TI TPS622314-Q1

TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
3 MHz Ultra Small Step Down Converter in 1x1.5 SON Package
Check for Samples: TPS62231-Q1, TPS622314-Q1
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Qualified for Automotive Applications
3 MHz Switch Frequency
Up to 94% Efficiency
Output Peak Current up to 500 mA
Excellent AC and Transient Load Regulation
High PSRR (up to 90 dB)
Small External Output Filter Components 1 μH/
4.7 μF
VIN range from 2.05 V to 6 V
Optimized Power Save Mode For Low Output
Ripple Voltage
Forced PWM Mode Operation
Typ. 22 μA Quiescent Current
100% Duty Cycle for Lowest Dropout
Small 1 × 1.5 × 0.6mm3 SON Package
12 mm2 Minimum Solution Size
Supports 0.6 mm Maximum Solution Height
Soft Start with typ. 100μs Start Up Time
APPLICATIONS
•
•
•
•
•
•
L
1/2.2 mH
TPS62231
2.05 V - 6 V
VIN
EN
MODE
CIN
2.2 mF
SW
FB
GND
The TPS6223x-Q1 device family is a high frequency
synchronous step down DC-DC converter optimized
for battery powered portable applications. It supports
up to 500 mA output current and allows the use of
tiny and low cost chip inductors and capacitors.
With a wide input voltage range of 2.05 V to 6 V the
device supports applications powered by Li-Ion
batteries with extended voltage range. The minimum
input voltage of 2.05 V allows as well the operation
from Li-primary or two alkaline batteries. Different
fixed output voltage versions are available from 1 V to
3.3 V.
The TPS6223x-Q1 series features switch frequency
up to 3.8 MHz. At medium to heavy loads, the
converter operates in PWM mode and automatically
enters Power Save Mode operation at light load
currents to maintain high efficiency over the entire
load current range.
Because of its excellent PSRR and AC load
regulation performance, the device is also suitable to
replace linear regulators to obtain better power
conversion efficiency.
The Power Save Mode in TPS6223x-Q1 reduces the
quiescent current consumption down to 22 μA during
light load operation. It is optimized to achieve very
low output voltage ripple even with small external
component and features excellent ac load regulation.
LDO Replacement
Portable Audio, Portable Media
Cell Phones
Low Power Wireless
Low Power DSP Core Supply
Digital Cameras
VIN
DESCRIPTION
VOUT
1.8 V
For very noise sensitive applications, the device can
be forced to PWM Mode operation over the entire
load range by pulling the MODE pin high. In the
shutdown mode, the current consumption is reduced
to less than 1μA. The TPS6223x-Q1 is available in a
1 × 1.5mm2 6 pin SON package.
COUT
4.7 mF
Total area
L1
12mm²
V IN
C1
C2
GND
V OUT
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION (1)
TA
–40°C to 105°C
(1)
OUTPUT
VOLTAGE
FREQUENCY
[MHz]
PACKAGE
DESIGNATOR
TPS62231-Q1
1.8 V
3
TPS622314-Q1
1.5 V
3
PART NUMBER
ORDERING
PACKAGE
MARKING
DRY
TPS62231TDRYRQ1
31
DRY
TPS622314TDRYRQ1
14
For detailed ordering information see the PACKAGE OPTION ADDENDUM at the end of this data sheet.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
MIN
VI
MAX
UNIT
Voltage at VIN and SW Pin (2)
–0.3
7
V
Voltage at EN, MODE Pin (2)
–0.3
VIN +0.3, ≤7
V
–0.3
3.6
V
internally limited
A
Voltage at FB Pin
(2)
Peak output current
ESD rating (3)
Human Body Model (HBM)
2
Charged Device Model CDM)
1
Machine Model (MM)
200
Power dissipation
kV
V
Internally limited
TJ
Maximum operating junction temperature
–40
125
°C
Tstg
Storage temperature range
–65
150
°C
(1)
(2)
(3)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
DISSIPATION RATINGS (1)
(1)
(2)
2
PACKAGE
RθJA
POWER RATING
FOR TA ≤ 25°C
DERATING FACTOR
ABOVE TA = 25°C
1 × 1.5 SON
234°C/W (2)
420 mW
4.2 mW/°C
Maximum power dissipation is a function of TJ(max), θJA and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = [TJ(max) – TA] /θJA.
This thermal data is measured with high-K board (4 layers board according to JESD51-7 JEDEC standard).
Copyright © 2011, Texas Instruments Incorporated
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
RECOMMENDED OPERATING CONDITIONS
operating ambient temperature TA = –40 to 105°C (unless otherwise noted) (1)
MIN
Supply voltage VIN
(2)
2.05
Effective inductance
2
VOUT ≤ VIN -1 V (3)
Recommended minimum
supply voltage
VOUT ≤ 1.8V
Operating junction temperature range, TJ
(2)
(3)
(4)
MAX
6
(4)
3
350 mA maximum IOUT
(4)
2.5
60 mA maximum output current (4)
V
μF
4.7
500 mA maximum IOUT
UNIT
μH
2.2
Effective capacitance
(1)
NOM
3.6
2.7
V
2.05
–40
125
°C
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the
maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package
in the application (θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max)).
The minimum required supply voltage for startup is 2.05 V. The part is functional down to the falling UVL (Under Voltage Lockout)
threshold.
For a voltage difference between minimum VIN and VOUT of ≥ 1 V
Typical value applies for TA = 25°C, maximum value applies for TA = 105°C with TJ ≤ 125°C, PCB layout needs to support proper
thermal performance.
Copyright © 2011, Texas Instruments Incorporated
3
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
ELECTRICAL CHARACTERISTICS
VIN = 3.6V, VOUT = 1.8V, EN = VIN, MODE = GND, TA = –40°C to 105°C (1) typical values are at TA = 25°C (unless otherwise
noted), CIN = 2.2μF, L = 2.2μH, COUT = 4.7μF, see parameter measurement information
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY
VIN
Input voltage range
IQ
(2)
Operating quiescent current
2.05
Shutdown current
UVLO
Undervoltage lockout threshold
V
40
μA
22
IOUT = 0mA. PFM mode enabled (Mode = 0)
device switching, VIN = 3.6V, VOUT = 1.2V
25
μA
3
mA
IOUT = 0 mA. Switching with no load
(MODE/DATA = VIN), PWM operation,
VOUT = 1.8V, L = 2.2μH
ISD
6
IOUT = 0mA. PFM mode enabled (Mode = 0)
device not switching
EN = GND (3)
0.1
Falling
Rising
1
μA
1.8
1.9
V
1.9
2.05
V
0.8
1
V
0.01
0.5
μA
600
850
350
480
690
850
1050
mA
550
840
1220
mA
ENABLE, MODE THRESHOLD
VIH
TH
Threshold for detecting high EN, MODE 2.05 V ≤ VIN ≤ 6V , rising edge
VIL TH HYS
Threshold for detecting low EN, MODE
2.05 V ≤ VIN ≤ 6V , falling edge
IIN
Input bias Current, EN, MODE
EN, MODE = GND or VIN = 3.6V
0.4
0.6
V
POWER SWITCH
RDS(ON)
ILIMF
High side MOSFET on-resistance
Low Side MOSFET on-resistance
Forward current limit MOSFET
high-side
VIN = 3.6V, TJmax = 105°C; RDS(ON) max value
VIN = 3.6V, open loop
Forward current limit MOSFET low side
TSD
mΩ
Thermal shutdown
Increasing junction temperature
150
°C
Thermal shutdown hysteresis
Decreasing junction temperature
20
°C
135
ns
40
ns
0.70
V
CONTROLLER
tONmin
Minimum ON time
tOFFmin
Minimum OFF time
VIN 3.6V, VOUT = 1.8V, Mode = high, IOUT = 0 mA
OUTPUT
VREF
Internal Reference Voltage
VIN = 3.6V, Mode = GND, device operating in PFM
Mode, IOUT = 0mA
Output voltage accuracy (4)
VOUT
tStart
ILK_SW
(1)
(2)
(3)
(4)
(5)
4
VIN = 3.6V, MODE = VIN,
IOUT = 0 mA
TA = 25°C
–2.0%
2.0%
TA = –40°C to
105°C
–2.5%
2.5%
DC output voltage load regulation
PWM operation, Mode = VIN = 3.6V, VOUT = 1.8 V
DC output voltage line regulation
IOUT = 0 mA, Mode = VIN, 2.05V ≤ VIN ≤ 6V
Start-up Time
Time from active EN to VOUT = 1.8V, VIN = 3.6V,
10Ω load
Leakage current into SW pin
0%
VIN = VOUT = VSW = 3.6 V, EN = GND
(5)
0.001
%/mA
0
%/V
μs
100
0.1
0.5
μA
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the
maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the
part/package in the application (θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max)).
The minimum required supply voltage for startup is 2.05V. The part is functional down to the falling UVL (Under Voltage Lockout)
threshold
Shutdown current into VIN pin, includes internal leakage
VIN = VO + 1.0 V
The internal resistor divider network is disconnected from FB pin.
Copyright © 2011, Texas Instruments Incorporated
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
DRY PACKAGE
(TOP VIEW)
MODE 1
6
FB
SW 2
5 EN
VIN 3
4
GND
PIN FUNCTIONS
PIN
NAME
NO
I/O
DESCRIPTION
VIN
3
PWR
VIN power supply pin.
GND
4
PWR
GND supply pin
EN
5
IN
SW
2
OUT
FB
6
IN
Feedback Pin for the internal regulation loop. Connect this pin directly to the output capacitor.
MODE
1
IN
MODE pin = high forces the device to operate in PWM mode. Mode = low enables the Power Save Mode
with automatic transition from PFM (Pulse frequency mode) to PWM (pulse width modulation) mode.
This is the enable pin of the device. Pulling this pin to low forces the device into shutdown mode. Pulling
this pin to high enables the device. This pin must be terminated.
This is the switch pin and is connected to the internal MOSFET switches. Connect the inductor to this
terminal
FUNCTIONAL BLOCK DIAGRAM
VIN
Bandgap
VREF
0.70 V
Undervoltage
Lockout
Limit
High Side
MODE
MODE
Current
Limit Comparator
PMOS
Softstart
VIN
Min. On Time
FB
EN
Min. OFF Time
Control
Logic
Gate Driver
Anti
Shoot-Through
VREF
NMOS
FB
Integrated
Feed Back
Network
SW
Limit
Low Side
Error
Comparator
Thermal
Shutdown
Zero/Negative
Current Limit Comparator
EN
GND
Copyright © 2011, Texas Instruments Incorporated
5
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VIN = 2.05 V to 6 V
TPS6223X
VIN
CIN
2.2 mF
EN
MODE
L = 1/2.2 mH
VOUT
SW
FB
COUT
GND
4.7 mF
CIN: Murata GRM155R60J225ME15D 2.2 mF 0402 size
COUT: Murata GRM188R60J475ME 4.7 mF 0603 size, VOUT >= 1.8 V
COUT: Taiyo Yuden AMK105BJ475MV 4.7 mF 0402 size, VOUT = 1.2 V
l: Murata LQM2HPN1R0MJ0
1 mH, LQM2HPN2R2MJ0 2.2 mH,
3
size 2.5x2.0x1.2mm
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
η
Efficiency
vs Load current
η
Efficiency
vs Output Current
8, 9, 10, 11
Output voltage
vs Output current
12, 13, 14, 15,
16, 17
Switching frequency
vs Output current
18, 19, 20, 21,
22, 23, 24, 25,
26, 27
28,29
VO
1, 2, 3, 4, 5, 6, 7
Output voltage peak to peak
vs Output current
IQ
Quiescent current
vs Ambient temperature
30
ISD
Shutdown current
vs Ambient temperature
31
PMOS Static drain-source on-state resistance
vs Supply voltage and ambient temperature
32
NMOS Static drain-source on-state resistance
vs Supply voltage and ambient temperature
33
Power supply rejection ratio
vs Frequency
rDS(ON)
PSRR
Typical operation
Line transient response
Mode transition PFM / forced PWM
AC - load regulation performance
Load transient response
Start-up
6
34
35, 36, 37
PFM
38
PWM
39
40
41 42, 43
44, 45, 46, 47
48, 49
Spurious Output Noise, 12R Load
50
Spurious Output Noise, 100R Load
51
Copyright © 2011, Texas Instruments Incorporated
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
100
100
VIN = 3.6 V
80
VIN = 2.9 V
70
VIN = 5 V
50
40
30
L = 2.2 mH (LQM2HPN2R2MJ0)
COUT = 4.7 mF
10
0
0.1
60
VIN = 5 V
50
40
20
MODE = VIN,
VOUT = 2.5 V,
10
L = 2.2 mH (LQM2HPN2R2MJ0)
COUT = 4.7 mF
0
1
10
100
IO - Output Current - mA
1
1000
Figure 1. Efficiency PFM/PWM Mode 2.5V Output Voltage
100
100
80
80
VIN = 3.3 V
VIN = 2.7 V
60
VIN = 4.2 V
VIN = 5 V
20
MODE = GND,
VOUT = 1.8 V,
10
L = 2.2 mH (MIPSA25202R2),
COUT = 4.7 mF
0
0.1
VIN = 2.3 V
VIN = 2.7 V
70
VIN = 3.6 V
Efficiency -%
Efficiency -%
70
30
1000
VIN = 2.3 V
90
40
10
100
IO - Output Current - mA
Figure 2. Efficiency Forced PWM Mode 2.5V Output
Voltage
90
50
VIN = 4.2 V
30
MODE = GND,
VOUT = 2.5V,
20
VIN = 3.6 V
80
VIN = 4.2 V
Efficiency -%
Efficiency -%
70
60
VIN = 2.9 V
90
90
VIN = 3.3 V
60
VIN = 3.6 V
50
VIN = 4.2 V
40
VIN = 5 V
30
20
MODE = VIN,
VOUT = 1.8 V,
10
L = 2.2 mH (MIPSA25202R2),
COUT = 4.7 mF
0
1
10
100
IO - Output Current - mA
1000
Figure 3. Efficiency PFM/PWM MODE 1.8V Output Voltage
Copyright © 2011, Texas Instruments Incorporated
1
10
100
IO - Output Current - mA
1000
Figure 4. Efficiency Forced PWM Mode 1.8V Output
voltage
7
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
100
100
90
VIN = 2.3 V
90
40
30
VIN = 3.6 V
Efficiency -%
Efficiency -%
50
70
VIN = 2.7 V
70
60
VIN = 4.2 V
VIN = 5 V
VIN = 2.7 V
60
VIN = 3.6 V
VIN = 4.2 V
50
VIN = 5 V
40
30
20
MODE = GND,
VOUT = 1.2 V,
10
L = 2.2 mH MIPSZ2012 2R2 (2012 size),
COUT = 4.7 mF
0
0.1
VIN = 2.3 V
80
80
20
MODE = VIN,
VOUT = 1.2 V,
10
L = 2.2 mH MIPSZ2012 2R2 (2012 size),
COUT = 4.7 mF
0
1
10
100
IO - Output Current - mA
1000
Figure 5. Efficiency PFM/PWM Mode 1.2V Output voltage
1
10
100
IO - Output Current - mA
Figure 6. Efficiency Forced PWM Mode 1.2V Output
Voltage
100
90
VIN = 3.6 V
90
85
80
70
MIPSD1R0
L = 1 mH 0805
(2x1.25x1mm3)
MIPSZ2012D2R2
L = 2.2 mH 0805
(2x1.25x1mm3)
MIPSA25202R2
L = 2.2 mH
(2.5x2x1.2mm3)
LQM2HPN1R0MJ0
L = 1 mH
(2.5x2x1.2mm3)
65
60
55
50
0.1
LQM21PN2R2
L = 2.2 mH 0805
(2x1.25x0.55mm3)
COUT = 4.7 mF (0402),
VOUT = 1.8 V,
VIN = 3.6 V
1000
Figure 7. Comparison Efficiency vs Inductor Value and
Size
8
VIN = 4.2 V
60
50
40
30
MODE = GND,
CIN = 2.2 mF (0402),
1
10
100
IO - Output Current - mA
VIN = 5 V
70
Efficiency - %
Efficiency -%
80
75
1000
TPS62233
MODE = GND,
VOUT = 3 V,
20
L = 1 mH,
COUT = 4.7 mF
10
0
0.1
1
10
100
IO - Output Current - mA
1000
Figure 8. Comparison Efficiency vs IOUT – TPS62233
Copyright © 2011, Texas Instruments Incorporated
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
100
90
VIN = 3.3 V
VIN = 3.3 V
90
80
VIN = 3.6 V
80
VIN = 4.2 V
Efficiency - %
Efficiency - %
70
60
VIN = 3.6 V
VIN = 4.2 V
70
60
50
50
40
40
VOUT = 1.2 V PFM,
MODE = GND
30
0.1
1
10
100
IO - Output Current - mA
TPS62236
VOUT = 1.85 V PFM
30
0.1
1000
Figure 9. Comparison Efficiency vs IOUT – TPS62235
1000
2.575
VIN = 3.3 V
MODE = VIN,
VOUT = 2.5 V,
2.55
80
VO - Output Voltage (DC) - V
VIN = 3.6 V
VIN = 4.2 V
70
Efficiency - %
10
100
IO - Output Current - mA
Figure 10. Comparison Efficiency vs IOUT – TPS62236
90
60
50
40
30
0.1
1
10
100
IO - Output Current - mA
1000
Figure 11. Comparison Efficiency vs IOUT – TPS622311
Copyright © 2011, Texas Instruments Incorporated
VIN = 3.3 V
VIN = 3.6 V
2.5
VIN = 4.2 V
2.475
VIN = 5 V
2.45
TPS622311
VOUT = 1.1 V PFM
1
2.525
L = 1 mH,
COUT = 4.7 mF,
TA = 25°C
2.425
0.1
1
10
100
IO - Output Current - mA
1000
Figure 12. 2.5V Output Voltage Accuracy forced PWM
Mode
9
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
2.575
VIN = 4.2 V
2.525
2.5
VIN = 5 V
VIN = 3.3 V
VIN = 3.6 V
2.475
MODE = GND,
VOUT = 1.8 V,
1.836
VO - Output Voltage (DC) - V
L = 1 mH,
COUT = 4.7 mF,
TA = 25°C
2.55
VO - Output Voltage (DC) - V
1.854
MODE = GND,
VOUT = 2.5 V,
2.425
0.1
1
10
100
IO - Output Current - mA
VIN = 3.6 V
VIN = 3.3 V
1.8
VIN = 4.2 V
1.782
1.746
0.01
1000
Figure 13. 2.5V Output Voltage Accuracy PFM/PWM Mode
VIN = 5 V
1.818
L = 1 mH,
COUT = 4.7 mF,
TA = 25°C
1.224
VIN = 3.3 V
VIN = 3.6 V
VIN = 5 V
VIN = 4.2 V
1.212
L = 2.2 mH,
COUT = 4.7 mF,
TA = 25°C
VIN = 3.3 V
VIN = 3.6 V
1.2
VIN = 4.2 V
1.188
VIN = 5 V
1.176
1.764
1.746
0.1
1000
MODE = VIN,
VOUT = 1.2 V,
1.8
1.782
1
10
100
IO - Output Current - mA
1.236
MODE = VIN,
VOUT = 1.8 V,
VO - Output Voltage (DC) - V
1.836
0.1
Figure 14. 1.8V Output Voltage Accuracy PFM/PWM Mode
1.854
VO - Output Voltage (DC) - V
1.818
1.764
2.45
1
10
100
IO - Output Current - mA
1000
Figure 15. 1.8V Output Voltage Accuracy Forced PWM
MODE
10
L = 2.2 mH,
COUT = 4.7 mF,
TA = 25°C
1.164
0.1
1
10
100
IO - Output Current - mA
1000
Figure 16. 1.2V Output Voltage Accuracy Forced PWM
MODE
Copyright © 2011, Texas Instruments Incorporated
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
1.236
4000
MODE = GND,
VOUT = 1.2 V,
VIN = 5 V
3500
L = 2.2 mH,
COUT = 4.7 mF,
TA = 25°C
VIN = 4.2 V
3000
VIN = 3.3 V
1.212
f - Frequency - kHz
VO - Output Voltage (DC) - V
1.224
VIN = 3.6 V
1.2
VIN = 4.2 V
1.188
VIN = 5 V
VIN = 3.6 V
VIN = 3.3 V
2500
2000
1500
1000
1.176
0
0.1
1
10
IO - Output Current - mA
100
1000
Figure 17. 1.2V Output Voltage Accuracy PFM/PWM MODE
4000
0
VIN = 4.2 V
VIN = 3.6 V
3500
3000
VIN = 3.3 V
f - Frequency - kHz
f - Frequency - kHz
3000
2500
2000
1500
500
0
0
100
500
VIN = 5 V
VIN = 3.6 V
VIN = 2.3 V
200
300
400
IO - Output Current - mA
4000
VIN = 4.2 V
1000
100
Figure 18. Switching Frequency vs Output Current, 1.8V
Output Voltage MODE = GND
VIN = 5 V
3500
L = 2.2 mH,
COUT = 4.7 mF,
TA = 25°C
VIN = 2.3 V
500
1.164
0.01
MODE = GND,
VOUT = 1.8 V,
VIN = 2.7 V
VIN = 2.7 V
MODE = GND,
VOUT = 1.8 V,
2000
1500
VIN = 2.7 V
VIN = 2.3 V
500
500
Figure 19. Switching Frequency vs Output Current, 1.8V
Output Voltage MODE = GND
Copyright © 2011, Texas Instruments Incorporated
2500
1000
L = 1 mH,
COUT = 4.7 mF,
TA = 25°C
200
300
400
IO - Output Current - mA
VIN = 3.3 V
0
0
100
MODE = VIN,
VOUT = 1.8 V,
L = 2.2 mH,
COUT = 4.7 mF,
TA = 25°C
200
300
400
IO - Output Current - mA
500
Figure 20. Switching Frequency vs Output Current, 1.8V
Output Voltage MODE = VIN
11
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
4000
4000
3500
VIN = 5 V
L = 2.2 mH,
C
= 4.7 mF,
VIN = 3.3 V OUT
TA = 25°C
3000
VIN = 3.6 V
2000
VIN = 3.3 V
1500
2500
2000
1500
1000
1000
VIN = 3 V
500
0
0
100
VIN = 3 V
500
0
200
300
400
IO - Output Current - mA
500
Figure 21. Switching Frequency vs Output Current, 2.5V
Output Voltage MODE = GND
0
100
VIN = 5 V
VIN = 4.2 V
3000
2500
VIN = 4.2 V
VIN = 3.3 V
2500
VIN = 3.6 V
VIN = 3.6 V
f - Frequency - kHz
f - Frequency - kHz
500
3000
VIN = 5 V
VIN = 2.7 V
2000
1500
VIN = 2.3 V
1000
VIN = 2 V
500
0
0
200
300
400
IO - Output Current - mA
Figure 22. Switching Frequency vs Output Current, 2.5V
Output Voltage MODE = VIN
3500
MODE = GND,
VOUT = 1.2 V,
L = 2.2 mH,
COUT = 4.7 mF,
TA = 25°C
VIN = 3.3 V
2000
1500
VIN = 2.3 V
VIN = 2 V
1000
200
300
400
IO - Output Current - mA
500
VIN = 2.7 V
MODE = VIN,
VOUT = 1.2 V,
500
L = 2.2 mH,
COUT = 4.7 mF,
TA = 25°C
0
100
Figure 23. Switching Frequency vs Output Current, 1.2V
Output Voltage MODE = GND
12
MODE = VIN,
VOUT = 2.5 V,
VIN = 4.2 V
VIN = 3.6 V
f - Frequency - kHz
2500
VIN = 5 V
3500
L = 2.2 mH,
VIN = 4.2 V COUT = 4.7 mF,
TA = 25°C
3000
f - Frequency - kHz
MODE = GND,
VOUT = 2.5 V,
0
100
200
300
400
IO - Output Current - mA
500
Figure 24. Switching Frequency vs Output Current, 1.2V
Output Voltage MODE = VIN
Copyright © 2011, Texas Instruments Incorporated
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
3000
2500
VIN = 5 V
VIN = 4.2 V
1500
VIN = 2.3 V
VIN = 2.7 V
VIN = 3.3 V
1000
VIN = 4.2 V
f - Frequency - KHz
f - Frequency - KHz
2000
TPS62235
MODE = GND,
VOUT = 1.2 V,
500
1500
VIN = 3.3 V
VIN = 3.6 V
1000
500
VIN = 2.3 V
0
0
0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50
IO - Output Current - A
Figure 25. Switching Frequency vs Output Current, 1.2V
Output Voltage MODE = PFM – TPS62235
1500
VIN = 2.7 V
VIN = 3.3 V
VIN = 2.3 V
1000
TPS622311
MODE = GND,
VOUT = 1.1 V,
500
L = 2.2 mH,
COUT = 4.7 mF
0
0
0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50
IO - Output Current - A
Figure 27. Switching Frequency vs Output Current, 1.1V
Output Voltage MODE = PFM – TPS622311
Copyright © 2011, Texas Instruments Incorporated
VO(PP) - Peak-to-Peak Output Voltage - mV
2500
TPS62230
45 VO = 2.5 V,
L = 2.2 mH 2012,
40 (MIPSZ2012),
CO = 4.7 mF 0402
35
VIN = 4.2 V
L = 2.2 mH,
COUT = 4.7 mF
Figure 26. Switching Frequency vs Output Current, 1.85V
Output Voltage MODE = PFM –TPS62236
50
2000
TPS62236
MODE = GND,
VOUT = 1.85 V,
0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45
IO - Output Current - A
3000
VIN = 5 V
f - Frequency - KHz
2000
VIN = 2.7 V
L = 2.2 mH,
COUT = 4.7 mF
0
0
VIN = 5 V
2500
VIN = 3.6 V
30
VI = 3.3 V
25
VI = 3.6 V
20
15
10
5
VI = 4.2 V
0
0
50
100 150 200 250 300 350 400 450 500
IO - Output Current - mA
Figure 28. Output Voltage, Peak-to-Peak vs Output Current
- TPS62230
13
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
35
TPS62230
VO = 1.8 V,
TA = 85°C
25 L = 2.2 mH 2012,
(MIPSZ2012),
CO = 4.7 mF 0402
20
VI = 3.3 V
VI = 3.6 V
15
10
VI = 4.2 V
5
0
50
100 150 200 250 300 350 400 450 500
IO - Output Current - mA
ISD - Shutdown Current - mA
0.16
0.14
0.12
0.1
TA = 60°C
TA = 25°C
TA = -40°C
0.06
0.04
0.02
0
2
2.5
3
3.5
4
4.5
5
VIN - Input Voltage - V
5.5
6
Figure 31. Shutdown Current ISD vs Ambient Temperature
TA
rDS(ON) - Static Drain-Source On-State Resistance - W
TA = 85°C
0.08
TA = -40°C
2
2.5
3
3.5
4
4.5
5
VIN - Input Voltage - V
5.5
6
Figure 30. Quiescent Current IQ vs Ambient Temperature
TA
0.2
14
20
15
Figure 29. Output Voltage, Peak-to-Peak vs Output
Current – TPS62231-Q1
0.18
TA = 25°C
25
10
0
TA = 60°C
30
IQ - Quiescent Current - mA
VO(PP) - Peak-to-Peak Output Voltage - mV
30
2
PMOS
1.8
TA = 85°C
TA = 60°C
1.6
1.4
TA = 25°C
1.2
TA = -40°C
1
0.8
0.6
0.4
0.2
0
2
2.5
3
3.5
4
4.5
5
VIN - Input Voltage - V
5.5
6
Figure 32. PMOS RDS(ON) vs Supply Voltage VIN and
Ambient Temperature TA
Copyright © 2011, Texas Instruments Incorporated
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
100
0.7
NMOS
PSRR - Power Supply Rejection Ratio - dB
rDS(ON) - Static Drain-Source On-State Resistance - W
TYPICAL CHARACTERISTICS (continued)
TA = 85°C
0.6
TA = 60°C
0.5
TA = 25°C
TA = -40°C
0.4
0.3
0.2
0.1
IOUT = 50 mA,
MODE = 0,
forced PWM
90
80
70
60
IOUT = 50 mA,
MODE = 1,
PFM/PWM
IOUT = 150 mA,
PWM Mode
50
40
30
VIN = 3.6 V,
VOUT = 1.8 V,
20
CIN = 2.2 mF,
COUT = 4.7 mF,
10
L = 2.2 mH
0
2
2.5
3
3.5
4
4.5
5
VIN - Input Voltage - V
5.5
6
0
10
100
Figure 33. NMOS RDS(ON) vs Supply Voltage VIN and
Ambient Temperature TA
SW
2 V/div
1k
10k
f - Frequency - kHz
100k
1M
Figure 34. TPS62231 1.8V PSRR
VIN = 3.6 V
VIN = 3.6V
COUT = 4.7 mF
L = 1 mH
VOUT = 2.5V
20 mV/Div
VOUT = 2.5V
20 mV/div
COUT = 4.7 mF
SW
2 V/div
MODE = GND
IOUT = 10 mA
L = 2.2 mH
MODE = GND
IOUT = 10 mA
IL
200 mA/Div
t - Time - 1 ms/div
Figure 35. PFM Mode Operation IOUT = 10mA
Copyright © 2011, Texas Instruments Incorporated
IL
200 mA/div
t - Time - 1 ms/div
Figure 36. PFM Mode Operation IOUT = 10mA
15
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
VOUT = 2.5 V
20 mV/div
MODE = VIN
IOUT = 10 mA
VIN = 3.6 V
COUT = 4.7 mF
L = 1 mH
VIN = 3.6 V to 4.2 V
200 mV/div
SW
2 V/div
IL
200 mA/div
COUT = 4.7 mF
VOUT = 1.8 V
20 mV/div
t - Time - 500 ns/div
Figure 37. Forced PWM Mode Operation IOUT = 10mA
L = 2.2 mH
MODE = GND
IOUT = 50 mA
t - Time - 10 ms/div
Figure 38. Line Transient Response PFM Mode
MODE: 0 V to 3.6 V
2 V/div
PFM Mode Operation
VIN = 3.6 V to 4.2 V
200 mV/div
Forced PWM
Mode Operation
VSW
2 V/div
VIN = 3.6 V,
ICOIL
200 mA/div
VOUT = 1.8 V
20 mV/div
L = 1 mH
IOUT = 10 mA
COUT = 4.7 mF
L = 2.2 mH
MODE = VIN
IOUT = 50 mA
t - Time - 100 ms/div
Figure 39. Line Transient Response PWM Mode
16
COUT = 4.7 mF
VOUT = 1.8 V
20 mV/div
t - Time - 1 ms/div
Figure 40. Mode Transition PFM / Forced PWM Mode
Copyright © 2011, Texas Instruments Incorporated
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
VIN = 3.6 V
VOUT = 2.5 V
50 mV/div
COUT = 4.7 mF
VOUT = 2.5 V
50 mV/div
L = 2.2 mH
MODE = GND
VIN = 3.6 V
IOUT = 5 mA to 200 mA
sinusoidal
100 mA/div
IOUT = 5mA to 200mA
sinusoidal
100mA/Div
IL
200 mA/div
COUT = 4.7 mF
L = 2.2 mH
MODE = VIN
IL
200 mA/div
t - Time - 5 ms/div
t - Time - 5 ms/div
Figure 41. AC – Load Regulation Performance 2.5V VOUT
PFM Mode
Figure 42. AC – Load Regulation Performance 2.5V VOUT
PWM Mode
VIN = 3.6 V
COUT = 4.7 mF
VOUT = 1.8 V
50 mV/div
L = 2.2 mH
MODE = GND
IOUT = 5 mA to 150 mA, 50 kHz
sinusoidal 100 mA/div
VOUT = 2.5 V
50 mV/div
VIN = 3.6 V
COUT = 4.7 mF
IOUT = 5 mA to 200 mA
100 mA/div
L = 1 mH
MODE = GND
IL
200 mA/div
IL
200 mA/div
t - Time - 4 ms/div
Figure 43. AC – Load Regulation Performance 1.8V VOUT
PFM Mode
Copyright © 2011, Texas Instruments Incorporated
t - Time - 5 ms/div
Figure 44. Load Transient Response 5mA to 200mA PFM
to PWM Mode, VOUT 2.5V
17
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
VIN = 3.6 V
VOUT = 2.5 V
50 mV/div
COUT = 4.7 mF
VOUT = 1.8 V
50 mV/div
L = 2.2 mH
MODE = GND
VIN = 3.6 V
IOUT = 5 mA to 200 mA
100 mA/div
COUT = 4.7 mF
L = 1 mH
MODE = VIN
IL
200 mA/div
I OUT = 5 mA to 150 mA
100 mA/div
IL
200 mA/div
t - Time - 10 ms/div
t - Time - 5 ms/div
Figure 45. Load Transient Response 5mA to 200mA,
Forced PWM Mode, VOUT 2.5V
Figure 46. Load Transient Response 5mA to 150mA, PFM
to PWM Mode, VOUT 1.8V
VIN = 3.6 V
COUT = 4.7 mF
VOUT = 1.8 V
50 mV/div
L = 2.2 mH
MODE = VIN
EN
2 V/div
SW
2 V/div
VIN = 3.6 V
IOUT = 5 mA to 150 mA
100 mA/div
IL
200 mA/div
COUT = 4.7 mF
L = 1 mH
MODE = GND
Load = 20 R
IIN
50 mA/div
t - Time - 10 ms/div
Figure 47. Load Transient Response 5mA to 150mA,
Forced PWM Mode, VOUT 1.8V
18
VOUT = 0 V to 2.5 V
1 V/div
t - Time - 20 ms/div
Figure 48. Start Up into 20Ω Load, VOUT 2.5V
Copyright © 2011, Texas Instruments Incorporated
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
1m
EN 2 V/div
900m
TPS62231
MODE = GND,
VOUT = 1.8 V,
Ref Lvl = 1mV
RBW 30kHz
VBW 30kHz
SWT ´115ms
RLOAD = 12R
800m
700m
VOUT = 1.8 V
1 V/div
VOUT Pre Bias = 1V
VIN = 2.7V(green)
Noise
600m
SW 5 V/div
IL
200 mA/div
L = 2.2 mH,
(MIPSZ2012 2R2, Size 2012)
COUT = 4.7 mF (Size 0402)
500m
VIN = 3.6 V
400m
COUT = 4.7 mF
300m
L = 2.2 mH
MODE = GND
IOUT = 0 mA
200m
VIN = 3V(red)
VIN = 3.6V(blue)
VIN = 4.2V(yellow)
100m
10n
Time Base - 20 ms/div
Start
0 Hz
Figure 49. Startup in 1V Pre-biased Output
800m
Stop
40 MHz
Figure 50. Spurious Output Noise, 12R Load,
TPS62231-Q1
1m
900m
4 MHz
f - Frequency
TPS62231
MODE = GND,
VOUT = 1.8 V,
Ref Lvl = 1mV
RBW 30kHz
VBW 30kHz
SWT 28ms
RLOAD = 100R
L = 2.2 mH,
(MIPSZ2012 2R2, Size 2012)
COUT = 4.7 mF (Size 0402)
700m
Noise
600m
VIN = 4.2V(yellow)
500m
VIN = 3.6V(blue)
400m
VIN = 3V(red)
300m
200m
VIN = 2.7V(green)
100m
10n
Stop
1 MHz
10 MHz
f - Frequency
Figure 51. Spurious Output Noise, 100R Load, TPS62231-Q1
Start
0 Hz
Copyright © 2011, Texas Instruments Incorporated
19
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
DETAILED DESCRIPTION
The TPS6223x-Q1 synchronous step down converter family includes a unique hysteretic PWM controller scheme
which enables switch frequencies over 3MHz, excellent transient and AC load regulation as well as operation
with cost competitive external components.
The controller topology supports forced PWM Mode as well as Power Save Mode operation. Power Save Mode
operation reduces the quiescent current consumption down to 22 μA and ensures high conversion efficiency at
light loads by skipping switch pulses. In forced PWM Mode, the device operates on a quasi fixed frequency,
avoids pulse skipping, and allows filtering of the switch noise by external filter components.
The TPS6223x-Q1 devices offer fixed output voltage options featuring smallest solution size by using only three
external components.
The internal switch current limit of typical 850 mA supports output currents of up to 500 mA, depending on the
operating condition.
A significant advantage of TPS6223x-Q1 compared to other hysteretic PWM controller topologies is its excellent
DC and AC load regulation capability in combination with low output voltage ripple over the entire load range
which makes this part well suited for audio and RF applications.
OPERATION
Once the output voltage falls below the threshold of the error comparator, a switch pulse is initiated, and the high
side switch is turned on. It remains turned on until a minimum on time of tONmin expires and the output voltage
trips the threshold of the error comparator or the inductor current reaches the high side switch current limit. Once
the high side switch turns off, the low side switch rectifier is turned on and the inductor current ramps down until
the high side switch turns on again or the inductor current reaches zero.
In forced PWM Mode operation, negative inductor current is allowed to enable continuous conduction mode even
at no load condition.
POWER SAVE MODE
Connecting the MODE pin to GND enables the automatic PWM and power-save mode operation. The converter
operates in quasi fixed frequency PWM mode at moderate to heavy loads and in the PFM (Pulse Frequency
Modulation) mode during light loads, which maintains high efficiency over a wide load current range. In PFM
Mode, the device starts to skip switch pulses and generates only single pulses with an on time of tONmin. The
PFM Mode frequency depends on the load current and the external inductor and output capacitor values. The
PFM Mode of TPS6223x-Q1 is optimized for low output voltage ripple if small external components are used.
Even at low output currents, the PFM frequency is above the audible noise spectrum and makes this operation
mode suitable for audio applications.
The on time tONmin can be estimated to:
V
t ONmin = OUT ´ 260 ns
VIN
(1)
Therefore, the peak inductor current in PFM mode is approximately:
(V - VOUT )
´ t ONmin
ILPFMpeak = IN
L
(2)
The transition from PFM into PWM mode and vice versa can be estimated to:
IOUT_PFM/PWM = 0.5 x ILPFMpeak
(3)
With
tON: High side switch on time [ns]
VIN: Input voltage [V]
VOUT: Output voltage [V]
L : Inductance [μH]
ILPFMpeak : PFM inductor peak current [mA]
IOUT_PFM/PWM : Output current for PFM to PWM mode transition and vice versa [mA]
20
Copyright © 2011, Texas Instruments Incorporated
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
FORCED PWM MODE
Pulling the MODE pin high forces the converter to operate in a continuous conduction PWM mode even at light
load currents. The advantage is that the converter operates with a quasi fixed frequency that allows simple
filtering of the switching frequency for noise-sensitive applications. In this mode, the efficiency is lower compared
to the power-save mode during light loads.
For additional flexibility, it is possible to switch from power-save mode to forced PWM mode during operation.
This allows efficient power management by adjusting the operation of the converter to the specific system
requirements.
100% DUTY CYCLE LOW DROPOUT OPERATION
The device starts to enter 100% duty cycle mode once the input voltage comes close to the nominal output
voltage. In order to maintain the output voltage, the High Side switch is turned on 100% for one or more cycles.
With further decreasing VIN the High Side MOSFET switch is turned on completely. In this case the converter
offers a low input-to-output voltage difference. This is particularly useful in battery-powered applications to
achieve longest operation time by taking full advantage of the whole battery voltage range.
The minimum input voltage to maintain regulation depends on the load current and output voltage, and can be
calculated as:
VINmin = VOUT max + IOUT max ´ RDS(on)max+ RL
(
)
(4)
With:
IOUTmax = maximum output current plus inductor ripple current
RDS(on)max = maximum P-channel switch RDSon.
RL = DC resistance of the inductor
VOUTmax = nominal output voltage plus maximum output voltage tolerance
UNDER VOLTAGE LOCKOUT
The under voltage lockout circuit prevents the device from misoperation at low input voltages. It prevents the
converter from turning on the switch or rectifier MOSFET under undefined conditions. The TPS6223x-Q1 devices
have a UVLO threshold set to 1.8V (typical). Fully functional operation is permitted for input voltage down to the
falling UVLO threshold level. The converter starts operation again once the input voltage trips the rising UVLO
threshold level.
SOFT START
The TPS6223x-Q1 has an internal soft-start circuit that controls the ramp up of the output voltage and limits the
inrush current during start-up. This limits input voltage drops when a battery or a high-impedance power source
is connected to the input of the converter.
The soft-start system generates a monotonic ramp up of the output voltage and reaches the nominal output
voltage typically 100μs after EN pin was pulled high.
Should the output voltage not have reached its target value by this time, such as in the case of heavy load, the
converter then operates in a current limit mode set by its switch current limits.
TPS6223x-Q1 is able to start into a pre-biased output capacitor. The converter starts with the applied bias
voltage and ramps the output voltage to its nominal value.
ENABLE / SHUTDOWN
The device starts operation when EN is set high and starts up with the soft start as previously described. For
proper operation, the EN pin must be terminated and must not be left floating.
Pulling the EN pin low forces the device into shutdown, with a shutdown quiescent current of typically 0.1 μA. In
this mode, the P and N-channel MOSFETs are turned off, the internal resistor feedback divider is disconnected,
and the entire internal-control circuitry is switched off.
Copyright © 2011, Texas Instruments Incorporated
21
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
The EN input can be used to control power sequencing in a system with various DC/DC converters. The EN pin
can be connected to the output of another converter, to drive the EN pin high and getting a sequencing of supply
rails.
SHORT-CIRCUIT PROTECTION
The TPS6223x-Q1 integrates a High Side and Low Side MOSFET current limit to protect the device against
heavy load or short circuit. The current in the switches is monitored by current limit comparators. When the
current in the P-channel MOSFET reaches its current limit, the P-channel MOSFET is turned off and the
N-channel MOSFET is turned on to ramp down the current in the inductor. The High Side MOSFET switch can
only turn on again, once the current in the Low Side MOSFET switch has decreased below the threshold of its
current limit comparator.
THERMAL SHUTDOWN
As soon as the junction temperature, TJ, exceeds 150°C (typical) the device goes into thermal shutdown. In this
mode, the High Side and Low Side MOSFETs are turned-off. The device continues its operation when the
junction temperature falls below the thermal shutdown hysteresis.
22
Copyright © 2011, Texas Instruments Incorporated
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
APPLICATION INFORMATION
VIN
2.05 V - 6 V
L
1/2.2 mH
TPS62231
VIN
EN
CIN
2.2 mF
MODE
SW
FB
GND
VOUT
1.8 V
COUT
4.7 mF
Figure 52. TPS62231 1.8V Output
OUTPUT FILTER DESIGN (INDUCTOR AND OUTPUT CAPACITOR)
The TPS6223x-Q1 is optimized to operate with effective inductance values in the range of 0.7 μH to 4.3 μH and
with effective output capacitance in the range of 2 μF to 15 μF. The internal compensation is optimized to
operate with an output filter of L = 1 μH/2.2 μH and COUT = 4.7 μF. Larger or smaller inductor/capacitor values
can be used to optimize the performance of the device for specific operation conditions. For more details, see the
CHECKING LOOP STABILITY section.
INDUCTOR SELECTION
The inductor value affects its peak-to-peak ripple current, the PWM-to-PFM transition point, the output voltage
ripple and the efficiency. The selected inductor has to be rated for its dc resistance and saturation current. The
inductor ripple current (ΔIL) decreases with higher inductance and increases with higher VI N or VO UT. Equation 5
calculates the maximum inductor current under static load conditions. The saturation current of the inductor
should be rated higher than the maximum inductor current as calculated with Equation 6. This is recommended
because during heavy load transient the inductor current will rise above the calculated value.
Vout
1Vin
D IL = Vout ´
L ´ ¦
(5)
ILmax = Ioutmax +
DIL
2
(6)
With:
f = Switching Frequency
L = Inductor Value
ΔIL= Peak to Peak inductor ripple current
ILmax = Maximum Inductor current
In high-frequency converter applications, the efficiency is essentially affected by the inductor AC resistance (i.e.,
quality factor) and to a smaller extent by the inductor DCR value. To achieve high efficiency operation, care
should be taken in selecting inductors featuring a quality factor above 25 at the switching frequency. Increasing
the inductor value produces lower RMS currents, but degrades transient response. For a given physical inductor
size, increased inductance usually results in an inductor with lower saturation current.
The total losses of the coil consist of both the losses in the DC resistance, R(DC), and the following
frequency-dependent components:
• The losses in the core material (magnetic hysteresis loss, especially at high switching frequencies)
• Additional losses in the conductor from the skin effect (current displacement at high frequencies)
• Magnetic field losses of the neighboring windings (proximity effect)
• Radiation losses
The following inductor series from different suppliers have been used with the TPS6223x-Q1 converters.
Copyright © 2011, Texas Instruments Incorporated
23
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
Table 1. List of inductors
INDUCTANCE
[μH]
DIMENSIONS
[mm3]
INDUCTOR TYPE
SUPPLIER
1.0/2.2
2.5 × 2.0 × 1.2
LQM2HPN1R0MJ0
Murata
2.2
2.0 × 1.2 × 0.55
LQM21PN2R2
Murata
1.0/2.2
2.0 × 1.2 × 1.0
MIPSZ2012
FDK
1.0/2.2
2.0 × 2.5 × 1.2
MIPSA2520
FDK
1.0/2.2
2.0 × 1.2 × 1.0
KSLI2012 series
Hitachi Metal
OUTPUT CAPACITOR SELECTION
The unique hysteretic PWM control scheme of the TPS62230 allows the use of tiny ceramic capacitors. Ceramic
capacitors with low ESR values have the lowest output voltage ripple and are recommended. The output
capacitor requires either an X7R or X5R dielectric. Y5V and Z5U dielectric capacitors, aside from their wide
variation in capacitance over temperature, become resistive at high frequencies.
At light load currents the converter operate in Power Save Mode and the output voltage ripple is dependent on
the output capacitor value and the PFM peak inductor current. Higher output capacitor values minimize the
voltage ripple in PFM Mode and tighten DC output accuracy in PFM Mode.
INPUT CAPACITOR SELECTION
Because of the nature of the buck converter having a pulsating input current, a low ESR input capacitor is
required for best input voltage filtering and minimizing the interference with other circuits caused by high input
voltage spikes. For most applications a 2.2 μF to 4.7 μF ceramic capacitor is recommended. The input capacitor
can be increased without any limit for better input voltage filtering. Because ceramic capacitor loses up to 80% of
its initial capacitance at 5 V, it is recommended to use 4.7 μF input capacitors for input voltages > 4.5 V.
Take care when using only small ceramic input capacitors. When a ceramic capacitor is used at the input and the
power is being supplied through long wires, such as from a wall adapter, a load step at the output or VIN step on
the input can induce ringing at the VIN pin. This ringing can couple to the output and be mistaken as loop
instability or could even damage the part by exceeding the maximum ratings.
Table 2 shows a list of tested input/output capacitors.
Table 2. List of Capacitor
CAPACITANCE [μF]
SIZE
CAPACITOR TYPE
SUPPLIER
2.2
0402
GRM155R60J225
Murata
4.7
0402
AMK105BJ475MV
Taiyo Yuden
4.7
0402
GRM155R60J475
Murata
4.7
0402
CL05A475MQ5NRNC
Samsung
4.7
0603
GRM188R60J475
Murata
CHECKING LOOP STABILITY
The first step of circuit and stability evaluation is to look from a steady-state perspective at the following signals:
• Switching node, SW
• Inductor current, IL
• Output ripple voltage, VOUT(AC)
These are the basic signals that need to be measured when evaluating a switching converter. When the
switching waveform shows large duty cycle jitter or the output voltage or inductor current shows oscillations, the
regulation loop may be unstable. This is often a result of board layout and/or L-C combination.
As a next step in the evaluation of the regulation loop, the load transient response is tested. The time between
24
Copyright © 2011, Texas Instruments Incorporated
TPS62231-Q1
TPS622314-Q1
SLVSB63 – DECEMBER 2011
www.ti.com
the application of the load transient and the turn on of the P-channel MOSFET, the output capacitor must supply
all of the current required by the load. VOUT immediately shifts by an amount equal to ΔI(LOAD) x ESR, where ESR
is the effective series resistance of COUT. ΔI(LOAD) begins to charge or discharge CO generating a feedback error
signal used by the regulator to return VOUT to its steady-state value. The results are most easily interpreted when
the device operates in PWM mode.
During this recovery time, VOUT can be monitored for settling time, overshoot or ringing that helps judge the
converter’s stability. Without any ringing, the loop has usually more than 45° of phase margin.
Because the damping factor of the circuitry is directly related to several resistive parameters (e.g., MOSFET
rDS(on)) that are temperature dependant, the loop stability analysis has to be done over the input voltage range,
load current range, and temperature range.
LAYOUT CONSIDERATIONS
As for all switching power supplies, the layout is an important step in the design. Proper function of the device
demands careful attention to PCB layout. Care must be taken in board layout to get the specified performance. If
the layout is not carefully done, the regulator could show poor line and/or load regulation, stability issues as well
as EMI problems. It is critical to provide a low inductance, impedance ground path. Therefore, use wide and
short traces for the main current paths. The input capacitor should be placed as close as possible to the IC pins
as well as the inductor and output capacitor.
Use a common Power GND node and a different node for the Signal GND to minimize the effects of ground
noise. Keep the common path to the GND PIN, which returns the small signal components and the high current
of the output capacitors as short as possible to avoid ground noise. The FB line should be connected to the
output capacitor and routed away from noisy components and traces (e.g. SW line).
L1
V IN
Total area
is less than
12mm²
C1
C2
GND
V OUT
Figure 53. Recommended PCB Layout for TPS6223x-Q1
Copyright © 2011, Texas Instruments Incorporated
25
PACKAGE OPTION ADDENDUM
www.ti.com
26-Dec-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
TPS622314TDRYRQ1
ACTIVE
SON
DRY
6
5000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
TPS62231TDRYRQ1
ACTIVE
SON
DRY
6
5000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS62231-Q1, TPS622314-Q1 :
• Catalog: TPS62231, TPS622314
NOTE: Qualified Version Definitions:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Dec-2011
• Catalog - TI's standard catalog product
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Dec-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPS622314TDRYRQ1
SON
DRY
6
5000
179.0
8.4
1.2
1.65
0.7
4.0
8.0
Q1
TPS62231TDRYRQ1
SON
DRY
6
5000
179.0
8.4
1.2
1.65
0.7
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Dec-2011
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS622314TDRYRQ1
SON
DRY
6
5000
195.0
200.0
45.0
TPS62231TDRYRQ1
SON
DRY
6
5000
195.0
200.0
45.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated