ETC 2SD2000P

Power Transistors
2SD2000
Silicon NPN triple diffusion planar type
Unit: mm
16.7±0.3
14.0±0.5
• High-speed switching
• Satisfactory linearity of forward current transfer ratio hFE
• Large collector power dissipation PC
• Full-pack package which can be installed to the heat sink with one
screw
4.2±0.2
5.5±0.2
4.2±0.2
2.7±0.2
φ 3.1±0.1
1.4±0.1
Solder Dip
(4.0)
■ Features
10.0±0.2
7.5±0.2
0.7±0.1
For power switching
Collector to base voltage
2.54±0.3
Symbol
Rating
Unit
VCBO
80
V
Collector to emitter voltage
VCEO
60
V
Emitter to base voltage
VEBO
6
V
Peak collector current
ICP
8
A
Collector current
IC
4
A
Base current
IB
1
A
PC
35
W
Collector power
dissipation
TC = 25°C
Ta = 25°C
0.5+0.2
–0.1
0.8±0.1
■ Absolute Maximum Ratings TC = 25°C
Parameter
1.3±0.2
5.08±0.5
1: Base
2: Collector
3: Emitter
EIAJ: SC-67
TO-220F Package
1 2 3
2
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
■ Electrical Characteristics TC = 25°C
Parameter
Symbol
Collector cutoff current
Conditions
Min
ICBO
VCB = 80 V, IE = 0
Emitter to base current
IEBO
VEB = 6 V, IC = 0
Collector to emitter voltage
VCEO
IC = 25 mA, IB = 0
60
Forward current transfer ratio
hFE1
*
Typ
Max
Unit
100
µA
100
µA
V
VCE = 4 V, IC = 1 A
70
hFE2
VCE = 4 V, IC = 4 A
20
250
Base to emitter saturation voltage
VBE(sat)
VCE = 4 V, IC = 4 A
2.0
V
Collector to emitter saturation voltage
VCE(sat)
IC = 4 A, IB = 0.4 A
1.5
V
Transition frequency
fT
VCE = 12 V, IC = 0.2 A, f = 10 MHz
80
MHz
Turn-on time
ton
IC = 4 A, IB1 = 0.4 A, IB2 = − 0.4 A,
0.3
µs
Storage time
tstg
VCC = 50 V
1.0
µs
Fall time
tf
0.2
µs
Note) *: Rank classification
Rank
Q
P
hFE1
70 to 150
120 to 250
1
2SD2000
Power Transistors
PC  T a
IC  VCE
VCE(sat)  IC
(1) TC=Ta
(2) With a 100 × 100 × 2mm
Al heat sink
(3) With a 50 × 50 × 2mm
Al heat sink
(4) Without heat sink
(PC=2W)
(1)
35
30
25
20
15
(2)
10
Collector to emitter saturation voltage VCE(sat) (V)
4
TC=25˚C
IB=40mA
35mA
Collector current IC (A)
Collector power dissipation PC (W)
40
3
30mA
25mA
20mA
2
15mA
10mA
1
5mA
(3)
5
(4)
0
0
0
20
40
60
80 100 120 140 160
0
Ambient temperature Ta (˚C)
1
2
3
VBE(sat)  IC
7
8
3
TC=–25˚C
100˚C
25˚C
0.1
0.03
0.3
1
1
0.3
TC=100˚C
0.1
3
0.03
0.01
0.01 0.03
103
TC=100˚C
102
–25˚C
25˚C
10
1
0.01 0.03
Collector current IC (A)
Cob  VCB
0.1
0.3
1
3
1
100
10
10
1
10
0.3
1
3
10
Area of safe operation (ASO)
100
Non repetitive pulse
TC=25˚C
30
tstg
1
ton
tf
0.1
0.1
Collector current IC (A)
Pulsed tw=1ms
Duty cycle=1%
IC/IB=10 (IB1=–IB2)
VCC=50V
TC=25˚C
IE=0
f=1MHz
TC=25˚C
Switching time ton,tstg,tf (µs)
3
100
0.1
0.01 0.03
10
ton, tstg, tf  IC
10000
10
0.3
VCE=12V
f=10MHz
TC=25˚C
Collector current IC (A)
100
0.1
VCE=4V
10
1000
–25˚C
25˚C
fT  I C
Collector current IC (A)
0.1
3
Collector current IC (A)
Transition frequency fT (MHz)
10
0.3
10
1000
IC/IB=10
30
1
30
hFE  IC
Forward current transfer ratio hFE
Base to emitter saturation voltage VBE(sat) (V)
6
104
0.01
0.01 0.03
Collector output capacitance Cob (pF)
5
IC/IB=10
Collector to emitter voltage VCE (V)
100
10
ICP
3
IC
t=1ms
DC
1
0.3
0.1
0.03
0.01
1
1
3
10
30
100
300
1000
Collector to base voltage VCB (V)
2
4
100
0.01
0
1
2
3
4
5
6
7
Collector current IC (A)
8
1
3
10
30
100
300
1000
Collector to emitter voltage VCE (V)
Power Transistors
2SD2000
Rth(t)  t
Thermal resistance Rth(t) (˚C/W)
10000
Note: Rth was measured at Ta=25˚C and under natural convection.
(1) Without heat sink
(2) With a 100 × 100 × 2mm Al heat sink
1000
100
(1)
10
(2)
1
0.1
10–4
10–3
10–2
10–1
1
10
102
103
104
Time t (s)
3
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2001 MAR