HD151TS306RP Spread Spectrum Clock for EMI Solution ADE-205-659C (Z) Preliminary Rev.3 Jun. 2002 Description The HD151TS306 is a high-performance Spread Spectrum Clock modulator. It is suitable for low EMI solution. Features • Supports 40 MHz to 140 MHz operation. (Designed @ SSCCLKOUT = 48 MHz and 72 MHz) • 1 copy of finx4 clock out with Spread Spectrum Modulation @3.3 V • 1 copy of reference clock @3.3 V • Programmable Spread Spectrum Modulation (-0.5%, -1.0%, -3.0% Down Spread Modulation and Spread Spectrum disable mode) • SOP-8pin Key Specifications • Supply Voltages: VDD = 3.3 V ±0.165 V • 0 to 70°C (Ta) Operating Range • 50 ± 5% Outputs Clock Duty Cycle • Cycle to Cycle jitter = ±250ps typ. HD151TS306RP Block Diagram VDD GND CLKOUT (12MHz typ.) XIN OSC 1/m SSCCLKOUT (48MHz typ.) Synthesizer XOUT R=1 MΩ 1/n SSC Modulator SEL0 R=100 kΩ Mode Control SEL1 R=100 kΩ Pin Arrangement SSCCLKOUT 1 8 SEL1 VDD 2 7 CLKOUT GND 3 6 SEL0 XIN 4 5 XOUT (Top view) Rev.3, Jun. 2002, page 2 of 10 HD151TS306RP SSC Function Table SEL1 :0 Spread Percentage 00 -1.0% 01 -3.0% 10 SSC OFF 11 -0.5% Note: -0.5% SSC is selected for default by internal pull-up & down resistors. Clock Frequency Table XIN(MHz) SSCCLKOUT(MHz) *1 10 40 35 140 *1 CLKOUT(MHz) 10 *2 35 *2 Notes: 1. With spread spectrum modulation. 2. Without spread spectrum modulation. Pin Descriptions Pin name No. Type Description GND 3 Ground GND pin VDD 2 Power Power supplies pin. Normally 3.3 V. CLKOUT 7 Output Normally 3.3 V reference clock output. SSCCLKOUT 1 Output Spread spectrum modulated clock output. XIN 4 Input Oscillator input. XOUT 5 Output Oscillator output. SEL0 6 Input SSC mode select pin. LVCMOS level input. Pull-up by internal resistor (100 kΩ). SEL1 8 Input SSC mode select pin. LVCMOS level input. Pull–up by internal resistor (100 kΩ). Rev.3, Jun. 2002, page 3 of 10 HD151TS306RP Absolute Maximum Ratings Item Symbol Ratings Unit Supply voltage VDD –0.5 to 4.6 V VI –0.5 to 4.6 V VO –0.5 to VDD+0.5 V Input clamp current IIK –50 mA VI < 0 Output clamp current IOK –50 mA VO < 0 Continuous output current IO ±50 mA VO = 0 to VDD 0.7 W –65 to +150 °C Input voltage Output voltage *1 Maximum power dissipation at Ta = 55°C (in still air) Storage temperature Notes: Tstg Conditions Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 1. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. Recommended Operating Conditions Item Symbol Min Typ Max Unit Conditions Supply voltage VDD 3.135 3.3 3.465 V –0.3 — VDD+0.3 V DC input signal voltage High level input voltage VIH 2.0 — VDD+0.3 V Low level input voltage VIL –0.3 — 0.8 V Operating temperature Ta 0 — 70 °C 45 50 55 % Input clock duty cycle Rev.3, Jun. 2002, page 4 of 10 HD151TS306RP DC Electrical Characteristics Ta = 0 to 70°C, VDD = 3.3 V±5% Item Symbol Min Typ Input low voltage VIL — Input high voltage VIH Input current II Input slew rate Input capacitance CI Operating current Note: *1 Max Unit Test Conditions — 0.8 V 2.0 — — V — — ±10 µA — — ±100 1 — 4 V / ns 20% – 80% — — 4 pF SEL0, SEL1 — 20 — mA XIN = 24 MHz, CL = 0 pF, VDD = 3.3 V VI = 0 V or 3.465 V, VDD = 3.465 V, XIN pin VI = 0 V or 3.465 V, VDD = 3.465 V, SEL0, SEL1 pins 1. For conditions shown as Min or Max, use the appropriate value specified under recommended operating conditions. DC Electrical Characteristics / Clock Output & SSC Clock Output Ta = 0 to 70°C, VDD = 3.3 V±5% Item Symbol Min Typ Output voltage VOH 3.1 VOL — Note: *1 Max Unit Test Conditions — — V IOH = –1 mA, VDD = 3.3 V — 50 mV IOL = 1 mA, VDD = 3.3 V 1. For conditions shown as Min or Max, use the appropriate value specified under recommended operating conditions. Rev.3, Jun. 2002, page 5 of 10 HD151TS306RP AC Electrical Characteristics / Clock Output & SSC Clock Output Ta = 25°C, VDD = 3.3 V, CL = 15 pF Item Cycle to cycle jitter *1, 2 Symbol Min Typ Max Unit Test Conditions Notes tCCS — | 250 | | 300 | ps — | 250 | — SSCCLKOUT = 48MHz, XIN = 12 MHz SSC = 0% SEL1:0 = 10 Fig1 | 300 | SSCCLKOUT = 48MHz, XIN = 12 MHz SSC = -0.5% SEL1:0 = 11 Fig1 | 250 | | 300 | SSCCLKOUT = 72MHz, XIN = 18 MHz SSC = 0% SEL1:0 = 10 Fig1 — | 250 | | 300 | SSCCLKOUT = 72MHz, XIN = 18 MHz SSC = -0.5% SEL1:0 = 11 Fig1 — | 250 | | 300 | 47.3 — 48.7 MHz SSCCLKOUT = 48MHz, XIN = 12 MHz SSC = 0% SEL1:0 = 10 47.1 — 48.7 SSCCLKOUT = 48MHz, XIN = 12 MHz SSC = -0.5% SEL1:0 = 11 70.4 — 73.6 SSCCLKOUT = 72MHz, XIN = 18 MHz SSC = 0% SEL1:0 = 10 70.1 — 73.6 SSCCLKOUT = 72MHz, XIN = 18 MHz SSC = -0.5% SEL1:0 = 11 0.8 — — V/ns XIN = 12 MHz CLKOUT 0.4 V to 2.4 V 45 50 55 % — 40 — Ω Spread spectrum *1 modulation frequency — 33 — KHz SSCCLKOUT = 96MHz, XIN = 24 MHz Input clock frequency 10 — 35 MHz — — 2 ms Output frequency *1, 2 *1 Slew rate Clock duty cycle tSL *1 Output impedance Stabilization time Note: *1 *1,3 CLKOUT=12MHz Fig1 1. Parameters are target of design. Not 100% tested in production. 2. Cycle to cycle jitter and output frequency are included spread spectrum modulation. 3. Stabilization time is the time required for the integrated circuit to obtain phase lock of its input signal after power up. Rev.3, Jun. 2002, page 6 of 10 HD151TS306RP SSCCLKOUT (or CLKOUT) tcycle n tcycle n+1 t CCS = (tcycle n) - (tcycle n+1) Figure 1 Cycle to cycle jitter Rev.3, Jun. 2002, page 7 of 10 HD151TS306RP Application Information Recommended Circuit Configuration The power supply circuit of the optimal performance on the application of a system should refer to Fig. 2. VDD decoupling is important to both reduce Jitter and EMI radiation. The C1 decoupling capacitor should be placed as close to the VDD pin as possible, otherwise the increased trace inductance will negate its decoupling capability. The C2 decoupling capacitor shown should be a tantalum type. R1 SSCCLKOUT 1 8 VDD 2 7 SEL1 R2 C2 CLKOUT C1 3 6 SEL0 TS306 GND GND 4 5 GND Notes: XIN XOUT (Crystal or Reference input) (Crystal or Not connection) C1 = High frequency supply decoupling capacitor. (0.1 µF recommended) C2 = Low frequency supply decoupling capacitor. (22 µF tantalum type recommended) R1, R2 = Match value to line impedance. Figure 2 Recommended circuit configuration Rev.3, Jun. 2002, page 8 of 10 HD151TS306RP Package Dimensions As of January, 2002 Unit: mm 3.95 4.90 5.3 Max 5 8 *0.22 ± 0.03 0.20 ± 0.03 4 1.75 Max 1 0.75 Max + 0.10 6.10 – 0.30 1.08 0.14 – 0.04 *0.42 ± 0.08 0.40 ± 0.06 + 0.11 0˚ – 8˚ 1.27 + 0.67 0.60 – 0.20 0.15 0.25 M *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC JEITA Mass (reference value) FP-8DC Conforms — 0.085 g Rev.3, Jun. 2002, page 9 of 10 HD151TS306RP Disclaimer 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Sales Offices Hitachi, Ltd. Semiconductor & Integrated Circuits Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: (03) 3270-2111 Fax: (03) 3270-5109 URL http://www.hitachisemiconductor.com/ For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe Ltd. Electronic Components Group Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 585200 Hitachi Asia Ltd. Hitachi Tower 16 Collyer Quay #20-00 Singapore 049318 Tel : <65>-6538-6533/6538-8577 Fax : <65>-6538-6933/6538-3877 URL : http://semiconductor.hitachi.com.sg Hitachi Europe GmbH Electronic Components Group Dornacher Straße 3 D-85622 Feldkirchen Postfach 201, D-85619 Feldkirchen Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Asia Ltd. (Taipei Branch Office) 4/F, No. 167, Tun Hwa North Road Hung-Kuo Building Taipei (105), Taiwan Tel : <886>-(2)-2718-3666 Fax : <886>-(2)-2718-8180 Telex : 23222 HAS-TP URL : http://www.hitachi.com.tw Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower World Finance Centre, Harbour City, Canton Road Tsim Sha Tsui, Kowloon Hong Kong Tel : <852>-2735-9218 Fax : <852>-2730-0281 URL : http://semiconductor.hitachi.com.hk Copyright © Hitachi, Ltd., 2002. All rights reserved. Printed in Japan. Colophon 6.0 Rev.3, Jun. 2002, page 10 of 10