MPS NB675GL

NB675
The Future of Analog IC Technology
24V, High Current
Synchronous Buck Converter
With +/-1.5A LDO and Buffed Reference
DESCRIPTION
FEATURES
The NB675 provides a complete power supply
for DDR3, DDR3L and LPDDR2 memory with
the highest power density. It integrates a high
frequency synchronous rectified step-down
switch mode converter (VDDQ) with an 1.5A
sink/source LDO (VTT) and buffered low noise
reference (VTTREF).
•
•
•
•
•
•
The fully integrated Buck converter is able to
deliver 10A continuous output current and 12A
peak output current over a wide input supply
range with excellent load and line regulation.
The Buck converter employs the Constant-OnTime (COT) control scheme, which provides
fast transient response and eases loop
stabilization.
•
•
•
•
•
Wide 5V to 24V Operating Input Range
10A Continuous Output Current
12A Peak Output Current
Built-in +/- 1.5A VTTLDO
Low RDS(ON) Internal Power MOSFETs
Proprietary Switching Loss Reduction
Technique
Internal Soft Start
Output Discharge
500kHZ Switching Frequency
OCP, OVP, UVP Protection and Thermal
Shutdown
VDDQ Adjustable from 0.604V to 5.5V
APPLICATIONS
•
•
•
•
•
•
•
The VTT LDO provides 1.5A sink/source
current capability and requires only 10uF
ceramic capacitance.
The VTTREF tracks VDDQ/2 with an excellent
1% accuracy.
Under voltage lockout is internally set as 4.5V.
An open drain power good signal indicates
VDDQ is within its nominal voltage range.
Laptop Computer
Tablet PC
Networking Systems
Server
Personal Video Recorders
Flat Panel Television and Monitors
Distributed Power Systems
All MPS parts are lead-free and adhere to the RoHS directive. For MPS green
status, please visit MPS website under Products, Quality Assurance page.
“MPS” and “The Future of Analog IC Technology” are registered trademarks of
Monolithic Power Systems, Inc.
Full protection features include OCP, OVP, and
thermal shut down.
This part requires minimum number of external
components and is available in QFN21
(3mmx4mm) package.
TYPICAL APPLICATION
220nF
VIN
5-21V
VIN
BST
75
65
NB675
55
PG
VDDQSEN
VCC
45
VINLDO
VTT
AGND
PGND
95
85
FB
EN 1
EN 2
VDDQ
1.35V/10A
SW
VTTREF
VTTSEN
220nF
VTT
0.675V/2A
35
25
15
0.001
0.01
0.1
1
10
LOAD CURRENT (A)
NB675 Rev. 1.0
1/14/2013
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1
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
ORDERING INFORMATION
Part Number*
NB675GL
Package
QFN21 (3mmx4mm)
Top Marking
NB675
* For Tape & Reel, add suffix –Z (e.g. NB675GL–Z)
PACKAGE REFERENCE
TOP VIEW
BST
1
SW
2
SW
NC
EN2
VCC
EN1
FB
PG
18
17
16
15
14
13
19
VIN
20
PGND
21
PGND
12
VIN
11
PGND
10
PGND
3
5
4
6
7
8
9
VTTSEN
VTT
VDDQSEN
VTTREF
VINLDO
AGND
EXPOSED PAD
ON BACKSIDE
(5)
ABSOLUTE MAXIMUM RATINGS (1)
Thermal Resistance
Supply Voltage VIN ....................................... 24V
VSW ...............................................-0.3V to 24.3V
VSW (30ns)..........................................-3V to 28V
VSW (5ns)............................................-6V to 28V
VBST ................................................... VSW + 5.5V
VEN ............................................................... 12V
Enable Current IEN (2)................................ 2.5mA
All Other Pins ..............................–0.3V to +5.5V
(3)
Continuous Power Dissipation (TA=+25°)
QFN21 ..................................................... 2.5W
Junction Temperature ...............................150°C
Lead Temperature ....................................260°C
Storage Temperature............... -65°C to +150°C
Notes:
1) Exceeding these ratings may damage the device.
2) Refer to Page 13 of Configuring the EN Control.
3) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ(MAX), the junction-toambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD(MAX)=(TJ(MAX)TA)/θJA. Exceeding the maximum allowable power dissipation
will cause excessive die temperature, and the regulator will go
into thermal shutdown. Internal thermal shutdown circuitry
protects the device from permanent damage.
4) The device is not guaranteed to function outside of its
operating conditions.
5) Measured on JESD51-7, 4-layer PCB.
Recommended Operating Conditions
θJA
θJC
QFN21 (3mmx4mm) ...............50 ...... 12 ... °C/W
(4)
Supply Voltage VIN ..............................5V to 22V
Output Voltage VOUT ....................0.604V to 5.5V
Enable Current IEN....................................... 1mA
Operating Junction Temp. (TJ). -40°C to +125°C
NB675 Rev. 1.0
1/14/2013
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2
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
ELECTRICAL CHARACTERISTICS
VIN = 12V, TJ = 25°C, unless otherwise noted.
Parameters
Symbol
Supply Current
Supply Current (Shutdown)
IIN
Supply Current (In S0 Mode)
IIN
Supply Current (In S3 Mode)
IIN
Condition
VEN = 0V
VEN1 = VEN1 =2V,
VFB = 0.65V, IVTT = 0A
VEN1 = 0V, VEN2 = 2V,
VFB = 0.65V
Min
Typ
Max
Units
0
1
μA
300
400
500
μA
160
190
220
μA
MOSFET
High-side Switch On Resistance
HSRDS-ON
TJ =25°C
25
mΩ
Low-side Switch On Resistance
LSRDS-ON
TJ =25°C
9
mΩ
VEN = 0V, VSW = 0V
0
1
μA
10
11
12
A
400
250
500
300
600
350
kHz
ns
125
130
2.5
60
12
135
%VREF
μs
%VREF
μs
598
604
10
1.6
610
50
1.95
mV
nA
ms
1.15
1.25
100
3
0
1.35
V
mV
VCCVth
4.5
4.85
VCCHYS
500
Switch Leakage
SWLKG
Current Limit
Low-side Valley Current Limit
ILIMIT
Switching frequency and minimum off time
Switching frequency
Minimum Off Time(6)
FS
TOFF
Over-voltage and Under-voltage Protection
OVP Threshold
OVP Delay
UVP Threshold
UVP Delay
VOVP
TOVPDEL
VUVP
TUVPDEL
55
65
Reference And Soft Start
Reference Voltage
Feedback Current
Soft Start Time
VREF
IFB
TSS
VFB = 0.604V
Enable And UVLO
Enable Input Low Voltage
Enable Hysteresis
Enable Input Current
VCC Under Voltage Lockout
Threshold Rising
VCC Under Voltage Lockout
Threshold Hysteresis
NB675 Rev. 1.0
1/14/2013
VILEN
VEN-HYS
IEN
VEN = 2V
VEN = 0V
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μA
V
mV
3
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
ELECTRICAL CHARACTERISTICS (continued)
VIN = 12V, TJ = 25°C, unless otherwise noted.
Parameters
Symbol
Condition
Min
Typ
Max
Units
4.8
5.1
5.3
V
VCC Regulator
VCC Regulator
VCC
VCC Load Regulation
Icc=8mA
5
%
Power Good
FB Rising (Good)
PGVth-Hi
95
FB Falling (Fault)
PGVth-Lo
85
FB Rising (Fault)
PGVth-Hi
115
FB Falling (Good)
PGVth-Lo
105
PGTd
450
Power Good Low to High Delay
Power Good Sink Current
Capability
Power Good Leakage Current
%VREF
μs
VPG
Sink 4mA
0.4
V
IPG_LEAK
VPG = 3.3V
1
μA
VTTREF Output
VTTREF Output Voltage
VTTREF
IVTTREF<0.1mA,
1V<VDDQ<1.4V
IVTTREF<10mA,
1V<VDDQ<1.4V
Output Voltage tolerance to
VDDQ
Current Limit
VDDQSEN/2
ILIMIT_VTTREF
48.2%
50%
51.8%
48%
50%
52%
10
15
mA
VTT LDO
VTT Output Voltage
VTT
VTT tolerance to VTTREF
Source Current Limit
Sink Current Limit
VTTREF
-10mA<IVTT<10mA,
1V<VDDQ<1.4V
-20
20
mV
-1A<IVTT<1A,
1V<VDDQ<1.4V
-45
45
mV
ILIMIT_SOUCE
ILIMIT_SINK
1.8
1.6
A
A
TSD
150
25
°C
°C
Thermal Protection
Thermal Shutdown(6)
Thermal Shutdown Hysteresis
Note:
6) Guaranteed by design.
NB675 Rev. 1.0
1/14/2013
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4
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
PIN FUNCTIONS
PIN #
1
2, 3
4
5
6
7
8
9
10,11
Exposed
Pad 20,21
12
Exposed
Pad 19
Name
Description
Bootstrap. A capacitor connected between SW and BST pins is required to form a
BST
floating supply across the high-side switch driver.
Switch Output. Connect this pin to the inductor and bootstrap capacitor. This pin is
driven up to the VIN voltage by the high-side switch during the on-time of the PWM
duty cycle. The inductor current drives the SW pin negative during the off-time. The onSW
resistance of the low-side switch and the internal diode fixes the negative voltage. Use
wide and short PCB traces to make the connection. Try to minimize the area of the SW
pattern.
Buffered VTT reference output. Decouple with a minimum 0.22μF ceramic capacitor as
VTTREF close to the pin as possible. X7R or X5R grade dielectric ceramic capacitors are
recommended for their stable temperature characteristics.
Buck regulator output voltage sense. Connect this pin to the output capacitor of the
VDDQSEN
regulator directly
VINLDO
VTT LDO regulator input. Connect VINLDO to VDDQ in typical application.
VTT LDO output. Decouple with a minimum 10uF ceramic capacitor as close to the pin
VTT
as possible. X7R or X5R grade dielectric ceramic capacitors are recommended for their
stable temperature characteristics.
Analog ground. The internal reference is referred to AGND. Connect the GND of the
AGND
FB divider resistor to AGND for better load regulation.
VTTSEN VTT output sense. Connect this pin to the output capacitor of the VTT regulator directly
PGND
VIN
13
PG
14
FB
15
EN1
16
VCC
17
EN2
18
NC
NB675 Rev. 1.0
1/14/2013
Power Ground. Use wide PCB traces and multiple vias to make the connection.
Supply Voltage. The VIN pin supplies power for internal MOSFET and regulator. The
NB675 operate from a +5V to +22V input rail. An input capacitor is needed to decouple
the input rail. Use wide PCB traces and multiple vias to make the connection.
Power good output, the output of this pin is an open drain signal and is high if the
output voltage is higher than 95% of the nominal voltage. There is a delay from FB ≥
95% to PG goes high.
Feedback. An external resistor divider from the output to GND, tapped to the FB pin,
sets the output voltage. Place the resistor divider as close to FB pin as possible. Avoid
vias on the FB traces. It is recommend to set the current through FB resistors around
10uA.
Enable. EN1 and EN2 are digital inputs, which are used to enable or disable the
internal regulators. Once EN1=EN2=1, the VDDQ regulator, VTT LDO and VTTREF
output will be turned on; when EN1=0 and EN2=1, the VDDQ regulator and VTTREF
are active while VTT LDO is off; all the regulators will be turned off when EN1=EN2=0.
Internal 5V LDO output. The driver and control circuits are powered from this voltage.
Decouple with a minimum 1µF ceramic capacitor as close to the pin as possible. X7R
or X5R grade dielectric ceramic capacitors are recommended for their stable
temperature characteristics.
Enable. EN1 and EN2 are digital inputs, which are used to enable or disable the
internal regulators. Once EN1=EN2=1, the VDDQ regulator, VTT LDO and VTTREF
output will be turned on; when EN1=0 and EN2=1, the VDDQ regulator and VTTREF
are active while VTT LDO is off; all the regulators will be turned off when EN1=EN2=0.
Not connected.
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© 2013 MPS. All Rights Reserved.
5
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
TYPICAL PERFORMANCE CHARACTERISTICS
VIN =20V, VDDQ =1.35V, L=1.2µH, TJ=+25°C, unless otherwise noted.
Load Regulation
3500
2
85 VIN=6V
3000
1.5
75
POWER LOSS (mW)
95
VIN=8.4V
65
VIN=12.6V
55
45
VIN=19V
35
1
2500
VIN=19V
1500
15
0.001
0.01
0.1
1
1000
0
10
8
-2
9 10
0 1
1 2 .6
516
1 2 .2
12
1 1 .8
1 1 .6
1 1 .4
1 1 .2
2
3 4
5
6 7
8
9 10
LOAD CURRENT (A)
Switching Frequency
vs. Output Current
IOUT=5A
600
IOUT=10A
500
FREQUENCY (kHz)
520
518
FREQUENCY (kHz)
I_LIMIT
5 6 7
Switching Frequency
vs. Temperature
13
1 2 .8
1 2 .4
514
512
510
508
506
504
400
300
200
100
502
11
-4 0
10
60
500
-50
110
VTT LDO Sink Current
Load Regulation
0
50
100
150
0
0
2
4
6
8
OUTPUT CURRENT (A)
10
VTT LDO Source Current
Load Regulation
VDDQ=1.35V, VTT=VDDQ/2
0.725
VDDQ=1.35V, VTT=VDDQ/2
0.715
0.715
0.705
0.705
VTTREF
0.695
VOLTAGE (V)
VOLTAGE (V)
VIN=6V
-1.5
LOAD CURRENT (A)
I_v_limit vs. Temperature
0.685
0.675
0.665
VTT
0.655
0.695
0.675
0.665
0.655
0.645
0.635
0.635
0
500
1000
VTT SINK CURRENT (mA)
NB675 Rev. 1.0
1/14/2013
1500
VTTREF
0.685
0.645
0.625
2 3 4
VIN=8.4V
-1
VIN=6V
0 1
VIN=12.6V
-0.5
VIN=8.4V
LOAD CURRENT (A)
0.725
0
VIN=12.6V
500
25
VIN=19V
0.5
2000
0.625
VTT
0
500
1000
1500
VTT SOURCE CURRENT (mA)
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© 2013 MPS. All Rights Reserved.
6
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN =20V, VDDQ =1.35V, L=1.2µH, TJ=+25°C, unless otherwise noted.
Output Voltage Ripple
Output Voltage Ripple
IOUT = 0A
IOUT = 10A
Power Good through
EN Start-Up
IOUT = 0A
VDDQ
50mV/div.
VDDQ
50mV/div.
VDDQ
500mV/div.
VSW
10V/div.
VSW
10V/div.
IL
1A/div.
IL
10A/div.
Power Good through
EN Start-Up
VEN2
5V/div.
VPG
5V/div.
IL
1A/div.
Start-Up through VIN
Start-Up through VIN
IOUT = 0A
IOUT = 10A
IOUT = 10A
VDDQ
500mV/div.
VEN2
5V/div.
VPG
5V/div.
IL
10A/div.
VDDQ
500mV/div.
VDDQ
500mV/div.
VIN
10V/div.
VSW
10V/div.
IL
5A/div.
VIN
10V/div.
VSW
10V/div.
Shutdown through VIN
IL
10A/div.
Shutdown through VIN
IOUT = 0A
Start-Up through EN
IOUT = 10A
IOUT = 0A
VDDQ
1V/div.
VDDQ
1V/div.
VDDQ
1V/div.
VIN
10V/div.
VSW
2V/div.
VIN
5V/div.
VSW
5V/div.
VEN2
5V/div.
VSW
20V/div.
IL
2A/div.
NB675 Rev. 1.0
1/14/2013
IL
5A/div.
IL
2A/div.
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7
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN =20V, VDDQ =1.35V, L=1.2µH, TJ=+25°C, unless otherwise noted.
VDDQ
1V/div.
VDDQ
1V/div.
VDDQ
1V/div.
VEN2
5V/div.
VSW
20V/div.
VEN2
5V/div.
VEN2
5V/div.
VSW
5V/div.
IL
2A/div.
VSW
20V/div.
IL
10A/div.
VDDQ(AC)
20mV/div.
IL
10A/div.
VDDQ
1V/div.
VDDQ
500mV/div.
VTTREF
500mV/div.
VTT
500mV/div.
VTTREF
500mV/div.
VIN
10V/div.
VTT
500mV/div.
VIN
20V/div.
VDDQ
1V/div.
VDDQ
1V/div.
VDDQ
1V/div.
VTTREF
500mV/div.
VTT
500mV/div.
VTTREF
500mV/div.
VTT
500mV/div.
VTTREF
500mV/div.
IL
5A/div.
VEN1
5V/div.
NB675 Rev. 1.0
1/14/2013
VTT
500mV/div.
VEN1
2V/div.
VEN2
5V/div.
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8
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN =20V, VDDQ =1.35V, L=1.2µH, TJ=+25°C, unless otherwise noted.
VDDQ
1V/div.
VTT
500mV/div.
VTTREF
500mV/div.
VEN2
5V/div.
VDDQ
1V/div.
VIN
500mV/div.
VOUT
500mV/div.
VSW
10V/div.
VSW
10V/div.
IL
10A/div.
VCC
2V/div.
IL
5A/div.
VOUT
500mV/div.
VSW
10V/div.
VCC
2V/div.
IL
5A/div.
NB675 Rev. 1.0
1/14/2013
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© 2013 MPS. All Rights Reserved.
9
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
BLOCK DIAGRAM
VCC
VDDQSEN
VIN
BST
BSTREG
Softstart
POR &
Reference
VIN
0.6V VREF
On Time
One Shot
FB
Gate
Control
Logic
Min off time
EN1/EN2
SW
VDDQ
PGND
1V
SW
130% Vref
OCP
PG
OVP
Fault
Logic
POK
95 % Vref
60%Vref
AGND
UVP
VINLDO
EN1/EN2
Control
Logic
VTTREF
VTT
VTTSEN
Figure 1—Functional Block Diagram
NB675 Rev. 1.0
1/14/2013
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10
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
OPERATION
PWM Operation
The NB675 is fully integrated synchronous
rectified step-down switch mode converter.
Constant-on-time (COT) control is employed to
provide fast transient response and easy loop
stabilization. At the beginning of each cycle, the
high-side MOSFET (HS-FET) is turned ON when
the feedback voltage (VFB) is below the reference
voltage (VREF), which indicates insufficient output
voltage. The ON period is determined by both the
output voltage and input voltage to make the
switching frequency fairy constant over input
voltage range.
After the ON period elapses, the HS-FET is
turned off, or becomes OFF state. It is turned ON
again when VFB drops below VREF. By repeating
operation this way, the converter regulates the
output voltage. The integrated low-side MOSFET
(LS-FET) is turned on when the HS-FET is in its
OFF state to minimize the conduction loss. There
will be a dead short between input and GND if
both HS-FET and LS-FET are turned on at the
same time. It’s called shoot-through. In order to
avoid shoot-through, a dead-time (DT) is
internally generated between HS-FET off and LSFET on, or LS-FET off and HS-FET on.
An internal compensation is applied for COT
control to make a more stable operation even
when ceramic capacitors are used as output
capacitors, this internal compensation will then
improve the jitter performance without affect the
line or load regulation.
Heavy-Load Operation
continuous-conduction-mode (CCM). The CCM
mode operation is shown in Figure 2 shown.
When VFB is below VREF, HS-MOSFET is turned
on for a fixed interval which is determined by
one- shot on-timer as equation 1 shown. When
the HS-MOSFET is turned off, the LS-MOSFET
is turned on until next period.
In CCM mode operation, the switching frequency
is fairly constant and it is called PWM mode.
Light-Load Operation
With the load decrease, the inductor current
decrease too. Once the inductor current touch
zero, the operation is transition from continuousconduction-mode (CCM) to discontinuousconduction-mode (DCM).
The light load operation is shown in Figure 3.
When VFB is below VREF, HS-MOSFET is turned
on for a fixed interval which is determined by
one- shot on-timer as equation 1 shown. When
the HS-MOSFET is turned off, the LS-MOSFET
is turned on until the inductor current reaches
zero. In DCM operation, the VFB does not reach
VREF when the inductor current is approaching
zero. The LS-FET driver turns into tri-state (high
Z) whenever the inductor current reaches zero. A
current modulator takes over the control of LSFET and limits the inductor current to less than 1mA. Hence, the output capacitors discharge
slowly to GND through LS-FET. As a result, the
efficiency at light load condition is greatly
improved. At light load condition, the HS-FET is
not turned ON as frequently as at heavy load
condition. This is called skip mode.
At light load or no load condition, the output
drops very slowly and the NB675 reduces the
switching frequency naturally and then high
efficiency is achieved at light load.
Figure 2—Heavy Load Operation
When the output current is high and the inductor
current is always above zero amps, it is called
NB675 Rev. 1.0
1/14/2013
Figure 3—Light Load Operation
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11
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
As the output current increases from the light
load condition, the time period within which the
current modulator regulates becomes shorter.
The HS-FET is turned ON more frequently.
Hence, the switching frequency increases
correspondingly. The output current reaches the
critical level when the current modulator time is
zero. The critical level of the output current is
determined as follows:
IOUT
(V − VOUT ) × VOUT
= IN
2 × L × FS × VIN
(1)
It turns into PWM mode once the output current
exceeds the critical level. After that, the switching
frequency stays fairly constant over the output
current range.
Jitter and FB Ramp Slope
Jitter occurs in both PWM and skip modes when
noise in the VFB ripple propagates a delay to the
HS-FET driver, as shown in Figures 4 and 5.
Jitter can affect system stability, with noise
immunity proportional to the steepness of VFB’s
downward slope. However, VFB ripple does not
directly affect noise immunity.
VNOISE
V SLO PE1
resistor. Ceramic capacitors usually can not be
used as output capacitor.
To realize the stability, the ESR value should be
chosen as follow:
RESR
(2)
TSW is the switching period.
The NB675 has built in internal ramp
compensation to make sure the system is stable
even without the help of output capacitor’s ESR;
and thus the pure ceramic capacitor solution can
be applicant. The pure ceramic capacitor solution
can significantly reduce the output ripple, total
BOM cost and the board area.
Figure 6 shows a typical output circuit in PWM
mode without an external ramp circuit. Turn to
application information section for design steps
without external compensation.
SW
L
FB
V FB
TSW
T
+ ON
2
≥ 0.7 × π
COUT
C4
Vo
R1
R2
CAP
V R EF
H S D river
Figure 6—Simplified Circuit in PWM Mode
without External Ramp Compensation
Jitter
Figure 4—Jitter in PWM Mode
VNOISE
When using a large-ESR capacitor on the output,
add a ceramic capacitor with a value of 10uF or
less to in parallel to minimize the effect of ESL.
V SLO PE2
V FB
V REF
H S D river
Jitter
Figure 5—Jitter in Skip Mode
Operating without external ramp
Operating with external ramp compensation
The NB675 is usually able to support ceramic
output capacitors without external ramp, however,
in some of the cases, the internal ramp may not
be enough to stabilize the system, and external
ramp compensation is needed. Skip to
application information section for design steps
with external ramp compensation.
The traditional constant-on-time control scheme
is intrinsically unstable if output capacitor’s ESR
is not large enough as an effective current-sense
NB675 Rev. 1.0
1/14/2013
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12
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
L
SW
R4
Vo
Vo
C4
IR4
IC4
R9
R1
Ro
I FB
Ceramic
FB
2π × FSW
⎞
1 ⎛ R × R2
< ×⎜ 1
+ R9 ⎟
× C4 5 ⎝ R1 + R 2
⎠
R2
(3)
Where:
IR4 = IC4 + IFB ≈ IC4
(4)
And the Vramp on the VFB can then be estimated
as:
VRAMP =
VIN − VOUT
R1 // R2
× TON ×
R 4 × C4
R1 // R2 + R9
(5)
VSLOPE1 =
− VOUT
− VRAMP
=
Toff
R 4 × C4
Figure 8—Simplified Circuit in skip Mode
The downward slope of the VFB ripple in skip
mode can be determined as follow:
VSLOPE2 =
− VREF
((R1 + R2 ) // Ro) × COUT
(8)
where Ro is the equivalent load resistor.
As described in Figure 5, VSLOPE2 in the skip mode
is lower than that is in the PWM mode, so it is
reasonable that the jitter in the skip mode is
larger. If one wants a system with less jitter
during light load condition, the values of the VFB
resistors should not be too big, however, that will
decrease the light load efficiency.
When using a large-ESR capacitor on the output,
add a ceramic capacitor with a value of 10uF or
less to in parallel to minimize the effect of ESL.
Configuring the EN Control
The downward slope of the VFB ripple then
follows
(6)
As can be seen from equation 6, if there is
instability in PWM mode, we can reduce either
R4 or C4. If C4 can not be reduced further due to
limitation from equation 3, then we can only
reduce R4. For a stable PWM operation, the
Vslope1 should be design follow equation 7.
TSW
T
+ ON -RESRCOUT
Io × 10-3
(7)
-Vslope1 ≥ 0.7 × π 2
VOUT +
2 × L × COUT
TSW -Ton
Io is the load current.
In skip mode, the downward slope of the VFB
ripple is the same whether the external ramp is
used or not. Figure 8 shows the simplified circuit
of the skip mode when both the HS-FET and LSFET are off.
NB675 Rev. 1.0
1/14/2013
Cout
R2
Figure 7—Simplified Circuit in PWM Mode
with External Ramp Compensation
Figure 7 shows a simplified external ramp
compensation (R4 and C4) for PWM mode, with
HS-FET off. Chose R1, R2, R9 and C4 of the
external ramp to meet the following condition:
1
ESR
R1
FB
The NB675 has two enable pins to control the
on/off of the internal regulators. All of VDDQ,
VTTREF and VTT are turned on at S0 state
(EN1=EN2=high). In S3 mode (EN1=low,
EN2=high), VDDQ and VTTREF voltages are
kept on while VTT is turned off and left at high
impedance state (high-Z). The VTT output floats
and doesn’t sink/source current in this state. In
S4/S5 mode (EN1=EN2=low), all of the
regulators are kept off and discharged to GND.
Table 1—EN1/EN2 Control
State
EN1
EN2
VDDQ
VTTREF
VTT
S0
High
High
ON
ON
ON
OFF(High-Z)
S3
Low
High
ON
ON
S4/S5
Low
Low
OFF
OFF
OFF
Others
High
Low
OFF
OFF
OFF
For automatic start-up the EN pin can be pulled
up to input voltage through a resistive voltage
divider. Choose the values of the pull-up resistor
(RUP from Vin pin to EN pin) and the pull-down
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13
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
resistor (RDOWN from EN pin to GND) to
determine the automatic start-up voltage:
VIN−START = 1.45 ×
RUP + RDOWN
(V)
RDOWN
For
example,
for
RUP=150kΩ
RDOWN=51kΩ,the VIN−START is set at 5.52V.
(9)
and
To avoid noise, a 10nF ceramic capacitor from
EN to GND is recommended.
There is an internal Zener diode on the EN pin,
which clamps the EN pin voltage to prevent it
from running away. The maximum pull up current
assuming a worst case 12V internal Zener clamp
should be less than 1mA.
Therefore, when EN is driven by an external logic
signal, the EN voltage should be lower than
12V.when EN is connected with VIN through a
pull-up resistor or a resistive voltage divider, the
resistance selection should ensure the maximum
pull up current less than 1mA.
If using a resistive voltage divider and VIN higher
than 12V, the allowed minimum pull-up resistor
RUP should meet the following equation:
VIN (V) − 12
12
−
< 1(mA)
RUP (kΩ)
RDOWN (kΩ)
(10)
Especially, just using the pull-up resistor RUP (the
pull-down resistor is not connected), the
VIN-START is determined by input UVLO, and the
minimum resistor value is:
RUP (kΩ) >
VIN (V) − 12
1(mA)
(11)
A typical pull-up resistor is 100kΩ.
Soft Start
The NB675 employs soft start (SS) mechanism
to ensure smooth output during power-up. When
the EN pin becomes high, the internal reference
voltage ramps up gradually; hence, the output
voltage ramps up smoothly, as well. Once the
reference voltage reaches the target value, the
soft start finishes and it enters into steady state
operation.
If the output is pre-biased to a certain voltage
during startup, the IC will disable the switching of
both high-side and low-side switches until the
NB675 Rev. 1.0
1/14/2013
voltage on the internal reference exceeds the
sensed output voltage at the FB node.
VTT and VTTREF
This part integrates two high performance, lowdrop-out linear regulators, VTT and VTTREF, to
provide complete DDR3/DDR3L power solutions.
The VTTREF has a 10-mA sink/source current
capability, and track 1/2 of VDDQSEN using an
on-chip divider. A minimum 0.22μF ceramic
capacitor must be connected close to the
VTTREF terminal for stable operation.
The VTT regulator responses quickly to track
VTTREF with +/-45mV under all conditions. The
current capability of the VTT regulator is up to
1.5A for both sink and source modes. A minimum
10μF ceramic capacitor need to be connected
close to the VTT terminal. The VTTSEN should
be connected to the positive node of VTT output
capacitor as a separated trace from the highcurrent line to the VTT pin.
VDDQ Power Good (PG)
The NB675 has power-good (PGOOD) output
used to indicate whether the output voltage of the
VDDQ regulator is ready or not. The PGOOD pin
is the open drain of a MOSFET. It should be
connected to VCC or other voltage source through
a resistor (e.g. 100k,). After the input voltage is
applied, the MOSFET is turned on so that the
PGOOD pin is pulled to GND before SS is ready.
After FB voltage reaches 95% of REF voltage,
the PGOOD pin is pulled high after a delay. The
PGOOD delay time is 1ms.
When the FB voltage drops to 85% of REF
voltage, the PGOOD pin will be pulled low.
VDDQ Over Current Protection
NB675 has cycle-by-cycle over current limiting
control. The current-limit circuit employs a
"valley" current-sensing algorithm. The part use
the Rds(on) of the low side MOSFET as a
current-sensing element. If the magnitude of the
current-sense signal is above the current-limit
threshold, the PWM is not allowed to initiate a
new cycle.
The trip level is fixed internally. The inductor
current is monitored by the voltage between GND
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14
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
pin and SW pin. GND is used as the positive
current sensing node so that GND should be
connected to the source terminal of the bottom
MOSFET.
Since the comparison is done during the high
side MOSFET OFF and low side MOSFET ON
state, the OC trip level sets the valley level of the
inductor current. Thus, the load current at overcurrent threshold, IOC, can be calculated as
follows:
IOC = I _ limit +
ΔIinductor
2
(13)
In an over-current condition, the current to the
load exceeds the current to the output capacitor;
thus the output voltage tends to fall off.
Eventually, it will end up with crossing the under
voltage protection threshold and shutdown.
UVLO Protection
The NB675 has under-voltage lock-out protection
(UVLO). When the VCC voltage is higher than
the UVLO rising threshold voltage, the part will
be powered up. It shuts off when the VIN voltage
is lower than the UVLO falling threshold voltage.
This is non-latch protection. The part is disabled
when the VCC voltage falls below 4.5V. If an
application requires a higher under-voltage
lockout (UVLO), use the EN pin as shown in
Figure 9 to adjust the input voltage UVLO by
using two external resistors. It is recommended
to use the enable resistors to set the UVLO
falling threshold (VSTOP) above 4.5V. The rising
threshold (VSTART) should be set to provide
enough hysteresis to allow for any input supply
variations.
VTT Over-Current Protection
IN
The VTT LDO has an internally fixed current limit
of 1.8A for source operation, and 1.6A for sink.
VDDQ
Over/Under-Voltage
(OVP/UVP)
Protection
NB675 monitors a resistor divided feedback
voltage to detect over and under voltage. When
the feedback voltage becomes higher than 115%
of the target voltage, the controller will enter
Dynamic Regulation Period. During this period,
the LS will off when the LS current goes to -1A,
this will then discharge the output and try to keep
it within the normal range. If the dynamic
regulation can not limit the increasing of the Vo,
once the feedback voltage becomes higher than
130% of the feedback voltage, the OVP
comparator output goes high and the circuit
latches as the high-side MOSFET driver OFF
and the low-side MOSFET turn on acting as an 1A current source.
When the feedback voltage becomes lower than
60% of the target voltage, the UVP comparator
output goes high if the UV still occurs after 26us
delay; then the fault latch will be triggered--latches HS off and LS on; the LS FET keeps on
until the inductor current goes zero.
NB675 Rev. 1.0
1/14/2013
RUP
NB675
EN Comparator
EN
RDOWN
Figure 9—Adjustable UVLO
Thermal Shutdown
Thermal shutdown is employed in the NB675.
The junction temperature of the IC is internally
monitored. If the junction temperature exceeds
the threshold value (typical 150ºC), the converter
shuts off. This is a non-latch protection. There is
about 25ºC hysteresis. Once the junction
temperature drops to about 125ºC, it initiates a
SS.
Output Discharge
NB675 discharges all the outputs, including
VDDQ, VTTREF and VTT when EN2=low, or the
controller is turned off by the protection functions
(UVP & OCP, OCP, OVP, UVLO, and thermal
shutdown). The part discharge the outputs using
an internal 6Ω MOSFET.
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15
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
APPLICATION INFORMATION
Setting the Output Voltage---without external
compensation
The NB675 can usually support different type of
output capacitors, including POSCAP, electrolytic
capacitor and also ceramic capacitors without
external ramp compensation, The output voltage
is then set by feedback resistors R1 and R2. As
Figure 10 shows.
Setting the Output Voltage ―with external
compensation
SW
Vo
L
FB
R4
C4
R1
R9
Ceramic
R2
SW
L
FB
Vo
C4
R1
R2
CAP
Figure10—Simplified Circuit of POS Capacitor
First, choose a value for R2. R2 should be
chosen reasonably, a small R2 will lead to
considerable quiescent current loss while too
large R2 makes the FB noise sensitive. Typically,
set the current through R2 at around 5-10uA will
make a good balance between system stability
and also the no load loss. Then R1 is determined
as follow with the output ripple considered:
1
VOUT − ΔVOUT − VREF
2
(13)
R1 =
⋅ R2
VREF
ΔVOUT is the output ripple, refer to equation (23)
Other than feedback resistors, a feed forward
cap C4 is usually applied for a better transient
performance, especially when ceramic caps are
applied for their small capacitance, a cap value
around 100pF-1nF is suggested for a better
transient while also keep the system stable with
enough noise immunity. In case the system is
noise sensitive because of the zero induced by
this cap, add a resistor-usually named as R9
between this cap and FB to form a pole, this
resistor can be set according to equation (16) as
in the following section.
NB675 Rev. 1.0
1/14/2013
Figure11—Simplified Circuit of Ceramic
Capacitor
If the system is not stable enough when low ESR
ceramic capacitor is used in the output, an
external voltage ramp should be added to FB
through resistor R4 and capacitor C4.
The output voltage is influenced by ramp voltage
VRAMP besides R divider as shown in Figure 11.
The VRAMP can be calculated as shown in
equation 7. R2 should be chosen reasonably, a
small R2 will lead to considerable quiescent
current loss while too large R2 makes the FB
noise sensitive. It is recommended to choose a
value within 5kΩ-50kΩ for R2, using a
comparatively larger R2 when Vo is low,
etc.,1.05V, and a smaller R2 when Vo is high.
And the value of R1 then is determined as follow:
R2
(14)
R=
1
VFB(AVG)
R2
(VOUT -VFB(AVG) ) R4 +R9
-
The VFB(AVG) is the average value on the FB,
VFB(AVG) varies with the Vin, Vo, and load
condition, etc., its value on the skip mode would
be lower than that of the PWM mode, which
means the load regulation is strictly related to the
VFB(AVG). Also the line regulation is related to the
VFB(AVG). If one wants to gets a better load or line
regulation, a lower Vramp is suggested, as long
as the criterion shown in equation 8 can be met.
For PWM operation, VFB(AVG) value can be
deduced from the equation below.
R1 //R2
1
VFB(AVG) = VREF + VRAMP ×
2
R1 //R2 + R9
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(15)
16
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
Usually, R9 is set to 0Ω, and it can also be set
following equation 16 for a better noise immunity.
It should also set to be 5 times smaller than
R1//R2 to minimize its influence on Vramp.
1
R9 =
2π× C4 × 2FSW
(16)
Using equation 14 to calculate the R1 can be
complicated. To simplify the calculation, a DCblocking capacitor Cdc can be added to filter the
DC influence from R4 and R9. Figure 12 shows
a simplified circuit with external ramp
compensation and a DC-blocking capacitor. With
this capacitor, R1 can easily be obtained by
using the simplified equation for PWM mode
operation:
1
(VOUT − VREF − VRAMP )
2
R1 =
R2
1
VREF + VRAMP
2
(17)
Cdc is suggested to be at least 10 times larger
than C4 for better DC blocking performance, and
should also not larger than 0.47uF considering
start up performance. In case one wants to use
larger Cdc for a better FB noise immunity,
combined with reduced R1 and R2 to limit the
Cdc in a reasonable value without affecting the
system start up. Be noted that even when the
Cdc is applied, the load and line regulation are
still Vramp related.
SW
FB
C4
R1
Cdc
ICIN = IOUT ×
VOUT
V
× (1 − OUT )
VIN
VIN
(18)
The worst-case condition occurs at VIN = 2VOUT,
where:
ICIN =
IOUT
2
(19)
For simplification, choose the input capacitor with
an RMS current rating greater than half of the
maximum load current.
The input capacitance value determines the input
voltage ripple of the converter. If there is an input
voltage ripple requirement in the system, choose
the input capacitor that meets the specification.
The input voltage ripple can be estimated as
follows:
ΔVIN =
IOUT
V
V
× OUT × (1 − OUT )
FSW × CIN VIN
VIN
(20)
Under worst-case conditions where VIN = 2VOUT:
ΔVIN =
IOUT
1
×
4 FSW × CIN
(21)
Output Capacitor
Ceramic
R2
Figure12—Simplified Circuit of Ceramic
Capacitor with DC blocking capacitor
Input Capacitor
The input current to the step-down converter is
discontinuous and therefore requires a capacitor
to supply the AC current to the step-down
converter while maintaining the DC input voltage.
Ceramic capacitors are recommended for best
performance and should be placed as close to
the VIN pin as possible. Capacitors with X5R and
NB675 Rev. 1.0
1/14/2013
The capacitors must also have a ripple current
rating greater than the maximum input ripple
current of the converter. The input ripple current
can be estimated as follows:
Vo
L
R4
X7R ceramic dielectrics are recommended
because they are fairly stable with temperature
fluctuations.
The output capacitor is required to maintain the
DC output voltage. Ceramic or POSCAP
capacitors are recommended. The output voltage
ripple can be estimated as:
ΔVOUT =
VOUT
V
1
× (1 − OUT ) × (RESR +
) (22)
FSW × L
VIN
8 × FSW × COUT
In the case of ceramic capacitors, the impedance
at the switching frequency is dominated by the
capacitance. The output voltage ripple is mainly
caused by the capacitance. For simplification, the
output voltage ripple can be estimated as:
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17
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
ΔVOUT
VOUT
V
=
× (1 − OUT )
2
8 × FSW × L × COUT
VIN
(23)
The output voltage ripple caused by ESR is very
small. Therefore, an external ramp is needed to
stabilize the system. The external ramp can be
generated through resistor R4 and capacitor C4.
In the case of POSCAP capacitors, the ESR
dominates the impedance at the switching
frequency. The ramp voltage generated from the
ESR is high enough to stabilize the system.
Therefore, an external ramp is not needed. A
minimum ESR value around 12mΩ is required to
ensure stable operation of the converter. For
simplification, the output ripple can be
approximated as:
ΔVOUT =
VOUT
V
× (1 − OUT ) × RESR
FSW × L
VIN
(24)
Maximum output capacitor limitation should be
also considered in design application. NB675 has
an around 1.6ms soft-start time period. If the
output capacitor value is too high, the output
voltage can’t reach the design value during the
soft-start time, and then it will fail to regulate. The
maximum output capacitor value Co_max can be
limited approximately by:
CO _ MAX = (ILIM _ AVG − IOUT ) × Tss / VOUT
(25)
Where, ILIM_AVG is the average start-up current
during soft-start period. Tss is the soft-start time.
Inductor
The inductor is necessary to supply constant
current to the output load while being driven by
the switched input voltage. A larger-value
inductor will result in less ripple current that will
result in lower output ripple voltage. However, a
larger-value inductor will have a larger physical
footprint, higher series resistance, and/or lower
saturation current. A good rule for determining
the inductance value is to design the peak-topeak ripple current in the inductor to be in the
range of 30% to 40% of the maximum output
current, and that the peak inductor current is
below the maximum switch current limit. The
inductance value can be calculated by:
NB675 Rev. 1.0
1/14/2013
L=
VOUT
V
× (1 − OUT )
FSW × ΔIL
VIN
(26)
Where ΔIL is the peak-to-peak inductor ripple
current.
The inductor should not saturate under the
maximum inductor peak current, where the peak
inductor current can be calculated by:
ILP = IOUT +
VOUT
V
× (1 − OUT )
2FSW × L
VIN
(27)
PCB Layout Guide
1. The high current paths (GND, IN, and SW)
should be placed very close to the device
with short, direct and wide traces.
2. Put the input capacitors as close to the IN
and GND pins as possible.
3. Put the decoupling capacitor as close to the
VCC and GND pins as possible. Place the
Cap close to VCC if the distance is long. And
place >3 Vias if via is required to reduce the
leakage inductance.
4. Keep the switching node SW short and away
from the feedback network.
5. The external feedback resistors should be
placed next to the FB pin. Make sure that
there is no via on the FB trace.
6. Keep the BST voltage path (BST, C3, and
SW) as short as possible.
7. Keep the IN and GND pads connected with
large copper and use at least two layers for
IN and GND trace to achieve better thermal
performance. Also, add several Vias with
10mil_drill/18mil_copper_width close to the
IN and GND pads to help on thermal
dissipation.
8. Four-layer layout is strongly recommended to
achieve better thermal performance.
Note
Please refer to the PCB Layout Application Note
for more details.
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18
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
PGND
DO NOT CONNECT
TO PGND HERE
To
AGND
VOUT
AGND KELVIN
CONNECT TO PGND
AT VCC CAP
AGND
LP
18
EN2
VCC
EN1
FB
PG
17
16
15
14
13
At least two layers should be applied for
Vin and PGND and place >20 vias close to
the part for a better thermal performance
VIN
BST
1
VIN
19
VIN
20
PGND
21
PGND
12
2
SW
11
PGND
3
4
5
6
7
10
8
9
AGND
--Top Layer
--Inner PGND Layer
--Inner Layer2
--Bottom Layer
--Via
--Via For AGND
VOUT
PGND
Figure 13—Recommend Layout
Recommend Design Example
Some design examples are provided below when
the ceramic capacitors are applied:
Table 2—Design Example
VOUT
(V)
Cout
(F)
L
(μH)
R4
(Ω)
C4
(F)
R1
(kΩ)
R2
(kΩ)
1.05
22μx3
1.2
NS
220p
59
82
1.2
22μx3
1.2
NS
220p
100
102
1.35
22μx3
1.2
NS
220p
100
82
NB675 Rev. 1.0
1/14/2013
The detailed application schematic is shown in
Figure 14 when large ESR caps are used and
Figure 15 when low ESR caps are applied. The
typical performance and circuit waveforms have
been shown in the Typical Performance
Characteristics section. For more possible
applications of this device, please refer to related
Evaluation Board Data Sheets.
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19
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
TYPICAL APPLICATION
4.7Ω
VIN
4.7-22V
220nF
1.2μH
VIN
22μF
22μF
BST
VDDQ
1.35V/10A
SW
NS
499
499kΩ
EN 1
220pF
100kΩ
EN 2
PG
22μFx3
Ceramic
Cap
FB
82kΩ
NB675
VDDQSEN
100kΩ
VCC
VINLDO
1μF
PGND
VTT
0.675V/2A
VTT
AGND
10μF
VTTSEN
VTTREF
10μF
220nF
Figure 14 — Typical Application Circuit with Low ESR Ceramic Output Capacitor
VIN=5-22V, VOUT=1.35V, IOUT=10A
4.7Ω
VIN
4.7-22V
220nF
1.2μH
VIN
22μF
22μF
BST
VDDQ
1.35V/10A
SW
100kΩ
499kΩ
EN 1
EN 2
+
FB
82kΩ
NB675
330μF
POSCAP
PG
VDDQSEN
100kΩ
VCC
VINLDO
1μF
PGND
VTT
0.675V/2A
VTT
AGND
VTTREF
VTTSEN
10μF
10μF
220nF
Figure 15 — Typical Application Circuit with Large ESR POSCAP Output Capacitor
VIN=5-22V, VOUT=1.35V, IOUT=10A
NB675 Rev. 1.0
1/14/2013
www.MonolithicPower.com
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2013 MPS. All Rights Reserved.
20
NB675 –24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER
PACKAGE INFORMATION
QFN21 (3mmX4mm)
NOTICE: The information in this document is subject to change without notice. Please contact MPS for current specifications.
Users should warrant and guarantee that third party Intellectual Property rights are not infringed upon when integrating MPS
products into any application. MPS will not assume any legal responsibility for any said applications.
NB675 Rev. 1.0
1/14/2013
www.MonolithicPower.com
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2013 MPS. All Rights Reserved.
21