ETC HD151TS301RP

HD151TS301RP
Clock Generator for Printer
ADE-205-603G (Z)
Rev. 7
Oct. 2002
Description
The HD151TS301RP is a high-performance clock generator. It is specifically designed for printer.
Features
•
•
•
•
Supports 20 MHz to 50 MHz operation. (Designed for 24 MHz and 48 MHz)
1 copy of clock out with spread spectrum modulation @3.3 V
1 copy of reference clock @3.3 V
Programmable spread spectrum modulation (–0.5%, –1.0%, –2.0% and –3.0% down spread
modulation.)
• SOP-8pin
Key Specifications
•
•
•
•
Supply voltages : VDD = 3.3 V±0.165 V
Ta = 0 to 70°C operating range
Clock output duty cycle = 50±5%
Ordering Information
Part Name
Package Type
Package Code
Package
Abbreviation
Taping
Abbreviation (Quantity)
HD151TS301RPEL
SOP-8 pin (JEDEC)
FP-8DC
RP
EL (2,500 pcs / Reel)
Note: Please consult the sales office for the above package availability.
HD151TS301RP
Pin Arrangement
SSCCLKOUT
1
8
SEL1
VDD
2
7
CLKOUT
GND
3
6
SEL0
XIN
4
5
XOUT
(Top view)
SSC Function Table
SEL1 :0
Spread Percentage
00
–1.0%
01
–3.0%
10
–2.0%
11
–0.5%
Note: –3.0% spread percentage is selected @ default.
Rev.7, Oct. 2002, page 2 of 11
HD151TS301RP
Pin Descriptions
Pin name
No.
Type
Description
GND
3
Ground
GND pins
VDD
2
Power
Power supplies pins. Nominal 3.3 V.
CLKOUT
7
Output
Normal 3.3 V reference clock output.
SSCCLKOUT
1
Output
Spread spectrum modulated clock output.
XIN
4
Input
Oscillator input.
XOUT
5
Output
Oscillator output.
SEL0
6
Input
SSC mode select pin. LVCMOS level input.
Internal pull–up resistors (typically 100 kΩ).
SEL1
8
Input
SSC mode select pin. LVCMOS level input.
Internal pull–down resistors (typically 100 kΩ).
Block Diagram
VDD
GND
CLKOUT
XIN
OSC
1/m
Synthesizer
1/2
SSCCLKOUT
XOUT R=1 MΩ
1/n
SSC Modulator
SEL0
R=100 kΩ
Mode Control
SEL1
R=100 kΩ
Rev.7, Oct. 2002, page 3 of 11
HD151TS301RP
Absolute Maximum Ratings
Item
Symbol
Ratings
Unit
Supply voltage
VDD
–0.5 to 4.6
V
VI
–0.5 to 4.6
V
VO
–0.5 to
VDD+0.5
V
Input clamp current
IIK
–50
mA
VI < 0
Output clamp current
IOK
–50
mA
VO < 0
Continuous output current
IO
±50
mA
VO = 0 to VDD
0.7
W
–65 to +150
°C
Input voltage
Output voltage
*1
Maximum power dissipation
at Ta = 55°C (in still air)
Storage temperature
Notes:
Tstg
Conditions
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage
to the device. These are stress ratings only, and functional operation of the device at these or
any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute maximum rated conditions for extended periods may affect device
reliability.
1. The input and output negative voltage ratings may be exceeded if the input and output clamp
current ratings are observed.
Recommended Operating Conditions
Item
Symbol
Min
Typ
Max
Unit Conditions
Supply voltage
VDD
3.135
3.3
3.465
V
–0.3
—
VDD+0.3
V
DC input signal voltage
High level input voltage
VIH
2.0
—
VDD+0.3
V
Low level input voltage
VIL
–0.3
—
0.8
V
Operating temperature
Ta
0
—
70
°C
45
50
55
%
Input clock duty cycle
Rev.7, Oct. 2002, page 4 of 11
HD151TS301RP
DC Electrical Characteristics
Ta = 0 to 70°C, VDD = 3.3 V±5%
Item
Symbol
Min
Input low voltage
VIL
—
Input high voltage
VIH
2.0
Input current
II
—
Typ
Max
Unit
—
0.8
V
—
—
V
—
±10
µA
—
—
±100
Test Conditions
VI = 0 V or 3.465 V,
VDD = 3.465 V, XIN
VI = 0 V or 3.465 V,
VDD = 3.465 V, SEL0, SEL1
Input slew rate
SR
1
—
4
V / ns 20% – 80%
Input capacitance
CI
—
—
4
pF
SEL0, SEL1
—
11
—
mA
XIN = 24 MHz, CL = 0 pF,
VDD = 3.3 V
—
22
—
Operating current
XIN = 48 MHz, CL = 0 pF,
VDD = 3.3 V
DC Electrical Characteristics / Clock Output & SSC Clock Output
Ta = 0 to 70°C, VDD = 3.3 V±5%
Item
Symbol Min
Typ
Max
Unit
Test Conditions
Output voltage
VOH
3.1
—
—
V
IOH = –1 mA, VDD = 3.3 V
VOL
—
—
50
mV
IOL = 1 mA, VDD = 3.3 V
IOH
–55
–85
–125
mA
VOH = 1.5 V
IOL
55
75
105
Output current
VOL = 1.5 V
Rev.7, Oct. 2002, page 5 of 11
HD151TS301RP
AC Electrical Characteristics / Clock Output & SSC Clock Output
Ta = 25°C, VDD = 3.3 V, CL = 30 pF
Item
Cycle to cycle jitter
*1, 2
Symbol
Min
Typ
Max
Unit Test Conditions Notes
tCCS
—
—
| 500 |
ps
—
—
—
Output frequency *1, 2
Slew rate
*1
Clock duty cycle
tSL
*1
@24 MHz
SSCCLKOUT
SSC = –0.5%
| 500 |
@48 MHz
SEL1:0 = 1 1
Figure 1
—
| 500 |
@24 MHz
SSCCLKOUT
SSC = –3.0%
—
—
| 500 |
@48 MHz
SEL1:0 = 0 1
Figure 1
—
—
| 500 |
@24, 48 MHz
CLKOUT
Figure 1
23.6
—
24.3
MHz @24 MHz
SSCCLKOUT
SSC = –0.5%
46.6
—
49.2
@48 MHz
SEL1:0 = 1 1
23.0
—
24.3
@24 MHz
SSCCLKOUT
SSC = –3.0%
45.5
—
49.2
@48 MHz
SEL1:0 = 0 1
23.7
—
24.3
@24 MHz
CLKOUT
46.8
—
49.2
@48 MHz
1.0
—
—
V/ns @48 MHz
45
50
55
%
Output impedance *1
—
30
—
Ω
Spread spectrum
*1
modulation frequency
—
33
—
KHz @48 MHz
Input clock frequency
20
—
50
MHz
—
—
2
ms
Stabilization time
*1,3
tSTAB
0.4 V to 2.4 V
Notes: 1. Parameters are target of design. Not 100% tested in production.
2. Cycle to cycle jitter and output frequency are included spread spectrum modulation.
3. Stabilization time is the time required for the integrated circuit to obtain phase lock of its input
signal after power up.
SSCCLKOUT
tcycle n
tcycle n+1
t CCS = (tcycle n) - (tcycle n+1)
Figure 1 Cycle to cycle jitter (SSCCLKOUT)
Rev.7, Oct. 2002, page 6 of 11
HD151TS301RP
Application Information
1. Recommended Circuit Configuration
The power supply circuit of the optimal performance on the application of a system should refer to Fig. 2.
VDD decoupling is important to both reduce Jitter and EMI radiation.
The C1 decoupling capacitor should be placed as close to the VDD pin as possible, otherwise the increased
trace inductance will negate its decoupling capability.
The C2 decoupling capacitor shown should be a tantalum type.
R1
SSCCLKOUT
1
8
VDD
2
7
SEL1
R2
C2
CLKOUT
C1
3
6
SEL0
TS300 Series
GND GND
4
5
GND
Notes:
XIN
XOUT
(Crystal or
Reference input)
(Crystal or
Not connection)
C1 = High frequency supply decoupling capacitor.
(0.1 µF recommended)
C2 = Low frequency supply decoupling capacitor.
(22 µF tantalum type recommended)
R1, R2 = Match value to line impedance.
(22 Ω Reference value)
Figure 2 Recommended circuit configuration
Rev.7, Oct. 2002, page 7 of 11
HD151TS301RP
2. Example Board Layout Configuration
VDD
(+3.3 V Supply)
P
22 µF
FB
G
R1
1
SSCCLKOUT
8
0.1 µF
R2
7
G
G
3
6
4
5
Crystal connection
or Reference input
Note:
Crystal connection
or Not connection
G Via to GND plane
R1, R2 = Match value to line impedance.
(22 Ω Reference value)
FB = Ferrite bead.
Figure 3 Example Board Layout
Rev.7, Oct. 2002, page 8 of 11
CLKOUT
HD151TS301RP
3. Example of TS300 EMI Solution IC’s Application
Spread Spectrum
Modulated Clock
XTAL
XOUT
TS30X
CPU & ASIC
SSC
CLKOUT
Memory
System BUS
XIN
Graphics
System Cont.
Ref.
Clock
3.3 V CMOS level ref. Clock
Fig 4 Ref. Clock Input Example
XIN
XTAL
XOUT
TS30X
CPU & ASIC
SSC
CLKOUT
System BUS
Spread Spectrum
Modulated Clock
Memory
Graphics
System Cont.
Fig 5 XTAL Ref. Clock Input Example
Rev.7, Oct. 2002, page 9 of 11
HD151TS301RP
Package Dimensions
As of July, 2002
Unit: mm
3.95
4.90
5.3 Max
5
8
*0.22 ± 0.03
0.20 ± 0.03
4
1.75 Max
1
0.75 Max
+ 0.10
6.10 – 0.30
1.08
0.14 – 0.04
*0.42 ± 0.08
0.40 ± 0.06
+ 0.11
0˚ – 8˚
1.27
+ 0.67
0.60 – 0.20
0.15
0.25 M
*Dimension including the plating thickness
Base material dimension
Rev.7, Oct. 2002, page 10 of 11
Hitachi Code
JEDEC
JEITA
Mass (reference value)
FP-8DC
Conforms
—
0.085 g
HD151TS301RP
Disclaimer
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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Copyright © Hitachi, Ltd., 2002. All rights reserved. Printed in Japan.
Colophon 7.0
Rev.7, Oct. 2002, page 11 of 11