HAT2057RA Silicon N Channel Power MOS FET High Speed Power Switching ADE-208-1636 (Z) 1st. Edition Feb. 2003 Features • • • • Low on-resistance Capable of 1.5 V gate drive Low drive current High density mounting Outline SOP-8 8 5 7 6 3 1 2 4 5 6 D D 7 8 D D 4 G 2 G S1 MOS1 S3 MOS2 1, 3 Source 2, 4 Gate 5, 6, 7, 8 Drain HAT2057RA Absolute Maximum Ratings (Ta = 25°C) Item Symbol Ratings Unit Drain to source voltage VDSS 20 V Gate to source voltage VGSS +6,-3 V Drain current ID 4 A Drain peak current ID(pulse)Note1 32 A Body–drain diode reverse drain current IDR 4 A Channel dissipation Pch Note2 2 W Channel dissipation Pch Note3 3 W Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C Notes: 1. PW ≤ 10µs, duty cycle ≤ 1 % 2. 1 Drive operation: When using the glass epoxy board (FR4 40 x 40 x 1.6 mm), PW≤ 10s 3. 2 Drive operation: When using the glass epoxy board (FR4 40 x 40 x 1.6 mm), PW≤ 10s Rev.0, Feb. 2003, page 2 of 5 HAT2057RA Electrical Characteristics (Ta = 25°C) Item Symbol Min Typ Max Unit Test Conditions Drain to source breakdown voltage V(BR)DSS 20 — — V ID = 10 mA, VGS = 0 Gate to source leak current IGSS — — ±0.2 µA VGS = +6 V, -3V, VDS = 0 Zero gate voltage drain current IDSS — — 10 µA VDS = 10 V, VGS = 0 Gate to source cutoff voltage VGS(off) 0.15 — 0.90 V VDS = 10 V, I D = 1mA Static drain to source on state RDS(on) — 26 33 mΩ ID = 2 A,VGS = 4 V Note4 resistance RDS(on) — 40 60 mΩ ID = 2 A,VGS = 1.5 V Forward transfer admittance |yfs| 8 13 — S ID = 2 A,VDS = 10 V Note4 Input capacitance Ciss — 1100 — pF VDS = 10 V Output capacitance Coss — 155 — pF VGS = 0 Reverse transfer capacitance Crss — 125 — pF f = 1 MHz Turn-on delay time td(on) — 15 — ns VGS = 4 V, ID = 2 A Rise time tr — 25 — ns VDD ≅ 10 V Turn-off delay time td(off) — 65 — ns Rg = 4.7 Ω Fall time tf — 13 — ns RL = 5 Ω Body–drain diode forward voltage VDF — 0.80 1.04 V IF = 4 , VGS = 0 Note4 Body–drain diode reverse recovery time trr — 40 — ns IF = 4A, VGS = 0 diF/ dt =20 A/µs Note4 Notes: 4. Pulse test Rev.0, Feb. 2003, page 3 of 5 HAT2057RA Package Dimensions As of July, 2002 Unit: mm 3.95 4.90 5.3 Max 5 8 *0.22 ± 0.03 0.20 ± 0.03 4 1.75 Max 1 0.75 Max + 0.10 6.10 – 0.30 1.08 0.14 – 0.04 *0.42 ± 0.08 0.40 ± 0.06 + 0.11 0˚ – 8˚ 1.27 + 0.67 0.60 – 0.20 0.15 0.25 M *Dimension including the plating thickness Base material dimension Rev.0, Feb. 2003, page 4 of 5 Hitachi Code JEDEC JEITA Mass (reference value) FP-8DA Conforms — 0.085 g HAT2057RA Disclaimer 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Sales Offices Hitachi, Ltd. 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(Taipei Branch Office) 4/F, No. 167, Tun Hwa North Road Hung-Kuo Building Taipei (105), Taiwan Tel : <886>-(2)-2718-3666 Fax : <886>-(2)-2718-8180 Telex : 23222 HAS-TP URL : http://semiconductor.hitachi.com.tw Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower World Finance Centre, Harbour City, Canton Road Tsim Sha Tsui, Kowloon Hong Kong Tel : <852>-2735-9218 Fax : <852>-2730-0281 URL : http://semiconductor.hitachi.com.hk Copyright © Hitachi, Ltd., 2003. All rights reserved. Printed in Japan. Colophon 7.0 Rev.0, Feb. 2003, page 5 of 5