CY8CLED16P01 Powerline Communication Solution Features ■ Powerline Communication Solution ❐ Integrated Powerline Modem PHY ❐ Frequency Shift Keying Modulation ❐ Configurable baud rates up to 2400 bps ❐ Powerline Optimized Network Protocol ❐ Integrates Data Link, Transport, and Network Layers ❐ Supports Bidirectional Half Duplex Communication ❐ 8-bit CRC Error Detection to Minimize Data Loss 2 ❐ I C enabled Powerline Application Layer 2 ❐ Supports I C Frequencies of 50, 100, and 400 kHz ❐ Reference Designs for 110V/240V AC and 12V/24V AC/DC Powerlines ❐ Reference Designs comply with CENELEC EN 50065-1:2001 and FCC Part 15 ■ HB LED Controller ❐ Configurable Dimmers Support up to 16 Independent LED Channels ❐ 8 to 32 Bits of Resolution per Channel ❐ PrISM™ Modulation technology to reduce radiated EMI and Low Frequency Blinking ❐ Additional communication interfaces for lighting control such as DALI, DMX512 etc. ■ Powerful Harvard Architecture Processor ❐ M8C Processor Speeds to 24 MHz ❐ Two 8x8 Multiply, 32-Bit Accumulate ® ■ Programmable System Resources (PSoC Blocks) ❐ 12 Rail-to-Rail Analog PSoC Blocks provide: • Up to 14-Bit ADCs • Up to 9-Bit DACs • Programmable Gain Amplifiers • Programmable Filters and Comparators Logic Block Diagram ❐ 16 Digital PSoC Blocks provide: • 8 to 32-Bit Timers, Counters, and PWMs • CRC and PRS Modules • Up to Four Full Duplex UARTs • Multiple SPITM Masters or Slaves • Connectable to all GPIO Pins ❐ Complex Peripherals by Combining Blocks ■ Flexible On-Chip Memory ❐ 32 KB Flash Program Storage 50,000 Erase or Write Cycles ❐ 2 KB SRAM Data Storage ❐ EEPROM Emulation in Flash ■ Programmable Pin Configurations ❐ 25 mA Sink, 10 mA Source on all GPIOs ❐ Pull Up, Pull Down, High Z, Strong, or Open-drain Drive Modes on all GPIOs ❐ Up to 12 Analog Inputs on GPIO ❐ Configurable Interrupt on all GPIO ■ Additional System Resources 2 ❐ I C Slave, Master, and Multi-Master to 400 kHz ❐ Watchdog and Sleep Timers ❐ User-Configurable Low Voltage Detection ❐ Integrated Supervisory Circuit ❐ On-Chip Precision Voltage Reference ■ Complete Development Tools ❐ Free Development Software (PSoC Designer™) ❐ Full Featured In-Circuit Emulator (ICE) and Programmer ❐ Full Speed Emulation ❐ Complex Breakpoint Structure ❐ 128 KB Trace Memory ❐ Complex Events ❐ C Compilers, Assembler, and Link Powerline Communication Solution Powerline Network Protocol Physical Layer FSK Modem PLC Core Programmable System Resources Modulation Technology Digital and Analog Peripherals PrISM, PWM etc. Additional System Resources Additional Communication Interface MAC, Decimator, I2C, SPI, UART etc. PSoC Core DALI, DMX512 CY8CLED16P01 Embedded Application HB LED Controller Powerline Transceiver Packet AC/DC Powerline Coupling Circuit (110V/240V AC, 12V/24V AC/DC etc.) Powerline Cypress Semiconductor Corporation Document Number: 001-49263 Rev. *J • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised June 17, 2011 CY8CLED16P01 1. Contents PLC Functional Overview ................................................ 3 Robust Communication using Cypress’s PLC Solution 3 Powerline Modem PHY ............................................... 3 Network Protocol ......................................................... 4 High Brightness (HB) LED Controller ............................. 8 LED Dimming Modulation ............................................ 8 Color Mixing Algorithm ................................................ 9 LED Temperature Compensation ................................ 9 ColorLock Algorithm .................................................... 9 Digital Communication .............................................. 10 Other Functions ......................................................... 10 PSoC Core ....................................................................... 11 Programmable System Resources ............................ 12 Additional System Resources ................................... 14 Getting Started ................................................................ 14 Application Notes ...................................................... 14 Development Kits ...................................................... 14 Training ..................................................................... 14 CYPros Consultants .................................................. 14 Solutions Library ........................................................ 14 Technical Support ..................................................... 14 Development Tools ........................................................ 15 PSoC Designer Software Subsystems ...................... 15 In-Circuit Emulator (ICE) ........................................... 15 Designing with PSoC Designer ..................................... 16 Select Components ................................................... 16 Configure Components ............................................. 16 Organize and Connect .............................................. 16 Generate, Verify, and Debug ..................................... 16 PLC User Modules .................................................... 17 Intelligent Lighting User Modules .............................. 17 Pin Information ............................................................... 18 28-Pin Part Pinout ..................................................... 18 48-Pin Part Pinout ..................................................... 19 Document Number: 001-49263 Rev. *J 100-Pin Part Pinout (On-Chip Debug) ....................... 20 Register Reference ......................................................... 22 Register Conventions ................................................ 22 Register Mapping Tables .......................................... 22 Electrical Specifications ................................................ 25 Absolute Maximum Ratings ....................................... 25 Operating Temperature ............................................. 25 DC Electrical Characteristics ..................................... 26 AC Electrical Characteristics ..................................... 35 Packaging Information ................................................... 43 Packaging Dimensions .............................................. 43 Thermal Impedances ................................................. 46 Capacitance on Crystal Pins ..................................... 46 Solder Reflow Peak Temperature ............................. 46 Development Tool Selection ......................................... 47 Software .................................................................... 47 Development Kits ...................................................... 47 Evaluation Kits ........................................................... 48 Device Programmers ................................................. 48 Ordering Information ...................................................... 49 Ordering Code Definitions ......................................... 49 Acronyms ........................................................................ 50 Acronyms Used ......................................................... 50 Reference Documents .................................................... 51 Document Conventions ................................................. 51 Glossary .......................................................................... 52 Document History Page ................................................. 57 Sales, Solutions, and Legal Information ...................... 58 Products .................................................................... 58 PSoC Solutions ......................................................... 58 Page 2 of 58 CY8CLED16P01 2. PLC Functional Overview Figure 2-2. Physical Layer FSK Modem Block Diagram Network Protocol The CY8CLED16P01 is an integrated Powerline Communication (PLC) chip with the Powerline Modem PHY and Network Protocol Stack running on the same device. Apart from the PLC core, the CY8CLED16P01 also offers Cypress's revolutionary PSoC technology that enables system designers to integrate multiple functions on the same chip. Integrated Powerline PHY modem with optimized filters and amplifiers to work with lossy high voltage and low voltage powerlines. ■ Powerline optimized network protocol that supports bidirectional communication with acknowledgement-based signaling. In case of data packet loss due to bursty noise on the powerline, the transmitter has the capability to retransmit data. Hysteresis Comparator Logic ‘1’ or Logic ‘0’ Low Pass Filter External Low Pass Filter Modulator Correlator Square Wave at FSK Frequencies IF Band Pass Filter Local Oscillator Mixer Programmable Gain Amplifier Receiver ■ Local Oscillator Transmitter Powerlines are available everywhere in the world and are a widely available communication medium for PLC technology. The pervasiveness of powerlines also makes it difficult to predict the characteristics and operation of PLC products. Because of the variable quality of powerlines around the world, implementing robust communication has been an engineering challenge for years. The Cypress PLC solution enables secure and reliable communications. Cypress PLC features that enable robust communication over powerlines include: Powerline Modem PHY 2.1 Robust Communication using Cypress’s PLC Solution Digital Receiver Digital Transmitter HF Band Pass Filter RX Amplifier Coupling Circuit ■ The Powerline Network Protocol also supports an 8-bit CRC for error detection and data packet retransmission. ■ A Carrier Sense Multiple Access (CSMA) scheme is built into the network protocol that minimizes collisions between packet transmissions on the powerline and supports multiple masters and reliable communication on a bigger network. 2.2 Powerline Modem PHY Figure 2-1. Physical Layer FSK Modem Physical Layer FSK Modem PLC Core Modulation Technology Digital and Analog Peripherals PrISM, PWM etc. Additional System Resources Additional Communication Interface MAC, Decimator, I2C, SPI, UART etc. PSoC Core DALI, DMX512 CY8CLED16P01 Embedded Application Programmable System Resources HB LED Controller Powerline Transceiver Packet The physical layer of the Cypress PLC solution is implemented using an FSK modem that enables half duplex communication on any high voltage and low voltage powerline. This modem supports raw data rates up to 2400 bps. A block diagram is shown in Figure 2-2. Document Number: 001-49263 Rev. *J Digital data from the network layer is serialized by the digital transmitter and fed as input to the modulator. The modulator divides the local oscillator frequency by a definite factor depending on whether the input data is high level logic ‘1’ or low level logic ‘0’. It then generates a square wave at 133.3 kHz (logic ‘0’) or 131.8 kHz (logic ‘1’), which is fed to the Programmable Gain Amplifier to generate FSK modulated signals. This enables tunable amplification of the signal depending on the noise in the channel. The logic ‘1’ frequency can also be configured as 130.4 kHz for wider FSK deviation. 2.2.2 Receiver Section Powerline Communication Solution Powerline Network Protocol 2.2.1 Transmitter Section The incoming FSK signal from the powerline is input to a high frequency (HF) band pass filter that filters out-of-band frequency components and outputs a filtered signal within the desired spectrum of 125 kHz to 140 kHz for further demodulation. The mixer block multiplies the filtered FSK signals with a locally generated signal to produce heterodyned frequencies. The intermediate frequency (IF) band pass filters further remove out-of-band noise as required for further demodulation. This signal is fed to the correlator, which produces a DC component (consisting of logic ‘1’ and ‘0’) and a higher frequency component. The output of the correlator is fed to a low pass filter (LPF) that outputs only the demodulated digital data at 2400 baud and suppresses all other higher frequency components generated in the correlation process. The output of the LPF is digitized by the hysteresis comparator. This eliminates the effects of correlator delay and false logic triggers due to noise. The digital receiver deserializes this data and outputs to the network layer for interpretation. Page 3 of 58 CY8CLED16P01 2.2.3 Coupling Circuit Reference Design 2.3.1 CSMA and Timing Parameters The coupling circuit couples low voltage signals from the CY8CLED16P01 to the powerline. The topology of this circuit is determined by the voltage on the powerline and design constraints mandated by powerline usage regulations. ■ CSMA – The protocol provides the random selection of a period between 85 and 115 ms (out of seven possible values in this range). Within this period, the Band-In-Use (BIU) detector must indicate that the line is not in use, before attempting a transmission. ■ BIU – A Band-In-Use detector, as defined under CENELEC EN 50065-1, is active whenever a signal that exceeds 86 dBVrms anywhere in the range 131.5 kHz to 133.5 kHz is present for at least 4 ms. This threshold can be configured for different end-system applications not requiring CENELEC compliance.The modem tries to retransmit after every 85 to 115 ms when the band is in use. The transmitter times out after 1.1 seconds to 3 seconds (depending on the noise on the Powerline) and generates an interrupt to indicate that the transmitter was unable to acquire the powerline. Cypress provides reference designs for a range of powerline voltages including 110V/240V AC and 12V/24V AC/DC. The CY8CLED16P01 is capable of data communication over other AC/DC Powerlines as well with the appropriate external coupling circuit. The 110V AC and 240V AC designs are compliant to the following powerline usage regulations: ■ FCC Part 15 for North America ■ EN 50065-1:2001 for Europe 2.3 Network Protocol Cypress’s powerline optimized network protocol performs the functions of the data link, network, and transport layers in an ISO/OSI-equivalent model. Figure 2-3. Powerline Network Protocol Powerline Communication Solution Powerline Network Protocol Physical Layer FSK Modem PLC Core Programmable System Resources Modulation Technology Digital and Analog Peripherals PrISM, PWM etc. Additional System Resources Additional Communication Interface MAC, Decimator, I2C, SPI, UART etc. PSoC Core DALI, DMX512 CY8CLED16P01 Embedded Application HB LED Controller Powerline Transceiver Packet 2.3.2 Powerline Transceiver Packet The powerline network protocol defines a Powerline Transceiver (PLT) packet structure, which is used for data transfers between nodes across the powerline. Packet formation and data transmission across the powerline network is implemented internally in the CY8CLED16P01. A PLT packet is divided into a variable length header (minimum 6 bytes to maximum 20 bytes, depending on address type), variable length payload (minimum 0 bytes to maximum 31 bytes), and a packet CRC byte. This packet (preceded by a one byte preamble "0xAB") is then transmitted by the powerline modem PHY and the external coupling circuit across the powerline. The format of the PLT packet is shown in the following table. Table 2-1. Powerline Transceiver (PLT) Packet Structure Byte Offset Bit Offset 7 The network protocol implemented on the CY8CLED16P01 supports the following features: 0x00 SA Type 6 5 4 3 2 1 0 DA Type Service RSVD RSVD Response RSVD Type 0x01 Destination Address (8-Bit Logical, 16-Bit Extended Logical or 64-Bit Physical) Master-slave or peer-to-peer network topologies 0x02 Source Address (8-Bit Logical, 16-Bit Extended Logical or 64-Bit Physical) Multiple masters on powerline network 0x03 Command ■ 8-bit logical addressing supports up to 256 powerline nodes 0x04 ■ 16-bit extended logical addressing supports up to 65536 powerline nodes 0x05 ■ Bidirectional half duplex communication ■ ■ ■ 64-bit physical addressing supports up to 264 powerline nodes ■ Individual, broadcast or group mode addressing ■ Carrier Sense Multiple Access (CSMA) ■ Full control over transmission parameters ❐ Acknowledged ❐ Unacknowledged ❐ Repeated Transmit Document Number: 001-49263 Rev. *J Payload Length RSVD Seq Num Powerline Packet Header CRC 0x06 Payload (0 to 31 Bytes) Powerline Transceiver Packet CRC Page 4 of 58 CY8CLED16P01 2.3.3 Packet Header The packet header contains the first 6 bytes of the packet when 1-byte logical addressing is used. When 8-byte physical addressing is used, the source and destination addresses each contain 8 bytes. In this case, the header can consist of a maximum of 20 bytes. Unused fields marked RSVD are for future expansion and are transmitted as bit 0. Table 2-2 describes the PLT packet header fields in detail. Table 2-2. Powerline Transceiver (PLT) Packet Header Field Name SA Type No. of Bits 1 DA Type 2 Service Type Response 1 1 Seq Num 4 Header CRC 4 Tag Source Address Type Physical addressing: Every CY8CLED16P01 has a unique 64-bit physical address. ■ Group addressing: This is explained in the next section. 2.3.8 Group Membership Group membership enables the user to multicast messages to select groups. The CY8CLED16P01 supports two types of group addressing: ■ Single Group Membership – The network protocol supports up to 256 different groups on the network in this mode. In this mode, each PLC node can only be part of a single group. For example, multiple PLC nodes can be part of Group 131. ■ Multiple Group Membership – The network protocol supports eight different groups in this mode and each PLC node can be a part of multiple groups. For example, a single PLC node can be a part of Group 3, Group 4, and Group 7 at the same time. Description 0 – Logical Addressing 1 – Physical Addressing 00 – Logical Addressing Destination 01 – Group Addressing Address 10 – Physical Addressing Type 11 – Invalid 0 – Unacknowledged Messaging 1 – Acknowledged Messaging Response 0 - Not an acknowledgement or response packet 1 - Acknowledgement or response packet 4-bit unique identifier for each Sequence packet between source and destiNumber nation. 4-bit CRC value. This enables the receiver to suspend receiving the rest of the packet if its header is corrupted 2.3.4 Payload The packet payload has a length of 0 to 31 bytes. Payload content is user defined and can be read or written through I2C. 2.3.5 Packet CRC The last byte of the packet is an 8-bit CRC value used to check packet data integrity. This CRC calculation includes the header and payload portions of the packet and is in addition to the powerline packet header CRC. 2.3.6 Sequence Numbering The sequence number is increased for every new unique packet transmitted. If in acknowledged mode and an acknowledgment is not received for a given packet, that packet will be re-transmitted (if TX_Retry > 0) with the same sequence number. If in unacknowledged mode, the packet will be transmitted (TX_Retry + 1) times with the same sequence number. If the receiver receives consecutive packets from the same source address with the same sequence number and packet CRC, it does not notify the host of the reception of the duplicate packet. If in acknowledged mode, it still sends an acknowledgment so that the transmitter knows that the packet was received. 2.3.7 Addressing The CY8CLED16P01 has three modes of addressing: ■ ■ Logical addressing: Every CY8CLED16P01 node can have either a 8-bit logical address or a 16-bit logical address. The logical address of the PLC Node is set by the local application or by a remote node on the Powerline. Document Number: 001-49263 Rev. *J Both of these membership modes can also be used together for group membership. For example, a single PLC node can be a part of Group 131 and also multiple groups such as Group 3, Group 4, and Group 7. The group membership ID for broadcasting messages to all nodes in the network is 0x00. The service type is always set to Unacknowledgment Mode in Group Addressing Mode. This is to avoid acknowledgment flooding on the powerline during multicast. 2.3.9 Remote Commands In addition to sending normal data over the Powerline, the CY8CPLC10 can also send (and request) control information to (and from) another node on the network. The type of remote command to transmit is set by the TX_CommandID register and when received, is stored in the RX_CommandID register. When a control command (Command ID = 0x01 - 0x08 and 0x0C - 0x0F) is received, the protocol will automatically process the packet (if Lock_Configuration is '0'), respond to the initiator, and notify the host of the successful transmission and reception. When the send data command (ID 0x09) or request for data command (ID 0x0A) is received, the protocol will reply with an acknowledgment packet (if TX_Service_Type = '1'), and notify the host of the new received data. If the initiator doesn't receive the acknowledgment packet within 500ms, it will notify the host of the no acknowledgment received condition. When a response command (ID 0x0B) is received by the initiator within 1.5s of sending the request for data command, the protocol will notify the host of the successful transmission and reception. If the response command is not received by the initiator within 1.5s, it will notify the host of the no response received condition. The host is notified by updating the appropriate values in the INT_Status register (including Status_Value_Change). The command IDs 0x30-0xff can be used for custom commands that would be processed by the external host (e.g. set an LED color, get a temperature/voltage reading). The available remote commands are described in Table 2-3 on page 6 with the respective Command IDs. Page 5 of 58 CY8CLED16P01 Table 2-3. Remote Commands Cmd ID Command Name Description Payload (TX Data) Response (RX Data) 0x01 SetRemote_TXEnable Sets the TX Enable bit in the 0 - Disable Remote TX PLC Mode Register. Rest of the 1 - Enable Remote TX PLC Mode register is unaffected If Remote Lock Config = 0, Response = 00 (Success) If Remote Lock Config = 1, Response = 01 (Denied) 0x03 SetRemote_ExtendedAddr Set the Addressing to Extended Addressing Mode 0 - Disable Extended Addressing 1 - Enable Extended Addressing If Remote Lock Config = 0, Response = 00 (Success) If Remote Lock Config = 1, Response = 01 (Denied) 0x04 SetRemote_LogicalAddr Assigns the specified logical address to the remote PLC node If Ext Address = 0, Payload = 8-bit Logical Address If Ext Address = 1, Payload = 16-bit Logical Address If Remote Lock Config = 0, Response = 00 (Success) If Remote Lock Config = 1, Response = 01 (Denied) 0x05 GetRemote_LogicalAddr Get the Logical Address of the None remote PLC node If Remote TX Enable = 0, Response = None If Remote TX Enable = 1, {If Ext Address = 0, Response = 8-bit Logical Address If Ext Address = 1, Response = 16-bit Logical Address} 0x06 GetRemote_PhysicalAddr Get the Physical Address of the None remote PLC node If Remote TX Enable = 0, Response = None If Remote TX Enable = 1, Response = 64-bit Physical Address 0x07 GetRemote_State Request PLC_Mode Register content from a Remote PLC node If Remote TX Enable = 0, Response = None If Remote TX Enable = 1, Response = Remote PLC Mode register 0x08 GetRemote_Version Get the Version Number of the None Remote Node If TX Enable = 0, Response = None If TX Enable = 1, Response = Remote Version register 0x09 SendRemote_Data Transmit data to a Remote Node. Payload = Local TX Data If Local Service Type = 0, Response = None If Local Service Type = 1, Response = Ack 0x0A RequestRemote_Data Request data from a Remote Node Payload = Local TX Data If Local Service Type = 1, Response = Ack Then, the remote node host must send a ResponseRemote_Data command. The response must be completely transmitted within 1.5s of receiving the request. Otherwise, the requesting node will time out. 0x0B ResponseRemote_Data Transmit response data to a Remote Node. Payload = Local TX Data None 0x0C SetRemote_BIU Enables/Disables BIU function- 0 - Enable Remote BIU If Remote Lock Config = 0, ality at the remote node 1 - Disable Remote BIU Response = 00 (Success) If Remote Lock Config = 1, Response = 01 (Denied) Document Number: 001-49263 Rev. *J None Page 6 of 58 CY8CLED16P01 Table 2-3. Remote Commands (continued) Cmd ID Command Name Description Payload (TX Data) SetRemote_ThresholdValue 0x0E SetRemote_GroupMembership Sets the Group Membership of Byte0 - Remote SIngle the Remote node Group Membership Address Byte1- Remote Multiple Group Membership Address If Remote Lock Config = 0, Response = 00 (Success) If Remote Lock Config = 1, Response = 01 (Denied) 0x0F GetRemote_GroupMembership Gets the Group Membership of None the Remote node If Remote TX Enable = 0, Response = None If Remote TX Enable = 1, Response = Byte0 - Remote SIngle Group Membership Address Byte1- Remote Multiple Group Membership Address 0x10 0x2F Reserved 0x30 0xFF User Defined Command Set Document Number: 001-49263 Rev. *J Sets the Threshold Value at the 3-bit Remote Remote node Threshold Value Response (RX Data) 0x0D If Remote Lock Config = 0, Response = 00 (Success) If Remote Lock Config = 1, Response = 01 (Denied) Page 7 of 58 CY8CLED16P01 3. High Brightness (HB) LED Controller 3.1 LED Dimming Modulation Figure 3-1. CY8CLED16P01: HB LED Controller The LED Dimming modulators are an important part of any HB LED application. All EZ-Color controllers are capable of three primary types of LED dimming modulations. These are: Powerline Communication Solution Programmable System Resources Powerline Network Protocol Physical Layer FSK Modem PLC Core Modulation Technology Digital and Analog Peripherals PrISM, PWM etc. Additional System Resources Additional Communication Interface MAC, Decimator, I2C, SPI, UART etc. PSoC Core DALI, DMX512 CY8CLED16P01 Embedded Application HB LED Controller ■ Pulse Width Modulation (PWM) ■ Precise Illumination Signal Modulation (PrISM) ■ Delta Sigma Modulated PWM (DSPWM) PWM is among the most commonly used and conventional methods of modulation. It is straightforward to use and effective in practice. There are two additional techniques of modulation supported by EZ-Color that are superior to using the PWM alone: ■ Powerline Transceiver Packet PrISM is a modulation technique that is developed and patented by Cypress. It results in reduced EMI as compared to the PWM technique while still providing adequate dimming control for LEDs. ■ The HB LED Controller is based on Cypress's EZ-Color™ technology. EZ-Color offers the ideal control solution for high brightness (HB) LED applications requiring intelligent dimming control. EZ-Color devices combine the power and flexibility of PSoC (Programmable System-on-Chip) with Cypress's PrISM™ (Precise Illumination Signal Modulation) modulation technology providing lighting designers a fully customizable and integrated lighting solution platform. The CY8CLED16P01 supports up to 16 independent LED channels with up to 32 bits of resolution per channel, giving lighting designers the flexibility to choose the LED array size and color quality. PSoC Designer software, with lighting-specific user modules, significantly cuts development time and simplifies implementation of fixed color points through temperature and LED binning compensation. EZ-Color's virtually limitless analog and digital customization enable simple integration of features in addition to intelligent lighting, such as battery charging, image stabilization, and motor control during the development process. These features, along with Cypress's best-in-class quality and design support, make EZ-Color the ideal choice for intelligent HB LED control applications. The list of functions that EZ-Color devices implement are: ■ LED Dimming Modulation ■ Pulse Density Modulation Techniques ❐ DMX512 ❐ DALI ■ Digital Communication for Lighting ■ LED Temperature Compensation ■ 3- and 4-Channel Color Mixing ❐ Including LED Binning Compensation ■ Optical Feedback Algorithms Document Number: 001-49263 Rev. *J The Delta Sigma Modulated PWM technique provides higher resolution while using the same hardware resources as a conventional PWM. LED dimming modulators use digital block resources. Digital blocks are configurable 8-bit digital peripherals. There are two types of digital blocks in the CY8CLED16P01: basic and communication. Usually, there are equal numbers of each. Any communication functions must be implemented using communication blocks but basic, noncommunication functions are implemented using either kind of block. PWM and DSPWM modulators can have a dimming resolution of up to 16 bits. A PrISM modulator can theoretically have a dimming resolution of up to 32 bits, but the maximum recommended resolution for these modulators is 13 bits. This is because the output signal of a PrISM modulator has a frequency output range that increases with the resolution of the modulator. This increase in frequency output range is undesirable as it goes beyond the switching frequency of the current driver. Therefore, a resolution of 13 bits or lower is recommended for a PrISM modulator. Refer to application note AN47372, PrISM Technology for LED Dimming on http://www.cypress.com, for details. To determine the number of digital blocks used by one PWM or PrISM modulator, use Equation 1. Note that a partial digital block cannot be used, so the result must always be rounded up. In Equation 1, n is the dimming resolution of the modulator. The resolution of dimming is determined by the color accuracy needed for the end application. DigBlocksPWM ,PRISM n 8 Equation 1 Page 8 of 58 CY8CLED16P01 Equations 2 and 3 are used to determine how many digital blocks are needed by a DSPWM. The total dimming resolution of a DSPWM modulator is the total of the hardware PWM modulation resolution and extra resolution added by Delta Sigma modulation in the software. Equation 3 shows that the number of digital blocks needed is only determined by the hardware resolution. DigBlocksDSPWM nHW 8 nTotal nSW nHW Equation 2 Equation 3 These equations show that more dimming resolution is achieved with a DSPWM modulator than with a PWM or PrISM modulator. A DSPWM modulator requires more code space and execution time to use. Equations 1, 2, and 3 determine the number of digital blocks required by one modulator. The total number of blocks for all modulators is determined by adding up the digital blocks needed by each modulator used in the device. If the dimming resolution is increased, the number of digital blocks needed should be calculated accordingly. 3.3 LED Temperature Compensation Many HB LED systems need to measure analog signals. One or more thermistors are often present to measure temperatures of the system and the LEDs. The CY8CLED16P01 measures an analog signal with an analog-to-digital converter (ADC). The device can implement a variety of flexible ADC implementations. The ADCs cover a wide range of resolutions and techniques and use varied number of digital and analog block resources. For help in selecting from this multitude of ADCs, refer to application note AN2239, Analog – ADC Selection on http://www.cypress.com. When designing with an EZ-Color device, the number of digital and analog blocks used by an ADC must be factored into the total number of digital and analog blocks that are used. In a typical case, such as the 3-channel color mixing firmware IP developed by Cypress, the simple 8-bit incremental ADC is used. This module occupies one digital and one switched capacitor analog block. Analog blocks come in two types: continuous time and switched capacitor blocks. The former enables continuous time functions such as comparators and programmable gain amplifiers. The switched capacitor blocks enable functions such as ADCs and filters. The CY8CLED16P01 device has a variety of LED dimming configurations. Because it has 16 digital blocks, it can implement eight 16-bit PWM modulators, eight 12-bit PrISM modulators, or sixteen 12-bit DSPWM modulators (assuming the software resolution is 4 bits). As another example, it can implement four 10-bit PrISM modulators and still have 8 digital blocks left over to implement other digital functions. Temperature sensors with an I2C interface can also be used instead of raw thermistors, thereby eliminating the need for ADCs and complicated processing. The CY8CLED16P01 is a one-device solution for powerline communication and HB LED control. For an application that runs powerline communication and HB LED control simultaneously, the CY8CLED16P01 can implement four 16-bit PWM modulators, four 12-bit PrISM modulators, or eight 12-bit DSPWM modulators (assuming the software resolution is 4 bits). ColorLock functionality uses feedback from an optical sensor in the system to adjust the LED dimming modulators correctly to “lock on” to a target color. This is similar to the concept of temperature compensation because it compensates for change in color. Instead of indirectly measuring change in color through temperature, it senses actual change in color and compensates for it. 3.2 Color Mixing Algorithm The ColorLock algorithm implemented by Cypress requires the use of 10 digital blocks. Due to a 9-bit PrISM implementation, 6 digital blocks are used for dimming as in Equation 1. A 16-bit PWM and two 8-bit timers are also used to form the frame generator, pulse counter, and debounce counter. Code algorithms to implement color mixing functionality work well with EZ-Color controllers. Color mixing algorithms convert a set of color coordinates that specify a color into the appropriate 8-bit dimming values for the LED dimming modulators. This enables the EZ-Color controller to be communicated on a higher level and maintain desired color and brightness levels. 3.4 ColorLock Algorithm The basic 3-channel color mixing firmware performing 8-bit LED dimming requires three 8-bit dimming blocks. The discussion on LED dimming modulation implies that it consumes three digital blocks. The addition of a simple temperature compensation algorithm using a thermistor consumes an additional digital block and analog block (for the ADC). Document Number: 001-49263 Rev. *J Page 9 of 58 CY8CLED16P01 3.5 Digital Communication Most HB LED-based lighting systems require some form of digital communication to send and receive data to and from the light fixtures to control them. The CY8CLED16P01 is a one-device solution for HB LED lighting control and powerline communication. However, the CY8CLED16P01 supports several other data communication protocols, apart from powerline communication. These are listed in Table 3-1. Some of the hardware is dedicated for a protocol and does not use any digital blocks. Some protocols use digital blocks to implement the communication. A DMX512 protocol receiver can be implemented using two digital blocks. This is a standard protocol that is common in stage and concert lighting systems. The receiver has a software programmable address and programmable number of channels that it can control. A typical DMX512 receiver implementation (developed by Cypress) controlling three LED channels consumes five digital blocks (three for the LED modulators). Table 3-1. Digital Communication Resource Usage Digital Blocks Communication Digital Blocks DMX512 (Receiver) 2 1 DALI (Slave) 3 0 I2 C 0 0 Half Duplex UART 1 1 SPI Master or Slave 1 1 Data Protocol Master or Slave Apart from these specific lighting communication protocols, the industry standard communication protocols such as I2C, UART, and SPI can be implemented in any of the devices in the family. As examples, SPI can be used to interface to external WUSB devices, while I2C can be used to interface to external microcontrollers. Table 3-1 also shows the number of digital block resources that each type of communication block consumes. 3.6 Other Functions The CY8CLED16P01 is capable of functions other than those previously discussed. Most functions that can be implemented with a standard microcontroller can be also implemented with the CY8CLED16P01. Similar to regular PSoC devices, the CY8CLED16P01 also has dynamic reconfiguration ability. This is a technique that enables the device’s digital and analog resources to be reused for different functions that may not be available simultaneously. For instance, consider the application to remotely control LED color/intensity (with current feedback) over powerlines using the CY8CLED16P01 for both PLC and LED color control. The PLC functionality and the current feedback do not necessarily need to happen at the same time. Therefore, the digital and analog blocks that implement the PLC functionality can dynamically reconfigure into resources that implement current feedback. By doing this, the CY8CLED16P01 device gets more functionality out of a fixed number of resources than would otherwise be possible. The only constraint on this technique is the amount of Flash and SRAM size required for the code to implement these functions. For more details on dynamic reconfiguration, refer to application note AN2104, PSoC Dynamic Reconfiguration. DALI is another lighting communication protocol that is common for large commercial buildings. The DALI slave can be implemented in EZ-Color consuming six digital blocks (three for the DALI slave and three to modulate 3 LED channels). The three blocks used to implement DALI need not be communication blocks as the Manchester encoding is performed in the software. Document Number: 001-49263 Rev. *J Page 10 of 58 CY8CLED16P01 4. PSoC Core The CY8CLED16P01 is based on the Cypress PSoC® 1 architecture. The PSoC platform consists of many Programmable System-on-chip Controller devices. These devices are designed to replace multiple traditional MCU-based system components with one, low cost single-chip programmable device. PSoC devices include configurable blocks of analog and digital logic, and programmable interconnects. This architecture enables the user to create customized peripheral configurations that match the requirements of each individual application. Additionally, a fast CPU, Flash program memory, SRAM data memory, and configurable I/Os are included in a range of convenient pinouts and packages. The PSoC architecture, as shown in Figure 4-1., consists of four main areas: PSoC Core, Digital System, Analog System, and System Resources. Configurable global busing enables all the device resources to be combined into a complete custom system. The CY8CLED16P01 family can have up to five I/O ports that connect to the global digital and analog interconnects, providing access to 16 digital blocks and 12 analog blocks. The PSoC Core is a powerful engine that supports a rich feature set. The core includes a CPU, memory, clocks, and configurable GPIO (General Purpose I/O). Figure 4-1. PSoC Architecture Port 7 Port 6 Port 5 Port 4 Port 3 Port 2 Port 1 Port 0 Analog Drivers SYSTEM BUS Global Digital Interconnect SRAM 2K Memory encompasses 32 KB of Flash for program storage, 2 KB of SRAM for data storage, and up to 2 KB of EEPROM emulated using Flash. Program Flash uses four protection levels on blocks of 64 bytes, enabling customized software IP protection. The PSoC device incorporates flexible internal clock generators, including a 24 MHz IMO (internal main oscillator) accurate to 2.5 percent over temperature and voltage. The 24 MHz IMO can also be doubled to 48 MHz for the digital system use. A low power 32 kHz ILO (internal low speed oscillator) is provided for the sleep timer and WDT. If crystal accuracy is desired, the ECO (32.768 kHz external crystal oscillator) is available for use as a Real Time Clock (RTC) and can optionally generate a crystal-accurate 24 MHz system clock using a PLL. When operating the Powerline Transceiver (PLT) user module, the ECO must be selected to ensure accurate protocol timing. The clocks, together with programmable clock dividers (as a System Resource), provide the flexibility to integrate almost any timing requirement into the PSoC device. PSoC GPIOs provide connection to the CPU, digital, and analog resources of the device. Each pin’s drive mode may be selected from eight options, enabling great flexibility in external interfacing. Every pin also has the capability to generate a system interrupt on high level, low level, and change from last read. Global Analog Interconnect SROM Flash 32K PSoC CORE CPU Core (M8C) Interrupt Controller The M8C CPU core is a powerful processor with speeds up to 24 MHz, providing a 4 MIPS 8-bit Harvard architecture microprocessor. The CPU uses an interrupt controller with 25 vectors, to simplify programming of realtime embedded events. Program execution is timed and protected using the included Sleep and Watchdog timers (WDT). Sleep and Watchdog Multiple Clock Sources (Includes IMO, ILO, PLL, and ECO) DIGITAL SYSTEM ANALOG SYSTEM Analog Ref. Digital Block Array Digital Clocks Two Multiply Accums. Analog Block Array POR and LVD Decimator I2 C System Resets Analog Input Muxing Internal Voltage Ref. SYSTEM RESOURCES Document Number: 001-49263 Rev. *J Page 11 of 58 CY8CLED16P01 4.1 Programmable System Resources Figure 4-3. Digital System Block Diagram Port 7 Figure 4-2. Programmable System Resources Port 5 Port 6 Port 3 Port 4 Port 1 Port 2 Port 0 Powerline Communication Solution Additional System Resources Additional Communication Interface MAC, Decimator, I2C, SPI, UART etc. DALI, DMX512 PSoC Core PLC Core DIGITAL SYSTEM Digital PSoC Block Array Row Input Configuration PrISM, PWM etc. HB LED Controller Powerline Transceiver Packet Row 0 DBB00 8 8 ■ Counters (8 to 32 bit) ■ Timers (8 to 32 bit) ■ UART 8 bit with selectable parity (up to four) ■ SPI master and slave (up to four each) 2 ■I C slave and multi-master (one available as a System Resource) ■ Row Input Configuration Row Input Configuration PWMs with Dead Band (8 to 32 bit) Row Input Configuration ■ Row 1 DBB10 DBB11 DCB12 8 4 DCB13 4 Row 2 DBB20 DBB21 DCB22 4 DCB23 4 Row 3 DBB30 DBB31 DCB32 4 Row Output Configuration PWMs (8 to 32 bit) DCB03 Row Output Configuration ■ DCB02 Row Output Configuration The digital system contains 16 digital PSoC blocks. Each block is an 8-bit resource that can be used alone, or combined with other blocks to form 8-, 16-, 24-, and 32-bit peripherals called user modules. Digital peripheral configurations include: DBB01 4 4 8 4.1.1 The Digital System ToAnalog System Row Output Configuration Physical Layer FSK Modem Modulation Technology Digital and Analog Peripherals CY8CLED16P01 Programmable System Resources Powerline Network Protocol To System Bus Digital Clocks FromCore Embedded Application DCB33 4 Cyclical Redundancy Checker and Generator (8 to 32 bit) GIE[7:0] ■ IrDA (up to 4) GIO[7:0] ■ Pseudo Random Sequence Generators (8 to 32 bit) Global Digital Interconnect GOE[7:0] GOO[7:0] The digital blocks can be connected to any GPIO through a series of global buses that can route any signal to any pin. The buses also enable signal multiplexing and perform logic operations. This configurability frees your designs from the constraints of a fixed peripheral controller. Document Number: 001-49263 Rev. *J Page 12 of 58 CY8CLED16P01 The analog system contains 12 configurable blocks, each containing an opamp circuit, enabling the creation of complex analog signal flows. Analog peripherals are very flexible and can be customized to support specific application requirements. Some of the more common PSoC analog functions (most available as user modules) are: ■ Analog-to-digital converters (up to 4, with 6- to 14-bit resolution, selectable as Incremental, Delta Sigma, and SAR) ■ Filters (2, 4, 6, or 8 pole band pass, low pass, and notch) ■ Amplifiers (up to 4, with selectable gain to 48x) ■ Instrumentation amplifiers (up to 2, with selectable gain to 93x) ■ Comparators (up to 4, with 16 selectable thresholds) ■ DACs (up to 4, with 6- to 9-bit resolution) ■ Multiplying DACs (up to 4, with 6- to 9-bit resolution) ■ High current output drivers (4 with 40 mA drive as a Core Resource) ■ 1.3V reference (as a System Resource) ■ DTMF Dialer ■ Modulators ■ Correlators ■ Peak detectors ■ Many other topologies possible Figure 4-4. Analog System Block Diagram P0[7] P0[6] P0[5] P0[4] P0[3] P0[2] P0[1] P0[0] AGNDIn RefIn 4.1.2 The Analog System P2[3] P2[1] P2[6] P2[4] P2[2] P2[0] Array Input Configuration ACI0[1:0] ACI1[1:0] ACI2[1:0] ACI3[1:0] Block Array Analog blocks are provided in columns of three, which includes one CT (continuous time) and two SC (switched capacitor) blocks, as shown in the Figure 4-4. on page 13. ACB00 ACB01 ACB02 ACB03 ASC10 ASD11 ASC12 ASD13 ASD20 ASC21 ASD22 ASC23 Analog Reference Interface to Digital System RefHi RefLo AGND Reference Generators AGNDIn RefIn Bandgap M8C Interface (Address Bus, Data Bus, Etc.) Document Number: 001-49263 Rev. *J Page 13 of 58 CY8CLED16P01 4.2 Additional System Resources 5. Getting Started Figure 4-5. Additional System Resources The quickest way to understand Cypress’s Powerline Communication offering is to read this data sheet and then use the PSoC Designer Integrated Development Environment (IDE). The latest version of PSoC Designer can be downloaded from http://www.cypress.com. This data sheet is an overview of the CY8CLED16P01 integrated circuit and presents specific pin, register, and electrical specifications. Powerline Communication Solution Powerline Network Protocol Physical Layer FSK Modem PLC Core Programmable System Resources Modulation Technology Digital and Analog Peripherals PrISM, PWM etc. Additional System Resources Additional Communication Interface MAC, Decimator, I2C, SPI, UART etc. DALI, DMX512 PSoC Core CY8CLED16P01 Embedded Application HB LED Controller For in depth information, along with detailed programming details, see the PLC Technical Reference Manual. For up to date ordering, packaging, and electrical specification information, see the latest PLC device data sheets on the web at http://www.cypress.com. Application Notes Powerline Transceiver Packet System Resources, some of which have been previously described, provide additional capability useful to complete systems. Resources include a multiplier, decimator, low voltage detection, and power on reset. The following statements describe the merits of each system resource. ■ Digital clock dividers provide three customizable clock frequencies for use in applications. The clocks can be routed to both the digital and analog systems. Additional clocks are generated using digital PSoC blocks as clock dividers. ■ Multiply accumulate (MAC) provides a fast 8-bit multiplier with 32-bit accumulate, to assist in general math and digital filters. ■ The decimator provides a custom hardware filter for digital signal processing applications including the creation of Delta Sigma ADCs. ■ The I2C module provides 100 and 400 kHz communication over two wires. Slave, master, and multi-master modes are supported. ■ Low Voltage Detection (LVD) interrupts signal the application of falling voltage levels, while the advanced POR (Power On Reset) circuit eliminates the need for a system supervisor. ■ An internal 1.3V reference provides an absolute reference for the analog system, including ADCs and DACs. Cypress application notes are an excellent introduction to the wide variety of possible PSoC designs. Development Kits PSoC Development Kits are available online from and through a growing number of regional and global distributors, which include Arrow, Avnet, Digi-Key, Farnell, Future Electronics, and Newark. Training Free PSoC technical training (on demand, webinars, and workshops), which is available online via www.cypress.com, covers a wide variety of topics and skill levels to assist you in your designs. CYPros Consultants Certified PSoC consultants offer everything from technical assistance to completed PSoC designs. To contact or become a PSoC consultant go to the CYPros Consultants web site. Solutions Library Visit our growing library of solution focused designs. Here you can find various application designs that include firmware and hardware design files that enable you to complete your designs quickly. Technical Support Technical support – including a searchable Knowledge Base articles and technical forums – is also available online. If you cannot find an answer to your question, call our Technical Support hotline at 1-800-541-4736. Document Number: 001-49263 Rev. *J Page 14 of 58 CY8CLED16P01 6. Development Tools PSoC Designer™ is the revolutionary integrated design environment (IDE) that you can use to customize PSoC to meet your specific application requirements. PSoC Designer software accelerates system design and time to market. Develop your applications using a library of precharacterized analog and digital peripherals (called user modules) in a drag-and-drop design environment. Then, customize your design by leveraging the dynamically generated application programming interface (API) libraries of code. Finally, debug and test your designs with the integrated debug environment, including in-circuit emulation and standard software debug features. PSoC Designer includes: of debugging tools. You can develop your design in C, assembly, or a combination of the two. Assemblers. The assemblers allow you to merge assembly code seamlessly with C code. Link libraries automatically use absolute addressing or are compiled in relative mode, and linked with other software modules to get absolute addressing. ■ Application editor graphical user interface (GUI) for device and user module configuration and dynamic reconfiguration C Language Compilers. C language compilers are available that support the PSoC family of devices. The products allow you to create complete C programs for the PSoC family devices. The optimizing C compilers provide all of the features of C, tailored to the PSoC architecture. They come complete with embedded libraries providing port and bus operations, standard keypad and display support, and extended math functionality. ■ Extensive user module catalog Debugger ■ Integrated source-code editor (C and assembly) ■ Free C compiler with no size restrictions or time limits ■ Built-in debugger ■ In-circuit emulation PSoC Designer has a debug environment that provides hardware in-circuit emulation, allowing you to test the program in a physical system while providing an internal view of the PSoC device. Debugger commands allow you to read and program and read and write data memory, and read and write I/O registers. You can read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The debugger also lets you to create a trace buffer of registers and memory locations of interest. ■ Built-in support for communication interfaces: 2 ❐ Hardware and software I C slaves and masters ❐ Full-speed USB 2.0 ❐ Up to four full-duplex universal asynchronous receiver/transmitters (UARTs), SPI master and slave, and wireless PSoC Designer supports the entire library of PSoC 1 devices and runs on Windows XP, Windows Vista, and Windows 7. PSoC Designer Software Subsystems Design Entry In the chip-level view, choose a base device to work with. Then select different onboard analog and digital components that use the PSoC blocks, which are called user modules. Examples of user modules are analog-to-digital converters (ADCs), digital-to-analog converters (DACs), amplifiers, and filters. Configure the user modules for your chosen application and connect them to each other and to the proper pins. Then generate your project. This prepopulates your project with APIs and libraries that you can use to program your application. The tool also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic reconfiguration makes it possible to change configurations at run time. In essence, this lets you to use more than 100 percent of PSoC's resources for an application. Online Help System The online help system displays online, context-sensitive help. Designed for procedural and quick reference, each functional subsystem has its own context-sensitive help. This system also provides tutorials and links to FAQs and an Online Support Forum to aid the designer. In-Circuit Emulator A low-cost, high-functionality in-circuit emulator (ICE) is available for development support. This hardware can program single devices. The emulator consists of a base unit that connects to the PC using a USB port. The base unit is universal and operates with all PSoC devices. Emulation pods for each device family are available separately. The emulation pod takes the place of the PSoC device in the target board and performs full-speed (24 MHz) operation. Code Generation Tools The code generation tools work seamlessly within the PSoC Designer interface and have been tested with a full range Document Number: 001-49263 Rev. *J Page 15 of 58 CY8CLED16P01 7. Designing with PSoC Designer The development process for the PSoC device differs from that of a traditional fixed-function microprocessor. The configurable analog and digital hardware blocks give the PSoC architecture a unique flexibility that pays dividends in managing specification change during development and lowering inventory costs. These configurable resources, called PSoC blocks, have the ability to implement a wide variety of user-selectable functions. The PSoC development process is: 1. Select user modules. 2. Configure user modules. 3. Organize and connect. 4. Generate, verify, and debug. Select User Modules PSoC Designer provides a library of prebuilt, pretested hardware peripheral components called “user modules.” User modules make selecting and implementing peripheral devices, both analog and digital, simple. Configure User Modules Each user module that you select establishes the basic register settings that implement the selected function. They also provide parameters and properties that allow you to tailor their precise configuration to your particular application. For example, a PWM User Module configures one or more digital PSoC blocks, one for each eight bits of resolution. Using these parameters, you can establish the pulse width and duty cycle. Configure the parameters and properties to correspond to your chosen application. Enter values directly or by selecting values from drop-down menus. All of the user modules are documented in datasheets that may be viewed directly in PSoC Designer or on the Cypress website. These user module datasheets explain the internal operation of the user module and provide performance specifications. Each datasheet describes the use of each user module parameter, and other information that you may need to successfully implement your design. Document Number: 001-49263 Rev. *J Organize and Connect Build signal chains at the chip level by interconnecting user modules to each other and the I/O pins. Perform the selection, configuration, and routing so that you have complete control over all on-chip resources. Generate, Verify, and Debug When you are ready to test the hardware configuration or move on to developing code for the project, perform the “Generate Configuration Files” step. This causes PSoC Designer to generate source code that automatically configures the device to your specification and provides the software for the system. The generated code provides APIs with high-level functions to control and respond to hardware events at run time, and interrupt service routines that you can adapt as needed. A complete code development environment lets you to develop and customize your applications in C, assembly language, or both. The last step in the development process takes place inside PSoC Designer's Debugger (accessed by clicking the Connect icon). PSoC Designer downloads the HEX image to the ICE where it runs at full-speed. PSoC Designer debugging capabilities rival those of systems costing many times more. In addition to traditional single-step, run-to-breakpoint, and watch-variable features, the debug interface provides a large trace buffer. It lets you to define complex breakpoint events that include monitoring address and data bus values, memory locations, and external signals. Page 16 of 58 CY8CLED16P01 7.1 PLC User Modules ■ Powerline Transceiver (PLT) User Module (UM) enables data communication over powerlines up to baud rates of 2400 bps. This UM also exposes all the APIs from the network protocol for ease of application development. The UM, when instantiated, provides the user with three implementation modes: FSK Modem + Network Stack – This mode allows the user to use the Cypress network protocol for PLC and build any application with the APIs provided by the network protocol. ■ FSK Modem + Network Stack + I2C – This mode allows the user to interface the CY8CLEDP01 with any other microcontroller or PSoC device. Users can also split the application between the PLC device and the external microcontroller. If the external microcontroller is a PSoC device, then the I2C UMs can be used to interface it with the PLC device. ■ FSK Modem Only – This mode enables the user to use the raw FSK modem and build any network protocol or application with the help of the APIs generated by the modem PHY. Figure 7-1. shows the starting window for the PLT UM with the three implementation modes from which the user can choose. Figure 7-1. PLT User Module Refer to the application note AN55403 - "Estimating CY8CPLC20/CY8CLED16P01 Power Consumption" at http://www.cypress.com to determine the power consumption estimate of the CY8CLED16P01 chip with the PLT User Module, loaded along with the other User Modules. 7.6 Intelligent Lighting User Modules The CY8CLED16P01 has the intelligent lighting control user modules along with the PLC user modules. These user modules enable the user to do the following: ■ Control multiple channels, anywhere between 1 and 16. ■ Enable temperature compensation and color feedback ■ Provide algorithms for high CRI ■ Control color with 1931 or 1976 gamuts and through CCT ■ Provide additional communication interfaces such as DALI and DMX512 Document Number: 001-49263 Rev. *J Page 17 of 58 CY8CLED16P01 8. Pin Information The CY8CLED16P01 PLC device is available in a variety of packages which are listed and illustrated in the following tables. Every port pin (labeled with a “P”) is capable of Digital I/O. However, Vss, Vdd, and XRES are not capable of Digital I/O. 8.1 28-Pin Part Pinout Table 8-1. 28-Pin Part Pinout (SSOP) Pin No. 1 2 3 4 5 Type Digital Analog I/O I Reserved O I/O I O Pin Name Description P0[7] RSVD FSK_OUT P0[1] TX_SHUT DOWN Analog Column Mux Input Reserved Analog FSK Output Analog Column Mux Input Output to disable PLC transmit circuitry in receive mode Logic ‘0’ - When the Modem is transmitting Logic ‘1’ - When the Modem is not transmitting 6 7 8 9 10 11 12 I/O I/O I I/O I Reserved I/O I/O I/O P2[5] P2[3] P2[1] RSVD P1[7] P1[5] P1[3] 13 I/O P1[1] 14 15 I/O Vss P1[0] 16 17 I/O I/O P1[2] P1[4] 18 19 I/O Power O 21 I 22 Analog Ground 23 24 25 I/O Reserved I/O I/O 26 I/O I/O I Power A, I , P0[7] RSVD FSK_OUT A, I , P0[1] TX_ SHUTDOWN P2[5] A, I , P2[3] A , I,P2[1] RSVD I2C SCL, P1[7] I2C SDA, P1[5] P1[3] I2C SCL, XTALin, P1[1] Vss 1 2 3 4 5 6 7 8 9 10 11 12 13 14 SSOP 28 27 26 25 24 23 22 21 20 19 18 17 16 15 Vdd FSK_IN P0[4] , A , IO P0[2],A,IO RSVD P2[6] , External VREF AGND RXCOMP_IN RXCOMP_OUT XRES P1[6] P1[4] , EXTCLK P1[2] P1[0] , XTALout, I2C SDA Optional External Clock Input (EXTCLK)[2] P1[6] XRES Input 20 27 28 Direct switched capacitor block input Direct switched capacitor block input Reserved I2C Serial Clock (SCL) I2C Serial Data (SDA) XTAL_STABILITY. Connect a 0.1 µF capacitor between the pin and Vss. Crystal (XTALin)[2], ISSP-SCLK[1], I2C SCL Ground connection. Crystal (XTALout)[2], ISSP-SDATA[1], I2C SDA Figure 8-1. CY8CLED16P01 28-Pin PLC Device Active high external reset with internal pull down RXCOMP_ Analog Output to external Low Pass OUT Filter Circuitry RXCOMP_ Analog Input from the external Low IN Pass Filter Circuitry AGND Analog Ground. Connect a 1.0 µF capacitor between the pin and Vss. P2[6] External Voltage Reference (VREF) RSVD Reserved P0[2] Analog column mux input and column output P0[4] Analog column mux input and column output FSK_IN Analog FSK Input Vdd Supply Voltage LEGEND: A = Analog, I = Input, O = Output, and RSVD = Reserved (should be left unconnected). Notes 1. These are the ISSP pins, which are not High Z at POR (Power On Reset). See the PSoC Technical Reference Manual for details. 2. When using the PLT user module, the external crystal is always required for protocol timing. For the FSK modem, either the PLL Mode should be enabled or the external 24MHz on P1[4] should be selected. The IMO should not be used. Document Number: 001-49263 Rev. *J Page 18 of 58 CY8CLED16P01 8.2 48-Pin Part Pinout Table 8-2. 48-Pin Part Pinout (QFN )[3] 17 18 19 I/O Vss P1[0] I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O 30 31 32 33 34 I/O I/O I/O I/O P1[2] P1[4] P1[6] P5[0] P5[2] P3[0] P3[2] P3[4] P3[6] XRES Input O 35 I 36 Analog Ground 37 38 39 I/O 40 41 42 43 44 45 46 47 P4[0] P4[2] P4[4] P4[6] RXCOMP_ OUT RXCOMP_ IN AGND P2[6] RSVD Reserved Reserved I2C Serial Clock (SCL) I2C Serial Data (SDA) XTAL_STABILITY. Connect a 1.0 µF capacitor between the pin and Vss. Crystal (XTALin)[2], I2C Serial Clock (SCL), ISSP-SCLK[1] Ground connection. Crystal (XTALout)[2], I2C Serial Data (SDA), ISSP-SDATA[1] I/O I/O I P0[4] FSK_IN Vdd P0[7] RSVD FSK_OUT] P0[1] TX_SHUT DOWN Analog column mux input and column output Analog FSK Input Supply Voltage Analog column mux input Reserved Analog FSK Output Analog column mux input Output to disable transmit circuitry in receive mode Logic ‘0’ - When the Modem is transmitting Logic ‘1’ - When the Modem is not transmitting I/O O O I AGND RXCOMP_IN RXCOMP_ OUT P4[6] P4[4] P4[2] P4[0] XRES P3[6] P3[4] P3[2] P3[0] Analog Output to external Low Pass Filter Circuitry Analog Input from external Low Pass Filter Circuitry Analog Ground. Connect a 1.0 µF capacitor between the pin and Vss. External Voltage Reference (VREF) Reserved Analog column mux input and column output I QFN ( Top View) 36 35 34 33 32 31 30 29 28 27 26 25 Active high external reset with internal pull down P0[2] Reserved A , I , P2[3] 1 A , I , P2[1] 2 P4[7] 3 P4[5] 4 P4[3] 5 P4[1] 6 RSVD 7 P3[7] 8 P3[5] 9 P3[3] 10 P3[1] 11 P5[3] 12 Optional External Clock Input (EXTCLK)[2] I/O Power P2[5] TX_SHUTDOWN P0[1], A, I FSK_OUT RSVD P0[7], A, I Direct switched capacitor block input Direct switched capacitor block input I/O I/O Figure 8-2. CY8CLED16P01 48-Pin PLC Device Vdd FSK_IN P0[4], A, IO P0[2], A, IO RSVD P2[6], External VREF Description 48 47 46 45 44 43 42 41 40 39 38 37 P2[3] P2[1] P4[7] P4[5] P4[3] P4[1] RSVD P3[7] P3[5] P3[3] P3[1] P5[3] P5[1] P1[7] P1[5] P1[3] P1[1] Power 20 21 22 23 24 25 26 27 28 29 Pin Name 13 14 15 16 17 18 19 20 21 22 23 24 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Type Digital Analog I/O I I/O I I/O I/O I/O I/O Reserved I/O I/O I/O I/O I/O I/O I/O I/O I/O P5[1] I2C SCL, P1[7] I2C SDA, P1[5] P1[3] I2C SCL, XTALin, P1[1] Vss I2C SDA, XTALout, P1[0] P1[2] EXTCLK, P1[4] P1[6] P5[0] P5[2] Pin No. 48 I/O P2[5] LEGEND: A = Analog, I = Input, O = Output, and RSVD = Reserved (should be left unconnected). Note 3. The QFN package has a center pad that must be connected to ground (Vss). Document Number: 001-49263 Rev. *J Page 19 of 58 CY8CLED16P01 8.3 100-Pin Part Pinout (On-Chip Debug) The 100-pin TQFP part is for the CY8CLED16P01-OCD On-Chip Debug PLC device. Note that the OCD parts are only used for in-circuit debugging. OCD parts are not available for production. I/O O I NC NC P0[1] TX_SHUTD OWN No Connection No Connection Analog Column Mux Input Output to disable transmit circuitry in receive mode Logic ‘0’ - When the Modem is transmitting Logic ‘1’ - When the Modem is not transmitting Pin No. 51 52 53 54 Name NC P5[0] P5[2] P5[4] I/O I/O I/O 19 I/O P3[1] 69 I 20 I/O P5[7] 70 Ground 21 22 23 24 25 26 27 I/O I/O I/O I/O P5[5] P5[3] P5[1] P1[7] NC NC NC 71 72 73 74 75 76 77 I/O I/O P0[2] Analog column mux input and column output 28 29 I/O I/O P1[5] P1[3] 78 79 I/O I/O NC P0[4] 30 I/O P1[1] No Connection Analog column mux input and column output, VREF No Connection 45 46 47 48 49 50 Power Power I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O NC Vdd NC Vss NC P7[7] P7[6] P7[5] P7[4] P7[3] P7[2] P7[1] P7[0] P1[0] P1[2] P1[4] P1[6] NC NC NC OCD even data I/O OCD odd data output Reserved Ground Connection I2C Serial Clock (SCL) No Connection No Connection No Connection I2C Serial Data (SDA) XTAL_STABILITY. Connect a 0.1 uF capacitor between the pin and VSS. Crystal (XTALin)[2], I2C Serial Clock (SCL), TC SCLK No Connection Supply Voltage No Connection Ground Connection No Connection Crystal (XTALout)[2], I2C Serial Data (SDA), TC SDATA Optional External Clock Input (EXTCLK)[2] No Connection No Connection No Connection Input I/O I/O Power I/O I/O O I/O Reserved 80 P5[6] P3[0] P3[2] P3[4] P3[6] HCLK CCLK XRES P4[0] P4[2] Vss P4[4] P4[6] RXCOMP_OUT No Connection Reserved Power I/O I/O I/O Direct switched capacitor block input Direct switched capacitor block input I/O I/O I/O I/O I/O Description P2[5] P2[3] P2[1] P4[7] P4[5] P4[3] P4[1] OCDE OCDO RSVD Vss P3[7] P3[5] P3[3] I I 55 56 57 58 59 60 61 62 63 64 65 66 67 68 Analog Description Digital Name 5 6 7 8 9 10 11 12 13 14 15 16 17 18 31 32 33 34 35 36 37 38 39 40 41 42 43 44 I/O I/O I/O I/O I/O I/O I/O Analog Pin No. 1 2 3 4 Digital Table 8-3. 100-Pin OCD Part Pinout (TQFP) RXCOMP_IN AGND NC P2[6] NC RSVD NC NC NC 81 82 83 84 85 86 87 88 89 90 91 92 93 94 I Power Power Power Power I/O I/O I/O I/O I/O I/O I/O I/O 95 96 97 98 99 100 I/O I Reserved O OCD high speed clock output OCD CPU clock output Active high pin reset with internal pull down Ground Connection Analog Output to external Low Pass Filter Circuitry Analog Input from external Low Pass Filter Circuitry Analog Ground. Connect a 1.0 µF capacitor between the pin and Vss. No Connection External Voltage Reference (VREF) input No Connection Reserved No Connection No Connection FSK_IN Vdd Vdd Vss Vss P6[0] P6[1] P6[2] P6[3] P6[4] P6[5] P6[6] P6[7] NC Analog FSK Input Supply Voltage Supply Voltage Ground Connection Ground Connection P0[7] NC RSVD NC FSK_OUT NC Analog Column Mux Input No Connection Reserved No Connection Analog FSK Output No Connection No Connection LEGEND A = Analog, I = Input, O = Output, NC = No Connection, TC/TM: Test, TC/TM: Test, RSVD = Reserved (should be left unconnected). Document Number: 001-49263 Rev. *J Page 20 of 58 CY8CLED16P01 90 P6[4] 89 P6[3] 88 P6[2] 87 P6[1] 86 P6[0] 85 Vss 84 Vss 83 Vdd 82 Vdd 81 FSK_IN 80 NC 79 P0[4], A, IO 78 NC 77 P0[2], A, IO 76 NC 75 74 OCD TQFP 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 NC RSVD NC P2[6] , External VREF NC AGND RXCOMP_IN RXCOMP_ OUT P4[6] P4[4] Vss P4[2] P4[0] XRES CCLK HCLK P3[6] P3[4] P3[2] P3[0] P5[6] P5[4] P5[2] P5[0] NC NC NC 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 P7[7] P7[6] P7[5] P7[4] P7[3] P7[2] P7[1] P7[0] XTALout, I2C SDA, P1[0] P1[2] EXTCLK, P1[4] P1[6] NC 54 53 52 51 26 27 28 29 30 31 32 33 34 35 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 NC NC I2C SDA, P1[5] P1[3] XTALin, I2C SCL, P1[1] NC Vdd NC Vss NC NC NC AI , P0[1] TX_ SHUTDOWN P2[5] AI , P2[3] AI , P2[1] P4[7] P4[5] P4[3] P4[1] OCDE OCDO RSVD Vss P3[7] P3[5] P3[3] P3[1] P5[7] P5[5] P5[3] P5[1] I2 C SCL, P1[7] NC 100 NC 99 FSK_OUT 98 NC 97 RSVD 96 NC 95 P0[7], AI 94 NC 93 P6[7] 92 P6[6] 91 P6[5] Figure 8-3. CY8CLED16P01-OCD Not for Production Document Number: 001-49263 Rev. *J Page 21 of 58 CY8CLED16P01 9. Register Reference This section lists the registers of the CY8CLED16P01 PLC device. For detailed register information, refer to the PLC Technical Reference Manual. 9.1 Register Conventions The register conventions specific to this section are listed in the following table. Convention R 9.2 Register Mapping Tables The CY8CLEDP01 device has a total register address space of 512 bytes. The register space is referred to as I/O space and is divided into two banks. The XOI bit in the Flag register (CPU_F) determines which bank the user is currently in. When the XOI bit is set the user is in Bank 1. Note In the following register mapping tables, blank fields are reserved and should not be accessed. Description Read register or bit(s) W Write register or bit(s) L Logical register or bit(s) C Clearable register or bit(s) # Access is bit specific Document Number: 001-49263 Rev. *J Page 22 of 58 CY8CLED16P01 Table 9-1. Register Map Bank 0 Table: User Space Name Addr (0,Hex) Access Name PRT0DR 00 RW DBB20DR0 PRT0IE 01 RW DBB20DR1 PRT0GS 02 RW DBB20DR2 PRT0DM2 03 RW DBB20CR0 PRT1DR 04 RW DBB21DR0 PRT1IE 05 RW DBB21DR1 PRT1GS 06 RW DBB21DR2 PRT1DM2 07 RW DBB21CR0 PRT2DR 08 RW DCB22DR0 PRT2IE 09 RW DCB22DR1 PRT2GS 0A RW DCB22DR2 PRT2DM2 0B RW DCB22CR0 PRT3DR 0C RW DCB23DR0 PRT3IE 0D RW DCB23DR1 PRT3GS 0E RW DCB23DR2 PRT3DM2 0F RW DCB23CR0 PRT4DR 10 RW DBB30DR0 PRT4IE 11 RW DBB30DR1 PRT4GS 12 RW DBB30DR2 PRT4DM2 13 RW DBB30CR0 PRT5DR 14 RW DBB31DR0 PRT5IE 15 RW DBB31DR1 PRT5GS 16 RW DBB31DR2 PRT5DM2 17 RW DBB31CR0 PRT6DR 18 RW DCB32DR0 PRT6IE 19 RW DCB32DR1 PRT6GS 1A RW DCB32DR2 PRT6DM2 1B RW DCB32CR0 PRT7DR 1C RW DCB33DR0 PRT7IE 1D RW DCB33DR1 PRT7GS 1E RW DCB33DR2 PRT7DM2 1F RW DCB33CR0 DBB00DR0 20 # AMX_IN DBB00DR1 21 W DBB00DR2 22 RW DBB00CR0 23 # ARF_CR DBB01DR0 24 # CMP_CR0 DBB01DR1 25 W ASY_CR DBB01DR2 26 RW CMP_CR1 DBB01CR0 27 # DCB02DR0 28 # DCB02DR1 29 W DCB02DR2 2A RW DCB02CR0 2B # DCB03DR0 2C # TMP_DR0 DCB03DR1 2D W TMP_DR1 DCB03DR2 2E RW TMP_DR2 DCB03CR0 2F # TMP_DR3 DBB10DR0 30 # ACB00CR3 DBB10DR1 31 W ACB00CR0 DBB10DR2 32 RW ACB00CR1 DBB10CR0 33 # ACB00CR2 DBB11DR0 34 # ACB01CR3 DBB11DR1 35 W ACB01CR0 DBB11DR2 36 RW ACB01CR1 DBB11CR0 37 # ACB01CR2 DCB12DR0 38 # ACB02CR3 DCB12DR1 39 W ACB02CR0 DCB12DR2 3A RW ACB02CR1 DCB12CR0 3B # ACB02CR2 DCB13DR0 3C # ACB03CR3 DCB13DR1 3D W ACB03CR0 DCB13DR2 3E RW ACB03CR1 DCB13CR0 3F # ACB03CR2 Blank fields are Reserved and should not be accessed. Document Number: 001-49263 Rev. *J Addr (0,Hex) 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5D 5E 5F 60 61 62 63 64 65 66 67 68 69 6A 6B 6C 6D 6E 6F 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7D 7E 7F Access # W RW # # W RW # # W RW # # W RW # # W RW # # W RW # # W RW # # W RW # RW RW # # RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW Name ASC10CR0 ASC10CR1 ASC10CR2 ASC10CR3 ASD11CR0 ASD11CR1 ASD11CR2 ASD11CR3 ASC12CR0 ASC12CR1 ASC12CR2 ASC12CR3 ASD13CR0 ASD13CR1 ASD13CR2 ASD13CR3 ASD20CR0 ASD20CR1 ASD20CR2 ASD20CR3 ASC21CR0 ASC21CR1 ASC21CR2 ASC21CR3 ASD22CR0 ASD22CR1 ASD22CR2 ASD22CR3 ASC23CR0 ASC23CR1 ASC23CR2 ASC23CR3 Addr (0,Hex) 80 81 82 83 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 A4 A5 A6 A7 MUL1_X A8 MUL1_Y A9 MUL1_DH AA MUL1_DL AB ACC1_DR1 AC ACC1_DR0 AD ACC1_DR3 AE ACC1_DR2 AF RDI0RI B0 RDI0SYN B1 RDI0IS B2 RDI0LT0 B3 RDI0LT1 B4 RDI0RO0 B5 RDI0RO1 B6 B7 RDI1RI B8 RDI1SYN B9 RDI1IS BA RDI1LT0 BB RDI1LT1 BC RDI1RO0 BD RDI1RO1 BE BF # Access is bit specific. Access RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW W W R R RW RW RW RW RW RW RW RW RW RW RW Name RDI2RI RDI2SYN RDI2IS RDI2LT0 RDI2LT1 RDI2RO0 RDI2RO1 RDI3RI RDI3SYN RDI3IS RDI3LT0 RDI3LT1 RDI3RO0 RDI3RO1 CUR_PP STK_PP IDX_PP MVR_PP MVW_PP I2C_CFG I2C_SCR I2C_DR I2C_MSCR INT_CLR0 INT_CLR1 INT_CLR2 INT_CLR3 INT_MSK3 INT_MSK2 INT_MSK0 INT_MSK1 INT_VC RES_WDT DEC_DH DEC_DL DEC_CR0 DEC_CR1 MUL0_X MUL0_Y MUL0_DH MUL0_DL ACC0_DR1 ACC0_DR0 ACC0_DR3 ACC0_DR2 CPU_F RW RW RW RW RW RW RW CPU_SCR1 CPU_SCR0 Addr (0,Hex) C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF Access RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW # RW # RW RW RW RW RW RW RW RW RC W RC RC RW RW W W R R RW RW RW RW RL # # Page 23 of 58 CY8CLED16P01 Table 9-2. Register Map Bank 1 Table: Configuration Space Name PRT0DM0 PRT0DM1 PRT0IC0 PRT0IC1 PRT1DM0 PRT1DM1 PRT1IC0 PRT1IC1 PRT2DM0 PRT2DM1 PRT2IC0 PRT2IC1 PRT3DM0 PRT3DM1 PRT3IC0 PRT3IC1 PRT4DM0 PRT4DM1 PRT4IC0 PRT4IC1 PRT5DM0 PRT5DM1 PRT5IC0 PRT5IC1 PRT6DM0 PRT6DM1 PRT6IC0 PRT6IC1 PRT7DM0 PRT7DM1 Addr (1,Hex) 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D Access RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW Name DBB20FN DBB20IN DBB20OU DBB21FN DBB21IN DBB21OU DCB22FN DCB22IN DCB22OU DCB23FN DCB23IN DCB23OU DBB30FN DBB30IN DBB30OU DBB31FN DBB31IN DBB31OU DCB32FN DCB32IN DCB32OU DCB33FN DCB33IN PRT7IC0 PRT7IC1 DBB00FN DBB00IN DBB00OU 1E RW DCB33OU 1F RW 20 RW CLK_CR0 21 RW CLK_CR1 22 RW ABF_CR0 23 AMD_CR0 DBB01FN 24 RW DBB01IN 25 RW DBB01OU 26 RW AMD_CR1 27 ALT_CR0 DCB02FN 28 RW ALT_CR1 DCB02IN 29 RW CLK_CR2 DCB02OU 2A RW 2B DCB03FN 2C RW TMP_DR0 DCB03IN 2D RW TMP_DR1 DCB03OU 2E RW TMP_DR2 2F TMP_DR3 DBB10FN 30 RW ACB00CR3 DBB10IN 31 RW ACB00CR0 DBB10OU 32 RW ACB00CR1 33 ACB00CR2 DBB11FN 34 RW ACB01CR3 DBB11IN 35 RW ACB01CR0 DBB11OU 36 RW ACB01CR1 37 ACB01CR2 DCB12FN 38 RW ACB02CR3 DCB12IN 39 RW ACB02CR0 DCB12OU 3A RW ACB02CR1 3B ACB02CR2 DCB13FN 3C RW ACB03CR3 DCB13IN 3D RW ACB03CR0 DCB13OU 3E RW ACB03CR1 3F ACB03CR2 Blank fields are Reserved and should not be accessed. Document Number: 001-49263 Rev. *J Addr (1,Hex) 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5D Access Name RW ASC10CR0 RW ASC10CR1 RW ASC10CR2 ASC10CR3 RW ASD11CR0 RW ASD11CR1 RW ASD11CR2 ASD11CR3 RW ASC12CR0 RW ASC12CR1 RW ASC12CR2 ASC12CR3 RW ASD13CR0 RW ASD13CR1 RW ASD13CR2 ASD13CR3 RW ASD20CR0 RW ASD20CR1 RW ASD20CR2 ASD20CR3 RW ASC21CR0 RW ASC21CR1 RW ASC21CR2 ASC21CR3 RW ASD22CR0 RW ASD22CR1 RW ASD22CR2 ASD22CR3 RW ASC23CR0 RW ASC23CR1 5E 5F 60 61 62 63 64 65 66 67 68 69 6A 6B 6C 6D 6E 6F 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7D 7E 7F RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW ASC23CR2 ASC23CR3 Addr (1,Hex) 80 81 82 83 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF RDI0RI B0 RDI0SYN B1 RDI0IS B2 RDI0LT0 B3 RDI0LT1 B4 RDI0RO0 B5 RDI0RO1 B6 B7 RDI1RI B8 RDI1SYN B9 RDI1IS BA RDI1LT0 BB RDI1LT1 BC RDI1RO0 BD RDI1RO1 BE BF # Access is bit specific. Access RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW Name RDI2RI RDI2SYN RDI2IS RDI2LT0 RDI2LT1 RDI2RO0 RDI2RO1 RDI3RI RDI3SYN RDI3IS RDI3LT0 RDI3LT1 RDI3RO0 RDI3RO1 GDI_O_IN GDI_E_IN GDI_O_OU GDI_E_OU OSC_GO_E N OSC_CR4 OSC_CR3 OSC_CR0 OSC_CR1 OSC_CR2 VLT_CR VLT_CMP DEC_CR2 IMO_TR ILO_TR BDG_TR ECO_TR RW RW RW RW RW RW RW CPU_F RW RW RW RW RW RW RW FLS_PR1 CPU_SCR1 CPU_SCR0 Addr (1,Hex) C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD Access RW RW RW RW RW RW RW DE DF E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF RW RW RW RW RW RW R RW RW RW RW RW RW RW RW RW RW RW RW RW W W RW W RL RW # # Page 24 of 58 CY8CLED16P01 10. Electrical Specifications This section presents the DC and AC electrical specifications of the CY8CLED16P01 device. For the most up to date electrical specifications, confirm that you have the most recent data sheet by going to the web at http://www.cypress.com. Specifications are valid for -40°C TA 85°C and TJ 100°C, except where noted. 10.1 Absolute Maximum Ratings Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested. Table 10-1. Absolute Maximum Ratings Symbol TSTG Description Storage Temperature TBAKETEMP Bake Temperature Min –55 Typ 25 Max +100 Units °C – 125 C See package label –40 – See package label 72 Hours – +85 °C V V mA mA TBAKETIME Bake Time TA Vdd VIO Ambient Temperature with Power Applied Supply Voltage on Vdd Relative to Vss DC Input Voltage –0.5 Vss – 0.5 – – VIOZ DC Voltage Applied to Tristate Vss – 0.5 – IMIO IMAIO Maximum Current into any Port Pin Maximum Current into any Port Pin Configured as Analog Driver Electro Static Discharge Voltage Latch-up Current –25 -50 – – +6.0 Vdd + 0.5 Vdd + 0.5 +50 +50 2000 – – – – 200 V mA Typ – – Max +85 +100 Units C C ESD LU Notes Higher storage temperatures reduce data retention time. Recommended storage temperature is +25°C ± 25°C. Extended duration storage temperatures above 65°C degrade reliability. V Human Body Model ESD 10.2 Operating Temperature Table 10-2. Operating Temperature Symbol TA TJ Description Ambient Temperature Junction Temperature Document Number: 001-49263 Rev. *J Min -40 -40 Notes The temperature rise from ambient to junction is package specific. See Thermal Impedances on page 46.The user must limit the power consumption to comply with this requirement. Page 25 of 58 CY8CLED16P01 10.3 DC Electrical Characteristics 10.3.1 DC Chip-Level Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C. Typical parameters apply to 5V at 25°C and are for design guidance only. Table 10-3. DC Chip-Level Specifications Symbol Description Vdd Supply Voltage IDD Supply Current Min 4.75 – Typ – 8 Max 5.25 14 Units V mA VREF 1.28 1.3 1.32 V Reference Voltage (Bandgap) Notes Conditions are 5.0V, TA = 25°C, CPU = 3 MHz, SYSCLK doubler disabled, VC1 = 1.5 MHz, VC2 = 93.75 kHz, VC3 = 0.366 kHz. Trimmed for appropriate Vdd. 10.3.2 DC GPIO Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature range: 4.75V to 5.25V and -40°C TA 85°C. Typical parameters apply to 5V at 25°C and are for design guidance only. Table 10-4. DC GPIO Specifications Symbol RPU RPD VOH Description Pull Up Resistor Pull Down Resistor High Output Level Min 4 4 Vdd 1.0 Typ 5.6 5.6 – Max 8 8 – Units k k V VOL Low Output Level – – 0.75 V IOH High Level Source Current 10 – – mA IOL Low Level Sink Current 25 – – mA VIL VIH VH IIL CIN COUT Input Low Level Input High Level Input Hysterisis Input Leakage (Absolute Value) Capacitive Load on Pins as Input Capacitive Load on Pins as Output – 2.1 – – – – – – 60 1 3.5 3.5 0.8 V V mV nA pF pF Document Number: 001-49263 Rev. *J – – 10 10 Notes IOH = 10 mA, (8 total loads, 4 on even port pins (for example, P0[2], P1[4]), 4 on odd port pins (for example, P0[3], P1[5])). 80 mA maximum combined IOH budget. IOL = 25 mA, (8 total loads, 4 on even port pins (for example, P0[2], P1[4]), 4 on odd port pins (for example, P0[3], P1[5])). 150 mA maximum combined IOL budget. VOH = Vdd-1.0V. See the limitations of the total current in the Note for VOH. VOL = 0.75V. See the limitations of the total current in the Note for VOL. Gross tested to 1 A. Package and pin dependent. Temp = 25°C. Package and pin dependent. Temp = 25°C. Page 26 of 58 CY8CLED16P01 10.3.3 DC Operational Amplifier Specifications The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C. Typical parameters apply to 5V at 25°C and are for design guidance only. The Operational Amplifier is a component of both the Analog Continuous Time PSoC blocks and the Analog Switched Capacitor PSoC blocks. The guaranteed specifications are measured in the Analog Continuous Time PSoC block. Typical parameters apply to 5V at 25°C and are for design guidance only. Table 10-5. 5-V DC Operational Amplifier Specifications Symbol Min Typ Max Unit Input offset voltage (absolute value) Power = Low, Opamp bias = Low Power = Low, Opamp bias = High Power = Medium, Opamp bias = Low Power = Medium, Opamp bias = High Power = High, Opamp bias = Low Power = High, Opamp bias = High – – – – – – 1.6 1.6 1.6 1.6 1.6 1.6 10 10 10 10 10 10 mV mV mV mV mV mV TCVOSOA Average input offset voltage drift – 4 23 µV/°C I VOSOA Description Notes EBOA Input leakage current (port 0 analog pins) – 200 – pA Gross tested to 1 µA CINOA Input capacitance (port 0 analog pins) – 4.5 9.5 pF Package and pin dependent. Temp = 25 °C V Common mode voltage range (All cases, except Power = High, Opamp bias = High) 0 – VDD V Common mode voltage range (Power = High, Opamp bias = High) 0.5 – VDD – 0.5 V The common-mode input voltage range is measured through an analog output buffer. The specification includes the limitations imposed by the characteristics of the analog output buffer. CMRROA Common mode rejection ratio 60 – – dB GOLOA Open loop gain CMOA 80 – – dB VDD – 0.01 – – V – – 0.1 V Supply current (including associated AGND buffer) Power = Low, Opamp bias = Low Power = Low, Opamp bias = High Power = Medium, Opamp bias = Low Power = Medium, Opamp bias = High Power = High, Opamp bias = Low Power = High, Opamp bias = High – – – – – – 150 300 600 1200 2400 4600 200 400 800 1600 3200 6400 µA µA µA µA µA µA Supply voltage rejection ratio 67 80 – dB VOHIGHOA High output voltage swing (internal signals) VOLOWOA Low output voltage swing (internal signals) ISOA PSRROA VSS VIN (VDD – 2.25) or (VDD – 1.25 V) VIN VDD. 10.3.4 DC Low Power Comparator Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C. Typical parameters apply to 5V at 25°C and are for design guidance only. Table 10-6. DC Low Power Comparator Specifications Symbol Description VREFLPC Low Power Comparator (LPC) Reference Voltage Range LPC Supply Current ISLPC VOSLPC LPC Voltage Offset Document Number: 001-49263 Rev. *J Min 0.2 Typ – Max Vdd - 1 Units V – – 10 2.5 40 30 A mV Notes Page 27 of 58 CY8CLED16P01 10.3.5 DC Analog Output Buffer Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C. Typical parameters apply to 5V at 25°C and are for design guidance only. Table 10-7. DC Analog Output Buffer Specifications Symbol CL VOSOB TCVOSOB VCMOB ROUTOB VOHIGHOB VOLOWOB ISOB PSRROB Description Load capacitance Input Offset Voltage (Absolute Value) Power = Low, Opamp bias = Low Power = Low, Opamp bias = High Power = High, Opamp bias = Low Power = High, Opamp bias = High Average Input Offset Voltage Drift Common-Mode Input Voltage Range Output Resistance Power = Low Power = High High Output Voltage Swing (Load = 32 ohms to Vdd/2) Power = Low Power = High Low Output Voltage Swing (Load = 32 ohms to Vdd/2) Power = Low Power = High Supply Current Including Bias Cell (No Load) Power = Low Power = High Supply Voltage Rejection Ratio Document Number: 001-49263 Rev. *J Min – Typ – Max 200 Units pF – – – – – 0.5 3.2 3.2 3.2 3.2 5.5 – 18 18 18 18 26 Vdd - 1.0 mV mV mV mV V/°C V – – – – 1 1 W W 0.5 × Vdd + 1.3 0.5 × Vdd + 1.3 – – – – V V – – – – 0.5 × Vdd - 1.3 0.5 × Vdd - 1.3 V V – – 40 1.1 2.6 64 2 5 – mA mA dB Notes This specification applies to the external circuit driven by the analog output buffer. Page 28 of 58 CY8CLED16P01 10.3.6 DC Analog Reference Specifications Table 10-8 lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C. Typical parameters apply to 5V at 25°C and are for design guidance only. The guaranteed specifications are measured through the Analog Continuous Time PSoC blocks. The power levels for AGND refer to the power of the Analog Continuous Time PSoC block. The power levels for RefHi and RefLo refer to the Analog Reference Control register. The limits stated for AGND include the offset error of the AGND buffer local to the Analog Continuous Time PSoC block. Reference control power is high. Note Avoid using P2[4] for digital signaling when using an analog resource that depends on the Analog Reference. Some coupling of the digital signal may appear on the AGND. Table 10-8. 5-V DC Analog Reference Specifications Reference ARF_CR[5:3] Reference Power Settings Symbol Reference Description Min RefPower = High Opamp bias = High VREFHI Ref High VDD/2 + Bandgap VDD/2 + 1.228 VDD/2 + 1.290 VDD/2 + 1.352 VAGND AGND VDD/2 VDD/2 – 0.078 VDD/2 – 0.007 VDD/2 + 0.063 V VREFLO Ref Low VDD/2 – Bandgap VDD/2 – 1.336 VDD/2 – 1.295 VDD/2 – 1.250 V VREFHI Ref High VDD/2 + Bandgap VDD/2 + 1.224 VDD/2 + 1.293 VDD/2 + 1.356 V VAGND AGND VDD/2 VDD/2 – 0.056 VDD/2 – 0.005 VDD/2 + 0.043 V VREFLO Ref Low VDD/2 – Bandgap VDD/2 – 1.338 VDD/2 – 1.298 VDD/2 – 1.255 V VREFHI Ref High VDD/2 + Bandgap VDD/2 + 1.226 VDD/2 + 1.293 VDD/2 + 1.356 V VAGND AGND VDD/2 VDD/2 – 0.057 VDD/2 – 0.006 VDD/2 + 0.044 V RefPower = High Opamp bias = Low 0b000 RefPower = Med Opamp bias = High RefPower = Med Opamp bias = Low Typ Max Unit V VREFLO Ref Low VDD/2 – Bandgap VDD/2 – 1.337 VDD/2 – 1.298 VDD/2 – 1.256 V VREFHI Ref High VDD/2 + Bandgap VDD/2 + 1.226 VDD/2 + 1.294 VDD/2 + 1.359 V VAGND AGND VDD/2 VDD/2 – 0.047 VDD/2 – 0.004 VDD/2 + 0.035 V VREFLO Ref Low VDD/2 – Bandgap VDD/2 – 1.338 VDD/2 – 1.299 VDD/2 – 1.258 V Document Number: 001-49263 Rev. *J Page 29 of 58 CY8CLED16P01 Table 10-8. 5-V DC Analog Reference Specifications (continued) Reference ARF_CR[5:3] Reference Power Settings Symbol Reference RefPower = High Opamp bias = High VREFHI Ref High RefPower = High Opamp bias = Low 0b001 RefPower = Med Opamp bias = High RefPower = Med Opamp bias = Low RefPower = High Opamp bias = High RefPower = High Opamp bias = Low 0b010 RefPower = Med Opamp bias = High RefPower = Med Opamp bias = Low Description P2[4] + P2[6] (P2[4] = VDD/2, P2[6] = 1.3 V) Min Typ Max Unit P2[4] + P2[6] – 0.085 P2[4] + P2[6] – 0.016 P2[4] + P2[6] + 0.044 V P2[4] P2[4] VAGND AGND VREFLO Ref Low P2[4] – P2[6] (P2[4] = VDD/2, P2[6] = 1.3 V) P2[4] – P2[6] – 0.022 P2[4] – P2[6] + P2[4] – P2[6] + 0.010 0.055 V VREFHI Ref High P2[4] + P2[6] (P2[4] = VDD/2, P2[6] = 1.3 V) P2[4] + P2[6] – 0.077 P2[4] + P2[6] – 0.010 P2[4] + P2[6] + 0.051 V P2[4] P2[4] P2[4] P2[4] – VAGND AGND VREFLO Ref Low P2[4] – P2[6] (P2[4] = VDD/2, P2[6] = 1.3 V) P2[4] – P2[6] – 0.022 P2[4] – P2[6] + P2[4] – P2[6] + 0.005 0.039 V VREFHI Ref High P2[4] + P2[6] (P2[4] = VDD/2, P2[6] = 1.3 V) P2[4] + P2[6] – 0.070 P2[4] + P2[6] – 0.010 P2[4] + P2[6] + 0.050 V VAGND AGND P2[4] P2[4] P2[4] – VREFLO Ref Low P2[4] – P2[6] (P2[4] = VDD/2, P2[6] = 1.3 V) P2[4] – P2[6] – 0.022 P2[4] – P2[6] + P2[4] – P2[6] + 0.005 0.039 V VREFHI Ref High P2[4] + P2[6] (P2[4] = VDD/2, P2[6] = 1.3 V) P2[4] + P2[6] – 0.070 P2[4] + P2[6] – 0.007 P2[4] + P2[6] + 0.054 V P2[4] P2[4] P2[4] P2[4] VAGND AGND VREFLO Ref Low P2[4] – P2[6] (P2[4] = VDD/2, P2[6] = 1.3 V) VREFHI Ref High VDD VAGND AGND P2[4] VDD/2 P2[4] P2[4] P2[4] – P2[6] – 0.022 P2[4] – P2[6] + P2[4] – P2[6] + 0.002 0.032 – – V VDD – 0.037 VDD – 0.009 VDD V VDD/2 – 0.061 VDD/2 – 0.006 VDD/2 + 0.047 V VREFLO Ref Low VSS VSS VSS + 0.007 VSS + 0.028 V VREFHI Ref High VDD VDD – 0.039 VDD – 0.006 VDD V VAGND AGND VDD/2 – 0.049 VDD/2 – 0.005 VDD/2 + 0.036 V VDD/2 VREFLO Ref Low VSS VSS VSS + 0.005 VSS + 0.019 V VREFHI Ref High VDD VDD – 0.037 VDD – 0.007 VDD V VAGND AGND VDD/2 – 0.054 VDD/2 – 0.005 VDD/2 + 0.041 V VDD/2 VREFLO Ref Low VSS VSS VSS + 0.006 VSS + 0.024 V VREFHI Ref High VDD VDD – 0.042 VDD – 0.005 VDD V VDD/2 – 0.046 VDD/2 – 0.004 VDD/2 + 0.034 V VSS VSS + 0.004 VSS + 0.017 V VAGND AGND VREFLO Ref Low Document Number: 001-49263 Rev. *J VDD/2 VSS Page 30 of 58 CY8CLED16P01 Table 10-8. 5-V DC Analog Reference Specifications (continued) Reference ARF_CR[5:3] Reference Power Settings Symbol Reference RefPower = High Opamp bias = High VREFHI Ref High 3 × Bandgap RefPower = High Opamp bias = Low 0b011 RefPower = Med Opamp bias = High RefPower = Med Opamp bias = Low RefPower = High Opamp bias = High RefPower = High Opamp bias = Low 0b100 RefPower = Med Opamp bias = High RefPower = Med Opamp bias = Low Description Min Typ Max Unit 3.788 3.891 3.986 V VAGND AGND 2 × Bandgap 2.500 2.604 3.699 V VREFLO Ref Low Bandgap 1.257 1.306 1.359 V VREFHI Ref High 3 × Bandgap 3.792 3.893 3.982 V 2 × Bandgap 2.518 2.602 2.692 V Bandgap 1.256 1.302 1.354 V VAGND AGND VREFLO Ref Low VREFHI Ref High 3 × Bandgap 3.795 3.894 3.993 V VAGND AGND 2 × Bandgap 2.516 2.603 2.698 V VREFLO Ref Low Bandgap 1.256 1.303 1.353 V VREFHI Ref High 3 × Bandgap 3.792 3.895 3.986 V VAGND AGND 2 × Bandgap 2.522 2.602 2.685 V VREFLO Ref Low Bandgap 1.255 1.301 1.350 V VREFHI Ref High 2 × Bandgap + P2[6] (P2[6] = 1.3 V) 2.495 – P2[6] 2.586 – P2[6] 2.657 – P2[6] V VAGND AGND 2.502 2.604 2.719 V VREFLO Ref Low 2 × Bandgap – P2[6] (P2[6] = 1.3 V) 2.531 – P2[6] 2.611 – P2[6] 2.681 – P2[6] V VREFHI Ref High 2 × Bandgap + P2[6] (P2[6] = 1.3 V) 2.500 – P2[6] 2.591 – P2[6] 2.662 – P2[6] V 2 × Bandgap VAGND AGND 2.519 2.602 2.693 V VREFLO Ref Low 2 × Bandgap – P2[6] (P2[6] = 1.3 V) 2.530 – P2[6] 2.605 – P2[6] 2.666 – P2[6] V VREFHI Ref High 2 × Bandgap + P2[6] (P2[6] = 1.3 V) 2.503 – P2[6] 2.592 – P2[6] 2.662 – P2[6] V 2 × Bandgap VAGND AGND 2.517 2.603 2.698 V VREFLO Ref Low 2 × Bandgap – P2[6] (P2[6] = 1.3 V) 2.529 – P2[6] 2.606 – P2[6] 2.665 – P2[6] V VREFHI Ref High 2 × Bandgap + P2[6] (P2[6] = 1.3 V) 2.505 – P2[6] 2.594 – P2[6] 2.665 – P2[6] V VAGND AGND 2.525 2.602 2.685 V VREFLO Ref Low 2.528 – P2[6] 2.603 – P2[6] 2.661 – P2[6] V Document Number: 001-49263 Rev. *J 2 × Bandgap 2 × Bandgap 2 × Bandgap – P2[6] (P2[6] = 1.3 V) Page 31 of 58 CY8CLED16P01 Table 10-8. 5-V DC Analog Reference Specifications (continued) Reference ARF_CR[5:3] Reference Power Settings Symbol Reference RefPower = High Opamp bias = High VREFHI Ref High VAGND AGND VREFLO Ref Low VREFHI Ref High RefPower = High Opamp bias = Low 0b101 RefPower = Med Opamp bias = High RefPower = Med Opamp bias = Low RefPower = High Opamp bias = High RefPower = High Opamp bias = Low 0b110 RefPower = Med Opamp bias = High RefPower = Med Opamp bias = Low RefPower = High Opamp bias = High RefPower = High Opamp bias = Low 0b111 RefPower = Med Opamp bias = High RefPower = Med Opamp bias = Low Description Min Typ Max Unit P2[4] + 1.222 P2[4] + 1.290 P2[4] + 1.343 V P2[4] P2[4] P2[4] – P2[4] – Bandgap (P2[4] = VDD/2) P2[4] – 1.331 P2[4] – 1.295 P2[4] – 1.254 V P2[4] + Bandgap (P2[4] = VDD/2) P2[4] + 1.226 P2[4] + 1.293 P2[4] + 1.347 V P2[4] + Bandgap (P2[4] = VDD/2) P2[4] VAGND AGND P2[4] P2[4] P2[4] – VREFLO Ref Low P2[4] – Bandgap (P2[4] = VDD/2) P2[4] P2[4] – 1.331 P2[4] – 1.298 P2[4] – 1.259 V VREFHI Ref High P2[4] + Bandgap (P2[4] = VDD/2) P2[4] + 1.227 P2[4] + 1.294 P2[4] + 1.347 V VAGND AGND P2[4] P2[4] P2[4] – VREFLO Ref Low P2[4] – Bandgap (P2[4] = VDD/2) P2[4] P2[4] – 1.331 P2[4] – 1.298 P2[4] – 1.259 V VREFHI Ref High P2[4] + Bandgap (P2[4] = VDD/2) P2[4] + 1.228 P2[4] + 1.295 P2[4] + 1.349 V VAGND AGND P2[4] P2[4] P2[4] – VREFLO Ref Low P2[4] – 1.332 P2[4] – 1.299 P2[4] – 1.260 V VREFHI Ref High VAGND AGND P2[4] P2[4] – Bandgap (P2[4] = VDD/2) 2 × Bandgap 2.535 2.598 2.644 V Bandgap 1.227 1.305 1.398 V V VREFLO Ref Low VSS VSS VSS + 0.009 VSS + 0.038 VREFHI Ref High 2 × Bandgap 2.530 2.598 2.643 V VAGND AGND Bandgap 1.244 1.303 1.370 V V VREFLO Ref Low VSS VSS VSS + 0.005 VSS + 0.024 VREFHI Ref High 2 × Bandgap 2.532 2.598 2.644 V VAGND AGND Bandgap 1.239 1.304 1.380 V VREFLO Ref Low VSS VSS VSS + 0.006 VSS + 0.026 V VREFHI Ref High 2 × Bandgap 2.528 2.598 2.645 V Bandgap 1.249 1.302 1.362 V VSS VSS + 0.004 VSS + 0.018 V 4.155 4.234 V VAGND AGND VREFLO Ref Low VSS VREFHI Ref High 3.2 × Bandgap 4.041 1.6 × Bandgap 1.998 2.083 2.183 V VSS VSS + 0.010 VSS + 0.038 V 4.153 4.236 V VAGND AGND VREFLO Ref Low VSS VREFHI Ref High 3.2 × Bandgap 4.047 1.6 × Bandgap 2.012 2.082 2.157 V VSS VSS + 0.006 VSS + 0.024 V VAGND AGND VREFLO Ref Low VREFHI Ref High 3.2 × Bandgap 4.049 4.154 4.238 V VAGND AGND 1.6 × Bandgap 2.008 2.083 2.165 V VREFLO Ref Low VSS VSS + 0.006 VSS + 0.026 V VREFHI Ref High 3.2 × Bandgap 4.047 4.154 4.238 V VAGND AGND 1.6 × Bandgap 2.016 2.081 2.150 V VREFLO Ref Low VSS VSS + 0.004 VSS + 0.018 V Document Number: 001-49263 Rev. *J VSS VSS VSS Page 32 of 58 CY8CLED16P01 10.3.7 DC Analog PSoC Block Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C. Typical parameters apply to 5V at 25°C and are for design guidance only. Table 10-9. DC Analog PSoC Block Specifications Symbol RCT CSC Description Resistor Unit Value (Continuous Time) Capacitor Unit Value (Switch Cap) Min – – Typ 12.2 80 Max – – Units k fF Notes 10.3.8 DC POR and LVD Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C = TA = 85°C. Typical parameters apply to 5V at 25°C and are for design guidance only. Table 10-10. DC POR and LVD Specifications Symbol Description Vdd Value for PPOR Trip (positive ramp) VPPOR2R PORLEV[1:0] = 10b Min Typ Max Units – 4.55 – V VPPOR2 Vdd Value for PPOR Trip (negative ramp) PORLEV[1:0] = 10b – 4.55 – V VPH2 PPOR Hysteresis PORLEV[1:0] = 10b – 0 – mV VLVD6 VLVD7 Vdd Value for LVD Trip VM[2:0] = 110b VM[2:0] = 111b 4.63 4.72 4.73 4.81 4.82 4.91 V V Document Number: 001-49263 Rev. *J Notes Page 33 of 58 CY8CLED16P01 10.3.9 DC Programming Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C. Typical parameters apply to 5V at 25°C and are for design guidance only. Table 10-11. DC Programming Specifications Symbol VDDP Description VDD for programming and erase Min 4.5 Typ 5 Max 5.5 Units V VDDLV Low VDD for verify 4.7 4.8 4.9 V VDDHV High VDD for verify 5.1 5.2 5.3 V VDDIWRITE Supply voltage for flash write operation 4.75 5,0 5.25 V IDDP VILP 10 – 30 0.8 mA V – – V – 0.2 mA – 1.5 mA – V – Vss + 0.75 Vdd FlashENPB Supply Current During Programming or Verify – Input Low Voltage During Programming or – Verify Input High Voltage During Programming or 2.2 Verify Input Current when Applying VILP to P1[0] or – P1[1] During Programming or Verify Input Current when Applying VIHP to P1[0] or – P1[1] During Programming or Verify Output Low Voltage During Programming or – Verify Output High Voltage During Programming or Vdd - 1.0 Verify Flash Endurance (per block) 50,000 – – – FlashENT FlashDR Flash Endurance (total)[5] Flash Data Retention – – – – – Years VIHP IILP IIHP VOLV VOHV 1,800,000 10 Notes This specification applies to the functional requirements of external programmer tools. This specification applies to the functional requirements of external programmer tools. This specification applies to the functional requirements of external programmer tools. This specification applies to this device when it is executing internal flash writes. Driving internal pull down resistor Driving internal pull down resistor V Erase/write cycles per block Erase/write cycles DC I2C Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C. Typical parameters apply to 5V at 25°C and are for design guidance only. Table 10-12. DC I2C Specifications Parameter VILI2C[4] VIHI2C[4] Description Min Typ Max Units Notes Input low level – – 0.25 × VDD V 4.75 V VDD 5.25 V Input high level 0.7 × VDD – – V 4.75 V VDD 5.25 V Note 4. All GPIOs meet the DC GPIO VIL and VIH specifications found in the DC GPIO specifications sections.The I2C GPIO pins also meet the mentioned specs. Document Number: 001-49263 Rev. *J Page 34 of 58 CY8CLED16P01 10.4 AC Electrical Characteristics 10.4.1 AC Chip-Level Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C. Typical parameters apply to 5V at 25°C and are for design guidance only. Note See the individual user module data sheets for information on maximum frequencies for user modules. Table 10-13. AC Chip-Level Specifications Symbol FIMO24 Description Internal Main Oscillator Frequency for 24 MHz Min 23.4 Typ 24 Max 24.6 Units MHz FIMO6 Internal Main Oscillator Frequency for 6 MHz 5.5 6 6.5[6] MHz FCPU1 F48M CPU Frequency (5V Nominal) Digital PSoC Block Frequency 0.0914 0 24 48 24.6[6] 49.2[6, 7] MHz MHz F32K1 F32K2 Internal Low Speed Oscillator Frequency External Crystal Oscillator 15 – 32 32.768 64 – kHz kHz F32K_U Internal Low Speed Oscillator (ILO) Untrimmed Frequency 5 – 100 kHz FPLL PLL Frequency – 23.986 – MHz TPLLSLEW TPLLSLEWLOW TOS TOSACC PLL Lock Time PLL Lock Time for Low Gain Setting External Crystal Oscillator Startup to 1% External Crystal Oscillator Startup to 100 ppm 0.5 0.5 – – – – 250 300 10 50 500 600 ms ms ms ms TXRST External Reset Pulse Width SRPOWER_UP Power Supply Slew Rate 10 – – – – 250 s V/ms TPOWERUP Time from End of POR to CPU Executing Code – 16 100 ms DC24M 24 MHz Duty Cycle 40 50 60 % Notes Trimmed for 5V operation using factory trim values. SLIMO Mode = 0. Trimmed for 5V operation using factory trim values. SLIMO Mode = 1. SLIMO Mode = 0. Refer to the AC Digital Block Specifications below. Accuracy is capacitor and crystal dependent. 50% duty cycle. After a reset and before the m8c starts to run, the ILO is not trimmed. See the System Resets section of the PSoC Technical Reference Manual for details on timing this. A multiple (x732) of crystal frequency. The crystal oscillator frequency is within 100 ppm of its final value by the end of the TOSACC period. Correct operation assumes a properly loaded 1 W maximum drive level 32.768 kHz crystal. -40°C TA 85°C. Vdd slew rate during power up. Power up from 0V. See the System Resets section of the PSoC Technical Reference Manual. Notes 5. A maximum of 36 x 50,000 block endurance cycles is allowed. This may be balanced between operations on 36x1 blocks of 50,000 maximum cycles each, 36x2 blocks of 25,000 maximum cycles each, or 36x4 blocks of 12,500 maximum cycles each (to limit the total number of cycles to 36x50,000 and that no single block ever sees more than 50,000 cycles). For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing. Refer to the Flash APIs Application Note AN2015 at http://www.cypress.com under Application Notes for more information. 6. Accuracy derived from Internal Main Oscillator with appropriate trim for Vdd range. 7. See the individual user module data sheets for information on maximum frequencies for user modules. 8. Refer to Cypress Jitter Specifications application note, Understanding Datasheet Jitter Specifications for Cypress Timing Products – AN5054 for more information. Document Number: 001-49263 Rev. *J Page 35 of 58 CY8CLED16P01 Table 10-13. AC Chip-Level Specifications (continued) Symbol DCILO Step24M Fout48M Description Internal Low Speed Oscillator Duty Cycle 24 MHz Trim Step Size 48 MHz Output Frequency FMAX Maximum frequency of signal on row input or row output. 24 MHz IMO cycle-to-cycle jitter (RMS) 24 MHz IMO long term N cycle-to-cycle jitter (RMS) 24 MHz IMO period jitter (RMS) 24 MHz IMO cycle-to-cycle jitter (RMS) 24 MHz IMO long term N cycle-to-cycle jitter (RMS) 24 MHz IMO period jitter (RMS) tjit_IMO [8] tjit_PLL [8] Min 20 – 46.8 Typ 50 50 48.0 Max 80 – 49.2 Units % kHz MHz Notes – – 12.3 MHz – – 200 300 700 900 ps ps N = 32 – – – 100 200 300 400 800 1200 ps ps ps N = 32 – 100 700 ps Trimmed using factory trim values. Figure 10-1. PLL Lock Timing Diagram PLL Enable TPLLSLEW 24 MHz FPLL PLL Gain 0 Figure 10-2. PLL Lock for Low Gain Setting Timing Diagram PLL Enable TPLLSLEWLOW 24 MHz FPLL PLL Gain 1 Figure 10-3. External Crystal Oscillator Startup Timing Diagram 32K Select 32 kHz TOS F32K2 Document Number: 001-49263 Rev. *J Page 36 of 58 CY8CLED16P01 10.4.2 AC GPIO Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C. Typical parameters apply to 5V at 25°C and are for design guidance only. Table 10-14. AC GPIO Specifications Symbol FGPIO TRiseF TFallF TRiseS TFallS Description GPIO Operating Frequency Rise Time, Normal Strong Mode, Cload = 50 pF Fall Time, Normal Strong Mode, Cload = 50 pF Rise Time, Slow Strong Mode, Cload = 50 pF Fall Time, Slow Strong Mode, Cload = 50 pF Min 0 3 2 10 10 Typ – – – 27 22 Max 12.3 18 18 – – Units MHz ns ns ns ns Notes Normal Strong Mode 10% - 90% 10% - 90% 10% - 90% 10% - 90% Figure 10-4. GPIO Timing Diagram 90% GPIO Pin Output Voltage 10% TRiseF TRiseS TFallF TFallS 10.4.3 AC Operational Amplifier Specifications Table 10-15 lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C. Typical parameters apply to 5V at 25°C and are for design guidance only. Settling times, slew rates, and gain bandwidth are based on the Analog Continuous Time PSoC block. Table 10-15. 5V AC Operational Amplifier Specifications Symbol TROA TSOA SRROA SRFOA Description Rising Settling Time to 0.1% for a 1V Step (10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High Falling Settling Time to 0.1% for a 1V Step (10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High Rising Slew Rate (20% to 80%) of a 1V Step (10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High Falling Slew Rate (20% to 80%) of a 1V Step (10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High Document Number: 001-49263 Rev. *J Min Typ Max Units – – – – – – 3.9 0.72 0.62 s s s – – – – – – 5.9 0.92 0.72 s s s 0.15 1.7 6.5 – – – – – – V/s V/s V/s 0.01 0.5 4.0 – – – – – – V/s V/s V/s Notes Page 37 of 58 CY8CLED16P01 Table 10-15. 5V AC Operational Amplifier Specifications (continued) Symbol BWOA ENOA Description Gain Bandwidth Product Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High Noise at 1 kHz (Power = Medium, Opamp Bias = High) Min Typ Max Units 0.75 3.1 5.4 – – – – 100 – – – – MHz MHz MHz nV/rt-Hz Notes When bypassed by a capacitor on P2[4], the noise of the analog ground signal distributed to each block is reduced by a factor of up to 5 (14 dB). This is at frequencies above the corner frequency defined by the on-chip 8.1k resistance and the external capacitor. Figure 10-5. Typical AGND Noise with P2[4] Bypass nV/rtHz 10000 0 0.01 0.1 1.0 10 1000 100 0.001 0.01 0.1 Freq (kHz) 1 10 100 At low frequencies, the opamp noise is proportional to 1/f, power independent, and determined by device geometry. At high frequencies, increased power level reduces the noise spectrum level. Figure 10-6. Typical Opamp Noise nV/rtHz 10000 PH_BH PH_BL PM_BL PL_BL 1000 100 10 0.001 0.01 Document Number: 001-49263 Rev. *J 0.1 Freq (kHz) 1 10 100 Page 38 of 58 CY8CLED16P01 10.4.4 AC Low Power Comparator Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C. Typical parameters apply to 5V at 25°C and are for design guidance only. Table 10-16. AC Low Power Comparator Specifications Symbol TRLPC Description LPC response time Min – Typ – Max 50 Units s Notes 50 mV overdrive comparator reference set within VREFLPC. 10.4.5 AC Digital Block Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C. Typical parameters apply to 5V at 25°C and are for design guidance only. Table 10-17. AC Digital Block Specifications Function Description All functions Block input clock frequency Timer Input clock frequency VDD 4.75 V Max Unit – – 49.2 MHz No capture, VDD 4.75 V – – 49.2 MHz – – 24.6 MHz 50[9] – – ns – – 49.2 MHz – – 24.6 MHz 50[9] – – ns Notes Input clock frequency No enable input, VDD 4.75 V With enable input Enable input pulse width Dead Band Typ With capture Capture pulse width Counter Min Kill pulse width Asynchronous restart mode 20 – – ns Synchronous restart mode 50[9] – – ns Disable mode 50[9] – – ns – – 49.2 MHz Input clock frequency VDD 4.75 V CRCPRS (PRS Mode) Input clock frequency – – 49.2 MHz CRCPRS (CRC Mode) Input clock frequency – – 24.6 MHz SPIM Input clock frequency – – 8.2 MHz The SPI serial clock (SCLK) frequency is equal to the input clock frequency divided by 2 SPIS Input clock (SCLK) frequency – – 4.1 MHz The input clock is the SPI SCLK in SPIS mode – – ns VDD 4.75 V Width of SS_negated between transmissions Transmitter Receiver 50 [9] Input clock frequency VDD 4.75 V, 2 stop bits – – 49.2 MHz VDD 4.75 V, 1 stop bit – – 24.6 MHz Input clock frequency VDD 4.75 V, 2 stop bits – – 49.2 MHz VDD 4.75 V, 1 stop bit – – 24.6 MHz The baud rate is equal to the input clock frequency divided by 8 The baud rate is equal to the input clock frequency divided by 8 Note 9. 50 ns minimum input pulse width is based on the input synchronizers running at 24 MHz (42 ns nominal period). Document Number: 001-49263 Rev. *J Page 39 of 58 CY8CLED16P01 10.4.6 AC Analog Output Buffer Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C. Typical parameters apply to 5V at 25°C and are for design guidance only. Table 10-18. 5V AC Analog Output Buffer Specifications Symbol TROB TSOB SRROB SRFOB BWOB BWOB Description Rising Settling Time to 0.1%, 1V Step, 100 pF Load Power = Low Power = High Falling Settling Time to 0.1%, 1V Step, 100 pF Load Power = Low Power = High Rising Slew Rate (20% to 80%), 1V Step, 100 pF Load Power = Low Power = High Falling Slew Rate (80% to 20%), 1V Step, 100 pF Load Power = Low Power = High Small Signal Bandwidth, 20mVpp, 3 dB BW, 100 pF Load Power = Low Power = High Large Signal Bandwidth, 1Vpp, 3 dB BW, 100 pF Load Power = Low Power = High Min Typ Max Units – – – – 4 4 s s – – – – 3.4 3.4 s s 0.5 0.5 – – – – V/s V/s 0.55 0.55 – – – – V/s V/s 0.8 0.8 – – – – MHz MHz 300 300 – – – – kHz kHz Notes 10.4.7 AC External Clock Specifications The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C. Typical parameters apply to 5V at 25°C and are for design guidance only. Table 10-19. 5V AC External Clock Specifications Symbol Description Min Typ Max Units 0.093 – 24.6 MHz High Period 20.6 – 5300 ns Low Period 20.6 – – ns Power Up IMO to Switch 150 – – µs FOSCEXT Frequency – – – Document Number: 001-49263 Rev. *J Notes Page 40 of 58 CY8CLED16P01 10.4.8 AC Programming Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C. Typical parameters apply to 5V at 25°C and are for design guidance only. Table 10-20. AC Programming Specifications Symbol TRSCLK TFSCLK TSSCLK THSCLK FSCLK TERASEB TWRITE TDSCLK TERASEALL Description Rise Time of SCLK Fall Time of SCLK Data Setup Time to Falling Edge of SCLK Data Hold Time from Falling Edge of SCLK Frequency of SCLK Flash Erase Time (Block) Flash Block Write Time Data Out Delay from Falling Edge of SCLK Flash Erase Time (Bulk) TPROGRAM_HOT Flash Block Erase + Flash Block Write Time TPROGRAM_COLD Flash Block Erase + Flash Block Write Time Document Number: 001-49263 Rev. *J Min 1 1 40 40 0 – – – – Typ – – – – – 10 40 – 80 Max 20 20 – – 8 – – 45 – Units ns ns ns ns MHz ms ms ns ms – – – – 100[10] 200[10] ms ms Notes Erase all Blocks and protection fields at once 0°C <= Tj <= 100°C -40°C <= Tj <= 0°C Page 41 of 58 CY8CLED16P01 10.4.9 AC I2C Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C. Typical parameters apply to 5V at 25°C and are for design guidance only. Table 10-21. AC Characteristics of the I2C SDA and SCL Pins Symbol FSCLI2C THDSTAI2C TLOWI2C THIGHI2C TSUSTAI2C THDDATI2C TSUDATI2C TSUSTOI2C TBUFI2C TSPI2C Description SCL Clock Frequency Hold Time (repeated) START Condition. After this period, the first clock pulse is generated. LOW Period of the SCL Clock HIGH Period of the SCL Clock Setup Time for a Repeated START Condition Data Hold Time Data Setup Time Setup Time for STOP Condition Bus Free Time Between a STOP and START Condition Pulse Width of spikes are suppressed by the input filter Standard-Mode Min Max 0 100 4.0 – Fast-Mode Min Max 0 400 0.6 – Units Notes kHz s 4.7 4.0 4.7 0 250 4.0 4.7 – – – – – – – 1.3 0.6 0.6 0 100[11] 0.6 1.3 – – – – – – – s s s s ns s s – – 0 50 ns Figure 10-7. Definition for Timing for Fast-/Standard-Mode on the I2C Bus Packaging Dimensions I2C_SDA TSUDATI2C THDSTAI2C TSPI2C THDDATI2CTSUSTAI2C TBUFI2C I2C_SCL THIGHI2C TLOWI2C S START Condition TSUSTOI2C Sr Repeated START Condition P S STOP Condition Notes 10. For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing. Refer to the Flash APIs Application Note AN2015 at http://www.cypress.com for more information. 11. A Fast-Mode I2C-bus device can be used in a Standard-Mode I2C-bus system, but the requirement tSU;DAT 250 ns must then be met. This is automatically the case if the device does not stretch the LOW period of the SCL signal. If this device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released. Document Number: 001-49263 Rev. *J Page 42 of 58 CY8CLED16P01 11. Packaging Information This section illustrates the packaging specifications for the CY8CLED16P01 PLC device, along with the thermal impedances for each package, and the typical package capacitance on crystal pins. Note Emulation tools may require a larger area on the target PCB than the chip's footprint. For a detailed description of the emulation tools' dimensions, refer to the Emulator Pod Dimension drawings at http://www.cypress.com. 11.1 Packaging Dimensions Figure 11-1. 28-Pin (210-Mil) SSOP 51-85079 *E Document Number: 001-49263 Rev. *J Page 43 of 58 CY8CLED16P01 Figure 11-2. 48-Pin (7 × 7 mm) QFN SOLDERABLE EXPOSED PAD 001-12919 *C Important Note For information on the preferred dimensions for mounting QFN packages, refer to Application Note, "Application Notes for Surface Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages" available at http://www.amkor.com. Pinned vias for thermal conduction are not required for the low power PSoC devices. Document Number: 001-49263 Rev. *J Page 44 of 58 CY8CLED16P01 Figure 11-3. 48-Pin QFN 7x7x 0.90 MM (Sawn Type) 001-13191 *E Figure 11-4. 100-Pin TQFP 51-85048 *E Document Number: 001-49263 Rev. *J Page 45 of 58 CY8CLED16P01 11.1 Thermal Impedances Table 11-1. Thermal Impedances per Package Package Typical JA[12] Typical JC 28 SSOP 59 °C/W 23 C/W [13] 15 °C/W 18 C/W 100 TQFP 42 °C/W 15 C/W 48 QFN 11.2 Capacitance on Crystal Pins Table 11-2. Typical Package Capacitance on Crystal Pins Package Package Capacitance 28 SSOP 2.8 pF 48 QFN 1.8 pF 100 TQFP 3.1 pF 11.3 Solder Reflow Peak Temperature Following is the minimum solder reflow peak temperature to achieve good solderability. Table 11-3. Solder Reflow Peak Temperature Package Maximum Peak Temperature Time at Maximum Peak Temperature 28 SSOP 260 °C 20 s 48 QFN 260 °C 20 s 100 TQFP 260 °C 20 s Notes 12. TJ = TA + POWER × JA 13. To achieve the thermal impedance specified for the QFN package, refer to "Application Notes for Surface Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages" available at http://www.amkor.com. Document Number: 001-49263 Rev. *J Page 46 of 58 CY8CLED16P01 12. Development Tool Selection 12.1 Software ■ CY8CLED16P01-OCD (100 TQFP) 12.1.1 PSoC Designer™ ■ Software CD At the core of the PSoC development software suite is PSoC Designer, used to generate firmware applications. PSoC Designer is available free of charge at http://www.cypress.com. PSoC Designer comes with a free C compiler. ■ Supporting Literature ■ MiniProg1 12.1.2 PSoC Programmer The CY3250-PLC Pod Kits are essential for development purposes as they provide the users a medium to emulate and debug their designs. The pod kits are available for all the available footprints. The details are: PSoC Programmer is a very flexible programming application. It is used on the bench in development and is also suitable for factory programming. PSoC Programmer works either in a standalone configuration or operates directly from PSoC Designer. PSoC Programmer software is compatible with both PSoC ICE Cube In-Circuit Emulator and PSoC MiniProg. PSoC programmer is available free of charge at http://www.cypress.com. 12.2.3 CY3250-PLC Pod Kits ■ CY3250-LED16P01NQ – One SSOP Pod (CY8CLED16P01-OCD), Two 28-SSOP Feet, One 3250-Flex Cable, One 28-SSOP Foot Mask ■ CY3250-LED16P01QFN – One QFN Pod (CY8CLED16P01-OCD), Two 48-QFN Feet, One 3250-Flex Cable ■ CY3250-LED16P01NQ-POD – Two SSOP Pods (CY8CLED16P01-OCD) ■ CY3250-LED16P01QFN-POD – Two QFN Pods (CY8CLED16P01-OCD) 12.2 Development Kits All development kits are sold at the Cypress Online Store. 12.2.1 CY3276-Programmable HV PLC + EZ-Color™ Development Kit The CY3276 is used for prototyping and development on the CY8CLED16P01 with PSoC Designer. This kit supports in-circuit emulation. The software interface enables users to run, halt, and single-step the processor and view the content of specific memory locations. PSoC Designer also supports the advanced emulation features. The hardware contains the high voltage coupling circuit for 110 VAC to 240 VAC powerline, which is compliant with the CENELEC/FCC standards. This board also has an onboard switch mode power supply. The kit includes: ■ 12.2.4 CY3215-DK Basic Development Kit The CY3215-DK is used for prototyping and development with PSoC Designer. This kit can be used in conjunction with the PLC kits to support in-circuit emulation. The software interface enables users to run, halt, and single step the processor and view the content of specific memory locations. PSoC Designer also supports the advanced emulation features. The kit includes: One High Voltage (110 to 230VAC) PLC Board. Cypress recommends that a user purchases two CY3276 kits to set up a two-node PLC subsystem for evaluation and development. ■ PSoC Designer Software CD ■ ICE-Cube In-Circuit Emulator ■ LED Daughter Card ■ ICE Flex-Pod for CY8C29x66 Family ■ CY8CLED16P01-OCD (100 TQFP) ■ Cat-5 Adapter ■ Software CD ■ Mini-Eval Programming Board ■ Supporting Literature ■ 110 ~ 240V Power Supply, Euro-Plug Adapter ■ MiniProg1 ■ iMAGEcraft C Compiler (Registration Required) ■ ISSP Cable ■ USB 2.0 Cable and Blue Cat-5 Cable ■ 2 CY8C29466-24PXI 28-PDIP Chip Samples 12.2.2 CY3277-Programmable LV PLC + EZ-Color Development Kit The CY3277-PLC is used for prototyping and development on the CY8CLED16P01 with PSoC Designer. This kit supports in-circuit emulation. The software interface enables users to run, halt, and single-step the processor and view the content of specific memory locations. PSoC Designer also supports advanced emulation features. The hardware contains the low voltage coupling circuit for 12-24V AC/DC powerline. The kit includes: ■ One Low Voltage (12 to 24V AC/DC) PLC Board. Cypress recommends that a user purchases two CY3275 kits to set up a two-node PLC subsystem for evaluation and development ■ LED Daughter Card Document Number: 001-49263 Rev. *J Page 47 of 58 CY8CLED16P01 12.3 Evaluation Kits 12.4 Device Programmers The evaluation kits do not have on-board powerline capability, but can be used with a PLC kit for evaluation purposes. All evaluation tools are sold at the Cypress Online Store. All device programmers are sold at the Cypress. 12.3.1 CY3210-MiniProg1 The CY3210-MiniProg1 kit enables the user to program PSoC devices via the MiniProg1 programming unit. The MiniProg is a small, compact prototyping programmer that connects to the PC via a provided USB 2.0 cable. The kit includes: 12.4.1 CY3216 Modular Programmer The CY3216 Modular Programmer kit features a modular programmer and the MiniProg1 programming unit. The modular programmer includes three programming module cards and supports multiple Cypress products. The kit includes: ■ Modular Programmer Base ■ MiniProg Programming Unit ■ Three Programming Module Cards ■ MiniEval Socket Programming and Evaluation Board ■ MiniProg Programming Unit ■ 28-Pin CY8C29466-24PXI PDIP PSoC Device Sample ■ PSoC Designer Software CD ■ 28-Pin CY8C27443-24PXI PDIP PSoC Device Sample ■ Getting Started Guide ■ PSoC Designer Software CD ■ USB 2.0 Cable ■ Getting Started Guide 12.4.2 CY3207 ISSP In-System Serial Programmer (ISSP) ■ USB 2.0 Cable The CY3207ISSP is a production programmer. It includes protection circuitry and an industrial case that is more robust than the MiniProg in a production programming environment. 12.3.2 CY3210-PSoCEval1 The CY3210-PSoCEval1 kit features an evaluation board and the MiniProg1 programming unit. The evaluation board includes an LCD module, potentiometer, LEDs, and plenty of bread boarding space to meet all of your evaluation needs. The kit includes: Note that CY3207ISSP needs special software and is not compatible with PSoC Programmer. The kit includes: ■ ■ CY3207 Programmer Unit ■ PSoC ISSP Software CD Evaluation Board with LCD Module ■ 110 ~ 240V Power Supply, Euro-Plug Adapter ■ MiniProg Programming Unit ■ USB 2.0 Cable ■ 28-Pin CY8C29466-24PXI PDIP PSoC Device Sample (2) ■ PSoC Designer Software CD ■ Getting Started Guide ■ USB 2.0 Cable 12.3.3 CY3214-PSoCEvalUSB The CY3214-PSoCEvalUSB evaluation kit features a development board for the CY8C24794-24LFXI PSoC device. Special features of the board include both USB and capacitive sensing development and debugging support. This evaluation board also includes an LCD module, potentiometer, LEDs, an enunciator, and plenty of bread boarding space to meet all of your evaluation needs. The kit includes: ■ PSoCEvalUSB Board ■ LCD Module ■ MIniProg Programming Unit ■ Mini USB Cable ■ PSoC Designer and Example Projects CD ■ Getting Started Guide ■ Wire Pack Document Number: 001-49263 Rev. *J Page 48 of 58 CY8CLED16P01 13. Ordering Information The following table lists the CY8CLED16P01 PLC device family key package features and ordering codes. RAM (Bytes) Temperature Range Digital PSoC Blocks Analog PSoC Blocks Digital I/O Pins Analog Inputs Analog Outputs XRES Pin CY8CLED16P01-28PVXI 32 K 2K –40 °C to +85 °C 16 12 24 12 4 Yes 28-Pin (210-Mil) SSOP (Tape and Reel) CY8CLED16P01-28PVXIT 32 K 2K –40 °C to +85 °C 16 12 24 12 4 Yes 48-Pin QFN[14] CY8CLED16P01-48LFXI 32 K 2K –40 °C to +85 °C 16 12 44 12 4 Yes 48-Pin QFN (Sawn) CY8CLED16P01-48LTXI 32 K 2K –40 °C to +85 °C 16 12 44 12 4 Yes 48-Pin QFN (Sawn) (Tape and Reel) CY8CLED16P01-48LTXIT 32 K 2K –40 °C to +85 °C 16 12 44 12 4 Yes 100-Pin OCD TQFP[15] CY8CLED16P01-OCD 32 K 2K –40 °C to +85 °C 16 12 64 12 4 Yes Ordering Code 28-Pin (210-Mil) SSOP Package Flash (Bytes) Table 13-1. CY8CLED16P01 PLC Device Key Features and Ordering Information 13.1 Ordering Code Definitions CY 8 C LED 16 P01- PC xxx Package Type: PVX = SSOP Pb-Free LFX/LTX = QFN Pb-Free Pin Count: 28/48 Powerline Communication capability with Programmability Family Code: HB LED Controllers with 16 Channels Technology Code: C = CMOS Marketing Code: 8 = Cypress PSoC Company ID: CY = Cypress Note 14. Not recommended for new designs. 15. This part may be used for in-circuit debugging. It is not available for production. Document Number: 001-49263 Rev. *J Page 49 of 58 CY8CLED16P01 14. Acronyms 14.1 Acronyms Used Table 14-1 lists the acronyms that are used in this document. Table 14-1. Acronyms Used in this Datasheet Acronym Description Acronym Description AC alternating current MCU microcontroller unit ADC analog-to-digital converter MIPS million instructions per second API application programming interface OCD on-chip debug BIU band-in-use PCB printed circuit board CMOS complementary metal oxide semiconductor PDIP plastic dual-in-line package CPU central processing unit PGA programmable gain amplifier CRC cyclic redundancy check PLC powerline communication CSMA carrier sense multiple access PLL phase-locked loop CT continuous time PLT powerline transceiver DAC digital-to-analog converter POR power on reset DC direct current PPOR precision power on reset DTMF dual-tone multi-frequency PRS pseudo-random sequence ECO external crystal oscillator PSoC® Programmable System-on-Chip EEPROM electrically erasable programmable read-only memory PWM pulse width modulator FSK frequency-shift keying QFN quad flat no leads GPIO general-purpose I/O RTC real time clock I/O input/output SAR successive approximation ICE in-circuit emulator SC switched capacitor IDE integrated development environment SLIMO slow IMO ILO internal low speed oscillator SPITM serial peripheral interface IMO internal main oscillator SRAM static random access memory IrDA infrared data association SROM supervisory read only memory ISSP in-system serial programming SSOP shrink small-outline package LCD liquid crystal display TQFP thin quad flat pack LED light-emitting diode UART universal asynchronous reciever / transmitter LPC low power comparator USB universal serial bus LPF low pass filter WDT watchdog timer LVD low voltage detect XRES external reset MAC multiply-accumulate Document Number: 001-49263 Rev. *J Page 50 of 58 CY8CLED16P01 15. Reference Documents CY8CPLC20, CY8CLED16P01, CY8C29x66, CY8C27x43, CY8C24x94, CY8C24x23, CY8C24x23A, CY8C22x13, CY8C21x34, CY8C21x23, CY7C64215, CY7C603xx, CY8CNP1xx, and CYWUSB6953 PSoC® Programmable System-on-Chip Technical Reference Manual (TRM) (001-14463) Design Aids – Reading and Writing PSoC® Flash – AN2015 (001-40459) Understanding Datasheet Jitter Specifications for Cypress Timing Products – AN5054 (001-14503) Estimating CY8CPLC20/CY8CLED16P01 Power Consumption – AN55403 (001-55403) PSoC Dynamic Reconfiguration – AN2104 (001-36000) Analog – ADC Selection – AN2239 (001-33719) PrISM™ Technology for LED Dimming – AN47372 (001-47372) Application Notes for Surface Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages – available at http://www.amkor.com. 16. Document Conventions Units of Measure Table 16-1 lists the unit sof measures. Table 16-1. Units of Measure Symbol kB dB C fF kHz k MHz µA µF µs µV µW mA mm Unit of Measure 1024 bytes decibels degree Celsius femto farad kilohertz kilohm megahertz microampere microfarad microsecond microvolts microwatts milliampere millimeter Symbol ms mV nA ns nV ppm % pF ps pA rt-Hz V W Unit of Measure millisecond millivolts nanoampere nanosecond nanovolts parts per million percent picofarad picosecond pikoampere root hertz volts watt Numeric Conventions Hexadecimal numbers are represented with all letters in uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or ‘3Ah’). Hexadecimal numbers may also be represented by a ‘0x’ prefix, the C coding convention. Binary numbers have an appended lowercase ‘b’ (for example, 01010100b’ or ‘01000011b’). Numbers not indicated by an ‘h’, ‘b’, or 0x are decimals. Document Number: 001-49263 Rev. *J Page 51 of 58 CY8CLED16P01 17. Glossary active high 1. A logic signal having its asserted state as the logic 1 state. 2. A logic signal having the logic 1 state as the higher voltage of the two states. analog blocks The basic programmable opamp circuits. These are SC (switched capacitor) and CT (continuous time) blocks. These blocks can be interconnected to provide ADCs, DACs, multi-pole filters, gain stages, and much more. analog-to-digital (ADC) A device that changes an analog signal to a digital signal of corresponding magnitude. Typically, an ADC converts a voltage to a digital number. The digital-to-analog (DAC) converter performs the reverse operation. Application programming interface (API) A series of software routines that comprise an interface between a computer application and lower level services and functions (for example, user modules and libraries). APIs serve as building blocks for programmers that create software applications. asynchronous A signal whose data is acknowledged or acted upon immediately, irrespective of any clock signal. bandgap reference A stable voltage reference design that matches the positive temperature coefficient of VT with the negative temperature coefficient of VBE, to produce a zero temperature coefficient (ideally) reference. bandwidth 1. The frequency range of a message or information processing system measured in hertz. 2. The width of the spectral region over which an amplifier (or absorber) has substantial gain (or loss); it is sometimes represented more specifically as, for example, full width at half maximum. bias 1. A systematic deviation of a value from a reference value. 2. The amount by which the average of a set of values departs from a reference value. 3. The electrical, mechanical, magnetic, or other force (field) applied to a device to establish a reference level to operate the device. block 1. A functional unit that performs a single function, such as an oscillator. 2. A functional unit that may be configured to perform one of several functions, such as a digital PSoC block or an analog PSoC block. buffer 1. A storage area for data that is used to compensate for a speed difference, when transferring data from one device to another. Usually refers to an area reserved for IO operations, into which data is read, or from which data is written. 2. A portion of memory set aside to store data, often before it is sent to an external device or as it is received from an external device. 3. An amplifier used to lower the output impedance of a system. bus 1. A named connection of nets. Bundling nets together in a bus makes it easier to route nets with similar routing patterns. 2. A set of signals performing a common function and carrying similar data. Typically represented using vector notation; for example, address[7:0]. 3. One or more conductors that serve as a common connection for a group of related devices. clock The device that generates a periodic signal with a fixed frequency and duty cycle. A clock is sometimes used to synchronize different logic blocks. comparator An electronic circuit that produces an output voltage or current whenever two input levels simultaneously satisfy predetermined amplitude requirements. Document Number: 001-49263 Rev. *J Page 52 of 58 CY8CLED16P01 17. Glossary (continued) compiler A program that translates a high level language, such as C, into machine language. configuration space In PSoC devices, the register space accessed when the XIO bit, in the CPU_F register, is set to ‘1’. crystal oscillator An oscillator in which the frequency is controlled by a piezoelectric crystal. Typically a piezoelectric crystal is less sensitive to ambient temperature than other circuit components. cyclic redundancy A calculation used to detect errors in data communications, typically performed using a linear check (CRC) feedback shift register. Similar calculations may be used for a variety of other purposes such as data compression. data bus A bi-directional set of signals used by a computer to convey information from a memory location to the central processing unit and vice versa. More generally, a set of signals used to convey data between digital functions. debugger A hardware and software system that allows you to analyze the operation of the system under development. A debugger usually allows the developer to step through the firmware one step at a time, set break points, and analyze memory. dead band A period of time when neither of two or more signals are in their active state or in transition. digital blocks The 8-bit logic blocks that can act as a counter, timer, serial receiver, serial transmitter, CRC generator, pseudo-random number generator, or SPI. digital-to-analog (DAC) A device that changes a digital signal to an analog signal of corresponding magnitude. The analogto-digital (ADC) converter performs the reverse operation. duty cycle The relationship of a clock period high time to its low time, expressed as a percent. emulator Duplicates (provides an emulation of) the functions of one system with a different system, so that the second system appears to behave like the first system. External Reset (XRES) An active high signal that is driven into the PSoC device. It causes all operation of the CPU and blocks to stop and return to a pre-defined state. Flash An electrically programmable and erasable, non-volatile technology that provides you the programmability and data storage of EPROMs, plus in-system erasability. Non-volatile means that the data is retained when power is OFF. Flash block The smallest amount of Flash ROM space that may be programmed at one time and the smallest amount of Flash space that may be protected. A Flash block holds 64 bytes. frequency The number of cycles or events per unit of time, for a periodic function. gain The ratio of output current, voltage, or power to input current, voltage, or power, respectively. Gain is usually expressed in dB. I2C A two-wire serial computer bus by Philips Semiconductors (now NXP Semiconductors). I2C is an Inter-Integrated Circuit. It is used to connect low-speed peripherals in an embedded system. The original system was created in the early 1980s as a battery control interface, but it was later used as a simple internal bus system for building control electronics. I2C uses only two bi-directional pins, clock and data, both running at +5V and pulled high with resistors. The bus operates at 100 kbits/second in standard mode and 400 kbits/second in fast mode. Document Number: 001-49263 Rev. *J Page 53 of 58 CY8CLED16P01 17. Glossary (continued) ICE The in-circuit emulator that allows you to test the project in a hardware environment, while viewing the debugging device activity in a software environment (PSoC Designer). input/output (I/O) A device that introduces data into or extracts data from a system. interrupt A suspension of a process, such as the execution of a computer program, caused by an event external to that process, and performed in such a way that the process can be resumed. interrupt service routine (ISR) A block of code that normal code execution is diverted to when the M8C receives a hardware interrupt. Many interrupt sources may each exist with its own priority and individual ISR code block. Each ISR code block ends with the RETI instruction, returning the device to the point in the program where it left normal program execution. jitter 1. A misplacement of the timing of a transition from its ideal position. A typical form of corruption that occurs on serial data streams. 2. The abrupt and unwanted variations of one or more signal characteristics, such as the interval between successive pulses, the amplitude of successive cycles, or the frequency or phase of successive cycles. low-voltage detect A circuit that senses VDD and provides an interrupt to the system when VDD falls lower than a selected threshold. (LVD) M8C An 8-bit Harvard-architecture microprocessor. The microprocessor coordinates all activity inside a PSoC by interfacing to the Flash, SRAM, and register space. master device A device that controls the timing for data exchanges between two devices. Or when devices are cascaded in width, the master device is the one that controls the timing for data exchanges between the cascaded devices and an external interface. The controlled device is called the slave device. microcontroller An integrated circuit chip that is designed primarily for control systems and products. In addition to a CPU, a microcontroller typically includes memory, timing circuits, and IO circuitry. The reason for this is to permit the realization of a controller with a minimal quantity of chips, thus achieving maximal possible miniaturization. This in turn, reduces the volume and the cost of the controller. The microcontroller is normally not used for general-purpose computation as is a microprocessor. mixed-signal The reference to a circuit containing both analog and digital techniques and components. modulator A device that imposes a signal on a carrier. noise 1. A disturbance that affects a signal and that may distort the information carried by the signal. 2. The random variations of one or more characteristics of any entity such as voltage, current, or data. oscillator A circuit that may be crystal controlled and is used to generate a clock frequency. parity A technique for testing transmitting data. Typically, a binary digit is added to the data to make the sum of all the digits of the binary data either always even (even parity) or always odd (odd parity). Phase-locked loop (PLL) An electronic circuit that controls an oscillator so that it maintains a constant phase angle relative to a reference signal. pinouts The pin number assignment: the relation between the logical inputs and outputs of the PSoC device and their physical counterparts in the printed circuit board (PCB) package. Pinouts involve pin numbers as a link between schematic and PCB design (both being computer generated files) and may also involve pin names. Document Number: 001-49263 Rev. *J Page 54 of 58 CY8CLED16P01 17. Glossary (continued) port A group of pins, usually eight. Power on reset (POR) A circuit that forces the PSoC device to reset when the voltage is lower than a pre-set level. This is a type of hardware reset. PSoC® Cypress Semiconductor’s PSoC® is a registered trademark and Programmable System-onChip™ is a trademark of Cypress. PSoC Designer™ The software for Cypress’ Programmable System-on-Chip technology. pulse width An output in the form of duty cycle which varies as a function of the applied measurand modulator (PWM) RAM An acronym for random access memory. A data-storage device from which data can be read out and new data can be written in. register A storage device with a specific capacity, such as a bit or byte. reset A means of bringing a system back to a know state. See hardware reset and software reset. ROM An acronym for read only memory. A data-storage device from which data can be read out, but new data cannot be written in. serial 1. Pertaining to a process in which all events occur one after the other. 2. Pertaining to the sequential or consecutive occurrence of two or more related activities in a single device or channel. settling time The time it takes for an output signal or value to stabilize after the input has changed from one value to another. shift register A memory storage device that sequentially shifts a word either left or right to output a stream of serial data. slave device A device that allows another device to control the timing for data exchanges between two devices. Or when devices are cascaded in width, the slave device is the one that allows another device to control the timing of data exchanges between the cascaded devices and an external interface. The controlling device is called the master device. SRAM An acronym for static random access memory. A memory device where you can store and retrieve data at a high rate of speed. The term static is used because, after a value is loaded into an SRAM cell, it remains unchanged until it is explicitly altered or until power is removed from the device. SROM An acronym for supervisory read only memory. The SROM holds code that is used to boot the device, calibrate circuitry, and perform Flash operations. The functions of the SROM may be accessed in normal user code, operating from Flash. stop bit A signal following a character or block that prepares the receiving device to receive the next character or block. synchronous 1. A signal whose data is not acknowledged or acted upon until the next active edge of a clock signal. 2. A system whose operation is synchronized by a clock signal. Document Number: 001-49263 Rev. *J Page 55 of 58 CY8CLED16P01 17. Glossary (continued) tri-state A function whose output can adopt three states: 0, 1, and Z (high-impedance). The function does not drive any value in the Z state and, in many respects, may be considered to be disconnected from the rest of the circuit, allowing another output to drive the same net. UART A UART or universal asynchronous receiver-transmitter translates between parallel bits of data and serial bits. user modules Pre-build, pre-tested hardware/firmware peripheral functions that take care of managing and configuring the lower level Analog and Digital PSoC Blocks. User Modules also provide high level API (Application Programming Interface) for the peripheral function. user space The bank 0 space of the register map. The registers in this bank are more likely to be modified during normal program execution and not just during initialization. Registers in bank 1 are most likely to be modified only during the initialization phase of the program. VDD A name for a power net meaning "voltage drain." The most positive power supply signal. Usually 5 V or 3.3 V. VSS A name for a power net meaning "voltage source." The most negative power supply signal. watchdog timer A timer that must be serviced periodically. If it is not serviced, the CPU resets after a specified period of time. Document Number: 001-49263 Rev. *J Page 56 of 58 CY8CLED16P01 18. Document History Page Document Title: CY8CLED16P01 Powerline Communication Solution Document Number: 001-49263 Revision ECN No. Orig. of Change Submission Date Description of Change ** 2575716 GHH/PYRS 10/01/08 New Datasheet *A 2731927 GHH/HMT/ DSG 07/06/09 Added - Configurable baud rates and FSK Frequencies - PLC Pod Kits for development purposes Modified - Pin information for all packages *B 2748537 GHH See ECN Added Sections on ‘Getting Started’ and ‘Document Conventions’ Modified the following Electrical Parameters - FIMO6 Min: Changed from 5.75 MHz to 5.5 MHz - FIMO6 Max: Changed from 6.35 MHz to 6.5 MHz - SPIS (Maximum input clock frequency): Changed from 4.1 ns to 4.1 MHz - TWRITE (Flash Block Write Time): Changed from 40 ms to 10 ms *C 2752799 GHH 08/17/09 Posting to external web. *D 2759000 GHH 09/02/2009 Fixed typos in the data sheet. Updated Figure 2-2. on page 3 and Figure 4-1. on page 11. *E 2778970 FRE 10/05/2009 Added a table for DC POR and LVD Specifications Updated DC GPIO, AC Chip-Level, and AC Programming Specifications as follows: - Modified FIMO6, TWRITE, and Power Up IMO to Switch specifications - Added IOH, IOL, DCILO, F32K_U, TPOWERUP, TERASEALL, and SRPOWER_UP specifications Added 48-Pin QFN (Sawn) package diagram and CY8CLED16P01-48LTXI and CY8CLED16P01-48LTXIT part details in the Ordering Information table Updated section 5 and Tables 10-1, 10-2, and 10-3 to state the requirement to use the external crystal for PLC protocol timing Table 10-1 and Figure 10-1: Changed pins 9 and 25 from NC to RSVD Table 10-2 and Figure 10-2: Changed pins 7 and 39 from NC to RSVD Table 10-3 and Figure 10-3: Changed pins 14 and 77 from NC to RSVD Tables 10-1, 10-2, 10-3: Added explanation to Connect a 0.1 uF capacitor between XTAL_Stability and VSS. Fixed minor typos *F 2846686 FRE 01/12/2010 Add Table of Contents. Update copyright and Sales URLs. Update 28-Pin SSOP, 48-Pin QFN, 48-Pin QFN (Sawn Type) package diagrams. Add footnote in Ordering Information table of CY8CPLC20-48LFXI stating, “Not recommended for new designs.” Add capacitor description to AGND pin. *G 2903114 NJF 04/01/2010 Updated Cypress website links Added TBAKETEMP and TBAKETIME parameters Updated package diagrams *H 2938300 CGX 05/27/10 Minor ECN to post to external website *I 3114960 NJF 12/19/10 Added DC I2C Specifications table. Added F32K_U max limit. Added Tjit_IMO specification, removed existing jitter specifications. Updated DC Analog reference, DC operational amplifier specifications and DC analog output buffer specifications tables. Updated Units of Measure, Acronyms, Glossary, and References sections. Updated solder reflow specifications. No specific changes were made to AC Digital Block Specifications table and I2C Timing Diagram. They were updated for clearer understanding. Updated Figure 10-5 since the labelling for y-axis was incorrect. Removed footnote reference for “Solder Reflow Peak Temperature” table. Added the typical JC parameter to the Thermal Impedances table. Table 8-1 and Figure 8-1: Changed pin 25 from RSVD to P0[2]. Table 8-2 and Figure 8-2: Changed pin 39 from RSVD to P0[2]. Table 8-3 and Figure 8-3: Changed pin 77 from RSVD to P0[2]. *J 3284094 SHOB 06/17/11 Updated Getting Started, Development Tools, and Designing with PSoC Designer Document Number: 001-49263 Rev. *J Page 57 of 58 CY8CLED16P01 19. Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. 19.1 Products Automotive Clocks & Buffers Interface Lighting & Power Control 19.2 PSoC Solutions cypress.com/go/automotive psoc.cypress.com/solutions cypress.com/go/clocks PSoC 1 | PSoC 3 | PSoC 5 cypress.com/go/interface cypress.com/go/powerpsoc cypress.com/go/plc Memory Optical & Image Sensing cypress.com/go/memory cypress.com/go/image PSoC Touch Sensing cypress.com/go/psoc cypress.com/go/touch USB Controllers Wireless/RF cypress.com/go/USB cypress.com/go/wireless © Cypress Semiconductor Corporation, 2008-2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 001-49263 Rev. *J Revised June 17, 2011 Page 58 of 58 PSoC® and CapSense® are registered trademarks and PSoC Designer™ and EZ-Color™ are trademarks of Cypress Semiconductor Corp. All products and company names mentioned in this document may be the trademarks of their respective holders.