SMD Type Product specification ZXMP6A13F 60V P-CHANNEL ENHANCEMENT MODE MOSFET SUMMARY V(BR)DSS = -60V; RDS(ON) = 0.400 ID =-1.1A DESCRIPTION This new generation of trench MOSFETs from TY utilizes a unique structure that combines the benefits of low on-resistance with fast switching speed. This makes them ideal for high efficiency, low voltage, power management applications. SOT23 FEATURES • Low on-resistance • Fast switching speed • Low threshold • Low gate drive • Low profile SOIC package APPLICATIONS • DC - DC converters • Power management functions • Relay and solenoid driving • Motor control PINOUT ORDERING INFORMATION DEVICE REEL SIZE TAPE WIDTH QUANTITY PER REEL ZXMP6A13FTA 7” 8mm 3000 units ZXMP6A13FTC 13” 8mm 10000 units DEVICE MARKING Top View • 7P6 http://www.twtysemi.com [email protected] 4008-318-123 1 of 2 SMD Type Product specification ZXMP6A13F ABSOLUTE MAXIMUM RATINGS. PARAMETER SYMBOL Drain-Source Voltage V DSS Gate Source Voltage LIMIT UNIT -60 V 20 V ID -1.1 -0.8 -0.9 A I DM -4.0 A IS -1.2 A V GS Continuous Drain Current V GS =10V; T A =25°C V GS =10V; T A =70°C V GS =10V; T A =25°C Pulsed Drain Current (c) Continuous Source Current (Body Diode) (b) (c) (b) (b) (a) I SM -4.0 A (a) PD 625 5 mW mW/°C Power Dissipation at T A =25°C (b) Linear Derating Factor PD 806 6.5 mW mW/°C Operating and Storage Temperature Range T j :T stg -55 to +150 °C VALUE UNIT Pulsed Source Current (Body Diode) Power Dissipation at T A =25°C Linear Derating Factor THERMAL RESISTANCE PARAMETER SYMBOL Junction to Ambient (a) R θJA 200 °C/W Junction to Ambient (b) R θJA 155 °C/W NOTES (a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions (b) For a device surface mounted on FR4 PCB measured at t ≤5 secs. (c) Repetitive rating 25mm x 25mm FR4 PCB, D=0.05 pulse width=10µs - pulse width limited by maximum junction temperature. http://www.twtysemi.com [email protected] 4008-318-123 2 of 2