ETC NTD3055L104/D

NTD3055L104
Advance Information
Power MOSFET
12 Amps, 60 Volts, Logic Level
N–Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
http://onsemi.com
12 AMPERES
60 VOLTS
RDS(on) = 104 mΩ
Features
•
•
•
•
•
Lower RDS(on)
Lower VDS(on)
Tighter VSD Specification
Lower Diode Reverse Recovery Time
Lower Reverse Recovery Stored Charge
N–Channel
D
Typical Applications
•
•
•
•
Power Supplies
Converters
Power Motor Controls
Bridge Circuits
G
4
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Drain–to–Source Voltage
Drain–to–Gate Voltage (RGS = 10 MΩ)
Gate–to–Source Voltage
– Continuous
– Non–Repetitive (tp10 ms)
Drain Current
– Continuous @ TA = 25°C
– Continuous @ TA = 100°C
– Single Pulse (tp10 µs)
Total Power Dissipation @ TA = 25°C
Derate above 25°C
Total Power Dissipation @ TA = 25°C (Note 1.)
Total Power Dissipation @ TA = 25°C (Note 2.)
Operating and Storage Temperature Range
Single Pulse Drain–to–Source Avalanche
Energy – Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 5.0 Vdc, L = 1.0 mH
IL(pk) = 11 A, VDS = 60 Vdc)
Thermal Resistance
– Junction–to–Case
– Junction–to–Ambient (Note 1.)
– Junction–to–Ambient (Note 2.)
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
Symbol
Value
Unit
VDSS
VDGR
60
Vdc
60
Vdc
VGS
VGS
15
20
ID
ID
IDM
PD
12
10
45
Adc
48
0.32
2.1
1.5
W
W/°C
W
W
TJ, Tstg
–55 to
+175
°C
EAS
61
mJ
1
CASE 369A
DPAK
(Bent Lead)
STYLE 2
NTD3055L104
Y
WW
RθJC
RθJA
RθJA
3.13
71.4
100
°C/W
TL
260
°C
1
2
3
CASE 369
DPAK
(Straight Lead)
STYLE 2
= Device Code
= Year
= Work Week
MARKING DIAGRAMS
& PIN ASSIGNMENTS
Apk
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
March, 2001 – Rev. 1
1 2
3
Vdc
1. When surface mounted to an FR4 board using 1″ pad size,
(Cu Area 1.127 in2).
2. When surface mounted to an FR4 board using the minimum recommended
pad size, (Cu Area 0.412 in2).
 Semiconductor Components Industries, LLC, 2001
4
S
4
Drain
4
Drain
YWW
NTD
3055L104
YWW
NTD
3055L104
1
Gate
2
Drain
3
Source
1
Gate
3
Source
2
Drain
ORDERING INFORMATION
Device
NTD3055L104
Package
Shipping
DPAK
75 Units/Rail
DPAK
NTD3055L104–1
Straight Lead
NTD3055L104T4
DPAK
75 Units/Rail
2500 Tape & Reel
Publication Order Number:
NTD3055L104/D
NTD3055L104
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
60
–
70
62.9
–
–
–
–
–
–
1.0
10
–
–
±100
1.0
–
1.6
4.2
2.0
–
–
89
104
–
–
0.98
0.86
1.50
–
gFS
–
9.1
–
mhos
Ciss
–
316
440
pF
Coss
–
105
150
Crss
–
35
70
td(on)
–
9.2
20
OFF CHARACTERISTICS
Drain–to–Source Breakdown Voltage (Note 3.)
(VGS = 0 Vdc, ID = 250 µAdc)
Temperature Coefficient (Positive)
V(BR)DSS
Zero Gate Voltage Drain Current
(VDS = 60 Vdc, VGS = 0 Vdc)
(VDS = 60 Vdc, VGS = 0 Vdc, TJ = 150°C)
IDSS
Gate–Body Leakage Current (VGS = ±15 Vdc, VDS = 0 Vdc)
IGSS
Vdc
mV/°C
µAdc
nAdc
ON CHARACTERISTICS (Note 3.)
Gate Threshold Voltage (Note 3.)
(VDS = VGS, ID = 250 µAdc)
Threshold Temperature Coefficient (Negative)
VGS(th)
Static Drain–to–Source On–Resistance (Note 3.)
(VGS = 5.0 Vdc, ID = 6.0 Adc)
RDS(on)
Static Drain–to–Source On–Voltage (Note 3.)
(VGS = 5.0 Vdc, ID = 12 Adc)
(VGS = 5.0 Vdc, ID = 6.0 Adc, TJ = 150°C)
VDS(on)
Forward Transconductance (Note 3.) (VDS = 8.0 Vdc, ID = 6.0 Adc)
Vdc
mV/°C
mOhm
Vdc
DYNAMIC CHARACTERISTICS
Input Capacitance
(VDS = 25 Vd
Vdc, VGS = 0 Vdc,
Vd
f = 1.0 MHz)
Output Capacitance
Transfer Capacitance
SWITCHING CHARACTERISTICS (Note 4.)
Turn–On Delay Time
Rise Time
(VDD = 30 Vdc, ID = 12 Adc,
VGS = 5.0 Vdc, RG = 9.1 Ω) (Note 3.)
Turn–Off Delay Time
Fall Time
Gate Charge
(VDS = 48 Vdc,
Vd ID = 12 Adc,
Ad
VGS = 5.0 Vdc) (Note 3.)
ns
tr
–
104
210
td(off)
–
19
40
tf
–
40.5
80
QT
–
7.4
20
Q1
–
2.0
–
Q2
–
4.0
–
VSD
–
–
0.95
0.82
1.2
–
Vdc
trr
–
35
–
ns
ta
–
21
–
tb
–
14
–
QRR
–
0.04
–
nC
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage
(IS = 12 Adc, VGS = 0 Vdc) (Note 3.)
(IS = 12 Adc, VGS = 0 Vdc, TJ = 150°C)
Reverse Recovery Time
(IS = 12 Adc,
Ad VGS = 0 Vdc,
Vd
dIS/dt = 100 A/µs) (Note 3.)
Reverse Recovery Stored Charge
3. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%.
4. Switching characteristics are independent of operating junction temperatures.
http://onsemi.com
2
µC
NTD3055L104
PACKAGE DIMENSIONS
DPAK
CASE 369A–13
ISSUE AA
C
B
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
SEATING
PLANE
–T–
E
R
4
Z
A
S
1
2
3
U
K
F
J
L
H
D
2 PL
0.13 (0.005)
G
M
T
DIM
A
B
C
D
E
F
G
H
J
K
L
R
S
U
V
Z
INCHES
MIN
MAX
0.235
0.250
0.250
0.265
0.086
0.094
0.027
0.035
0.033
0.040
0.037
0.047
0.180 BSC
0.034
0.040
0.018
0.023
0.102
0.114
0.090 BSC
0.175
0.215
0.020
0.050
0.020
--0.030
0.050
0.138
---
STYLE 2:
PIN 1.
2.
3.
4.
MILLIMETERS
MIN
MAX
5.97
6.35
6.35
6.73
2.19
2.38
0.69
0.88
0.84
1.01
0.94
1.19
4.58 BSC
0.87
1.01
0.46
0.58
2.60
2.89
2.29 BSC
4.45
5.46
0.51
1.27
0.51
--0.77
1.27
3.51
---
GATE
DRAIN
SOURCE
DRAIN
DPAK
CASE 369–07
ISSUE M
C
B
V
E
R
4
A
1
2
3
S
–T–
SEATING
PLANE
K
J
F
H
D
G
3 PL
0.13 (0.005)
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
H
J
K
R
S
V
INCHES
MIN
MAX
0.235
0.250
0.250
0.265
0.086
0.094
0.027
0.035
0.033
0.040
0.037
0.047
0.090 BSC
0.034
0.040
0.018
0.023
0.350
0.380
0.175
0.215
0.050
0.090
0.030
0.050
STYLE 2:
PIN 1.
2.
3.
4.
T
http://onsemi.com
3
GATE
DRAIN
SOURCE
DRAIN
MILLIMETERS
MIN
MAX
5.97
6.35
6.35
6.73
2.19
2.38
0.69
0.88
0.84
1.01
0.94
1.19
2.29 BSC
0.87
1.01
0.46
0.58
8.89
9.65
4.45
5.46
1.27
2.28
0.77
1.27
NTD3055L104
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
NORTH AMERICA Literature Fulfillment:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada
Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada
Email: [email protected]
Fax Response Line: 303–675–2167 or 800–344–3810 Toll Free USA/Canada
N. American Technical Support: 800–282–9855 Toll Free USA/Canada
EUROPE: LDC for ON Semiconductor – European Support
German Phone: (+1) 303–308–7140 (Mon–Fri 2:30pm to 7:00pm CET)
Email: ONlit–[email protected]
French Phone: (+1) 303–308–7141 (Mon–Fri 2:00pm to 7:00pm CET)
Email: ONlit–[email protected]
English Phone: (+1) 303–308–7142 (Mon–Fri 12:00pm to 5:00pm GMT)
Email: [email protected]
CENTRAL/SOUTH AMERICA:
Spanish Phone: 303–308–7143 (Mon–Fri 8:00am to 5:00pm MST)
Email: ONlit–[email protected]
Toll–Free from Mexico: Dial 01–800–288–2872 for Access –
then Dial 866–297–9322
ASIA/PACIFIC: LDC for ON Semiconductor – Asia Support
Phone: 303–675–2121 (Tue–Fri 9:00am to 1:00pm, Hong Kong Time)
Toll Free from Hong Kong & Singapore:
001–800–4422–3781
Email: ONlit–[email protected]
JAPAN: ON Semiconductor, Japan Customer Focus Center
4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031
Phone: 81–3–5740–2700
Email: [email protected]
ON Semiconductor Website: http://onsemi.com
EUROPEAN TOLL–FREE ACCESS*: 00–800–4422–3781
*Available from Germany, France, Italy, UK, Ireland
For additional information, please contact your local
Sales Representative.
http://onsemi.com
4
NTD3055L104/D