Capacitance (VCB = 12 Vdc, IC = 0 Adc, f = 1.0 MHz)
VCE(sat)
mA
Vdc
−
−
0.4
120
−
560
fT
−
180
−
MHz
COB
−
2.0
−
pF
hFE
−
2. Pulse Test: Pulse Width ≤ 300 ms, D.C. ≤ 2%.
Version 1.0
L2SC5658M3T5G-2/4
LESHAN RADIO COMPANY, LTD.
L2SC5658M3T5G
TYPICAL ELECTRICAL CHARACTERISTICS
1000
160 mA
TA = 25°C
50
120 mA
40
100 mA
30
80 mA
60 mA
20
TA = − 25°C
100
40 mA
10
0
IB = 20 mA
0
2
4
6
VCE, COLLECTOR VOLTAGE (V)
10
0.1
8
1
10
100
IC, COLLECTOR CURRENT (mA)
Figure 2. DC Current Gain
2
900
TA = 25°C
800
COLLECTOR VOLTAGE (mV)
VCE , COLLECTOR-EMITTER VOLTAGE (V)
Figure 1. IC − VCE
1.5
1
0.5
700
600
500
400
TA = 25°C
VCE = 5 V
300
200
100
0
0.01
0.1
1
IB, BASE CURRENT (mA)
10
0
0.2
100
1
5
10
20
40
60
80
100
150 200
Figure 4. On Voltage
7
20
6
Cob, CAPACITANCE (pF)
18
16
14
12
10
0.5
IC, COLLECTOR CURRENT (mA)
Figure 3. Collector Saturation Region
Cib, INPUT CAPACITANCE (pF)
VCE = 10 V
TA = 25°C
TA = 75°C
140 mA
DC CURRENT GAIN
IC, COLLECTOR CURRENT (mA)
60
5
4
3
2
0
Version 1.0
1
2
3
4
1
0
10
20
30
VEB (V)
VCB (V)
Figure 5. Capacitance
Figure 6. Capacitance
40
L2SC5658M3T5G-3/4
LESHAN RADIO COMPANY, LTD.
L2SC5658M3T5G
PACKAGE DIMENSIONS
SOT−723
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
−X−
D
A
b1
−Y−
3
E
1
e
HE
L
2
b 2X
0.08 (0.0032) X Y
C
PIN 1. BASE
2. EMITTER
3. COLLECTOR
DIM
A
b
b1
C
D
E
e
HE
L
MILLIMETERS
MIN
NOM
MAX
0.45
0.50
0.55
0.15
0.20
0.27
0.25
0.3
0.35
0.07
0.12
0.17
1.15
1.20
1.25
0.75
0.80
0.85
0.40 BSC
1.15
1.20
1.25
0.15
0.20
0.25
INCHES
MIN
NOM
MAX
0.018 0.020 0.022
0.0059 0.0079 0.0106
0.010 0.012 0.014
0.0028 0.0047 0.0067
0.045 0.047 0.049
0.03 0.032 0.034
0.016 BSC
0.045 0.047 0.049
0.0059 0.0079 0.0098
SOLDERING FOOTPRINT
0.40
0.0157
0.40
0.0157
1.0
0.039
0.40
0.0157
0.40
0.0157
0.40
0.0157
mm Ǔ
ǒinches
Version 1.0
L2SC5658M3T5G-4/4