ETC GF4810

GF4810
N-Channel MOSFET & Schottky Diode
MOSFET: VDS 30V RDS(ON) 13.5mΩ ID 10A
Schottky: VR 30V VF 0.53V IF 4.0A
SO-8
0.197 (5.00)
0.189 (4.80)
5
8
0.157 (3.99)
0.150 (3.81)
0.244 (6.20)
0.228 (5.79)
4
1
0.020 (0.51)
0.013 (0.33)
0.050 (1.27)
H
C
N
TREENFET oduct
G New Pr
®
Dimensions in inches
and (millimeters)
0.019 (0.48)
x 45 °
0.010 (0.25)
K
D
D
D
8
7
6
5
1
2
3
4
A
S
S
G
Mounting Pad
Layout
0.05 (1.27)
0.04 (1.02)
0.165 (4.19)
0.155 (3.94)
0.245 (6.22)
Min.
0.009 (0.23)
0.007 (0.18)
0.069 (1.75)
0.053 (1.35)
0 °– 8 °
0.009 (0.23)
0.004 (0.10)
0.050(1.27)
0.016 (0.41)
0.035 (0.889)
0.025 (0.635)
0.050 typ.
(1.27)
Mechanical Data
Features
Case: SO-8 molded plastic body
Terminals: Leads solderable per MIL-STD-750,
Method 2026
Mounting Position: Any
Weight: 0.5g
• Enhancement mode MOSFET and Schottky Diode in a
compact package
• Advanced Trench Process Technology and high Density
Cell Design for Ultra Low On-Resistance
• Suitable for Low Voltage DC/DC Converters
• High performance Schottky diode with low VF and high IF
Maximum Ratings and Thermal Characteristics (T
A
= 25°C unless otherwise noted)
MOSFET
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
30
Gate-Source Voltage
VGS
±20
ID
10
8
IDM
50
IS
2.3
PD
2.3
1.5
W
TJ, Tstg
–55 to 150
°C
RθJA
55
°C/W
VR
30
V
PD
1.4
0.9
W
Continuous Drain Current
(TJ = 150°C) (1)
TA = 25°C
TA = 70°C
Pulsed Drain Current
Continuous Source Current (MOSFET Diode Conduction)(1)
Maximum Power Dissipation
(1)
TA = 25°C
TA = 70°C
Operating Junction and Storage Temperature Range
Maximum Thermal Resistance Junction-to-Ambient
(1)
Unit
V
A
Schottky
Reverse Voltage
Maximum Power Dissipation (1)
TA = 25°C
TA = 70°C
Average Forward Current (1)
Pulsed Forward Current
Operating Junction and Storage Temperature Range
Maximum Thermal Resistance Junction-to-Ambient
Notes: (1) Surface Mounted on FR4 Board, t ≤ 10 sec.
(1)
IF
4.0
IFM
50
TJ, Tstg
–55 to 150
°C
RθJA
90
°C/W
A
4/27/01
GF4810
N-Channel MOSFET With Schottky Diode
Electrical Characteristics (T
J
= 25°C unless otherwise noted)
MOSFET
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Drain-Source Breakdown Voltage
BVDSS
VGS = 0V, ID = 250µA
30
–
–
V
Gate Threshold Voltage
VGS(th)
VDS = VGS, ID = 250µA
1.0
–
–
V
Gate-Body Leakage
IGSS
VDS = 0V, VGS = ± 20V
–
–
± 100
nA
Zero Gate Voltage Drain Current
IDSS
VDS = 30V, VGS = 0V
–
–
1
VDS=30V, VGS=0V, TJ=55°C
–
–
5
On-State Drain Current (1)
ID(on)
VDS ≥ 5V, VGS = 10V
20
–
–
VGS = 10V, ID = 10A
–
11.5
13.5
VGS = 4.5V, ID = 5A
–
15.5
20
gfs
VDS = 15V, ID = 10A
–
28
–
S
VSD
IS = 2.3A, VGS = 0V
–
0.75
1.1
V
–
20
30
–
5
–
Static
Drain-Source On-State Resistance(1)
Forward Transconductance(1)
(1)
Diode Forward Voltage
RDS(on)
µA
A
mΩ
Dynamic
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
–
7
–
Turn-On Delay Time
td(on)
–
10
30
–
9
15
–
47
90
–
13
40
–
1850
–
–
315
–
–
150
–
IF = 3.0A
–
0.495
0.53
IF = 2.3A, TJ = 125°C
–
0.420
0.47
VR = 30V
–
0.015
0.100
VR = 30V, TJ = 125°C
–
6.5
20
Rise Time
Turn-Off Delay Time
Fall Time
tr
td(off)
VDS = 15V, VGS = 5V, ID = 10A
VDD = 15V, RL = 15Ω
ID ≅ 1A, VGEN=10V, RG=6Ω
tf
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
VDS = 15V, VGS = 0V
f = 1.0MHz
nC
ns
pF
Schottky
Diode Forward Voltage (1)
VF
Reverse Leakage Current
IR
Notes:
(1) Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2%
V
mA
GF4810
N-Channel MOSFET With Schottky Diode
Ratings and
Characteristic Curves (T
A
= 25°C unless otherwise noted)
Fig. 2 – Transfer Characteristics
Fig. 1 – Output Characteristics
50
VGS = 5.0V, 6.0V, 8.0V, 10V
4.5V
4.0V
3.5V
40
VDS = 10V
30
3.0V
20
10
30
20
TJ = 25°C
0
0
1
2
3
4
5
0
1
2
3
4
VDS -- Drain-to-Source Voltage (V)
VGS -- Gate-to-Source Voltage (V)
Fig. 3 – Threshold Voltage
vs. Temperature
Fig. 4 – On-Resistance
vs. Drain Current
5
0.02
1.4
ID = 250µA
RDS(ON) -- On-Resistance (Ω)
VGS(th) -- Gate-to-Source Threshold Voltage (Normalized)
TJ = 125°C
10
2.5V
0
1.2
1.0
0.8
0.6
--50
--25
0
25
50
75
100
125
150
VGS = 4.5V
0.016
0.014
VGS = 10V
0.012
1.6
VGS = 10V
ID = 10A
1.4
1.2
1
0.8
0.6
--25
0
25
50
75
100
TJ -- Junction Temperature (°C)
0
10
20
30
ID -- Drain Current (A)
TJ -- Junction Temperature (°C)
--50
0.018
0.01
0.4
Fig. 5 – On-Resistance
vs. Junction Temperature
RDS(ON) -- On-Resistance (Normalized)
TJ = -55°C
40
ID -- Drain Current (A)
ID -- Drain-to-Source Current (A)
50
125
150
40
50
GF4810
N-Channel MOSFET With Schottky Diode
Ratings and
Characteristic Curves (T
A
= 25°C unless otherwise noted)
GF4810
N-Channel MOSFET With Schottky Diode
Ratings and
Characteristic Curves (T
A
= 25°C unless otherwise noted)