NEC UPA675T

DATA SHEET
MOS FIELD EFFECT TRANSISTOR
µ PA675T
N-CHANNEL MOS FIELD EFFECT TRANSISTOR
FOR HIGH SPEED SWITCHING
PACKAGE DRAWING (Unit: mm)
DESCRIPTION
The µ PA675T is an N-channel vertical MOS FET. Because it
can be driven by a voltage as low as 1.5 V and it is not
necessary to consider a drive current, this FET is ideal as an
actuator for low-current portable systems such as headphone
stereos and video cameras.
+0.1
FEATURES
•
•
•
•
Two MOS FET circuits in package the same size as SC-70
Automatic mounting supported
Gate can be driven by a 1.5 V power source
Because of its high input impedance, there’s no need to
consider a drive current
• Since bias resistance can be omitted, the number of
components required can be reduced
1.25 ±0.1
2.1 ±0.1
0.2 -0
+0.1
0.15 -0.05
6
5
4
1
2
3
0 to 0.1
0.65
0.7
0.65
0.9 ±0.1
1.3
2.0 ±0.2
PIN CONNECTION
ORDERING INFORMATION
6
PART NUMBER
µ PA675T
5
4
PACKAGE
Note
SC-88 (SSP)
1.
2.
3.
4.
5.
6.
Note Marking: SA
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Drain to Source Voltage (VGS = 0 V)
VDSS
16
V
Gate to Source Voltage (VDS = 0 V)
VGSS
±7.0
V
Drain Current (DC) (Tc = 25°C)
ID(DC)
±0.1
A
ID(pulse)
±0.2
A
PT
0.2
W
Drain Current (pulse)
Note
Total Power Dissipation (TC = 25°C)
Channel Temperature
Tch
150
°C
Storage Temperature
Tstg
–55 to +150
°C
1
2
Source 1
Gate 1
Drain 2
Source 2
Gate 2
Drain 1
(S1)
(G1)
(D2)
(S2)
(G2)
(D1)
3
Note PW ≤ 10 ms, Duty Cycle ≤ 50%
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No.
G15454EJ1V0DS00 (1st edition)
Date Published May 2001 NS CP(K)
Printed in Japan
©
2001
µ PA675T
ELECTRICAL CHARACTERISTICS (TA = 25°C)
CHARACTERISTICS
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Zero Gate Voltage Drain Current
IDSS
VDS = 16 V, VGS = 0 V
1.0
µA
Gate Leakage Current
IGSS
VGS = ±7.0 V, VDS = 0 V
±3.0
µA
1.1
V
Gate Cut-off Voltage
Forward Transfer Admittance
Drain to Source On-state Resistance
VGS(off)
VDS = 3 V, ID = 10 µA
0.5
| yfs |
VDS = 3 V, ID = 10 mA
20
RDS(on)1
VGS = 1.5 V, ID = 1 mA
20
50
Ω
RDS(on)2
VGS = 2.5 V, ID = 10 mA
7
15
Ω
RDS(on)3
VGS = 4.0 V, ID = 10 mA
5
12
Ω
0.8
mS
Input Capacitance
Ciss
VDS = 3 V
10
pF
Output Capacitance
Coss
VGS = 0 V
13
pF
Reverse Transfer Capacitance
Crss
f = 1 MHz
3
pF
Turn-on Delay Time
td(on)
VDD = 3 V, ID = 10 mA
15
ns
tr
VGS = 3 V
70
ns
td(off)
RG = 10 Ω
100
ns
110
ns
Rise Time
Turn-off Delay Time
Fall Time
tf
SWITCHING TIME MEASUREMENT CIRCUIT AND CONDITIONS
DUT
RL
VDD
PG.
Drain
Current
Waveform
τ
VGS
0
VGS
90%
90%
ID
10%
10%
0
td(on)
tr
ton
τ = 1 µs
Duty Cycle ≤ 1%
2
Data Sheet G15454EJ1V0DS
90%
10%
ID
RG
VGS
0
Gate
Voltage
Waveform
td(off)
tf
toff
µ PA675T
TYPICAL CHARACTERISTICS (TA = 25°C)
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
TOTAL POWER DISSIPATION vs.
AMBIENT TEMPERATURE
50
VGS = 2.0 V
Free air
250
40
ID - Drain Current - mA
PT - Total Power Dissipation - mW
300
200
150
Pe
To
ro
ne
ta
l
un
it
100
50
1.8 V
30
20
1.6 V
10
1.4 V
1.2 V
0
25
50
75
100
125
150
1
2
3
4
VDS - Drain to Source Voltage - V
0
FORWARD TRANSFER ADMITTANCE vs.
DRAIN CURRENT
VDS = 3 V
200
TA = –25˚C
25˚C
75˚C
100
50
20
10
RDS(on) - Drain to Source On-state Resistance - Ω
5
10
20
50
100
ID - Drain Current - mA
200
DRAIN TO SOURCE ON-STATE
RESISTANCE vs. DRAIN CURRENT
200
TA = 25˚C
100
50
20
VGS = 1.5 V
10
2.5 V
4.0 V
5
0.5
1
2
5
10
20
5
DRAIN TO SOURCE ON-STATE
RESISTANCE vs. DRAIN CURRENT
200
TA = –25˚C
100
50
VGS = 1.5 V
20
10
2.5 V
5
4.0 V
0.5
1
2
5
10
20
50 100 200
500
ID - Drain Current - mA
50 100 200
500
RDS(on) - Drain to Source On-state Resistance - Ω
|yfs| - Forward Transfer Admittance - mS
500
RDS(on) - Drain to Source On-state Resistance - Ω
TC - Ambient Temperature - ˚C
DRAIN TO SOURCE ON-STATE
RESISTANCE vs. DRAIN CURRENT
200
TA = 75˚C
100
50
20
VGS = 1.5 V
10
2.5 V
4.0 V
5
ID - Drain Current - mA
0.5
1
2
5
10
20
50 100 200
500
ID - Drain Current - mA
Data Sheet G15454EJ1V0DS
3
30
TA = –25˚C
ID = 10 mA
20
1 mA
10
1
2
3
4
5
6
VGS - Gate to Source Voltage - V
0
7
RDS(on) - Drain to Source On-state Resistance - Ω
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
GATE TO SOURCE VOLTAGE
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
GATE TO SOURCE VOLTAGE
30
TA = 25˚C
ID = 10 mA
20
1 mA
10
1
2
3
4
5
6
VGS - Gate to Source Voltage - V
0
200
30
TA = 75˚C
20
ID = 10 mA
1 mA
10
100
50
20
10
5
2
1
0
2
3
4
5
6
1
VGS - Gate to Source Voltage - V
7
0
CAPACITANCE vs.
DRAIN TO SOURCE VOLTAGE
td(on), tr, td(off), tf - Switching Time - ns
Ciss, Crss, Coss, - Capacitance - pF
500
VGS = 0 V
f = 1 MHz
20
10
Ciss
Coss
5
2
1
0.5
Crss
1
2
5
10
20
VDS - Drain to Source Voltage - V
0.2
0.4
0.6
0.8
VSD - Source to Drain Voltage - V
1.0
SWITCHING CHARACTERISTICS
50
4
7
SOURCE TO DRAIN DIODE FORWARD
VOLTAGE
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
GATE TO SOURCE VOLTAGE
ISD - Diode Forward Current - mA
RDS(on) - Drain to Source On-state Resistance - Ω
RDS(on) - Drain to Source On-state Resistance - Ω
µ PA675T
50
VDD = 3 V
VGS = 3 V
tr
200
100
tf
50
td(on)
20
10
Data Sheet G15454EJ1V0DS
td(off)
20
50
100
200
ID - Drain Current - mA
500
µ PA675T
[MEMO]
Data Sheet G15454EJ1V0DS
5
µ PA675T
[MEMO]
6
Data Sheet G15454EJ1V0DS
µ PA675T
[MEMO]
Data Sheet G15454EJ1V0DS
7
µ PA675T
• The information in this document is current as of May, 2001. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
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agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
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semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
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"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
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and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
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(Note)
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(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
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M8E 00. 4