TL072-EP, TL074-EP www.ti.com SLOS747C – OCTOBER 2011 – REVISED AUGUST 2012 LOW-NOISE JFET-INPUT OPERATIONAL AMPLIFIER Check for Samples: TL072-EP, TL074-EP FEATURES 1 • • Low Power Consumption Wide Common-Mode and Differential Voltage Ranges Low Input Bias and Offset Currents Output Short-Circuit Protection Low Total Harmonic Distortion . . . 0.003% Typ Low Noise Vn = 18 nV/√Hz Typ at f = 1 kHz High Input Impedance . . . JFET Input Stage Internal Frequency Compensation Latch-Up-Free Operation High Slew Rate . . . 13 V/μs Typ Common-Mode Input Voltage Range Includes VCC+ • • • • • • • • • TL072 D PACKAGE (TOP VIEW) 1OUT 1IN− 1IN+ VCC− 1OUT 1IN− 1IN+ VCC+ 2IN+ 2IN− 2OUT Controlled Baseline One Assembly/Test Site One Fabrication Site Available in Extended (–40°C/125°C) Temperature Range Extended Product Life Cycle Extended Product-Change Notification Product Traceability • • • 8 2 7 3 6 4 5 VCC+ 2OUT 2IN− 2IN+ TL074 D PACKAGE (TOP VIEW) SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS • • • • 1 1 14 2 13 3 12 4 11 5 10 6 9 7 8 4OUT 4IN− 4IN+ VCC− 3IN+ 3IN− 3OUT DESCRIPTION/ORDERING INFORMATION The JFET-input operational amplifiers in the TL07x is similar to the TL08x series, with low input bias and offset currents and fast slew rate. The low harmonic distortion and low noise make the TL07x ideally suited for highfidelity and audio preamplifier applications. Each amplifier features JFET inputs (for high input impedance) coupled with bipolar output stages integrated on a single monolithic chip. The TL07x is characterized for operation over the full temperature range of –40°C to 125°C. ORDERING INFORMATION (1) TA VIOmaX AT 25°C –40°C to 125°C 6 mV (1) PACKAGE SOIC – D Reel of 2500 ORDERABLE PART NUMBER TOP-SIDE MARKING VID NUMBER TL072QDREP TL072Q V62/12604-01XE TL074QDREP TL074Q V62/11621-03XE For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011–2012, Texas Instruments Incorporated TL072-EP, TL074-EP SLOS747C – OCTOBER 2011 – REVISED AUGUST 2012 www.ti.com TL072 and TL074 SYMBOL (EACH AMPLIFIER) IN+ + IN− − OUT SCHEMATIC (EACH AMPLIFIER) VCC+ IN+ 64 Ω IN− 128 Ω OUT 64 Ω C1 18 pF ÎÎÎ ÎÎÎ ÎÎÎ 1080 Ω 1080 Ω VCC− All component values shown are nominal. COMPONENT COUNT (1) COMPONENT TYPE Resistors Transistors JFET Diodes Capacitors epi-FET (1) 2 TL072 TL074 22 28 4 2 2 2 44 56 6 4 4 4 Includes bias and trim circuitry Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TL072-EP TL074-EP TL072-EP, TL074-EP www.ti.com SLOS747C – OCTOBER 2011 – REVISED AUGUST 2012 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN VCC+ VCC– MAX UNIT 18 Supply voltage (2) V 18 VID Differential input voltage (3) ±30 V VI Input voltage (2) ±15 V (4) Duration of output short circuit (5) Unlimited θJA Thermal resistance, junction-to-ambient (6) θJC Thermal resistance, junction-to-case (7) TJ Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) (4) (5) (6) (7) (7) TL072 97.5 TL074 86 TL072 38.3 TL074 51.5 –65 °C/W °C/W 150 °C 150 °C Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC−. Differential voltages are at IN+, with respect to IN−. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less. The output may be shorted to ground or to either supply. Temperature and/or supply voltages must be limited to ensure that the dissipation rating is not exceeded. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TL072-EP TL074-EP Submit Documentation Feedback 3 TL072-EP, TL074-EP SLOS747C – OCTOBER 2011 – REVISED AUGUST 2012 www.ti.com ELECTRICAL CHARACTERISTICS VCC± = ±15 V (unless otherwise noted) PARAMETER TEST CONDITIONS (1) VIO Input offset voltage VO = 0, RS = 50 Ω αVIO Temperature coefficient of input offset voltage VO = 0, RS = 50 Ω IIO Input offset current VO = 0 IIB Input bias current VICR Common-mode input voltage range VOM Maximum peak output voltage swing TA TL072 (2) MIN TL074 TYP MAX 25°C 3 Full range Full range 18 25°C 5 65 125°C RL ≥ 10 kΩ ±11 –12 to 15 25°C ±12 ±13.5 Full range RL ≥ 2 kΩ 6 3 100 5 200 65 ±12 ±10 ±10 25°C 35 15 100 pA 2 nA 200 pA 20 nA ±11 –12 to 15 ±12 200 35 mV μV/°C 18 ±12 Full range 6 8 20 25°C UNIT MAX 2 25°C RL = 10 kΩ TYP 8 125°C VO = 0 MIN V ±13.5 V 200 AVD Large-signal differential voltage amplification B1 Unity-gain bandwidth 25°C 3 3 ri Input resistance 25°C 1012 1012 Ω CMRR Common-mode rejection ratio kSVR VO = ±10 V, RL ≥ 2 kΩ VIC = VICRmin, VO = 0, RS = 50 Ω V/mV 15 MHz 25°C 80 86 80 86 dB Supply-voltage rejection VCC = ±9 V to ±15 V, ratio (ΔVCC±/ΔVIO) VO = 0, RS = 50 Ω 25°C 80 86 80 86 dB ICC Supply current (each amplifier) VO = 0, No load 25°C VO1/VO2 Crosstalk attenuation AVD = 100 25°C (1) (2) 1.4 1.4 2.5 120 2.5 120 mA dB Input bias currents of an FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as shown in Figure 3. Pulse techniques must be used that will maintain the junction temperature as close to the ambient temperature as possible. All characteristics are measured under open-loop conditions with zero common-mode voltage, unless otherwise specified. Full range is TA = –40°C to 125°C. OPERATING CHARACTERISTICS VCC± = ±15 V, TA= 25°C PARAMETER TEST CONDITIONS TL072 TL074 MIN TYP 8 13 MAX MAX UNIT MIN TYP 8 13 V/μs μs SR Slew rate at unity gain VI = 10 V, CL = 100 pF, RL = 2 kΩ, See Figure 1 tr Rise-time overshoot factor VI = 20 V, CL = 100 pF, RL = 2 kΩ, See Figure 1 0.1 0.1 20 20 % Vn Equivalent input noise RS = 20 Ω voltage f = 1 kHz 18 18 nV/√Hz 4 4 μV In Equivalent input noise RS = 20 Ω, current 0.01 0.01 pA/√Hz THD Total harmonic distortion 0.003 0.003 % 4 VIrms = 6 V, RL ≥ 2 kΩ, f = 1 kHz, Submit Documentation Feedback f = 10 Hz to 10 kHz f = 1 kHz AVD = 1, RS ≤ 1 kΩ, Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TL072-EP TL074-EP TL072-EP, TL074-EP www.ti.com SLOS747C – OCTOBER 2011 – REVISED AUGUST 2012 PARAMETER MEASUREMENT INFORMATION 10 kΩ 1 kΩ − − VI VO VO + + VI CL = 100 pF RL RL = 2 kΩ Figure 1. Unity-Gain Amplifier CL = 100 pF Figure 2. Gain-of-10 Inverting Amplifier Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TL072-EP TL074-EP Submit Documentation Feedback 5 TL072-EP, TL074-EP SLOS747C – OCTOBER 2011 – REVISED AUGUST 2012 www.ti.com TYPICAL CHARACTERISTICS Table of Graphs IIB Input bias current VOM Maximum peak output voltage AVD Large-signal differential voltage amplification Phase shift Normalized unity-gain bandwidth Phase shift Common-mode rejection ratio Supply current per amplifier Total power dissipation Normalized slew rate Equivalent input noise voltage Total harmonic distortion Voltage-follower large-signal pulse response Output voltage CMRR ICC PD Vn THD VO 6 Submit Documentation Feedback vs vs vs vs vs vs vs vs vs vs vs vs vs vs vs vs vs vs vs Free-air temperature Frequency Free-air temperature Load resistance Supply voltage Free-air temperature Frequency Frequency Free-air temperature Free-air temperature Free-air temperature Supply voltage Free-air temperature Free-air temperature Free-air temperature Frequency Frequency Time Elapsed time FIGURE 3 4, 5, 6 7 8 9 10 11 11 12 12 13 14 15 16 17 18 19 20 21 Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TL072-EP TL074-EP TL072-EP, TL074-EP www.ti.com SLOS747C – OCTOBER 2011 – REVISED AUGUST 2012 TYPICAL CHARACTERISTICS Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. INPUT BIAS CURRENT vs FREE-AIR TEMPERATURE 100 ±15 VOM VOM − Maximum Peak Output Voltage − V IIIB− IB Input Bias Current − nA VCC± = ±15 V 10 1 0.1 0.01 −75 −50 −25 0 25 50 75 ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ MAXIMUM PEAK OUTPUT VOLTAGE vs FREQUENCY 100 125 ±12.5 ±10 ±7.5 ÁÁ ÁÁ ÁÁ ÁÁ ±5 VCC± = ±15 V VCC± = ±10 V VCC± = ±5 V ±2.5 0 100 1k TA − Free-Air Temperature − °C 10 k 100 k f − Frequency − Hz Figure 3. ÁÁ ÁÁ ÁÁ ÁÁ ÏÏÏÏÏ ÏÏÏÏÏ ÏÏÏÏÏ ÏÏÏÏÏ ±15 RL = 2 kΩ TA = 25°C See Figure 2 VCC± = ±15 V ±10 VCC± = ±10 V ±7.5 VCC± = ±5 V ±2.5 1k ±12.5 ÁÁ ÁÁ ÁÁ ÁÁ ±5 0 100 VOM VOM − Maximum Peak Output Voltage − V VOM VOM − Maximum Peak Output Voltage − V ±12.5 1M 10 M Figure 4. MAXIMUM PEAK OUTPUT VOLTAGE vs FREQUENCY ±15 RL = 10 kΩ TA = 25°C See Figure 2 10 k 100 k f − Frequency − Hz 1M 10 M ±10 MAXIMUM PEAK OUTPUT VOLTAGE vs FREQUENCY ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ VCC± = ±15 V RL = 2 kΩ See Figure 2 TA = 25°C TA = −55°C ±7.5 ±5 TA = 125°C ±2.5 0 10 k 40 k 100 k 400 k 1 M f − Frequency − Hz Figure 5. 4M 10 M Figure 6. Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TL072-EP TL074-EP Submit Documentation Feedback 7 TL072-EP, TL074-EP SLOS747C – OCTOBER 2011 – REVISED AUGUST 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. MAXIMUM PEAK OUTPUT VOLTAGE MAXIMUM PEAK OUTPUT VOLTAGE vs vs FREE-AIR TEMPERATURE LOAD RESISTANCE ÏÏÏÏ ÏÏÏÏ ÏÏÏÏ ÏÏÏÏ ±15 RL = 10 kΩ ±12.5 VOM − Maximum Peak Output Voltage − V VOM V VOM OM − Maximum Peak Output Voltage − V ±15 RL = 2 kΩ ±10 ÁÁ ÁÁ ÁÁ ÁÁ ÁÁ ±7.5 ±5 ±2.5 VCC± = ±15 V See Figure 2 0 −75 −50 −25 0 25 50 75 100 125 ÁÁ ÁÁ ÁÁ ÁÁ VCC± = ±15 V TA = 25°C See Figure 2 ±12.5 ±10 ±7.5 ±5 ±2.5 0 0.1 0.2 TA − Free-Air Temperature − °C 0.4 1000 RL = 10 kΩ TA = 25°C 400 AAVD VD − Large-Signal Differential Voltage Amplification − V/mV VOM VOM − Maximum Peak Output Voltage − V 7 10 LARGE-SIGNAL DIFFERENTIAL VOLTAGE AMPLIFICATION vs FREE-AIR TEMPERATURE ±15 ±10 ±7.5 ±5 ±2.5 200 100 40 20 10 4 2 0 0 2 4 6 8 10 12 |VCC±| − Supply Voltage − V 14 16 1 −75 VCC± = ±15 V VO = ±10 V RL = 2 kΩ −50 Submit Documentation Feedback −25 0 25 50 75 100 125 TA − Free-Air Temperature − °C Figure 9. 8 4 Figure 8. MAXIMUM PEAK OUTPUT VOLTAGE vs SUPPLY VOLTAGE ÁÁ ÁÁ ÁÁ ÁÁ 2 RL − Load Resistance − kΩ Figure 7. ±12.5 0.7 1 Figure 10. Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TL072-EP TL074-EP TL072-EP, TL074-EP www.ti.com SLOS747C – OCTOBER 2011 – REVISED AUGUST 2012 TYPICAL CHARACTERISTICS (continued) VCC± = ±5 V to ±15 V RL = 2 kΩ TA = 25°C 105 104 0° Differential Voltage Amplification 103 45° 102 90° Phase Shift 101 135° 1 1 10 100 1k 10 k 100 k f − Frequency − Hz 1M 180° 10 M 1.01 1.1 Phase Shift 1 1 0.99 0.9 VCC± = ±15 V RL = 2 kΩ f = B1 for Phase Shift 0.8 0.7 −75 −50 2 ICC − Supply Current Per Amplifier − mA I CC± CMRR − Common-Mode Rejection Ratio − dB SUPPLY CURRENT PER AMPLIFIER vs SUPPLY VOLTAGE VCC± = ±15 V RL = 10 kΩ 88 87 86 85 84 −50 −25 0.97 125 Figure 12. COMMON-MODE REJECTION RATIO vs FREE-AIR TEMPERATURE 83 −75 0.98 −25 0 25 50 75 100 TA − Free-Air Temperature − °C Figure 11. 89 1.02 Unity-Gain Bandwidth 1.2 Normalized Phase Shift AAVD VD − Large-Signal Differential Voltage Amplification 106 Phase Shift Normalized Unity-Gain Bandwidth Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. LARGE-SIGNAL NORMALIZED UNITY-GAIN BANDWIDTH DIFFERENTIAL VOLTAGE AMPLIFICATION AND PHASE SHIFT AND PHASE SHIFT vs vs FREE-AIR TEMPERATURE FREQUENCY 1.03 1.3 0 25 50 75 100 125 TA = 25°C No Signal No Load 1.8 1.6 1.4 1.2 ÁÁ ÁÁ ÁÁ ÁÁ ÁÁ 1 0.8 0.6 0.4 0.2 0 0 2 TA − Free-Air Temperature − °C Figure 13. 4 6 8 10 12 14 16 |VCC±| − Supply Voltage − V Figure 14. Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TL072-EP TL074-EP Submit Documentation Feedback 9 TL072-EP, TL074-EP SLOS747C – OCTOBER 2011 – REVISED AUGUST 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. SUPPLY CURRENT PER AMPLIFIER TOTAL POWER DISSIPATION vs vs FREE-AIR TEMPERATURE FREE-AIR TEMPERATURE 250 VCC± = ±15 V No Signal No Load 1.8 1.6 1.4 1.2 ÁÁ ÁÁ ÁÁ ÁÁ ÁÁ 1 0.8 0.6 0.4 200 175 150 125 100 0.2 0 −75 VCC± = ±15 V No Signal No Load 225 PD PD − Total Power Dissipation − mW ICC − Supply Current Per Amplifier − mA I CC± 2 75 50 25 −50 −25 0 25 50 75 100 0 −75 125 −50 TA − Free-Air Temperature − °C Figure 15. Vn V nV/ Hz n − Equivalent Input Noise Voltage − nV/Hz Normalized Slew Rate − V/ µ s 1.15 VCC± = ±15 V RL = 2 kΩ CL = 100 pF 1.05 1 0.95 0.90 0.85 −75 25 50 75 100 125 EQUIVALENT INPUT NOISE VOLTAGE vs FREQUENCY 50 VCC± = ±15 V AVD = 10 RS = 20 Ω TA = 25°C 40 30 20 10 0 −50 −25 0 25 50 75 100 125 10 40 100 TA − Free-Air Temperature − °C Figure 17. 10 0 Figure 16. ÁÁ ÁÁ ÁÁ ÁÁ ÁÁ NORMALIZED SLEW RATE vs FREE-AIR TEMPERATURE 1.10 −25 TA − Free-Air Temperature − °C Submit Documentation Feedback 400 1 k 4 k 10 k f − Frequency − Hz 40 k 100 k Figure 18. Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TL072-EP TL074-EP TL072-EP, TL074-EP www.ti.com SLOS747C – OCTOBER 2011 – REVISED AUGUST 2012 TYPICAL CHARACTERISTICS (continued) Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. TOTAL HARMONIC DISTORTION VOLTAGE-FOLLOWER vs LARGE-SIGNAL PULSE RESPONSE FREQUENCY 6 0.4 VCC± = ±15 V AVD = 1 VI(RMS) = 6 V TA = 25°C VI and VO − Input and Output Voltages − V THD − Total Harmonic Distortion − % 1 0.1 0.01 0.004 0.001 100 4 Output 2 ÁÁ ÁÁ ÁÁ ÁÁ ÁÁ 0.04 VCC± = ±15 V RL = 2 kΩ CL = 100 pF TA = 25°C ÏÏÏ ÏÏÏ ÏÏÏ 0 −2 Input −4 −6 400 1k 4 k 10 k f − Frequency − Hz 0 40 k 100 k 0.5 1 1.5 t − Time − µs Figure 19. 2 2.5 3 3.5 Figure 20. OUTPUT VOLTAGE vs ELAPSED TIME 28 24 VVO O − Output Voltage − mV Overshoot ÁÁ ÁÁ ÁÁ ÁÁ 20 90% 16 12 8 4 VCC± = ±15 V RL = 2 kΩ TA = 25°C 10% 0 tr −4 0 0.1 0.2 0.3 0.4 0.5 t − Elapsed Time − µs 0.6 0.7 Figure 21. Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TL072-EP TL074-EP Submit Documentation Feedback 11 TL072-EP, TL074-EP SLOS747C – OCTOBER 2011 – REVISED AUGUST 2012 www.ti.com APPLICATION INFORMATION 1N4148 6 sin ωt 18 kΩ (see Note A) −15 V 18 pF 18 pF VCC+ VCC+ − 88.4 kΩ TL072 − + 6 cos ωt TL072 + 88.4 kΩ 1 kΩ VCC− 1 kΩ 18 pF VCC− 15 V 18 kΩ (see Note A) 1N4148 88.4 kΩ NOTE A: These resistor values may be adjusted for a symmetrical output. Figure 22. 100-kHz Quadrature Oscillator VCC+ − 1 MΩ TL074 VCC+ + VCC− − 1 µF TL074 VCC+ + 100 kΩ Output B VCC− VCC+ VCC+ 100 kΩ − 100 µF TL074 VCC− 100 kΩ + 100 kΩ − Input Output A TL074 Output C + VCC− Figure 23. Audio-Distribution Amplifier 12 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TL072-EP TL074-EP PACKAGE OPTION ADDENDUM www.ti.com 25-Jan-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp TL072QDREP ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL074QDREP ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TL072-EP, TL074-EP : • Catalog: TL072, TL074 • Military: TL072M, TL074M Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 25-Jan-2012 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 1-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TL074QDREP Package Package Pins Type Drawing SOIC D 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 9.0 2.1 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 1-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL074QDREP SOIC D 14 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated