DATE May-13-'02 CHECKED May-13-'02 CHECKED May-13-'02 NAME DWG.NO. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. SPECIFICATION Device Name : Power MOSFET Type Name : 2SK3526-01L,S,SJ Spec. No. : MS5F5221 Date : May-13-2002 Fuji Electric Co.,Ltd. Matsumoto Factory APPROVED DRAWN Fuji Electric Co.,Ltd. MS5F5221 1 / 21 H04-004-05 Date May-13 2002 Classification Index Fuji Electric Co.,Ltd. DWG.NO. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. Revised Records Content Drawn Checked Checked Approved enactment MS5F5221 2 / 21 H04-004-03 1.Scope This specifies Fuji Power MOSFET 2SK3526-01L,S,SJ 2.Construction N-Channel enhancement mode power MOSFET 3.Applications for Switching 4.Outview T-pack L-type Outview See to 8/21 page S-type Outview See to 9/21 page SJ-type Outview See to 10/21 page 5.Absolute Maximum Ratings at Tc=25°° C (unless otherwise specified) Symbol Characteristics Unit 600 V Remarks Drain-Source Voltage VDS Continuous Drain Current ID ±6 A Pulsed Drain Current IDP ± 24 A Gate-Source Voltage VGS ± 30 V Maximum Avalanche Current IAR 6 A Maximum Avalanche Energy EAV 193 mJ Maximum Drain-Source dV/dt dVDS/dt 20 kV/µs VDS<=600V Peak Diode Recovery dV/dt dV/dt 5 kV/µs *1 Maximum Power Dissipation PD 1.67 W 65 Tch<=150°C L=9.83mH Vcc=60V Ta=25°C Tc=25°C Operating and Storage Tch 150 °C Temperature range Tstg -55 to +150 °C *1 IF≤-ID,-di/dt=50A/µs,Vcc≤BVDSS,Tch≤150°C 6.Electrical Characteristics at Tc=25°° C (unless otherwise specified) Static Ratings Description Symbol Conditions min. typ. max. Unit 600 - - V 3.0 - 5.0 V - - 25 ID=250µA Drain-Source Breakdown Voltage BVDSS Gate Threshold Voltage VGS(th) Zero Gate Voltage Drain Current IDSS Gate-Source Leakage Current IGSS Drain-Source On-State Resistance RDS(on) VGS=0V ID=250µA VDS=VGS VDS=600V Tch=25°C VGS=0V VDS=480V Tch=125°C VGS=0V µA - - 250 - 10 100 nA - 0.93 1.20 Ω VGS= ± 30V VDS=0V ID=3A VGS=10V Fuji Electric Co.,Ltd. DWG.NO. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. Description MS5F5221 3 / 21 H04-004-03 Dynamic Ratings Description Symbol Conditions min. typ. max. Unit VDS=25V 3 6 - S ID=3A Forward Transconductance gfs Input Capacitance Ciss VDS=25V - 750 1130 Output Capacitance Coss VGS=0V - 100 150 4 6 Reverse Transfer f=1MHz Capacitance Crss - td(on) Vcc=300V - 14 21 tr VGS=10V - 9 14 td(off) ID=3A - 24 36 Turn-Off Time tf RGS=10Ω - 7 10.5 Total Gate Charge QG Vcc=300V - 20 30 Gate-Source Charge QGS ID=6A - 8.5 13 Gate-Drain Charge QGD VGS=10V - 5.5 8.5 min. typ. max. Unit 6 - - A - 1.00 1.50 V - 0.7 - µs - 3.5 - µC min. typ. max. Unit Turn-On Time ns nC Reverse Diode Description Symbol Avalanche Capability Conditions L=9.83mH Tch=25°C IAV See Fig.1 and Fig.2 IF=6A Diode Forward On-Voltage VSD VGS=0V Tch=25°C IF=6A Reverse Recovery Time trr Reverse Recovery VGS=0V -di/dt=100A/µ s Charge Qrr Tch=25°C 7.Thermal Resistance Description Symbol Channel to Case Rth(ch-c) 1.92 °C/W Channel to Ambient Rth(ch-a) 75.0 °C/W Fuji Electric Co.,Ltd. DWG.NO. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. pF MS5F5221 4 / 21 H04-004-03 50Ω Fuji Electric Co.,Ltd. DWG.NO. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. Fig.1 Test circuit L D.U.T L=9.83mΗ Vcc=60V Single Pulse Test MS5F5221 Vcc Fig.2 Operating waveforms +10V VGS -15V IDP BVDSS 0 VDS ID 5 / 21 H04-004-03 8.Reliability test items All guaranteed values are under the categories of reliability per non-assembled(only MOSFETs). Each categories under the guaranteed reliability conform to EIAJ ED4701 B101A standards. Test items required without fail : Test Method B-121,B-122,B-123,B-131,B-141 Humidification treatment (85±2°C,65±5%RH,168±24hr) Heat treatment of soldering (IR-ray Reflow ,235±5°C(240°Cmax.),10±1sec,2 times) Test Items Testing methods and Conditions 1 Vibration frequency : 100Hz to 2kHz 2 Acceleration : 100m/s Sweeping time : 20min./1 cycle 6times for each X,Y&Z directions. 2 Peak amplitude: 15km/s Duration time : 0.5ms 3times for each X,Y&Z directions. 2 Shock 3 Solderability 4 Resistance to Soldering Heat Reference Standard EIAJ ED4701 A-122 test code D Acceptance number 15 15 (0:1) A-131A test code B Solder temp. : 235±5°C Immersion time : 10±1sec IR-ray Reflowing A-133A test code 1-A Fuji Electric Co.,Ltd. Sampling number A-121 test code C Solder temp. : 215±5°C Immersion time : 10±0.5sec DWG.NO. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. Mechanical test methods Test No. MS5F5221 15 15 6 / 21 H04-004-03 Test Items Testing methods and Conditions 1 High Temp. Storage 2 Low Temp. Storage 3 Temperature Humidity Storage 4 Temperature Humidity BIAS Temperature : 150+0/-5°C Test duration : 1000hr Temperature : -55+5/-0°C Test duration : 1000hr Temperature : 85±2°C Relative humidity : 85±5% Test duration : 1000hr Temperature : 85±2°C Relative humidity : 85±5% Bias Voltage : VDS(max) * 0.8 5 Unsaturated Pressurized Vapor Test duration : 1000hr Temperature : 130±2°C Relative humidity : 85±5% Vapor pressure : 230kPa Test duration : 96hr 6 Temperature Cycle Test for FET 7 Thermal Shock 1 Intermittent Operating Life 2 HTRB (Gate-source) 3 HTRB (Drain-Source) Reference Standard EIAJ ED4701 B-111A Sampling number Acceptance number 22 B-112A 22 B-121A test code C 22 B-122A test code C 22 (0:1) High temp.side : 150±5°C Low temp.side : -55±5°C Duration time : HT 30min,LT 30min Number of cycles : 100cycles Fluid : pure water(running water) High temp.side : 100+0/-5°C Low temp.side : 0+5/-0°C Duration time : HT 5min,LT 5min Number of cycles : 100cycles Ta=25±5°C ∆Tc=90degree Tch≤Tch(max.) Test duration : 3000 cycle Temperature : 150+0/-5°C Bias Voltage : VGS(max) Test duration : 1000hr Temperature : 150+0/-5°C Bias Voltage : VDS(max) Test duration : 1000hr B-123A test code C 22 B-131A test code A 22 B-141A test code A 22 D-322 22 D-323 22 D-323 22 (0:1) Failure Criteria Symbols Failure Criteria Lower Limit Upper Limit Breakdown Voltage BVDSS Zero gate Voltage Drain-Source Current Gate-Source Leakage Current Gate Threshold Voltage VGS(th) Unit LSL * 0.8 ----- V IDSS ----- USL * 2 A IGSS ----- USL * 2 A LSL * 0.8 USL * 1.2 V Drain-Source on-state Resistance RDS(on) Forward Transconductance gfs Diode forward on-Voltage VSD ----- USL * 1.2 Ω LSL * 0.8 ----- S ----- USL * 1.2 V Marking Soldering ----- With eyes or Microscope ----- and other damages * LSL : Lower Specification Limit * USL : Upper Specification Limit * Before any of electrical characteristics measure, all testing related to the humidity have conducted after drying the package surface for more than an hour at 150°C. Fuji Electric Co.,Ltd. DWG.NO. Electrical Characteristics Item Outview This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. Climatic test methods Test No. MS5F5221 7 / 21 H04-004-03 Fuji Electric Co.,Ltd. DWG.NO. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. T-pack L-type MS5F5221 8 / 21 H04-004-03 Fuji Electric Co.,Ltd. DWG.NO. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. T-pack S-type MS5F5221 9 / 21 H04-004-03 Fuji Electric Co.,Ltd. DWG.NO. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. T-pack SJ-type MS5F5221 10 / 21 H04-004-03 9 Warning 9.1. Although Fuji Electric is enhancing product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing a physical injury, fire, or other problem if any of the products become faulty. It is recommended to make your design fail-safe, flame retardant, and free of malfunction. 9.2. The products introduced in this Specification are intended for use in the following electronic and electrical equipment witch has normal reliability requirements. • Computers OA equipments • Measurement equipments • Electrical home appliances • Communications equipment (Terminal devices) • Machine tools • AV equipments • Personal equipments • Industrial robots etc… • Transportation equipment (Automotives, Locomotives and ships etc…) • Backbone network equipment • Traffic-signal control equipment • Gas alarm, Leakage gas auto breaker • Burglar alarm, Fire alarm, Emergency equipments etc… 9.4. Don’t use products in this Specification for the equipment requiring strict reliability such as (without limitation) • Aerospace equipment • Aeronautic equipment • nuclear control equipment • Medical equipment • Submarine repeater equipment 10. General Notice 10.1. Preventing ESD Damage Although the gate oxide of Fuji Power MOSFETs is much higher ruggedness to ESD damage than small-Signal MOSFETs and CMOS ICs, careful handling of any MOS devices are an important consideration. 1) When handling MOSFETs, hold them by the case (package) and don’t touch the leads and terminals. 2) It is recommended that any handling of MOSFETs is done while used electrically conductive floor and tablemats that are grounded. 3) Before touching a MOSFETs terminal, discharge any static electricity from your body and clothes by grounding out through a high impedance resistor (about 1MΩ) 4) When soldering, in order to protect the MOSFETs from static electricity, ground the soldering iron or soldering bath through a low impedance resistor. Fuji Electric Co.,Ltd. DWG.NO. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. 9.3. If you need to use a product in this Specification for equipment requiring higher reliability than normal, such as for the equipment listed below, it is imperative to contact Fuji Electric to obtain prior approval. When using these products for such equipment, take adequate measures such as a backup system to prevent the equipment from malfunctioning even if a Fuji’s product incorporated in the equipment becomes faulty. MS5F5221 11 / 21 H04-004-03 10.2. Short mode failure / Open mode failure The MOSFETs may be in the risk of having short mode failure or open mode failure when the applied over voltage, over current or over temperature each specified maximum rating. It is recommended to use the fail-safe equipment or circuit from such possible failures. 10.3. An Electric shock / A Skin burn You may be in risk for an Electric shock or a Skin burn for directly touching to the leads or package of the MOSFETs while turning on electricity or operating. 10.4. Smoke / Fire Fuji MOSFETs are made of incombustibility material. However, a failure of the MOSFETs may emit smoke or fire. Also, operating the MOSFETs near any flammable place or material may risk the MOSFETs to emit smoke or fire due to the MOSFETs reach high temperature while operated. 10.6. Radiation field Don’t use of the device under the radiation field since the device is not designed for radiation proofing. 11. Notes for Design 11.1. You must design the MOSFETs to be operated within specified maximum ratings (Voltage, Current, Temperature etc…) which are imperative to prevent possible failure or destruction of the device. 11.2. We recommend to use the protection equipment or safety equipment such as fuse, breaker to prevent the fire or damage in case of unexpected accident may have occurred. 11.3. You must design the MOSFETs within it’s reliability and lifetime in certain the environment or condition. There is a risk that MOSFETs breakdown earlier than the target lifetime of the your products when MOSFETs was used in the reliability condition excessively. Especially avoid use of the MOSFETs under the higher humidity, corrosive gases. 11.4. We recommend to consider for the temperature rise not only for the Channel but also for the Leads if it designed to large current operation to the MOSFETs. 11.5. We only guarantee the non-repetitive and repetitive Avalanche capability and not for the continuous Avalanche capability which can be assumed as abnormal condition. Please note the device may be destructed from the Avalanche over the specified maximum rating. Fuji Electric Co.,Ltd. DWG.NO. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. 10.5. Corrosion / Erosion Avoid use or storage of the MOSFETs under the higher humidity, corrosive gases. It will lead the device to corrode and possibly cause the device to fail. MS5F5221 12 / 21 H04-004-03 12. Note on implementation 12.1. Soldering Soldering involves temperatures witch exceed the device storage temperature rating. To avoid device damage and to ensure reliability, the following guidelines from the quality assurance standard must be observed. 1) Solder temperature and duration (Through-Hole Package) Solder temperature Duration 260±5 °C 10±1 seconds 350±10 °C 3.5±0.5 seconds 2) The device should not be soldered closer than 1mm from the package. (* through-hole package) 3) When flow soldered, care must be taken to Avoid immersing the package in the solder-bath. Table 1 : Recommended tightening torques. Package style TO-220 TO-220F TO-3P TO-3PF TO-247 TO-3PL Screw Recommended tightening torques M3 30 – 50 Ncm M3 40 – 60 Ncm M3 60 –80 Ncm 12.3. If the heat sink with coarse finish is used, increase in thermal resistance and concentrated force to a point may cause the MOSFETs to be destructed. We recommend in such condition to process the surface of heat sink within ±50µm and use of thermal compound to optimize its efficiency of heat radiation. Moreover, it is important to evenly apply the compound and eliminate any air voids. A simple method is to apply a dot of compound of the appropriate quantity to the center of the case just below the chip mount. Fuji Electric Co.,Ltd. DWG.NO. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. 12.2. Please see to the following the Torque reference when mounting the device to heat sink. Excess torque applied to the mounting screw causes damage to the device and weak torque will increase the thermal resistance. Both of these conditions may lead the device to be destructed. MS5F5221 13 / 21 H04-004-03 13.Notes for Storage 13.1. The MOSFETs should be stored at a standard temperature of 5 to 35 °C and humidity of 45 to 75%RH. If the storage area is very dry, a humidifier may be required. In such a case, use only deionized water or boiled water, since the chlorine in tap water may corrode the leads. 13.2. Avoid exposure to corrosive gases and dust. 13.3. Rapid temperature changes may cause condensation on the MOSFETs surface. Therefore, store the MOSFETs in a place with few temperature changes. 13.4. While in storage, it is important that nothing be loaded on top of the MOSFETs, since this may cause excessive external force on the case. 13.5. Store MOSFETs with unprocessed lead terminals. Rust may cause presoldered connections to go bad during later processing. 14. Additional points If you have any question about any portion in this Specification, ask Fuji Electric or its sales agents before using the product. Neither Fuji nor its agents shall be liable for any injury caused bay any use of the products not in accordance with instructions set forth herein. Fuji Electric Co.,Ltd. DWG.NO. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. 13.6. Use only antistatic containers or shipping bag for storing MOSFETs. MS5F5221 14 / 21 H04-004-03 0 0 25 2 4 6 50 8 Fuji Electric Co.,Ltd. DWG.NO. ID [A] This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. PD [W] Allowable Power Dissipation PD=f(Tc) 80 70 60 50 40 30 20 10 0 75 100 14 20V 6 2 125 150 Tc [°C] Typical Output Characteristics ID=f(VDS):80 µs pulse test,Tch=25 °C 18 16 10V 8V 12 7.5V 10 8 7.0V 4 VGS=6.5V 0 10 12 14 16 18 20 22 24 26 28 30 VDS [V] MS5F5221 15 / 21 H04-004-03 0 0.1 1 2 3 4 Fuji Electric Co.,Ltd. DWG.NO. gfs [S] This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. ID[A] Typical Transfer Characteristic ID=f(VGS):80 µs pulse test,VDS=25V,Tch=25 °C 10 1 0.1 5 VGS[V] 6 1 7 8 9 10 Typical Transconductance gfs=f(ID):80 µs pulse test,VDS=25V,Tch=25 °C 100 10 1 0.1 10 ID [A] MS5F5221 16 / 21 H04-004-03 Typical Drain-Source on-state Resistance RDS(on)=f(ID):80 µs pulse test,Tch=25 °C 2.6 7.0V VGS=6.5V 2.4 7.5V 2.2 2.0 8V RDS(on) [ Ω ] 1.8 10V 20V 1.6 1.4 1.2 1.0 0.8 0.6 This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. 0.4 0.2 0.0 0 2 4 6 8 10 12 14 16 18 125 150 ID [A] Drain-Source On-state Resistance RDS(on)=f(Tch):ID=3A,VGS=10V 3.0 2.5 RDS(on) [ Ω ] 2.0 max. 1.5 typ. 1.0 0.5 0.0 -25 0 25 Fuji Electric Co.,Ltd. 50 Tch [°C] DWG.NO. -50 75 100 MS5F5221 17 / 21 H04-004-03 VGS(th) [V] 5.0 3.0 -50 0 -25 10 0 25 16 20 Fuji Electric Co.,Ltd. DWG.NO. VGS [V] This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. Gate Threshold Voltage vs. Tch VGS(th)=f(Tch):VDS=VGS,ID=250uA 7.0 6.5 6.0 5.5 max. 4.5 4.0 3.5 min. 2.5 2.0 1.5 1.0 0.5 0.0 50 75 Tch [°C] 20 Vcc= 120V 18 300V 30 100 40 125 50 150 Typical Gate Charge Characteristics VGS=f(Qg):ID=3A,Tch=25 °C 24 22 480V 14 12 10 8 6 4 2 0 60 Qg [nC] MS5F5221 18 / 21 H04-004-03 10 -1 10 0 0.1 0.00 0.25 0.50 0.75 Fuji Electric Co.,Ltd. DWG.NO. IF [A] This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. C [F] Typical Capacitance C=f(VDS):VGS=0V,f=1MHz 10n 1n Ciss 100p Coss 10p Crss 1p 10 1 10 2 1.00 1.25 1.50 10 3 VDS [V] Typical Forward Characteristics of Reverse Diode IF=f(VSD):80 µs pulse test,Tch=25 °C 100 10 1 1.75 2.00 VSD [V] MS5F5221 19 / 21 H04-004-03 0 25 50 Fuji Electric Co.,Ltd. DWG.NO. EAV [mJ] This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. t [ns] Typical Switching Characteristics vs. ID t=f(ID):Vcc=300V,VGS=10V,RG=10 Ω 10 2 td(off) tr 1 td(on) 10 tf 0 10 10 0 10 1 ID [A] Maximum Avalanche Energy vs. starting Tch E(AV)=f(starting Tch):Vcc=60V,I(AV)<=6A 300 250 200 150 100 50 0 75 100 125 150 starting Tch [°C] MS5F5221 20 / 21 H04-004-03 Avalanche Current I AV [A] 2 1 10 -8 10 -6 10 -7 10 -5 10 -6 10 -4 Fuji Electric Co.,Ltd. DWG.NO. Zth(ch-c) [℃/W] This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. 10 Maximum Avalanche Current Pulsewidth IAV=f(tAV):starting Tch=25°C,Vcc=60V 10 Single Pulse 10 0 10 -1 10 -2 10 -5 10 -4 10 -3 10 -2 10 -3 10 -1 MS5F5221 10 -2 tAV [sec] Transient Thermal Impedance Zth(ch-c)=f(t):D=0 10 1 10 0 10 -1 10 -2 10 -3 10 0 t [sec] 21 / 21 H04-004-03