AGILENT HCPL-M454

Ultra High CMR, Small Outline,
5 Lead, High Speed Optocoupler
Technical Data
HCPL-M454
Features
Applications
• Function Compatible with
HCPL-4504
• Surface Mountable
• Very Small, Low Profile
JEDEC Registered
Package Outline
• Compatible with Infrared
Vapor Phase Reflow and
Wave Soldering Processes
• Short Propagation Delays
for TTL and IPM
Applications
• Very High Common Mode
Transient Immunity:
Guaranteed 15 kV/ µ s at
VCM = 1500 V
• High CTR: >25% at 25°C
• Guaranteed Specifications
for Common IPM
Applications
• TTL Compatible
• Guaranteed ac and dc
Performance Over
Temperature: 0°C to 70°C
• Open Collector Output
• Recognized Under the
Component Program of
U.L. (File No. E55361) for
Dielectric Withstand Proof
Test Voltage of 3750 Vac. 1
Minute
• Lead Free Option “-000E”
• Inverter Circuits and
Intelligent Power Module
(IPM) Interfacing - Shorter
propagation delays and
guaranteed (tPLH - tPHL)
specifications. (See Power
Inverter Dead Time section).
• High Speed Logic Ground
Isolation - TTL/TTL, TTL/
LTTL, TTL/CMOS, TTL/
LSTTL
• Line Receivers - High common mode transient immunity
(>15 kV/µs for a TTL load/
drive) and low input-output
capacitance (0.6 pF).
• Replace Pulse Transformers - Save board space
and weight
• Analog Signal Ground
Isolation - Integrated photon
detector provides improved
linearity over phototransistors
Outline Drawing (JEDEC MO-155)
ANODE 1
MXXX
XXX
4.4 ± 0.1
(0.173 ± 0.004)
6
7.0 ± 0.2
(0.276 ± 0.008)
VCC
5 VOUT
CATHODE 3
4
GND
TYPE NUMBER (LAST 3 DIGITS)
0.4 ± 0.05
(0.016 ± 0.002)
DATE CODE
3.6 ± 0.1*
(0.142 ± 0.004)
2.5 ± 0.1
(0.098 ± 0.004)
0.102 ± 0.102
(0.004 ± 0.004)
1.27 BSC
(0.050)
0.15 ± 0.025
(0.006 ± 0.001)
0.71 MIN.
(0.028)
DIMENSIONS IN MILLIMETERS (INCHES)
MAX. LEAD COPLANARITY
= 0.102 (0.004)
* MAXIMUM MOLD FLASH ON EACH SIDE IS 0.15 mm (0.006)
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
CAUTION: The small junction sizes inherent to the design of this bipolar component increase the component's
susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken
in handling and assembly of this component to prevent damage and/or degradation which may be induced by
ESD.
2
Description
The HCPL-M454 CTR, propagation delays, and CMR are
specified both for TTL load and
drive conditions and for IPM
(Intelligent Power Module) load
and drive conditions. Specifications and typical performance
plots for both TTL and IPM
conditions are provided for ease
of application.
The HCPL-M454 is similar to
Agilent’s other high speed
transistor output optocouplers,
but with shorter propagation
delays and higher CTR. The
HCPL-M454 also has a
guaranteed propagation delay
difference (tPLH - tPHL). These
features make the HCPL-M454
an excellent solution to IPM
inverter dead time and other
switching problems.
This diode-transistor optocoupler
uses an insulating layer between
Absolute Maximum Ratings
(No Derating Required up to 85°C)
Storage Temperature .................................................... -55°C to +125°C
Operating Temperature ................................................ -55°C to +100°C
Average Input Current - IF ......................................................... 25 mA[1]
Peak Input Current - IF .............................................................. 50 mA[2]
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current - IF ................................................... 1.0 A
(≤1 µs pulse width, 300 pps)
Reverse Input Voltage - VR (Pin 3-1) .................................................. 5 V
Input Power Dissipation ........................................................... 45 mW[3]
Average Output Current - IO (Pin 5) ............................................... 8 mA
Peak Output Current .................................................................... 16 mA
Output Voltage - VO (Pin 5-4)............................................ -0.5 V to 20 V
Supply Voltage - VCC (Pin 6-4) .......................................... -0.5 V to 30 V
Output Power Dissipation ....................................................... 100 mW [4]
Infrared and Vapor Phase Reflow Temperature ....................... see below
Solder Reflow Thermal Profile
300
TEMPERATURE (°C)
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
200
2.5°C ± 0.5°C/SEC.
30
SEC.
160°C
150°C
140°C
SOLDERING
TIME
200°C
30
SEC.
3°C + 1°C/–0.5°C
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
TIME (SECONDS)
200
250
the light emitting diode and an
integrated photon detector to
provide electrical insulation
between input and output.
Separate connections for the
photodiode bias and output
transistor collector increase the
speed up to a hundred times over
that of a conventional phototransistor coupler by reducing the
base-collector capacitance.
3
Recommended Pb-Free IR Profile
tp
TEMPERATURE
Tsmax
20-40 SEC.
260 +0/-5 °C
Tp
TL
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
RAMP-DOWN
6 °C/SEC. MAX.
Tsmin
ts
PREHEAT
60 to 180 SEC.
tL
60 to 150 SEC.
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 °C, Tsmin = 150 °C
Land Pattern Recommendation
Schematic
ICC
6
4.4
(0.17)
VCC
IF
+
ANODE
1.3
(0.05)
1
VF
CATHODE
–
IO
5
2.5
(0.10)
VO
3
SHIELD
4
2.0
(0.080)
GND
0.64
(0.025)
8.27
(0.325)
DIMENSION IN MILLIMETERS (INCHES)
Insulation Related Specifications
Parameter
Minimum External Air Gap
(Clearance)
Minimum External Tracking Path
(Creepage)
Minimum Internal Plastic Gap
(Clearance)
Tracking Resistance
Isolation Group (per DIN VDE 0109)
Symbol
L(IO1)
Value
≥ 5
Units
mm
L(IO2)
≥ 5
mm
0.08
mm
175
IIIa
V
CTI
Conditions
Measured from input terminals
to output terminals
Measured from input terminals
to output terminals
Through insulation distance
conductor to conductor
DIN IEC 112/VDE 0303 Part 1
Material Group DIN VDE 0109
4
DC Electrical Specifications
Over recommended temperature (TA = 0°C to 70°C) unless otherwise specified. (See note 11)
Parameter Symbol Min. Typ. Max. Units
Current
Transfer
Ratio
CTR
Current
Transfer
Ratio
CTR
Logic Low
Output
Voltage
VOL
Logic High
Output
Current
IOH
Logic Low
Supply
Current
Logic High
Supply
Current
25
32
21
34
26
35
22
37
60
%
Test Conditions
TA = 25°C VO = 0.4 V
VO = 0.5 V
65
%
TA = 25°C VO = 0.4 V
VO = 0.5 V
V
Fig. Note
IF = 16 mA 1,2,4
5
VCC = 4.5 V
IF = 12 mA 1,2,4
5
VCC = 4.5 V
0.2
0.4
0.2
0.5
0.003
0.5
0.01
1.0
ICCL
50
200
µA
IF = 16 mA VCC = 15 V
VO = open
11
ICCH
0.02
1
µA
TA = 25°C IF = 0 mA
VO = open
VCC = 15 V
11
0.02
2
1.5
1.7
V
TA = 25°C IF = 16 mA
1.5
1.8
V
IR = 10 µA
µA
TA = 25°C IO = 3.0 mA
IF = 16 mA
IO = 2.4 mA
VCC = 4.5 V
TA = 25°C VO = VCC = 5.5 V IF = 0 mA
5
TA = 25°C VO = VCC = 15 V
50
Input
Forward
Voltage
VF
5
3
Input
Reverse
Breakdown
Current
BVR
Temperature Coefficient of
Forward
Voltage
∆VF /∆TA
-1.6
Input
Capacitance
CIN
60
InputOutput
Insulation
Voltage
VISO
Resistance
(InputOutput)
RI-O
10[12]
Ω
VI-O = 500 Vdc
6
Capacitance
(InputOutput)
CI-O
0.6
pF
f = 1 MHz
6
3750
mV/°C IF = 16 mA
pF
f = 1 MHz VF = 0 V
VRMS
RH < 50%
TA = 25°C
t = 1 min
6,12
5
Switching Specifications
Over recommended temperature (TA = 0°C to 70°C) unless otherwise specified
Parameter
Propagation
Delay Time
to Logic
Low at
Output
Propagation
Delay Time
to Logic
High at
Output
Propagation
Delay
Difference
Between
Any 2 Parts
Sym.
tPHL
Min. Typ. Max. Units
Test Conditions
0.2
0.3
µs
TA = 25°C Pulse: f = 20 kHz
Duty Cycle = 10%
0.2
0.5
IF = 16 mA
VCC = 5.0 V
RL = 1.9 kΩ
CL = 15 pF
VTHHL = 1.5 V
0.2
0.5
0.7
0.1
0.5
1.0
0.3
0.5
0.3
0.7
0.3
0.8
1.1
0.2
0.8
1.4
TA = 25°C Pulse: f = 10 kHz
Duty Cycle = 50%
IF = 12 mA
VCC = 15.0 V
RL = 20 kΩ
CL = 100 pF
VTHHL = 1.5 V
1014
10
TA = 25°C Pulse: f = 20 kHz
Duty Cycle = 10%
IF = 16 mA
VCC = 5.0 V
RL = 1.9 kΩ
CL = 15 pF
VTHLH = 1.5 V
8, 9
9
TA = 25°C Pulse: f = 10 kHz
Duty Cycle = 50%
IF = 12 mA
VCC = 15.0 V
RL = 20 kΩ
CL = 100 pF
VTHLH = 2.0 V
1014
10
-0.4
0.3
0.9
TA = 25°C Pulse: f = 10 kHz
Duty Cycle = 50%
IF = 12 mA
VCC = 15.0 V
RL = 20 kΩ
CL = 100 pF
VTHHL = 1.5 V VTHLH = 2.0 V
1014
13
-0.7
0.3
1.3
15
30
kV/µs TA = 25°C VCC = 5.0 V
RL = 1.9 kΩ
CL = 15 pF
IF = 0 mA
VCM = 1500 VP-P
7
7,9
15
30
TA = 25°C VCC = 15.0 V RL = 20 kΩ
CL = 100 pF
IF = 0 mA
VCM = 1500 VP-P
7
8,10
15
30
kV/µs TA = 25°C VCC = 5.0 V
RL = 1.9 kΩ
CL = 15 pF
IF = 16 mA
VCM = 1500 VP-P
7
7,9
10
30
TA = 25°C VCC = 15.0 V RL = 20 kΩ
CL = 100 pF
IF = 12 mA
VCM = 1500 VP-P
7
8,10
15
30
TA = 25°C VCC = 15.0 V RL = 20 kΩ
CL = 100 pF
IF = 16 mA
VCM = 1500 VP-P
7
8,10
tPLH
tPLHtPHL
Common
Mode
Transient
Immunity
at Logic
High Level
Output
|CMH|
Common
Mode
Transient
Immunity
at Logic
Low Level
Output
|CML|
Fig. Note
8, 9
9
µs
µs
6
35 mA
30 mA
25 mA
5
20 mA
15 mA
10 mA
IF = 5 mA
0
0
10
20
1.5
1000
1.0
NORMALIZED
IF = 16 mA
VO = 0.4 V
VCC = 5.0 V
TA = 25°C
0.5
0.0
0 2 4 6 8 10 12 14 16 18 20 22 24 26
IF – INPUT CURRENT – mA
Figure 1. DC and Pulsed Transfer
Characteristics.
Figure 2. Current Transfer Ratio vs.
Input Current.
NORMALIZED CURRENT TRANSFER RATIO
IOH – LOGIC HIGH OUTPUT CURRENT – nA
VO – OUTPUT VOLTAGE – V
1.1
1.0
0.9
0.8
0.7
NORMALIZED
IF = 16 mA
VO = 0.4 V
VCC = 5.0 V
TA = 25°C
0.6
-60 -40 -20 0
20 40 60 80 100 120
TA – TEMPERATURE – °C
Figure 4. Current Transfer Ratio vs.
Temperature.
common mode pulse signal,VCM, to
assure that the output will remain in
a Logic Low state (i.e., VO < 1.0 V).
9. The 1.9 kΩ load represents 1 TTL
unit load of 1.6 mA and the 5.6 kΩ
pull-up resistor.
10. The RL = 20 kΩ, CL = 100 pF load
represents an IPM (Intelligent Power
Mode) load.
11. Use of a 0.1 µF bypass capacitor
connected between pins 4 and 6 is
recommended.
12. In accordance with UL 1577, each
optocoupler is proof tested by
applying an insulation test voltage
≥4500 VRMS for 1 second (leakage
detection current limit, Ii-e ≤ 5 µA).
13. The difference between tPLH and
tPHL, between any two HCPL-M454
parts under the same test condition.
(See Power Inverter Dead Time and
Propagation Delay Specifications
section).
10 4
10 3
10 2
IF = 0 mA
VO = VCC = 5.0 V
10 1
10 0
10 -1
10-2
-60 -40 -20
0
20 40 60 80 100 120
TA – TEMPERATURE – °C
Figure 5. Logic High Output Current
vs. Temperature.
IF – FORWARD CURRENT – mA
40 mA
TA = 25°C
10 VCC = 5.0 V
pulse, VCM, to assure that the output
will remain in a Logic High state
(i.e., VO > 2.0 V). Common mode
transient immunity in a Logic Low
level is the maximum tolerable
(negative) dVCM/dt on the trailing
edge of the common mode pulse
signal, VCM, to assure that the output
will remain in a Logic Low state (i.e.,
VO < 0.8 V).
8. Under IPM (Intelligent Power
Module) load and LED drive
conditions: Common mode transient
immunity in a Logic High level is the
maximum tolerable dVCM /dt on the
leading edge of the common mode
pulse, VCM, to assure that the output
will remain in a Logic High state
(i.e., VO > 3.0 V). Common mode
transient immunity in a Logic Low
level is the maximum tolerable
dVCM /dt on the trailing edge of the
NORMALIZED CURRENT TRANSFER RATIO
IO – OUTPUT CURRENT – mA
Notes:
1. Derate linearly above 70°C free-air
temperature at a rate of 0.8 mA/°C.
2. Derate linearly above 70°C free-air
temperature at a rate of 1.6mA/°C.
3. Derate linearly above 70°C free-air
temperature at a rate of 0.9 mA/°C.
4. Derate linearly above 70°C free-air
temperature at a rate of 2.0 mA/°C.
5. CURRENT TRANSFER RATIO in
percent is defined as the ratio of
output collector current (IO), to the
forward LED input current (IF),
times 100.
6. Device considered a two-terminal
device: Pins 1 and 3 shorted together
and Pins 4, 5 and 6 shorted together.
7. Under TTL load and drive conditions:
Common mode transient immunity
in a Logic High level is the maximum
tolerable (positive) dVCM /dt on the
leading edge of the common mode
100
IF
TA = 25°C
+
VF
–
10
1.0
0.1
0.01
0.001
1.1
1.2
1.3
1.4
1.5
1.6
VF – FORWARD VOLTAGE – VOLTS
Figure 3. Input Current vs. Forward
Voltage.
7
HCPL-M454
IF
PULSE
GEN.
ZO = 50 Ω
tr = 5 ns
0
VCC
VO
IF
VCC
1
6
RL
5
VTHHL
VO
0.1µF
VTHLH
tPHL
3
IF MONITOR
VOL
4
CL
RM
tPLH
Figure 6. Switching Test Circuit.
HCPL-M454
10 V
VCM
90%
IF
90%
10%
0V
1
10%
tr
RL
A
tf
VO
VCC
6
B
5
VO
0.1µF
VCC
3
SWITCH AT A: IF = 0 mA
VO
4
VFF
CL
VOL
VCM
SWITCH AT B: IF = 12 mA, 16 mA
+
–
PULSE GEN.
Figure 7. Test Circuit for Transient Immunity and Typical Waveforms.
tPLH
0.25
0.20
IF = 10 mA
IF = 16 mA
0.15
0.10
-60 -40 -20 0
20 40 60 80 100 120
TA – TEMPERATURE – °C
Figure 8. Propagation Delay Time vs.
Temperature.
tp – PROPAGATION DELAY – µs
tp – PROPAGATION DELAY – µs
VCC = 5.0 V
0.45 RL = 1.9 kΩ
CL = 15 pF
0.40 V
THHL = VTHLH = 1.5 V
10% DUTY CYCLE
0.35
t PHL
0.30
VCC = 5.0 V
T = 25° C
1.2 A
CL = 15 pF
1.0 VTHHL = VTHLH = 1.5 V
10% DUTY CYCLE
0.8
tPLH
0.6
t PHL
0.4
IF = 10 mA
IF = 16 mA
0.2
0.0
0
2
4
6
8 10 12 14 16 18 20
RL – LOAD RESISTANCE – kΩ
Figure 9. Propagation Delay Time vs.
Load Resistance.
tp – PROPAGATION DELAY – µs
1.4
0.50
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
VCC = 5.0 V
TA = 25° C
CL = 100 pF
VTHHL = 1.5 V
VTHLH = 2.0 V
50% DUTY CYCLE
t PLH
t PHL
0
2
4
6
IF = 10 mA
IF = 16 mA
8 10 12 14 16 18 20
RL– LOAD RESISTANCE – kΩ
Figure 10. Propagation Delay Time vs.
Load Resistance.
8
1.8
IF = 10 mA
IF = 16 mA
t PLH
50% DUTY CYCLE
0.7
0.6
0.5
tPHL
0.4
0.3
-60 -40 -20
0
20 40 60 80 100 120
TA – TEMPERATURE – °C
Figure 11. Propagation Delay Time vs.
Temperature.
tp – PROPAGATION DELAY – µs
1.2
TA = 25° C
RL = 20 kΩ
CL = 100 pF
VTHHL = 1.5 V
VTHLH = 2.0 V
50% DUTY CYCLE
1.1
1.0
0.9
0.8
0.7
t PLH
0.6
0.5
0.4
0.3
t PHL
IF = 10 mA
IF = 16 mA
0.2
10 11 12 13 14 15 16 17 18 19 20
VCC – SUPPLY VOLTAGE – V
Figure 14. Propagation Delay Time vs.
Supply Voltage.
3.5
VCC = 15.0 V
1.6 TA = 25° C
CL = 100 pF
1.4
VTHHL = 1.5 V
1.2 VTHLH = 2.0 V
50% DUTY CYCLE
1.0
0.8
t PLH
t PHL
0.6
0.4
IF = 10 mA
IF = 16 mA
0.2
0.0
0
5 10 15 20 25 30 35 40 45 50
RL – LOAD RESISTANCE – kΩ
Figure 12. Propagation Delay Time vs.
Load Resistance.
tp – PROPAGATION DELAY – µs
VCC = 15.0 V
1.0 RL = 20 kΩ
CL = 100 pF
0.9 V
THHL = 1.5 V
VTHLH = 2.0 V
0.8
tp – PROPAGATION DELAY – µs
tp – PROPAGATION DELAY – µs
1.1
VCC = 15.0 V
3.0 TA = 25° C
RL = 20 kΩ
2.5 VTHHL = 1.5 V
VTHLH = 2.0 V
2.0 50% DUTY CYCLE
t PLH
t PHL
1.5
1.0
IF = 10 mA
IF = 16 mA
0.5
0.0
0
200
400
600
800
1000
RL – LOAD CAPACITANCE – pF
Figure 13. Propagation Delay Time vs.
Load Capacitance.
9
+HV
+
HCPL-M454
LED 1
6
1
5
3
OUT 1
BASE/GATE
DRIVE CIRCUIT
Q1
BASE/GATE
DRIVE CIRCUIT
Q2
4
+
HCPL-M454
LED 2
6
1
5
3
OUT 2
4
–HV
Figure 15. Typical Power Inverter.
LED 1
OUT 1
tPLH MIN.
(tPLH MAX. – tPLH MIN.)
tPLH MAX.
TURN ON DELAY
(tPLH MAX. – tPLH MIN.)
LED 2
OUT 2
tPHL MIN.
(tPHL MAX. – tPHL MIN.)
tPHL MAX.
MAXIMUM DEAD TIME
Figure 16. LED Delay and Dead Time Diagram.
10
Power Inverter Dead
Time and Propagation
Delay Specifications
The HCPL-M454 includes a
specification intended to help
designers minimize “dead time” in
their power inverter designs. The
new “propagation delay
difference” specification (tPLH tPHL) is useful for determining not
only how much optocoupler
switching delay is needed to
prevent “shoot-through” current,
but also for determining the best
achievable wort-case dead time
for a given design.
When inverter power transistors
switch (Q1 and Q2 in Figure 15),
it is essential that they never
conduct at the same time.
Extremely large currents will flow
if there is any overlap in their
conduction during switching
transitions, potentially damaging
the transistor and even the
surrounding circuitry. This
“shoot-through” current is
eliminated by delaying the turn-on
of one transistor (Q2) long
enough to ensure that the
opposing transistor (Q1) has
completely turned off. This delay
introduces a small amount of
“dead time” at the output of the
inverter during which both
transistors are off during
switching transitions. Minimizing
this dead time is an important
design goal for an inverter
designer.
The amount of turn-on delay
needed depends on the propagation delay characteristics of the
optocoupler, as well as the
characteristics of the transistor
base/gate drive circuit. Considering only the delay characteristics
of the optocoupler (the
characteristics of the base/gate
drive circuit can be analyzed in
the same way), it is important to
know the minimum and maximum
turn-on (tPHL) and turn-off (tPLH)
propagation delay specifications,
preferably over the desired
operating temperature range. The
importance of these specifications
is illustrated in Figure 16. The
waveforms labeled “LED1”,
“LED2”, “OUT1”, and “OUT2” are
the input and output voltages of
the optocoupler circuits driving
Q1 and Q2 respectively. Most
inverters are designed such that
the power transistor turns on
when the optocoupler LED turns
on; this ensures that both power
transistors will be off in the event
of a power loss in the control
circuit. Inverters can also be
designed such that the power
transistor turns off when the
optocoupler LED turns on; this
type of design, however, requires
additional fail-safe circuitry to
turn off the power transistor if an
over-current condition is
detected. The timing illustrated in
Figure 16 assumes that the power
transistor turns on when the
optocoupler LED turns on.
The LED signal to turn on Q2
should be delayed enough so that
an optocoupler with the very
fastest turn-on propagation delay
(tPHLmin) will never turn on before
an optocoupler with the very
slowest turn-off propagation delay
(tPLHmax) turns off. To ensure this,
the turn-on of the optocoupler
should be delayed by an amount
no less than (tPLHmax - tPHLmin),
which also happens to be the
maximum data sheet value for the
propagation delay difference
specification, (tPLH - tPHL). The
HCPL-M454 specifies a maximum
(tPLH - tPHL) of 1.3 µs over an
operating temperature range of 070°C.
Although (tPLH - tPHL)max tells the
designer how much delay is
needed to prevent shoot-through
current, it is insufficient to tell the
designer how much dead time a
design will have. Assuming that
the optocoupler turn-on delay is
exactly equal to (tPLH - tPHL)max,
the minimum dead time is zero
(i.e., there is zero time between
the turn-off of the very slowest
optocoupler and the turn-on of
the very fastest optocoupler).
Calculating the maximum dead
time is slightly more complicated.
Assuming that the LED turn-on
delay is still exactly equal to (tPLH
- tPHL)max, it can be seen in Figure
16 that the maximum dead time is
the sum of the maximum
difference in turn-on delay plus
the maximum difference in turnoff delay,
[(tPLHmax-tPLHmin) + (tPHLmaxtPHLmin)],
This expression can be
rearranged to obtain
[(tPLHmax-tPHLmin) - (tPHLmintPHLmax)],
and further rearranged to obtain
[(tPLH-tPHL)max - (tPLH-tPHL)min],
which is the maximum minus the
minimum data sheet values of
(tPLH - tPHL). The difference
between the maximum and
minimum values depends directly
on the total spread of
11
propagation delays and sets the
limit on how good the worst-case
dead time can be for a given
design. Therefore, optocouplers
with tight propagation delay
specifications (and not just
shorter delays or lower pulsewidth distortion) can achieve
short dead times in power
inverters. The HCPL-M454
specifies a minimum (tPLH - tPHL)
of -0.7 µs over an operating
temeprature range of 0-70°C,
resulting in a maximum dead time
of 2.0 µs when the LED turn-on
delay is equal to (tPLH - tPHL)max,
or 1.3 µs.
It is important to maintain
accurate LED turn-on delays
because delays shorter than (tPLH
- tPHL)max may allow shootthrough currents, while longer
delays will increase the worst-case
dead time.
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Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5989-0793EN
December 28, 2004
5989-2116EN