LMA442 MEDIUM POWER PHEMT MMIC • FEATURES ♦ ♦ ♦ ♦ • 26.5 GHz to 29.5 GHz Frequency Band +22 dBm Output Power at 1dB Compression 19 dB Gain +5 V Dual Bias Supply DESCRIPTION AND APPLICATIONS The LMA442 is a medium power pHEMT amplifier that operates from 26.5 to 29.5 GHz. This 3stage amplifier provides 19 dB linear power gain with 1-dB gain compression power output of greater than +22 dBm. The LMA442 is designed for LMDS/LMCS applications. Ground is provided to the circuitry through vias to the backside metallization. • ELECTRICAL SPECIFICATIONS @ TAmbient = 25°°C (VDD = +5.0V, ZIN = ZOUT = 50Ω) Parameter Symbol Frequency Band F Power at 1-dB Compression P-1dB 75% IDSS 21 22 dBm Power at Saturation PSAT 75% IDSS 23 24 dBm Small Signal Gain S21 75% IDSS 18 19 dB Small Signal Gain Flatness ∆S21 Input Return Loss S11 -8.5 -10 dB Output Return Loss S22 -7.5 -10 dB Reverse Isolation S12 -30 -40 dB Saturated Drain Current IDSS 250 350 Phone: (408) 988-1845 Fax: (408) 970-9950 Test Conditions Min Typ 26.5 ±1 http:// www.filss.com Max Units 29.5 GHz ±2 450 dB mA Revised: 06/21/01 Email: [email protected] LMA442 MEDIUM POWER PHEMT MMIC • ABSOLUTE MAXIMUM RATINGS Parameter Symbol Test Conditions Drain Voltage VD Operating Current Min Max Units TAmbient = 22 ± 3 °C 6 V IOP TAmbient = 22 ± 3 °C 495 mA RF Input Power PIN TAmbient = 22 ± 3 °C 12 dBm Total Power Dissipation PTOT TAmbient = 22 ± 3 °C 4 W Channel Operating Temperature TCH TAmbient = 22 ± 3 °C 150 ºC Storage Temperature Maximum Assembly Temperature (1 min. max.) TSTG — 165 ºC TMAX — 300 ºC -65 Notes: • Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device. • Recommended Continuous Operating Limits should be observed for reliable device operation. • Power Dissipation defined as: PTOT ≡ (PDC + PIN) – POUT, where PDC: DC Bias Power PIN: RF Input Power POUT: RF Output Power • This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices. Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 06/21/01 Email: [email protected] LMA442 MEDIUM POWER PHEMT MMIC • ASSEMBLY DRAWING Notes: • Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is recommended. Ultrasonic bonding is not recommended. • The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150°C for 45 minutes. • Bond on bond or stitch bond acceptable. • Conductor over conductor acceptable. Conductors must not short. Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 06/21/01 Email: [email protected] LMA442 MEDIUM POWER PHEMT MMIC • MECHANICAL OUTLINE Notes: • • • • • All units are in microns (µm). All bond pads are 100 X 100 µm 2. Bias pad (VDD) size is 100 X 121.5 µm 2. Unless otherwise specified. HANDLING PRECAUTIONS To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500 V). Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. All information and specifications are subject to change without notice. Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 06/21/01 Email: [email protected]