CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY Logic Block Diagrams CY7C1481V33 – 2M x 36 MODE (A[1;0]) 2 BURST Q0 CE COUNTER Q1 CLR CLK ADV ADSC ADSP Q A[20:0] 21 GW 19 DQd, DPd BYTEWRITE REGISTERS DQc, DPc BYTEWRITE REGISTERS Q D DQb, DPb BYTEWRITE REGISTERS Q D DQa, DPa BYTEWRITE REGISTERS Q D BWE BW d D BWc BWb BWa CE1 CE2 CE3 19 ADDRESS CE REGISTER D D ENABLE CE REGISTER 21 2M X36 MEMORY ARRAY Q 36 36 Q D ENABLE DELAY Q REGISTER INPUT REGISTERS CLK OE ZZ SLEEP CONTROL DQa,b,c,d DPa,b,c,d CY7C1483V33 – 4M X 18 MODE (A[1;0]) 2 BURST Q0 CE COUNTER Q1 CLR CLK ADV ADSC ADSP A[21:0] GW Q 22 BWE BW b 20 DQb, DPb BYTEWRITE REGISTERS DQa, DPa BYTEWRITE REGISTERS Q D ENABLE CE CE REGISTER Q D D BWa CE1 CE2 CE3 ADDRESS CE REGISTER D 20 22 4M X 18 MEMORY ARRAY Q 18 D ENABLE DELAY Q REGISTER 18 INPUT REGISTERS CLK OE ZZ SLEEP CONTROL DQa,b DPa,b Document #: 38-05284 Rev. *A Page 2 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY Logic Block Diagrams (continued) CY7C1487V33 – 1M x72 MODE (A[1;0]) 2 BURST Q0 CE COUNTER Q1 CLR CLK ADV ADSC ADSP A[19:0] GW Q 20 18 DQh, DPh BYTEWRITE REGISTERS DQg, DPg BYTEWRITE REGISTERS Q D DQf, DPf BYTEWRITE REGISTERS Q D DQe, DPe BYTEWRITE REGISTERS Q D DQd, DPd BYTEWRITE REGISTERS DQc, DPc BYTEWRITE REGISTERS Q D DQb, DPb BYTEWRITE REGISTERS Q D DQa, DPa BYTEWRITE REGISTERS Q D BWE BW h ADDRESS CE REGISTER D D BWg BWf BWe BW d D BWc BWb BWa 20 18 1M X72 MEMORY ARRAY Q Q 72 CE1 CE2 CE3 D ENABLE CE REGISTER 72 Q D ENABLE DELAY Q REGISTER INPUT REGISTERS CLK OE ZZ SLEEP CONTROL DQa,b,c,d,e,f,g,h DPa,b,c,d,e,f,g,h . Selection Guide CY7C1481V33-150 CY7C1481V33-133 CY7C1481V33-117 CY7C1481V33-100 CY7C1483V33-150 CY7C1483V33-133 CY7C1483V33-117 CY7C1483V33-100 CY7C1487V33-150 CY7C1487V33-133 CY7C1487V33-117 CY7C1487V33-100 Maximum Access Time Unit 5.5 6.5 7.5 8.5 ns Maximum Operating Current TBD TBD TBD TBD mA Maximum CMOS Standby Current TBD TBD TBD TBD mA Document #: 38-05284 Rev. *A Page 3 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY A A CE1 CE2 NC NC BWb BWa CE3 VDD VSS CLK GW BWE OE ADSC ADSP ADV A A 100-pin TQFP (Top View) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 CY7C1483V33 (4M x 18) 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 Document #: 38-05284 Rev. *A A NC NC VDDQ VSSQ NC DPa DQa DQa VSSQ VDDQ DQa DQa VSS NC VDD ZZ DQa DQa VDDQ VSSQ DQa DQa NC NC VSSQ VDDQ NC NC NC A A A A A A A A A A VSS VDD A 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 DQPb NC NC DQb NC DQb VDDQ VDDQ VSSQ VSSQ NC DQb NC DQb DQb DQb DQb DQb VSSQ VSSQ VDDQ VDDQ DQb DQb DQb DQb NC VSS VDD NC NC VDD VSS ZZ DQa DQb DQa DQb VDDQ VDDQ VSSQ VSSQ DQa DQb DQa DQb DQa DPb NC DQa VSSQ VSSQ VDDQ VDDQ NC DQa NC DQa DQPa NC MODE A A A A A1 A0 CY7C1481V33 (2M X 36) 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 MODE A A A A A1 A0 A A VSS VDD A A A A A A A A A DQPc DQc DQc VDDQ VSSQ DQc DQc DQc DQc VSSQ VDDQ DQc DQc NC VDD NC VSS DQd DQd VDDQ VSSQ DQd DQd DQd DQd VSSQ VDDQ DQd DQd DQPd 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 A A CE1 CE2 BWd BWc BWb BWa CE3 VDD VSS CLK GW BWE OE ADSC ADSP ADV A A Pin Configurations Page 4 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY Pin Configurations (continued) 1 2 CY7C1481V33 (2M x 36) 3 4 5 A VDDQ B C NC NC D E DQc DQc A DQPc DQc VSS VSS F VDDQ DQc VSS A A DQc DQc VDD DQd DQd A A VDD A VSS A DQPb CE1 VSS BWc VSS NC OE ADV GW VDD VSS BWb VSS DQb DQb VSS BWd CLK NC NC VDDQ K DQd L M VDDQ DQd DQd DQd VSS VSS BWE N A1 DQPd VSS A0 DQd 7 VDDQ ADSP ADSC A A A G H J DQc DQc 6 A A NC VSS NC NC DQb DQb DQb VDD VDDQ DQb DQb VDDQ DQa DQa DQb DQa DQa VSS DQa VSS DQa VDDQ DQa VSS DQPa DQa BWa P DQd R NC T NC A A MODE A VDD A NC A A A NC ZZ U VDDQ TMS TDI TCK TDO NC VDDQ CY7C1483V33 (4M x 18) 1 2 3 4 5 6 7 A VDDQ A ADSP ADSC A A A A VDDQ NC NC A A A B A DQPa NC DQa C D A VDD VSS VSS NC A VSS CE1 VSS VSS NC OE ADV GW VDD E NC A NC DQb F VDDQ NC VSS G H J NC DQb BWb VSS VDDQ K NC L M DQb DQb NC VDD DQb NC VSS VSS CLK NC BWa VDDQ BWE DQb DQb NC VSS N VSS A1 A0 VDD DQb P NC DQPb VSS R NC T A A A MODE A U VDDQ TMS TDI Document #: 38-05284 Rev. *A NC NC NC DQa DQa VDD VDDQ DQa NC VDDQ NC DQa DQa NC VSS NC VSS DQa VDDQ NC VSS NC DQa NC A A A A NC ZZ TCK TDO NC VDDQ VSS VSS NC VSS NC Page 5 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY Pin Configurations (continued) 165-Ball Bump FBGA (This package is offered on opportunity basis) CY7C1481V33 (2M x 36) – 11 x 15 FBGA 1 2 3 4 5 6 7 8 9 10 11 A NC A CE1 BWc BWb CE3 BWE ADSC ADV A NC B C D E F G H J K L M N P NC DPc A NC CE2 VDDQ BWd VSS BWa VSS CLK VSS GW VSS OE VSS ADSP VDDQ A NC 144M DPb DQb R DQc DQc VDDQ VDD VSS VSS VSS VDD VDDQ DQb DQc DQc VDDQ VDD VSS VSS VSS VDD VDDQ DQb DQb DQc DQc VDDQ VDD VSS VSS VSS VDD VDDQ DQb DQb DQc DQc VDDQ VDD VSS VSS VSS VDD VDDQ DQb DQb NC DQd VSS DQd NC VDDQ VDD VDD VSS VSS VSS VSS VSS VSS VDD VDD NC VDDQ NC DQa ZZ DQa DQd DQd DQd DQd VDDQ VDDQ VDD VDD VSS VSS VSS VSS VSS VSS VDD VDD VDDQ VDDQ DQa DQa DQa DQa DQd DQd VDDQ VDD VSS VSS VSS VDD VDDQ DQa DQa DPd NC VDDQ VSS NC A VSS VSS VDDQ NC DPa NC A A A TDI A1 TDO A A A A MODE A A A TMS A0 TCK A A A A 11 CY7C1483V33 (4M x 18) – 11 x 15 FBGA 1 2 3 4 5 6 7 8 9 10 A NC A CE1 BWb NC CE3 BWE ADSC ADV A A B C D E F G H J K L M N P NC NC A NC CE2 VDDQ NC VSS BWa VSS CLK VSS GW VSS OE VSS ADSP VDDQ A NC 144M DPa NC DQa DQa R NC DQb VDDQ VDD VSS VSS VSS VDD VDDQ NC DQb VDDQ VDD VSS VSS VSS VDD VDDQ NC NC DQb VDDQ VDD VSS VSS VSS VDD VDDQ NC DQa NC DQb VDDQ VDD VSS VSS VSS VDD VDDQ NC DQa NC DQb VSS NC NC VDDQ VDD VDD VSS VSS VSS VSS VSS VSS VDD VDD NC VDDQ NC DQa ZZ NC DQb DQb NC NC VDDQ VDDQ VDD VDD VSS VSS VSS VSS VSS VSS VDD VDD VDDQ VDDQ DQa DQa NC NC DQb NC VDDQ VDD VSS VSS VSS VDD VDDQ DQa NC DPb NC VDDQ VSS NC A VSS VSS VDDQ NC NC NC A A A TDI A1 TDO A A A A MODE A A A TMS A0 TCK A A A A Document #: 38-05284 Rev. *A Page 6 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY Pin Configurations (continued) 209-ball BGA (This package is offered on opportunity basis) CY7C1487V33 (1M x72) 1 2 3 4 5 6 A DQg DQg B DQg DQg BWSc C DQg DQg BWSh D DQg DQg VSS NC NC OE E DPg DPc VDDQ VDDQ VDD VDD DQc VSS VSS VSS VDDQ VDDQ VDD VSS A CE2 7 8 9 10 11 CE3 A DQb DQb ADSP ADSC ADV BWSg NC BW A BWSb BWSf DQb DQb BWSd NC CE1 NC BWSe BWSa DQb DQb GW NC VSS DQb DQb VDD VDDQ VDDQ DPf DPb NC VSS VSS VSS DQf NC VDD VDDQ VDDQ DQf DQf NC VSS VSS VSSQ DQf DQf F DQc G DQc H DQc DQc VSS VSS J DQc DQc VDDQ VDDQ VDD NC VDD VDDQ VDDQ DQf DQf K NC NC CLK NC VSS VSS VSS NC NC NC NC L DQh DQh VDDQ VDDQ VDD NC VDD VDDQ VDDQ DQa DQa M DQh DQh VSS VSS VSS NC VSS VSS VSS DQa DQa N DQh DQh VDDQ VDDQ VDD NC VDD VDDQ VDDQ DQa DQa P DQh DQh VSS VSS VSS ZZ VSS VSS VSS DQa DQa DPh VDDQ VDDQ VDD VDD VDD VDDQ VDDQ NC MODE NC NC VSS DQe DQe R DPd DQc DPa DQf DPe T DQd DQd VSS NC U DQd DQd A A A A A A A DQe DQe V DQd DQd A A A A1 A A A DQe DQe W DQd DQd TMS TDI A A0 A TDO TCK DQe DQe Pin Definitions I/O Pin Description A0 A1 A Pin Name InputSynchronous Address Inputs used to select one of the address locations. Sampled at the rising edge of the CLK if ADSP or ADSC is active LOW, and CE1, CE2, and CE3 are sampled active. A[1:0] feed the two-bit counter. BWa BWb BWc BWd BWe BWf BWg BWh InputSynchronous Byte Write Select Inputs, active LOW. Qualified with BWE to conduct byte writes to the SRAM. Sampled on the rising edge of CLK. GW InputSynchronous Global Write Enable Input, active LOW. When asserted LOW on the rising edge of CLK, a global write is conducted (ALL bytes are written, regardless of the values on BWa,b,c,d,e,f,g,h and BWE). BWE InputSynchronous Byte Write Enable Input, active LOW. Sampled on the rising edge of CLK. This signal must be asserted LOW to conduct a byte write. Document #: 38-05284 Rev. *A Page 7 of 30 PRELIMINARY CY7C1481V33 CY7C1483V33 CY7C1487V33 Pin Definitions (continued) I/O Pin Description CLK Pin Name InputClock Clock Input. Used to capture all synchronous inputs to the device. Also used to increment the burst counter when ADV is asserted LOW, during a burst operation. CE1 InputSynchronous Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE2 and CE3 to select/deselect the device. ADSP is ignored if CE1 is HIGH. CE2 InputSynchronous Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction with CE1 and CE3 to select/deselect the device.(TQFP Only) CE3 InputSynchronous Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE1 and CE2 to select/deselect the device.(TQFP Only) OE InputAsynchronous Output Enable, asynchronous input, active LOW. Controls the direction of the I/O pins. When LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are three-stated, and act as input data pins. OE is masked during the first clock of a read cycle when emerging from a deselected state. ADV InputSynchronous Advance Input signal, sampled on the rising edge of CLK. When asserted, it automatically increments the address in a burst cycle. ADSP InputSynchronous Address Strobe from Processor, sampled on the rising edge of CLK. When asserted LOW, A is captured in the address registers. A[1:0] are also loaded into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized. ASDP is ignored when CE1 is deasserted HIGH. ADSC InputSynchronous Address Strobe from Controller, sampled on the rising edge of CLK. When asserted LOW, A[x:0] is captured in the address registers. A[1:0] are also loaded into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized. MODE InputStatic Selects Burst Order. When tied to GND selects linear burst sequence. When tied to VDDQ or left floating selects interleaved burst sequence. This is a strap pin and should remain static during device operation. ZZ InputAsynchronous ZZ “sleep” Input. This active HIGH input places the device in a non-time critical “sleep” condition with data integrity preserved. DQa, DPa DQb, DPb DQc, DPc DQd, DPd DQe, DPe DQf, DPf DQg, DPg DQh, DPh I/OSynchronous Bidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is triggered by the rising edge of CLK. As outputs, they deliver the data contained in the memory location specified by A during the previous clock rise of the read cycle. The direction of the pins is controlled by OE. When OE is asserted LOW, the pins behave as outputs. When HIGH, DQx and DPx are placed in a three-state condition. DQ a,b,c,d,e,f,g and h are 8 bits wide. DP a,b,c,d,e,f,g and h are 1 bit wide. TDO JTAG serial output Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK. (BGA Only) Synchronous TDI JTAG serial input Serial data-In to the JTAG circuit. Sampled on the rising edge of TCK.(BGA Only) Synchronous TMS Test Mode Select This pin controls the Test Access Port state machine. Sampled on the rising edge of TCK. Synchronous (BGA Only) TCK JTAG serial clock Serial clock to the JTAG circuit. (BGA Only) VDD VSS VDDQ Power Supply Ground Power supply inputs to the core of the device. Should be connected to 3.3V –5% +5% power supply. Ground for the core of the device. Should be connected to ground of the system. I/O Power Supply Power supply for the I/O circuitry. Should be connected to a 2.375V(min.) to VDD(max.) VSSQ I/O Ground 144M – NC. This pin is reserved for expansion to 144Mb. NC – No connects. Document #: 38-05284 Rev. *A Ground for the I/O circuitry. Should be connected to ground of the system. Page 8 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY precaution, DQx are automatically three-stated whenever a write cycle is detected, regardless of the state of OE. Functional Description Single Read Accesses Single Write Accesses Initiated by ADSC This access is initiated when the following conditions are satisfied at clock rise: (1) ADSP or ADSC is asserted LOW, (2) chip enable (CE1, CE2, CE3 on TQFP, CE1 on BGA) asserted active, and (3) the write signals (GW, BWE) are all deasserted HIGH. ADSP is ignored if CE1 is HIGH. The address presented to the address inputs is stored into the address advancement logic and the Address Register while being presented to the memory core. If the OE input is asserted LOW, the requested data will be available at the data outputs a maximum to tCDV after clock rise. ADSP is ignored if CE1 is HIGH. ADSC write accesses are initiated when the following conditions are satisfied: (1) ADSC is asserted LOW, (2) ADSP is deasserted HIGH, (3) Chip Enable (CE1, CE2, CE3 on TQFP, CE1 on BGA) asserted active, and (4) the appropriate combination of the write inputs (GW, BWE, and BWx) are asserted active to conduct a write to the desired byte(s). ADSC is ignored if ADSP is active LOW. The address presented to A[17:0] is loaded into the address register and the address advancement logic while being delivered to the RAM core. The ADV input is ignored during this cycle. If a global write is conducted, the data presented to the DQx is written into the corresponding address location in the RAM core. If a byte write is conducted, only the selected bytes are written. Bytes not selected during a byte write operation will remain unaltered. All I/Os are three-stated during a byte write because the CY7C1481V33/ CY7C1483V33/CY7C1487V33 is a common I/O device, the Output Enable (OE) must be deasserted HIGH before presenting data to the DQx inputs. Doing so will three-state the output drivers. As a safety precaution, DQx are automatically three-stated whenever a write cycle is detected, regardless of the state of OE. Single Write Accesses Initiated by ADSP This access is initiated when both of the following conditions are satisfied at clock rise: (1) ADSP is asserted LOW, and (2) Chip Enable asserted active. The address presented is loaded into the address register and the address advancement logic while being delivered to the RAM core. The write signals (GW, BWE, and BWx) and ADV inputs are ignored during this first clock cycle. If the write inputs are asserted active (see Write Cycle Descriptions table for appropriate states that indicate a write) on the next clock rise, the appropriate data will be latched and written into the device. The CY7C1481V33/CY7C1483V33/CY7C1487V33 provides byte write capability that is described in the Write Cycle Description table. Asserting the Byte Write Enable input (BWE) with the selected Byte Write (BWa,b,c,d,e,f,g,h for CY7C1487V33, BWa,b,c,d for CY7C1481V33 and BWa,b for CY7C1483V33) input will selectively write to only the desired bytes. Bytes not selected during a byte write operation will remain unaltered. All I/Os are three-stated during a byte write. Burst Sequences The CY7C1481V33/CY7C1483V33/CY7C1487V33 provides a two-bit wraparound counter, fed by A[1:0], that implements either an interleaved or linear burst sequence. to support processors that follow a linear burst sequence. The burst sequence is user selectable through the MODE input. Because the CY7C1481V33/CY7C1483V33/CY7C1487V33 is a common I/O device, the Output Enable (OE) must be deasserted HIGH before presenting data to the DQx inputs. Doing so will three-state the output drivers. As a safety Cycle Descriptions Next Cycle Asserting ADV LOW at clock rise will automatically increment the burst counter to the next address in the burst sequence. Both read and write burst operations are supported. [1, 2, 3, 4] Add. Used ZZ CE3 CE2 CE1 ADSP ADSC ADV OE DQ Write Unselected None 0 X X 1 X 0 X X Hi-Z X Unselected None 0 1 X 0 0 X X X Hi-Z X Unselected None 0 X 0 0 0 X X X Hi-Z X Unselected None 0 1 X 0 1 0 X X Hi-Z X Unselected None 0 X 0 0 1 0 X X Hi-Z X Begin Read External 0 0 1 0 0 X X X Hi-Z X Begin Read External 0 0 1 0 1 0 X X Hi-Z Read Continue Read Next 0 X X X 1 1 0 1 Hi-Z Read Continue Read Next 0 X X X 1 1 0 0 DQ Read Continue Read Next 0 X X 1 X 1 0 1 Hi-Z Read Continue Read Next 0 X X 1 X 1 0 0 DQ Read Suspend Read Current 0 X X X 1 1 1 1 Hi-Z Read Notes: 1. X = “Don't Care.” 1 = HIGH, 0 = LOW. 2. Write is defined by BWE, BWx, and GW. See Write Cycle Descriptions table. 3. The DQ pins are controlled by the current cycle and the OE signal. OE is asynchronous and is not sampled with the clock. 4. CE1, CE2, and CE3 are available only in the TQFP package. BGA package has a single chip select CE1. Document #: 38-05284 Rev. *A Page 9 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY Cycle Descriptions (continued)[1, 2, 3, 4] Next Cycle Add. Used ZZ CE3 CE2 CE1 ADSP ADSC ADV OE DQ Write Suspend Read Current 0 X X X 1 1 1 0 DQ Read Suspend Read Current 0 X X 1 X 1 1 1 Hi-Z Read Suspend Read Current 0 X X 1 X 1 1 0 DQ Read Begin Write Current 0 X X X 1 1 1 X Hi-Z Write Begin Write Current 0 X X 1 X 1 1 X Hi-Z Write Begin Write External 0 0 1 0 1 0 X X Hi-Z Continue Write Next 0 X X X 1 1 0 X Hi-Z Write Write Continue Write Next 0 X X 1 X 1 0 X Hi-Z Write Suspend Write Current 0 X X X 1 1 1 X Hi-Z Write Suspend Write Current 0 X X 1 X 1 1 X Hi-Z Write ZZ “sleep” None 1 X X X X X X X Hi-Z X Sleep Mode Interleaved Burst Sequence First Address Second Address Third Address Fourth Address A[1:0] A[1:0] A[1:0] A[1:0] 00 01 10 11 01 00 11 10 10 11 00 01 11 10 01 00 The ZZ input pin is an asynchronous input. Asserting ZZ places the SRAM in a power conservation “sleep” mode. Two clock cycles are required to enter into or exit from this “sleep” mode. While in this mode, data integrity is guaranteed. Accesses pending when entering the “sleep” mode are not considered valid nor is the completion of the operation guaranteed. The device must be deselected prior to entering the “sleep” mode. CEs, ADSP, and ADSC must remain inactive for the duration of tZZREC after the ZZ input returns LOW. Linear Burst Sequence First Address Second Address Third Address Fourth Address A[1:0] A[1:0] A[1:0] A[1:0] 00 01 10 11 01 10 11 00 10 11 00 01 11 00 01 10 ZZ Mode Electrical Characteristics Parameter IDDZZ tZZS tZZREC Description Test Conditions Max. Unit Snooze mode standby current ZZ > VDD – 0.2V TBD mA Device operation to ZZ ZZ > VDD – 0.2V 2tCYC ns ZZ recovery time ZZ < 0.2V Document #: 38-05284 Rev. *A Min. 2tCYC ns Page 10 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY Write Cycle Descriptions[1, 2] Function (CY7C1481V33) GW BWE BWd BWc BWb BWa Read 1 1 X X X X Read 1 0 1 1 1 1 Write Byte 0 – DQa 1 0 1 1 1 0 Write Byte 1 – DQb 1 0 1 1 0 1 Write Bytes 1, 0 1 0 1 1 0 0 Write Byte 2 – DQc 1 0 1 0 1 1 Write Bytes 2, 0 1 0 1 0 1 0 Write Bytes 2, 1 1 0 1 0 0 1 Write Bytes 2, 1, 0 1 0 1 0 0 0 Write Byte 3 – DQd 1 0 0 1 1 1 Write Bytes 3, 0 1 0 0 1 1 0 Write Bytes 3, 1 1 0 0 1 0 1 Write Bytes 3, 1, 0 1 0 0 1 0 0 Write Bytes 3, 2 1 0 0 0 1 1 Write Bytes 3, 2, 0 1 0 0 0 1 0 Write Bytes 3, 2, 1 1 0 0 0 0 1 Write All Bytes 1 0 0 0 0 0 Write All Bytes 0 X X X X X GW BWE BWb BWa Read 1 1 X X Read 1 0 1 1 Write Byte 0 – DQ[7:0] and DP0 1 0 1 0 Write Byte 1 – DQ[15:8] and DP1 1 0 0 1 Write All Bytes 1 0 0 0 Write All Bytes 0 X X X Function (CY7C1483V33) Function (CY7C1487V33)[5] GW BWE BWx Read 1 1 X Read 1 0 All BW = 1 Write Byte X 1 0 0 Write All Bytes 1 0 All BW = 0 Write All Bytes 0 X X Note: 5. BWx represents any byte write signal BW[0..7]. To enable any byte write BWx, a low logic signal should be applied at clock rise. Any number of byte writes can be enabled at the same time for any given write. Document #: 38-05284 Rev. *A Page 11 of 30 PRELIMINARY IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1483V33/CY7C1481V33/CY7C1487V33 incorporates a serial boundary scan Test Access Port (TAP) in the BGA package only. The TQFP package does not offer this functionality. This port operates in accordance with IEEE Standard 1149.1-1900, but does not have the set of functions required for full 1149.1 compliance. These functions from the IEEE specification are excluded because their inclusion places an added delay in the critical speed path of the SRAM. Note that the TAP controller functions in a manner that does not conflict with the operation of other devices using 1149.1 fully compliant TAPs. The TAP operates using JEDEC standard 3.3V I/O logic levels. Disabling the JTAG Feature It is possible to operate the SRAM without using the JTAG feature. To disable the TAP controller, TCK must be tied LOW (VSS) to prevent clocking of the device. TDI and TMS are internally pulled up and may be unconnected. They may alternately be connected to VDD through a pull-up resistor. TDO should be left unconnected. Upon power-up, the device will come up in a reset state which will not interfere with the operation of the device. Test Access Port (TAP) – Test Clock The test clock is used only with the TAP controller. All inputs are captured on the rising edge of TCK. All outputs are driven from the falling edge of TCK. Test Mode Select The TMS input is used to give commands to the TAP controller and is sampled on the rising edge of TCK. It is allowable to leave this pin unconnected if the TAP is not used. The pin is pulled up internally, resulting in a logic HIGH level. Test Data-In (TDI) The TDI pin is used to serially input information into the registers and can be connected to the input of any of the registers. The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. For information on loading the instruction register, see the TAP Controller State Diagram. TDI is internally pulled up and can be unconnected if the TAP is unused in an application. TDI is connected to the Most Significant Bit (MSB) on any register. Test Data Out (TDO) The TDO output pin is used to serially clock data-out from the registers. The output is active depending upon the current state of the TAP state machine (see TAP Controller State Diagram). The output changes on the falling edge of TCK. TDO is connected to the Least Significant Bit (LSB) of any register. Performing a TAP Reset A Reset is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This RESET does not affect the operation of the SRAM and may be performed while the SRAM is operating. At power-up, the TAP is reset internally to ensure that TDO comes up in a High-Z state. Document #: 38-05284 Rev. *A CY7C1481V33 CY7C1483V33 CY7C1487V33 TAP Registers Registers are connected between the TDI and TDO pins and allow data to be scanned into and out of the SRAM test circuitry. Only one register can be selected at a time through the instruction registers. Data is serially loaded into the TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK. Instruction Register Three-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the TDI and TDO pins as shown in the TAP Controller Block Diagram. Upon power-up, the instruction register is loaded with the IDCODE instruction. It is also loaded with the IDCODE instruction if the controller is placed in a reset state as described in the previous section. When the TAP controller is in the CaptureIR state, the two least significant bits are loaded with a binary “01” pattern to allow for fault isolation of the board level serial test path. Bypass Register To save time when serially shifting data through registers, it is sometimes advantageous to skip certain states. The bypass register is a single-bit register that can be placed between TDI and TDO pins. This allows data to be shifted through the SRAM with minimal delay. The bypass register is set LOW (VSS) when the BYPASS instruction is executed. Boundary Scan Register The boundary scan register is connected to all the input and output pins on the SRAM. Several no connect (NC) pins are also included in the scan register to reserve pins for higher density devices. The x36 configuration has a 70-bit-long register, and the x18 configuration has a 51-bit-long register. The boundary scan register is loaded with the contents of the RAM Input and Output ring when the TAP controller is in the Capture-DR state and is then placed between the TDI and TDO pins when the controller is moved to the Shift-DR state. The EXTEST, SAMPLE/PRELOAD and SAMPLE Z instructions can be used to capture the contents of the Input and Output ring. The Boundary Scan Order tables show the order in which the bits are connected. Each bit corresponds to one of the bumps on the SRAM package. The MSB of the register is connected to TDI, and the LSB is connected to TDO. Identification (ID) Register The ID register is loaded with a vendor-specific, 32-bit code during the Capture-DR state when the IDCODE command is loaded in the instruction register. The IDCODE is hardwired into the SRAM and can be shifted out when the TAP controller is in the Shift-DR state. The ID register has a vendor code and other information described in the Identification Register Definitions table. TAP Instruction Set Eight different instructions are possible with the three-bit instruction register. All combinations are listed in the Instruction Code table. Three of these instructions are listed as RESERVED and should not be used. The other five instructions are described in detail below. Page 12 of 30 PRELIMINARY The TAP controller used in this SRAM is not fully compliant to the 1149.1 convention because some of the mandatory 1149.1 instructions are not fully implemented. The TAP controller cannot be used to load address, data, or control signals into the SRAM and cannot preload the Input or Output buffers. The SRAM does not implement the 1149.1 commands EXTEST or INTEST or the PRELOAD portion of SAMPLE/PRELOAD; rather it performs a capture of the Inputs and Output ring when these instructions are executed. Instructions are loaded into the TAP controller during the Shift-IR state when the instruction register is placed between TDI and TDO. During this state, instructions are shifted through the instruction register through the TDI and TDO pins. To execute the instruction once it is shifted in, the TAP controller needs to be moved into the Update-IR state. EXTEST EXTEST is a mandatory 1149.1 instruction which is to be executed whenever the instruction register is loaded with all 0s. EXTEST is not implemented in the TAP controller, and therefore this device is not compliant to the 1149.1 standard. The TAP controller does recognize an all-0 instruction. When an EXTEST instruction is loaded into the instruction register, the SRAM responds as if a SAMPLE/PRELOAD instruction has been loaded. There is one difference between the two instructions. Unlike the SAMPLE/PRELOAD instruction, EXTEST places the SRAM outputs in a High-Z state. IDCODE The IDCODE instruction causes a vendor-specific, 32-bit code to be loaded into the instruction register. It also places the instruction register between the TDI and TDO pins and allows the IDCODE to be shifted out of the device when the TAP controller enters the Shift-DR state. The IDCODE instruction is loaded into the instruction register upon power-up or whenever the TAP controller is given a test logic reset state. SAMPLE Z The SAMPLE Z instruction causes the boundary scan register to be connected between the TDI and TDO pins when the TAP controller is in a Shift-DR state. It also places all SRAM outputs into a High-Z state. CY7C1481V33 CY7C1483V33 CY7C1487V33 When the SAMPLE/PRELOAD instructions are loaded into the instruction register and the TAP controller is in the Capture-DR state, a snapshot of data on the inputs and output pins is captured in the boundary scan register. The user must be aware that the TAP controller clock can only operate at a frequency up to 10 MHz, while the SRAM clock operates more than an order of magnitude faster. Because there is a large difference in the clock frequencies, it is possible that during the Capture-DR state, an input or output will undergo a transition. The TAP may then try to capture a signal while in transition (metastable state). This will not harm the device, but there is no guarantee as to the value that will be captured. Repeatable results may not be possible. To guarantee that the boundary scan register will capture the correct value of a signal, the SRAM signal must be stabilized long enough to meet the TAP controller’s capture set-up plus hold times (tCS and tCH). The SRAM clock input might not be captured correctly if there is no way in a design to stop (or slow) the clock during a SAMPLE/PRELOAD instruction. If this is an issue, it is still possible to capture all other signals and simply ignore the value of the CK and CK captured in the boundary scan register. Once the data is captured, it is possible to shift out the data by putting the TAP into the Shift-DR state. This places the boundary scan register between the TDI and TDO pins. Note that since the PRELOAD part of the command is not implemented, putting the TAP into the Update to the Update-DR state while performing a SAMPLE/PRELOAD instruction will have the same effect as the Pause-DR command. Bypass When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass register is placed between the TDI and TDO pins. The advantage of the BYPASS instruction is that it shortens the boundary scan path when multiple devices are connected together on a board. Reserved These instructions are not implemented but are reserved for future use. Do not use these instructions. SAMPLE/PRELOAD SAMPLE/PRELOAD is a 1149.1 mandatory instruction. The PRELOAD portion of this instruction is not implemented, so the TAP controller is not fully 1149.1 compliant. Document #: 38-05284 Rev. *A Page 13 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY TAP Controller State Diagram 1[6] TEST-LOGIC RESET 0 TEST-LOGIC/ IDLE 1 1 1 SELECT DR-SCAN SELECT IR-SCAN 0 0 1 1 CAPTURE-DR CAPTURE-DR 0 0 0 SHIFT-DR 0 SHIFT-IR 1 1 1 EXIT1-DR 1 EXIT1-IR 0 0 PAUSE-DR 0 0 PAUSE-IR 1 1 0 0 EXIT2-DR EXIT2-IR 1 1 UPDATE-DR 1 0 UPDATE-IR 1 0 Note: 6. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document #: 38-05284 Rev. *A Page 14 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY TAP Controller Block Diagram 0 Bypass Register Selection Circuitry 2 TDI 1 0 1 0 1 0 Selection Circuitry TDO Instruction Register 31 30 29 . . 2 Identification Register . . . . . 2 Boundary Scan Register TCK TAP Controller TMS TAP Electrical Characteristics Over the Operating Range[7, 8] Parameter Description Test Conditions Min. VOH1 Output HIGH Voltage IOH = −4.0 mA 2.4 VOH2 Output HIGH Voltage IOH = −100 µA 3.0 VOL1 Output LOW Voltage IOL = 8.0 mA VOL2 Output LOW Voltage IOL = 100 µA VIH Input HIGH Voltage VIL Input LOW Voltage IX Input Load Current GND ≤ VI ≤ VDDQ TAP AC Switching Characteristics Over the Operating Range Parameter Description Max. Unit V V 0.4 V 0.2 V 1.8 VDD + 0.3 V −0.5 0.8 V −5 5 µA [9, 10] Min. Max 100 Unit tTCYC TCK Clock Cycle Time ns tTF TCK Clock Frequency tTH TCK Clock HIGH 40 ns tTL TCK Clock LOW 40 ns 10 MHz Notes: 7. All Voltage referenced to Ground. 8. Overshoot: VIH(AC)<VDD+1.5V for t<tTCYC/2, Undershoot: VIL(AC)<0.5V for t<tTCYC/2, Power-up: VIH<2.6V and VDD<2.4V and VDDQ<1.4V for t<200 ms. 9. tCS and tCH refer to the set-up and hold time requirements of latching data from the boundary scan register. 10. Test conditions are specified using the load in TAP AC test conditions. tR/tF = 1 ns. Document #: 38-05284 Rev. *A Page 15 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY TAP AC Switching Characteristics Over the Operating Range (continued)[9, 10] Parameter Description Min. Max Unit Set-up Times tTMSS TMS Set-up to TCK Clock Rise 10 ns tTDIS TDI Set-up to TCK Clock Rise 10 ns tCS Capture Set-up to TCK Rise 10 ns tTMSH TMS Hold after TCK Clock Rise 10 ns tTDIH TDI Hold after Clock Rise 10 ns tCH Capture Hold after Clock Rise 10 ns Hold Times Output Times tTDOV TCK Clock LOW to TDO Valid tTDOX TCK Clock LOW to TDO Invalid 20 0 ns ns TAP Timing and Test Conditions 1.25V 50Ω ALL INPUT PULSES TDO Vih Z0 = 50Ω CL = 20 pF 0V (a) tTH GND tTL Test Clock TCK tTC YC tTMSS tTMSH Test Mode Select TMS t TDIS t TDIH Test Data-In TDI Test Data-Out TDO tTD OV Document #: 38-05284 Rev. *A tTDOX Page 16 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY Identification Register Definitions Instruction Field x 18 x36 x72 Description Revision Number (31:29) 000 000 000 Reserved for version number Department Number (27:25) 101 101 101 Department number Voltage (28&24) 00 00 00 Architecture (23:21) 000 000 000 Architecture type Memory Type (20:18) 001 001 001 Defines type of memory Device Width (17:15) 010 100 110 Defines width of the SRAM. x36 or x18 100 100 100 Defines the density of the SRAM Device Density (14:12) Cypress JEDEC ID (11:1) 0000011 0000011 0000011 Allows unique identification of SRAM vendor 0100 0100 0100 ID Register Presence (0) 1 1 1 Indicate the presence of an ID register Scan Register Sizes Register Name Bit Size (x18) Bit Size (x36) Bit Size (x72) Instruction 3 3 3 Bypass 1 1 1 ID Boundary Scan 32 32 32 TBD TBD TBD Identification Codes Instruction Code Description EXTEST 000 Captures the Input/Output ring contents. Places the boundary scan register between the TDI and TDO. Forces all SRAM outputs to High-Z state. This instruction is not 1149.1 compliant. IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and TDO. This operation does not affect SRAM operation. SAMPLE Z 010 Captures the Input/Output contents. Places the boundary scan register between TDI and TDO. Forces all SRAM output drivers to a High-Z state. RESERVED 011 Do Not Use: This instruction is reserved for future use. SAMPLE/PRELOAD 100 Captures the Input/Output ring contents. Places the boundary scan register between TDI and TDO. Does not affect the SRAM operation. This instruction does not implement 1149.1 preload function and is therefore not 1149.1 compliant. RESERVED 101 Do Not Use: This instruction is reserved for future use. RESERVED 110 Do Not Use: This instruction is reserved for future use. BYPASS 111 Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. Boundary Scan Order (2M x 36) Bit # Signal Name Bump ID Bit # Signal Name Boundary Scan Order (2M x 36) (continued) Bump ID Bit # Signal Name Bump ID Bit # Signal Name Bump ID TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Document #: 38-05284 Rev. *A Page 17 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY Boundary Scan Order (2M x 36) (continued) Bit # Signal Name Bump ID Bit # Signal Name Bump ID Boundary Scan Order (4M x 18) (continued) Bit # Signal Name Bump ID Bit # Signal Name Bump ID TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Boundary Scan Order (4M x 18) Bit # Signal Name Bump ID Bit # Signal Name Bump ID TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Document #: 38-05284 Rev. *A Page 18 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY Current into Outputs (LOW)......................................... 20 mA Maximum Ratings (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature .................................–65°C to +150°C Ambient Temperature with Power Applied............................................. –55°C to +125°C Static Discharge Voltage........................................... >2001V (per MIL-STD-883, Method 3015) Latch-up Current..................................................... >200 mA Operating Range Supply Voltage on VDD Relative to GND........ –0.5V to +4.6V Range DC Voltage Applied to Outputs in High-Z State[12] ............................... –0.5V to VDDQ + 0.5V Com’l Ambient Temperature[11] 0°C to +70°C DC Input Voltage[12] ............................ –0.5V to VDDQ + 0.5V VDD VDDQ 3.3V + 5%/ –5% 2.375V (min.) VDD(max.) Electrical Characteristics Over the Operating Range Parameter Description Test Conditions Min. Max. Unit VDD Power Supply Voltage 3.135 3.465 V VDDQ I/O Supply Voltage 2.375 VDD V VOH Output HIGH Voltage VOL VIH VIL IX Output LOW Voltage VDD = Min., IOH = –4.0 mA 3.3V 2.4 V VDD = Min., IOH = –1.0 mA 2.5V 2.0 V VDD = Min., IOL = 8.0 mA 3.3V 0.4 V VDD = Min., IOL = 1.0 mA 2.5V 0.4 V Input HIGH Voltage Input LOW Voltage[12] Input Load Current 3.3V 2.0 V 2.5V 1.7 V 3.3V –0.3 0.8 V 2.5V –0.3 0.7 V GND < VI < VDDQ Input Current of MODE 5 µA 30 µA Input Current of ZZ Input = VSS 30 µA IOZ Output Leakage Current GND < VI < VDDQ, Output Disabled 5 µA IDD VDD Operating Supply VDD = Max., IOUT = 0 mA, f = fMAX = 1/tCYC 150 MHz TBD mA 133 MHz TBD mA ISB1 Automatic CE Power-down Current—TTL Inputs Max. VDD, Device Deselected, VIN > VIH or VIN < VIL f = fMAX = 1/tCYC ISB2 Automatic CE Power-down Current—CMOS Inputs Max. VDD, Device Deselected, VIN < 0.3V or VIN > VDDQ – 0.3V, f=0 ISB3 Automatic CE Power-down Current—CMOS Inputs Max. VDD, Device Deselected, or VIN < 0.3V or VIN > VDDQ – 0.3V f = fMAX = 1/tCYC ISB4 Automatic CE Power-down Current—TTL Inputs Max. VDD, Device Deselected, VIN > VIH or VIN < VIL, f = 0 117 MHz TBD mA 100 MHz TBD mA 150 MHz TBD mA 133 MHz TBD mA 117 MHz TBD mA 100 MHz TBD mA All speed grades TBD mA 150 MHz TBD mA 133 MHz TBD mA 117 MHz TBD mA 100 MHz TBD mA All speed grades TBD mA Shaded area contains advance information. Notes: 11. TA is the ambient temperature. 12. Minimum voltage equals −2.0V for pulse durations of less than 20 ns. Document #: 38-05284 Rev. *A Page 19 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY Capacitance[14] Parameter Description CIN Input Capacitance CCLK Clock Input Capacitance CI/O Input/Output Capacitance Test Conditions Max. Unit TBD pF TBD pF TBD pF TA = 25°C, f = 1 MHz, VDD = VDDQ = 3.3V AC Test Loads and Waveforms R = 317Ω VDDQ OUTPUT ALL INPUT PULSES OUTPUT Z0 = 50Ω RL = 50Ω Vdd R = 351Ω VL = 1.5 for 3.3V VDDQ = 1.25 for 2.5V VDDQ INCLUDING JIG AND SCOPE (a) 90% 10% 90% 10% 5 pF [13] GND Rise Time: 2 V/ns Fall Time: 2 V/ns (c) (b) Thermal Resistance[14] Parameter Description Test Conditions QJA Thermal Resistance (Junction to Ambient) QJC Thermal Resistance (Junction to Case) Still Air, soldered on a 4.25 x 1.125 inch, 4-layer printed circuit board BGA Typ. TQFP Typ. Unit TBD TBD °C/W TBD TBD °C/W Switching Characteristics Over the Operating Range -150 Parameter Description Min. -133 Max. Min. -117 Max. Min. -100 Max. Min. Max. Unit Clock tCYC Clock Cycle Time 6.7 7.5 FMAX Maximum Operating Frequency tCH Clock HIGH 2.5 2.5 2.8 3.0 ns tCL Clock LOW 2.5 2.5 2.8 3.0 ns 150 8.5 133 10 117 ns 100 MHz Output Times tCDV Data Output Valid After CLK Rise 5.5 6.5 7.5 8.5 ns tEOV OE LOW to Output Valid[14, 16, 18] 2.5 3.0 3.4 3.8 ns tDOH Data Output Hold After CLK Rise tCHZ Clock to High-Z[14, 15, 16, 17, 18] tCLZ Clock to Low-Z[14, 15, 16, 17, 18] tEOHZ OE HIGH to Output High-Z[15, 16, 18] tEOLZ OE LOW to Output Low-Z[15, 16, 18] 2.5 2.5 3.5 2.5 2.5 3.8 3.0 2.5 2.5 4.0 3.0 3.0 ns 4.5 3.0 3.5 ns ns 4 ns 0 0 0 0 ns 1.5 1.5 1.5 1.5 ns Set-up Times tAS Address Set-up Before CLK Rise Shaded areas contain advance information. Notes: 13. Input waveform should have a slew rate of > 2 V/ns. 14. Tested initially and after any design or process change that may affect these parameters. 15. Unless otherwise noted, test conditions assume signal transition time of 1.5ns, timing reference levels of 1.75V, input pulse levels of 0 to 3.3V, and output loading of the specified IOL/IOH and load capacitance. Shown in (a), (b) and (c) of AC Test Loads. 16. tCHZ, tCLZ, tOEV, tEOLZ, and tEOHZ are specified with AC test conditions shown in part (a) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage. 17. At any given voltage and temperature, tEOHZ is less than tEOLZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High-Z prior to Low-Z under the same system conditions. 18. This parameter is sampled and not 100% tested. Document #: 38-05284 Rev. *A Page 20 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY Switching Characteristics Over the Operating Range (continued) -150 Parameter Description Min. Max. -133 Min. Max. -117 Min. Max. -100 Min. Max. Unit tDS Data Input Set-up Before CLK Rise 1.5 1.5 1.5 1.5 ns tADS ADSP, ADSC Set-up Before CLK Rise 1.5 1.5 1.5 1.5 ns tWES BWE, GW, BWx Set-up Before CLK Rise 1.5 1.5 1.5 1.5 ns tADVS ADV Set-up Before CLK Rise 1.5 1.5 1.5 1.5 ns tCES Chip Select Set-up 1.5 1.5 1.5 1.5 ns tAH Address Hold After CLK Rise 0.5 0.5 0.5 0.5 ns tDH Data Input Hold After CLK Rise 0.5 0.5 0.5 0.5 ns tADH ADSP, ADSC Hold After CLK Rise 0.5 0.5 0.5 0.5 ns tWEH BWE, GW, BWx Hold After CLK Rise 0.5 0.5 0.5 0.5 ns tADVH ADV Hold after CLK Rise 0.5 0.5 0.5 0.5 ns tCEH Chip Select Hold After CLK Rise 0.5 0.5 0.5 0.5 ns Hold Times Document #: 38-05284 Rev. *A Page 21 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY Switching Waveforms Write Cycle Timing[19,20] Single Write Burst Write Pipelined Write tCH Unselected tCYC CLK tADH tADS tCL ADSP ignored with CE1 inactive ADSP tADH tADS ADSC initiated write ADSC tADVH tADVS ADV tAS ADD ADV Must Be Inactive for ADSP Write WD1 WD3 WD2 tAH GW tWS tWH WE tCES tWH tWS tCEH CE1 masks ADSP CE1 tCES tCEH Unselected with CE2 CE2 CE3 tCES tCEH OE tDH tDS Data In High-Z 1a 1a 2a = UNDEFINED 2b 2c 2d 3a High-Z = DON’T CARE Notes: 19. WE is the combination of BWE, BWx, and GW to define a write cycle (see Write Cycle Descriptions table). 20. WDx stands for Write Data to Address X. Document #: 38-05284 Rev. *A Page 22 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY Switching Waveforms (continued) Read Cycle Timing[19, 21] Burst Read Single Read tCYC Unselected tCH Pipelined Read CLK tADH tADS tCL ADSP ignored with CE1 inactive ADSP tADS ADSC initiated read ADSC tADVS tADH Suspend Burst ADV tADVH tAS ADD RD1 RD3 RD2 tAH GW tWS tWS tWH WE tCES tCEH tWH CE1 masks ADSP CE1 Unselected with CE2 CE2 tCES tCEH CE3 tCES OE Data Out tCEH tEOV tCDV tOEHZ tDOH 2a 1a 1a 2b 2c 2c 2d 3a tCLZ tCHZ = DON’T CARE = UNDEFINED Note: 21. RDx stands for Read Data from Address X. Document #: 38-05284 Rev. *A Page 23 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY Switching Waveforms (continued) Read/Write Timing tCYC tCH tCL CLK tAH tAS ADD A B D C tADH tADS ADSP tADH tADS ADSC tADVH tADVS ADV tCEH tCES CE1 tCEH tCES CE tWEH tWES WE ADSP ignored with CE1 HIGH OE tEOHZ tCLZ Data Q(A) In/Out Q(B) Q (B+1) Q (B+2) Q (B+3) Q(B) D(C) D (C+1) D (C+2) D (C+3) Q(D) tCDV tDOH tCHZ Device originally deselected WE is the combination of BWE, BWx, and GW to define a write cycle (see Write Cycle Description table). CE is the combination of CE2 and CE3. All chip selects need to be active in order to select the device. RAx stands for Read Address X, WAx stands for Write Address X, Dx stands for Data-in X, Qx stands for Data-out X. = DON’T CARE = UNDEFINED Notes: 22. Device originally deselected. 23. CE is the combination of CE2 and CE3. All chip selects need to be active in order to select the device. Document #: 38-05284 Rev. *A Page 24 of 30 CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY Switching Waveforms (continued) OE Timing OE tEOV tEOHZ Three-state I/Os tEOLZ Ordering Information Speed (MHz) 150 133 117 100 Ordering Code CY7C1481V33-150AC CY7C1483V33-150AC Package Name Package Type Operating Range A101 100-Lead 14 x 20 x 1.4 mm Thin Quad Flat Pack Commercial CY7C1481V33-150BGC CY7C1483V33-150BGC BG119 CY7C1481V33-150BZC CY7C1483V33-150BZC BB165C CY7C1487V33-150BGC BG209 CY7C1481V33-133AC CY7C1483V33-133AC A101 CY7C1481V33-133BGC CY7C1483V33-133BGC BG119 CY7C1481V33-133BZC CY7C1483V33-133BZC BB165C CY7C1487V33-133BGC BG209 CY7C1481V33-117AC CY7C1483V33-117AC A101 CY7C1481V33-117BGC CY7C1483V33-117BGC BG119 CY7C1481V33-117BZC CY7C1483V33-117BZC BB165C CY7C1487V33-117BGC BG209 CY7C1481V33-100AC CY7C1483V33-100AC A101 CY7C1481V33-100BGC CY7C1483V33-100BGC BG119 CY7C1481V33-100BZC CY7C1483V33-100BZC BB165C CY7C1487V33-100BGC BG209 Document #: 38-05284 Rev. *A 119-Ball BGA (14 x 22 x 2.4 mm) 165-Ball FBGA (15 x 17 mm) 209-Ball BGA (14 x 22 x 2.2mm) 100-Lead 14 x 20 x 1.4 mm Thin Quad Flat Pack 119-Ball BGA (14 x 22 x 2.4 mm) 165-Ball FBGA (15 x 17 mm) 209-Ball BGA (14 x 22 x 2.2mm) 100-Lead 14 x 20 x 1.4 mm Thin Quad Flat Pack 119-Ball BGA (14 x 22 x 2.4 mm) 165-Ball FBGA (15 x 17 mm) 209-Ball BGA (14 x 22 x 2.2mm) 100-Lead 14 x 20 x 1.4 mm Thin Quad Flat Pack 119-Ball BGA (14 x 22 x 2.4 mm) 165-Ball FBGA (15 x 17 mm) 209-Ball BGA (14 x 22 x 2.2mm) Page 25 of 30 PRELIMINARY CY7C1481V33 CY7C1483V33 CY7C1487V33 Package Diagrams 100-pin Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm) A101 51-85050-A Document #: 38-05284 Rev. *A Page 26 of 30 PRELIMINARY CY7C1481V33 CY7C1483V33 CY7C1487V33 Package Diagrams (continued) 165-Ball FBGA (15 x 17 x 1.20 mm) BB165C 51-85165-** Document #: 38-05284 Rev. *A Page 27 of 30 PRELIMINARY CY7C1481V33 CY7C1483V33 CY7C1487V33 Package Diagrams (continued) 119-Lead PBGA (14 x 22 x 2.4 mm) BG119 51-85115-*B Document #: 38-05284 Rev. *A Page 28 of 30 PRELIMINARY CY7C1481V33 CY7C1483V33 CY7C1487V33 Package Diagrams (continued) 209-Lead PBGA (14 x 22 x 2.20 mm) BG209 51-85143-*B All product and company names mentioned in this document are the trademarks of their respective holders. Document #: 38-05284 Rev. *A Page 29 of 30 © Cypress Semiconductor Corporation, 2003. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges. CY7C1481V33 CY7C1483V33 CY7C1487V33 PRELIMINARY Document History Page Document Title: CY7C1481V33/CY7C1483V33/CY7C1487V33 2M x 36/4M x 18/1M x 72 Flow-through SRAM Document Number: 38-05284 REV. ECN NO. Issue Date ** 114671 08/12/02 PKS New Data Sheet *A 118283 01/27/03 HGK Updated Ordering Information Updated the features for package offering Changed from Advance Information to Preliminary Document #: 38-05284 Rev. *A Orig. of Change Description of Change Page 30 of 30