ETC HM51W4405BS-7

HM51W4405BS Series
1,048,576-word × 4-bit Dynamic Random Access Memory
ADE-203-686A (Z)
Rev. 1.0
Nov. 29, 1996
Description
The Hitachi HM51W4405BS Series is a CMOS dynamic RAM organized 1,048,576-word × 4-bit.
HM51W4405BS Series has realized higher density, higher performance and various functions by
employing 0.8 µm CMOS process technology and some new CMOS circuit design technologies. The
HM51W4405BS Series offers Extended Data Out (EDO) Page Mode as a high speed access mode. It has
the package variations of standard 26-pin plastic SOJ.
Features
• Single 3.3 V (±0.3 V) (HM51W4405BS-7)
• Single 3.3 V (+0.3 V/–0.15 V) (HM51W4405BS-6R)
• High speed
 Access time: 60/70 ns (max)
• Low power dissipation
 Active mode: 288/252 mW (max)
 Standby mode: 7.2 mW (max)
• EDO page mode capability
• 1024 refresh cycles : 16 ms
• 3 variations of refresh
 RAS-only refresh
 CAS-before-RAS refresh
 Hidden refresh
Ordering Information
Type No.
Access time
Package
HM51W4405BS-6R
HM51W4405BS-7
60 ns
70 ns
300-mil 26-pin plastic SOJ (CP-26/20D)
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HM51W4405BS Series
Pin Arrangement
HM51W4405BS Series
I/O1 1
26 VSS
I/O2 2
25 I/O4
WE 3
24 I/O3
RAS 4
23 CAS
A9 5
22 OE
A0 9
18 A8
A1 10
17 A7
A2 11
16 A6
A3 12
15 A5
V
CC
14 A4
13
(Top view)
Pin Description
Pin name
Function
A0 to A9
Address input
•
Row/Refresh: A0 to A9
•
Column: A0 to A9
I/O1 to I/O4
Data-in/Data-out
RAS
Row address strobe
CAS
Column address strobe
WE
Read/Write enable
OE
Output enable
VCC
Power supply
VSS
Ground
2
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Row Address Buffer
Row
Driver
256 k Memory Array Mat
OE Control
Circuit
256 k Memory Array Mat
WE Control
Circuit
I/O Bus & Column Decoder
CAS Control
Circuit
256 k Memory Array Mat
OE
I/O Bus & Column Decoder
Row
Driver
256 k Memory Array Mat
I/O Bus & Column Decoder
WE
256 k Memory Array Mat
Row
Driver
256 k Memory Array Mat
256 k Memory Array Mat
I/O Bus & Column Decoder
256 k Memory Array Mat
CAS
256 k Memory Array Mat
Row Row
Driver Driver
I/O Bus & Column Decoder
Row
Driver
256 k Memory Array Mat
Row Row
Driver Driver
256 k Memory Array Mat
Row
Driver
I/O Bus & Column Decoder
Row
Driver
256 k Memory Array Mat
RAS Control
Circuit
256 k Memory Array Mat
I/O Bus & Column Decoder
256 k Memory Array Mat
RAS
256 k Memory Array Mat
I/O Bus & Column Decoder
256 k Memory Array Mat
HM51W4405BS Series
Block Diagram
I/O1
I/O2
I/O3
I/O4
I/O1 Buffer
I/O2 Buffer
I/O3 Buffer
I/O4 Buffer
Row Decoder & Peripheral Circuit
Row Row
Driver Driver
Row
Driver
Row Row
Driver Driver
Row
Driver
Column Address Buffer
Address A0–A9
3
HM51W4405BS Series
Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Voltage on any pin relative to V SS
VT
–0.5 to +4.6
V
Supply voltage relative to VSS
VCC
–0.5 to +4.6
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
1.0
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
–55 to +125
°C
Recommended DC Operating Conditions (Ta = 0 to +70°C)
Parameter
Symbol
Min
Typ
Max
Unit
Supply voltage
VSS
0
0
0
V
•
(HM51W4405BS-6R)
VCC
3.15
3.3
3.6
V
1
•
(HM51W4405BS-7)
VCC
3.0
3.3
3.6
V
1
Input high voltage
VIH
2.0
—
VCC + 0.3
V
1
Input low voltage
VIL
–0.3
—
0.8
V
1
Note:
1. All voltage referred to VSS .
4
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Note
HM51W4405BS Series
DC Characteristics
(Ta = 0 to +70°C, VCC= 3.3 V +0.3 V/–0.15 V, VSS= 0 V) (HM51W4405BS-6R)
(Ta = 0 to +70°C, VCC= 3.3 V ±0.3 V, VSS = 0 V) (HM51W4405BS-7)
HM51W4405B
-6R
Parameter
-7
Symbol
Min
Max Min
Max Unit
Test conditions
I CC1
—
80
—
70
mA
RAS, CAS cycling, t RC = min
Standby current
I CC2
—
2
—
2
mA
TTL interface, RAS, CAS = VIH
Dout = High-Z
Standby current
I CC2
—
1
—
1
mA
CMOS interface
RAS, CAS ≥ V CC –0.2 V
Dout = High-Z
I CC3
—
80
—
70
mA
t RC = min
Standby current*
I CC5
—
4
—
4
mA
RAS = VIH, CAS = VIL
Dout = enable
CAS-before-RASrefresh
current
I CC6
—
80
—
70
mA
t RC = min
EDO page mode current*1, 3
I CC4
—
100
—
85
mA
t HPC = min
Input leakage current
I LI
–10
10
–10
10
µA
0 V ≤ Vin ≤ 4.6 V
Output leakage current
I LO
–10
10
–10
10
µA
0 V ≤ Vout ≤ 4.6 V
Dout = disable
Output high voltage
VOH
2.4
VCC
2.4
VCC
V
High Iout = –2 mA
Output low voltage
VOL
0
0.4
0
0.4
V
Low Iout = 2 mA
Operating current*
1, 2
RAS-only refresh current*2
1
Notes: 1. I CC depends on output load condition when the device is selected. ICC max is specified at the
output open condition.
2. Address can be changed twice or less while RAS = VIL.
3. Address can be changed once or less while CAS = VIH.
Capacitance
(Ta = 25°C, VCC= 3.3 V +0.3 V/–0.15 V) (HM51W4405BS-6R)
(Ta = 25°C, VCC= 3.3 V ±0.3 V) (HM51W4405BS-7)
Parameter
Symbol
Typ
Max
Unit
Notes
Input capacitance (Address)
CI1
—
5
pF
1
Input capacitance (Clocks)
CI2
—
7
pF
1
Output capacitance (Data-in, Data-out)
CI/O
—
7
pF
1, 2
Notes: 1. Capacitance measured with Boonton Meter or effective capacitance measuring method.
2. RAS and CAS = VIH to disable Dout.
5
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HM51W4405BS Series
AC Characteristics
(Ta = 0 to +70°C, VCC= 3.3 V +0.3 V /–0.15 V , VSS= 0 V ) (H M 51W4405BS-6R)* 1 , *1 4 , *1 5
(Ta = 0 to +70°C, VCC= 3.3 V ±0.3 V, VSS= 0 V) (HM51W4405BS-7)*1, *14, *15
Test Conditions
•
•
•
•
•
Input rise and fall time : 2 ns
Input level : VIL = 0 V, V IH = 3.0 V
Input timing reference levels : 0.8 V, 2.0 V
Output timing reference levels : 0.8 V, 2.0 V
Output load: 1 TTL gate + CL (100 pF) (Including scope and jig)
Read, Write, Read-Modify-Write and Refresh Cycles (Common parameters)
HM51W4405B
-6R
Parameter
Symbol Min
Random read or write cycle time
t RC
RAS precharge time
-7
Max
Min
Max
Unit
104
—
124
—
ns
t RP
40
—
50
—
ns
RAS pulse width
t RAS
60
10000
70
10000
ns
17
CAS pulse width
t CAS
10
10000
13
10000
ns
18
Row address setup time
t ASR
0
—
0
—
ns
Row address hold time
t RAH
10
—
10
—
ns
Column address setup time
t ASC
0
—
0
—
ns
Column address hold time
t CAH
10
—
13
—
ns
RAS to CAS delay time
t RCD
20
45
20
50
ns
8
RAS to column address delay time
t RAD
15
30
15
35
ns
9
RAS hold time
t RSH
15
—
18
—
ns
CAS hold time
t CSH
48
—
58
—
ns
CAS to RAS precharge time
t CRP
10
—
10
—
ns
OE to Din delay time
t ODD
15
—
18
—
ns
OE delay time from Din
t DZO
0
—
0
—
ns
CAS setup time from Din
t DZC
0
—
0
—
ns
Transition time (rise and fall)
tT
2
50
2
50
ns
Refresh period
t REF
—
16
—
16
ms
6
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Notes
21
7
HM51W4405BS Series
Read Cycle
HM51W4405B
-6R
Parameter
Symbol Min
Access time from RAS
t RAC
Access time from CAS
-7
Max
Min
Max
Unit
Notes
—
60
—
70
ns
2, 3
t CAC
—
15
—
18
ns
3, 4, 13
Access time from address
t AA
—
30
—
35
ns
3, 5, 13
Access time from OE
t OAC
—
15
—
18
ns
3
Read command setup time
t RCS
0
—
0
—
ns
Read command hold time to CAS
t RCH
0
—
0
—
ns
16
Read command hold time to RAS
t RRH
0
—
0
—
ns
16
Column address to RAS lead time
t RAL
30
—
35
—
ns
Column address to CAS lead time
t CAL
18
—
23
—
ns
Output buffer turn-off time
t OFF1
—
15
—
15
ns
6,19
Output buffer turn-off time to OE
t OFF2
—
15
—
15
ns
6
CAS to Din delay time
t CDD
15
—
18
—
ns
RAS to Din delay time
t RDD
15
—
18
—
ns
WE to Din delay time
t WDD
15
—
18
—
ns
OE pulse width
t OEP
15
—
18
—
ns
Turn-off to RAS
t OFR
—
15
—
15
ns
6, 19
Turn-off to WE
t WEZ
—
15
—
15
ns
6
Output data hold time
t OH
5
—
5
—
ns
Output data hold time from RAS
t OHR
5
—
5
—
ns
Read command hold time from RAS
t RCHR
60
—
70
—
ns
Read command hold time from CAS
t RCHC
15
—
18
—
ns
Read command hold time from column
address
t RCHA
30
—
35
—
ns
7
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HM51W4405BS Series
Write Cycle
HM51W4405B
-6R
Parameter
Symbol Min
Write command setup time
t WCS
Write command hold time
-7
Max
Min
Max
Unit
Notes
0
—
0
—
ns
10
t WCH
10
—
13
—
ns
Write command pulse width
t WP
10
—
10
—
ns
Write command to RAS lead time
t RWL
10
—
13
—
ns
Write command to CAS lead time
t CWL
10
—
13
—
ns
Data-in setup time
t DS
0
—
0
—
ns
11
Data-in hold time
t DH
10
—
13
—
ns
11
Notes
Read-Modify-Write Cycle
HM51W4405B
-6R
Parameter
Symbol Min
Read-modify-write cycle time
t RWC
RAS to WE delay time
-7
Max
Min
Max
Unit
133
—
159
—
ns
t RWD
77
—
90
—
ns
10
CAS to WE delay time
t CWD
32
—
38
—
ns
10
Column address to WE delay time
t AWD
47
—
55
—
ns
10
OE hold time from WE
t OEH
15
—
18
—
ns
Refresh Cycle
HM51W4405B
-6R
Parameter
Symbol Min
CAS setup time (CBR refresh cycle)
t CSR
CAS hold time (CBR refresh cycle)
-7
Max
Min
Max
Unit
10
—
10
—
ns
t CHR
10
—
10
—
ns
RAS precharge to CAS hold time
t RPC
10
—
10
—
ns
CAS precharge time in normal mode
t CPN
10
—
13
—
ns
CBR refresh cycle WE setup time
t WS
0
—
0
—
ns
CBR refresh cycle WE hold time
t WH
10
—
10
—
ns
8
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Notes
HM51W4405BS Series
EDO Page Mode Cycle
HM51W4405B
-6R
Parameter
Symbol Min
EDO page mode cycle time
t HPC
EDO page mode CAS precharge time
-7
Max
Min
Max
Unit
Notes
25
—
30
—
ns
20
t CP
10
—
13
—
ns
EDO page mode RAS pulse width
t RASC
—
100000 —
100000 ns
12
Access time from CAS precharge
t ACP
—
35
—
40
ns
3, 13
RAS hold time from CAS precharge
t RHCP
35
—
40
—
ns
Output data hold time from CAS low
t DOH
3
—
3
—
ns
CAS hold time referred OE
t COL
10
—
13
—
ns
CAS to OE setup time
t COP
5
—
5
—
ns
Read command hold time from CAS
precharge
t RCHP
35
—
40
—
ns
EDO Page Mode Read-Modify-Write Cycle
HM51W4405B
-6R
Parameter
Symbol Min
EDO page mode read-modify-write
cycle time
t HPCM
EDO page mode read-modify-write
t CPW
cycle CAS precharge to WE delay time
-7
Max
Min
Max
Unit
66
—
77
—
ns
52
—
60
—
ns
Notes
10
9
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HM51W4405BS Series
Counter Test Cycle
HM51W4405B
-6R
Parameter
Symbol Min
CAS precharge time in counter test
cycle
t CPT
40
-7
Max
Min
Max
Unit
—
40
—
ns
Notes
Notes: 1. AC measurements assume t T = 2 ns.
2. Assumes that t RCD ≤ tRCD (max) and tRAD ≤ tRAD (max). If tRCD or tRAD is greater than the maximum
recommended value shown in this table, t RAC exceeds the value shown.
3. Measured with a load circuit equivalent to 1 TTL loads and 100 pF.
4. Assumes that t RCD ≥ tRCD (max) and tRAD ≤ tRAD (max).
5. Assumes that t RCD ≤ tRCD (max) and tRAD ≥ tRAD (max).
6. t OFF1 (max), tOFF2 (max), tOFR (max) and tWEZ (max) define the time at which the output achieves the
open circuit condition and is not referred to output voltage levels.
7. VIH (min) and VIL (max) are reference levels for measuring timing of input signals. Also, transition
times are measured between V IH and VIL.
8. Operation with the tRCD (max) limit insures that tRAC (max) can be met, tRCD (max) is specified as a
reference point only, if t RCD is greater than the specified tRCD (max) limit, then access time is
controlled exclusively by tCAC .
9. Operation with the tRAD (max) limit insures that tRAC (max) can be met, tRAD (max) is specified as a
reference point only, if t RAD is greater than the specified tRAD (max) limit, then access time is
controlled exclusively by tAA .
10. t WCS , t RWD, t CWD, t CPW and t AWD are not restrictive operating parameters. They are included in the
data sheet as electrical characteristics only; if t WCS ≥ tWCS (min), the cycle is an early write cycle
and the data out pin will remain open circuit (high impedance) throughout the entire cycle; if tRWD
≥ tRWD (min), tCWD ≥ tCWD (min), tCPW ≥ tCPW (min) and tAWD ≥ tAWD (min), the cycle is a read-modifywrite and the data output will contain data read from the selected cell; if neither of the above sets
of conditions is satisfied, the condition of the data out (at access time) is indeterminate.
11. These parameters are referred to CAS leading edge in an early write cycle and to WE leading
edge in a delayed write or read-modify-write cycle.
12. t RASC defines RAS pulse width in fast page mode cycles.
13. Access time is determined by the longest among t AA , t CAC and t ACP.
14. An initial pause of 100 µs is required after power up followed by a minimum of eight initialization
cycles (RAS-only refresh cycle or CAS-before-RAS refresh cycle). If the internal refresh counter
is used, a minimum of eight CAS-before-RAS refresh cycles is required.
15. In delayed write or read-modify-write cycles, OE must disable output buffer prior to applying data
to the device.
16. Either tRCH or tRRH must be satisfied
17. t RAS (min) = tRWD (min) + tRWL (min) + tT in read-modify-write cycle.
18. t CAS (min) = tCWD (min) + tCWL (min) + tT in read-modify-write cycle.
19. Data output turns off and becomes high impedance from later rising edge of RAS and CAS. Hold
time and turn off time are specified by the timing specifications of later rising edge of RAS and
CAS between t OHR and t OH, and between tOFR and tOFF.
20. t HPC (min) can be achieved during a series of EDO page mode early write cycles or EDO page
mode read cycles. If both write and read operation are mixed in a EDO page mode RAS cycle
(EDO page mode mix cycle (1), (2)), minimum value of CAS cycle tHPC (tCAS + tCP + 2tT) becomes
greater than the specified t HPC (min) value.
21. t CSH (min) can be achieved when tRCD ≤ tCSH (min) –tCAS (min).
22. XXX: H or L (H: V IH (min) ≤ V IN ≤ V IH (max), L: VIL (min) ≤ V IN ≤ V IL (max))
10
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HM51W4405BS Series
///////: Invalid Dout
When the address, clock and input pins are not described on timing waveforms, their pins must
be applied VIH or VIL.
11
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HM51W4405BS Series
Timing Waveforms*22
Read Cycle
t RC
t RAS
RAS
tT
t RP
t CRP
t RSH
t CAS
t CSH
t RCD
CAS
t RAD
t ASR
Address
t RAL
t CAH
t RAH t
ASC
Row
Column
t RCHA
t CAL
t RCS
t RDD
t OH
t OHR
t RCHR
t RCHC
t RCH
t RRH
WE
t OFR
t CAC
t AA
t OFF1
Dout
Dout
t RAC
t OFF2
t OAC
t DZC
t WDD
t ODD
t DZO
12
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t WEZ
High-Z
Din
OE
t CDD
t OEP
HM51W4405BS Series
Early Write Cycle
t RC
t RAS
RAS
t RP
t RSH
t CAS
tT
t RCD
t CRP
t CSH
CAS
t ASR
Address
t RAH
tASC
Row
t CAH
Column
t WCS
t WCH
WE
t DH
t DS
Din
Dout
Din
High-Z*
* t WCS
t WCS (min)
13
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HM51W4405BS Series
Delayed Write Cycle
t RC
t RAS
t RP
RAS
t CSH
t CRP
t RCD
t RSH
t CAS
tT
CAS
t ASR
Address
t ASC
t RAH
t CWL
t RWL
t CAH
Row
Column
t RCS
t WP
WE
t DS
t DH
High-Z
Din
Din
t DZC
t ODD
t DZO
t OEH
Dout
Invalid Dout*
t OFF2
OE
*
* Invalid Dout comes out, when OE is low level.
14
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HM51W4405BS Series
Read-Modify-Write Cycle
t RWC
t RAS
t RP
RAS
tT
t RCD
t CAS
t CRP
CAS
t RAD
t ASR
Address
t RAH
tCAH
t ASC
Row
Column
t CWL
t CWD
t RCS
t RWL
t AWD
t WP
WE
t RWD
t AA
t CAC
t DS
t RAC
t DH
t DZC
High-Z
Din
Dout
Din
Dout
t OAC
t OFF2
t DZO
OE
t OEH
t ODD
t OEP
15
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HM51W4405BS Series
RAS-Only Refresh Cycle
t RC
t RAS
t RP
RAS
tT
t CRP
tRPC
CAS
t RAH
t ASR
Address
Row
Dout
16
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High-Z
tCRP
HM51W4405BS Series
CAS-Before-RAS Refresh Cycle
t RC
t RP
t RAS
t RP
RAS
t RPC
t CSR
t CHR
t RPC t CRP
tT
CAS
t CPN
t WS
t WH
t CPN
WE*
Address
t OFR
t OFF1
Dout
High-Z
* tWS and tWH must be satisfied while CAS = VIL.
17
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HM51W4405BS Series
Hidden Refresh Cycle
tRC
t RP
t RAS
(Read)
t RC
t RAS
t RC
t RP
(Refresh)
t RAS
tRP
(Refresh)
RAS
tT
t RSH
t CHR
t CRP
t CAS
t RCD
CAS
t ASC
t ASR
Address
t RAL
t RAD
t CAH
t RAH
Row
Column
t RCH
t RRH
t OHR
t RCS
t CAC
WE
t AA
t OFF1
t OH
t RAC
Dout
Dout
t DZC
t OFF2
t CDD
High-Z
Din
tDZO
t OAC
OE
18
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t ODD
t RDD
t WEZ
t WDD
HM51W4405BS Series
EDO Page Mode Read Cycle (tHPCminimum cycle operation)
t RASC
t RHCP
t RP
RAS
tT
t CSH
t RCD
t HPC
t CAS
t CP
t CAS
t RSH
t CP
t CRP
t CAS
CAS
t ASR
t CAL
t RAD
t RAH
Address
t CAH
tASC
Row
Column 1
t CAL
t CAL
t ASC t CAH
Column 2
t RAL
t CAH
t ASC
Column 3
t RCHA
t RRH
t RCHP
t RCS
t RCH
t RCHC
WE
t WEZ
t DZC
t CDD
High-Z
Din
t CAC
t CAC
t RAC
t AA
t AA
t ACP
t DOH
Dout 1
Dout
t CAC
t AA
t ACP
t DOH
Dout 2
t OFR
t OH
t ODD
t OHR
t OFF1
Dout 3
t OAC
t DZO
t OFF2
OE
19
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HM51W4405BS Series
EDO Page Mode Read Cycle (High-Z control by WEand OE)
t RP
t RASC
RAS
tT
t CSH
CAS
t CP
t HPC
t CAS
t RCS
t CP
t HPC
t CAS
tCAS
tCAS
t RCHP
t RCHC
t RCHA
tASR
tRAH t ASC tCAH
Row
tASC
t ASC t CAH
Column 2
tCAL
tDZC
t RRH
t RCH
t
t RAL RCHC
t ASC t CAH
Column 1
t CRP
t RHCP
t CP
t RCH t RCS
t RCHR
WE
Address
t HPC
Column 3
t CAL
t WDD
t CAH
Column 4
t CAL
tRDD
tCDD
t CAL
High-Z
Din
tCOL
tDZO
tCOP
tODD
OE
tAA
tCAC
tCAC
tAA
Dout
tOFF2
Dout 1
20
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tACP
tAA
tCAC
tWEZ
tRAC
tOFR
tOHR
tOFF2
tACP
tACP
tOAC
tOAC
Dout 2
tAA
tOFF2
tDOH
Dout 2
tCAC
tOFF1
tOH
tOAC
Dout 3
Dout 4
HM51W4405BS Series
EDO Page Mode Early Write Cycle (tHPCminimum cycle operation)
t RASC
t RP
RAS
tT
t CSH
t RCD
t RSH
t HPC
t CAS
t CP
t CAS
t CAS
t CP
t CRP
CAS
t ASR
Address
t RAH
Row
t ASC
t CAH
Column
t WCS
t WCH
t ASC
t CAH
Column
t WCS
t ASC
t CAH
Column
t WCH
t WCH
t WCS
WE
t DS
Din
Din
Dout
t DH
t DS
Din
t DH
t DS
t DH
Din
High-Z
21
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HM51W4405BS Series
EDO Page Mode Delayed Write Cycle
t RP
t RASC
RAS
tT
t CSH
tRCD
t HPC
t CAS
t CP
t CAS
t RSH
t CAS
t CP
t CRP
CAS
t ASR
t RAH
Address
t ASC
t CAH
t ASC
t CAH
Row
t CAH
t ASC
Column
Column
Column
t CWL
t CWL
t RCS
t CWL
t WP
t WP
t WP
t RWL
WE
t DH
t DS
Din
t RCS
t DH
t DS
t DH
t DS
Din
Din
t RCS
Din
t OEH
High-Z
Dout
t ODD
OE
22
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HM51W4405BS Series
EDO Page Mode Read-Modify-Write Cycle
t RP
t RASC
RAS
t RCD
t HPCM
tT
t CAS
CAS
t CRP
t CP
t CP
t CAS
t CAS
t RAD
t RAH
t ASR
Address
t ACP
t CAH
t ASC
t ASC
Row
t ASC
Column
Column
t CWL
t AWD
t CWD
t RCS
t CAH
t CAH
t AWD
t CWL
t CWD
t RCS
t WP
t RWD
Column
t CPW
t WP
t RCS
t CPW
t CWL
t AWD
t RWL
t CWD
t WP
WE
t CAC
t DZC
t DZC t CAC
t DH
High-Z
Din
High-Z
Din
tAA
Din
t OEH
Dout
t OAC
t OEH
Dout
t OFF2
t DS
t DH
t DZC
High-Z
Din
t CAC
t DZO
tOAC
t DZO
t DH
t AA
t RAC
Dout
t ACP
t DS
t DS
t AA
t OAC
t OEH
Dout
t OFF2
t DZO
t OFF2
OE
t ODD
t ODD
t OEP
t OEP
t ODD
tOEP
23
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HM51W4405BS Series
EDO Page Mode Mix Cycle (1)*20
t RP
t RASC
RAS
t CSH
tT
CAS
t CAS
t WCS
t CAS
tCAS
Address
t RCHP
t RCHC
tCPW
tAWD
t ASC
tRAH
Row
tCAH
Column 1
tCAL
t DS
Din
tCAS
t WCH
WE
tASR
t ASC t CAH
tASC t CAH
Column 2
Column 3
t CAL
tWP
tASC
t RRH
t RCH
t RCHA
t RAL
t CAH
Column 4
t CAL
t DS
t DH
Din 1
t CRP
t CP
t CP
t CP
High-Z
t DH
tRDD
tCDD
t CAL
Din 3
tODD
tWDD
OE
t ACP
tAA
tOAC
tCAC
tDZO
t ACP
tOFF2
tAA
tCAC
24
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Dout 2
tAA
tOFF2
tCAC
tOAC
t DOH
Dout
tOFR
tWEZ
tACP
Dout 3
tOFF1
tOH
Dout 4
HM51W4405BS Series
EDO Page Mode Mix Cycle (2) *20
t RP
t RASC
RAS
tT
t CSH
CAS
t CAS
t RCS
t RCHR
t CAS
Address
tCAS
t RCH t WCS t WCH
tCAS
Row
tCAH
Column 1
t ASC t CAH
t ASC t CAH
Column 2
Column 3
tCAL
t DS
High-Z
Din
t DH
Column 4
Din 2
tODD
t RRH
t RCH
t RCHA
t RAL
t CAH
tASC
t CAL
t DS
t CAL
t RCHC
tWP
tCPW
t ASC
tRAH
t RCHP
tCWL
WE
tASR
t CRP
t CP
t CP
t CP
tRDD
tCDD
t CAL
t DH
Din 3
tDZO
tODD
tWDD
tDZO
OE
tAA
tOAC
tCAC
tOFF2
Dout 1
tOFR
tWEZ
tOFF2
tACP
tCAC
tRAC
Dout
t OAC
tACP
tAA
tOFF2
tAA
tCAC
tOAC
Dout 3
tOFF1
tOH
Dout 4
25
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HM51W4405BS Series
CAS-Before-RAS Refresh Counter Check Cycle (Read)
t RP
t RAS
RAS
tT
t CSR
t CHR
t CPT
t RSH
tCRP
t CAS
CAS
t CAL
t ASC
t CAH
Column
Address
t RCH
t RRH
t WS
t WH
t RCS
WE
t CDD
t DZC
High-Z
Din
t OHR
t CAC
t OFR
t AA
t OFF1
t OH
Dout
Dout
t DZO
t OFF2
t OAC
t OEP
OE
26
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t ODD
HM51W4405BS Series
CAS-Before-RAS Refresh Counter Check Cycle (Write)
t RAS
t RP
RAS
tT
t CSR
t CHR
t CPT
t RSH
t CRP
t CAS
CAS
t CAL
t ASC
t CAH
Address
Column
t WS
t WH
t WCS
t WCH
WE
t DS
Din
Dout
t DH
Din
High-Z
OE
27
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HM51W4405BS Series
Package Dimensions
HM51W4405BS Series (CP-26/20D)
14
13
1.30 Max
0.43 ± 0.10
0.41 ± 0.08
5.08
1.27
0.21
2.40 +– 0.24
9
0.80 +0.25
–0.17
5
0.74
3.50 ± 0.26
1
8.51 ± 0.13
16.90
17.27 Max
22
18
7.62 ± 0.13
26
Unit: mm
6.71 ± 0.28
0.10
Hitachi Code
JEDEC Code
EIAJ Code
Weight
28
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CP-26/20D
MO-077-AA
SC-633A
0.6 g
HM51W4405BS Series
Disclaimer
When using this document, keep the following in mind:
1. This document may, wholly or partially, be subject to change without notice.
2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of
this document without Hitachi’s permission.
3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any
other reasons during operation of the user’s unit according to this document.
4. Circuitry and other examples described herein are meant merely to indicate the characteristics and
performance of Hitachi’s semiconductor products. Hitachi assumes no responsibility for any intellectual
property claims or other problems that may result from applications based on the examples described
herein.
5. No license is granted by implication or otherwise under any patents or other rights of any third party or
Hitachi, Ltd.
6. MEDICAL APPLICATIONS: Hitachi’s products are not authorized for use in MEDICAL
APPLICATIONS without the written consent of the appropriate officer of Hitachi’s sales company.
Such use includes, but is not limited to, use in life support systems. Buyers of Hitachi’s products are
requested to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL
APPLICATIONS.
Sales Offices
Hitachi, Ltd.
Semiconductor & IC Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100, Japan
Tel: Tokyo (03) 3270-2111
Fax: (03) 3270-5109
For further information write to:
Hitachi America, Ltd.
Semiconductor & IC Div.
2000 Sierra Point Parkway
Brisbane, CA. 94005-1835
USA
Tel: 415-589-8300
Fax: 415-583-4207
Hitachi Europe GmbH
Electronic Components Group
Continental Europe
Dornacher Straße 3
D-85622 Feldkirchen
München
Tel: 089-9 91 80-0
Fax: 089-9 29 30 00
Hitachi Europe Ltd.
Electronic Components Div.
Northern Europe Headquarters
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA
United Kingdom
Tel: 0628-585000
Fax: 0628-778322
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 0104
Tel: 535-2100
Fax: 535-1533
Hitachi Asia (Hong Kong) Ltd.
Unit 706, North Tower,
World Finance Centre,
Harbour City, Canton Road
Tsim Sha Tsui, Kowloon
Hong Kong
Tel: 27359218
Fax: 27306071
29
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HM51W4405BS Series
Revision Record
Rev.
Date
Contents of Modification
1.0
Nov. 29, 1996 Initial issue
30
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