APT60DF120HJ ISOTOP®Fast Diode Full Bridge Power Module VRRM = 1200V IC = 60A @ Tc = 80°C Application • • • • Switch mode power supplies rectifier Induction heating Welding equipment High speed rectifiers Features • • • • • • • • + ~ ~ Ultra fast recovery times Soft recovery characteristics High blocking voltage High current Low leakage current Very low stray inductance High level of integration ISOTOP® Package (SOT-227) Benefits • • • • • • - Outstanding performance at high frequency operation Low losses Low noise switching Direct mounting to heatsink (isolated package) Low junction to case thermal resistance RoHS Compliant Symbol VR VRRM Parameter Maximum DC reverse Voltage Maximum Peak Repetitive Reverse Voltage IF(AV) Maximum Average Forward Current IFSM Non-Repetitive Forward Surge Current Duty cycle = 50% 8.3ms Max ratings Unit 1200 V TC = 25°C 90 TC = 80°C TJ = 45°C 540 60 A These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com 1-4 APT60DF120HJ – Rev 0 November, 2009 Absolute maximum ratings APT60DF120HJ All ratings @ Tj = 25°C unless otherwise specified Electrical Characteristics Symbol Characteristic VF Diode Forward Voltage IRM Maximum Reverse Leakage Current CT Junction Capacitance Test Conditions IF = 60A IF = 120A Tj = 125°C IF = 60A Tj = 25°C VR = 1200V Tj = 125°C Min Typ 2.5 3 1.8 Max 3 V 100 500 VR = 200V Unit 70 µA pF Dynamic Characteristics Symbol Characteristic trr Reverse Recovery Time Qrr Reverse Recovery Charge IRRM Reverse Recovery Current trr Reverse Recovery Time Qrr Reverse Recovery Charge IRRM Reverse Recovery Current Test Conditions IF = 60A VR = 800V di/dt = 200A/µs IF = 60A VR = 800V di/dt=1000A/µs Min Typ Tj = 25°C 265 Tj = 125°C 350 Tj = 25°C Tj = 125°C 560 2890 Tj = 25°C 5 Tj = 125°C 13 Tj = 125°C Max Unit ns nC A 150 ns 4720 nC 40 A Thermal and package characteristics Characteristic Junction to Case Thermal resistance Junction to Ambient Min RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz 2500 -55 Storage Temperature Range Max Lead Temp for Soldering:0.063” from case for 10 sec Mounting torque (Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine) Package Weight www.microsemi.com Typ Max 0.9 20 Unit °C/W V 175 300 1.5 29.2 °C N.m g 2-4 APT60DF120HJ – Rev 0 November, 2009 Symbol RthJC RthJA VISOL TJ,TSTG TL Torque Wt APT60DF120HJ Typical Performance Curve Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration Thermal Impedance (°C/W) 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.05 Single Pulse 0 0.00001 0.0001 0.001 0.01 0.1 1 10 Rectangular Pulse Duration (Seconds) Forward Current vs Forward Voltage Trr vs. Current Rate of Charge trr, Reverse Recovery Time (ns) 125 100 TJ=125°C 75 50 TJ=25°C 25 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 400 TJ=125°C VR=800V 300 120 A 200 60 A 30 A 100 0 0 3.5 200 TJ=125°C VR=800V 6 120 A 5 60 A 4 30 A 3 2 1 0 0 200 400 600 800 800 1000 1200 1000 1200 50 TJ=125°C VR=800V 40 120 A 60 A 30 A 30 20 10 0 0 200 -diF/dt (A/µs) 400 600 800 1000 1200 -diF/dt (A/µs) Capacitance vs. Reverse Voltage Max. Average Forward Current vs. Case Temp. 100 400 Duty Cycle = 0.5 TJ=175°C 80 300 IF(AV) (A) C, Capacitance (pF) 600 IRRM vs. Current Rate of Charge QRR vs. Current Rate Charge 7 400 -diF/dt (A/µs) IRRM, Reverse Recovery Current (A) QRR, Reverse Recovery Charge (µC) VF, Anode to Cathode Voltage (V) 200 100 60 40 20 0 0 1 10 100 VR, Reverse Voltage (V) 1000 25 50 75 100 125 150 175 Case Temperature (ºC) www.microsemi.com 3-4 APT60DF120HJ – Rev 0 November, 2009 IF, Forward Current (A) 150 APT60DF120HJ SOT-227 (ISOTOP®) Package Outline 11.8 (.463) 12.2 (.480) 31.5 (1.240) 31.7 (1.248) 7.8 (.307) 8.2 (.322) r = 4.0 (.157) (2 places) W=4.1 (.161) W=4.3 (.169) H=4.8 (.187) H=4.9 (.193) (4 places) 4.0 (.157) 4.2 (.165) (2 places) 3.3 (.129) 3.6 (.143) 8.9 (.350) 9.6 (.378) Hex Nut M4 (4 places) 0.75 (.030) 0.85 (.033) 25.2 (0.992) 25.4 (1.000) 3.30 (.130) 12.6 (.496) 4.57 (.180) 12.8 (.504) 1.95 (.077) 2.14 (.084) 14.9 (.587) 15.1 (.594) 30.1 (1.185) 30.3 (1.193) Dimensions in Millimeters and (Inches) ISOTOP® is a registered trademark of ST Microelectronics NV Microsemi reserves the right to change, without notice, the specifications and information contained herein Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262 and foreign patents. U.S and Foreign patents pending. All Rights Reserved. www.microsemi.com 4-4 APT60DF120HJ – Rev 0 November, 2009 38.0 (1.496) 38.2 (1.504)