DS2004SF DS2004SF Rectifier Diode Replaces September 2001 version, DS4188-5.0 DS4188-5.1 December 2001 APPLICATIONS KEY PARAMETERS ■ Rectification VRRM 2800V ■ Freewheel Diode IF(AV) 2372A ■ DC Motor Control IFSM ■ Power Supplies 31250A ■ Welding ■ Battery Chargers FEATURES ■ Double Side Cooling ■ High Surge Capability VOLTAGE RATINGS Type Number DS2004SF28 DS2004SF27 DS2004SF26 DS2004SF25 DS2004SF24 Repetitive Peak Reverse Voltage VRRM V 2800 2700 2600 2500 2400 Conditions VRSM = VRRM + 100V Outline type code: F See Package Details for further information. Fig. 1 Package outline Lower voltage grades available. ORDERING INFORMATION When ordering, select the required part number shown in the Voltage Ratings selection table, e.g.: DS2004SF26 Note: Please use the complete part number when ordering and quote this number in any future correspondance relating to your order. 1/7 www.dynexsemi.com DS2004SF CURRENT RATINGS Tcase = 75oC unless otherwise stated Symbol Parameter Conditions Max. Units 2372 A Double Side Cooled Half wave resistive load IF(AV) Mean forward current IF(RMS) RMS value - 3726 A Continuous (direct) forward current - 3352 A 1684 A IF Single Side Cooled (Anode side) IF(AV) Mean forward current IF(RMS) RMS value - 2645 A Continuous (direct) forward current - 2235 A Conditions Max. Units Half wave resistive load, 1960 A IF Half wave resistive load Tcase = 100oC unless otherwise stated Symbol Parameter Double Side Cooled IF(AV) Mean forward current IF(RMS) RMS value - 3077 A Continuous (direct) forward current - 2750 A 1300 A IF Single Side Cooled (Anode side) IF(AV) Mean forward current IF(RMS) RMS value - 2040 A Continuous (direct) forward current - 1600 A IF Half wave resistive load 2/7 www.dynexsemi.com DS2004SF SURGE RATINGS Parameter Symbol IFSM I2t IFSM I2t Surge (non-repetitive) forward current I2t for fusing Surge (non-repetitive) forward current Conditions Max. Units 10ms half sine; Tcase = 175oC 25.0 kA VR = 50% VRRM - 1/4 sine 3.12 x 106 A2s 10ms half sine; Tcase = 175oC 31.25 kA VR = 0 4.88 x 106 A2s I2t for fusing THERMAL AND MECHANICAL DATA Min. Max. Units dc - 0.022 o Anode dc - 0.038 o Cathode dc - 0.052 o C/W Double side - 0.004 o C/W Single side - 0.008 o C/W Forward (conducting) - 185 o Reverse (blocking) - 175 o Storage temperature range –55 180 o Clamping force 18.0 22.0 Parameter Symbol Conditions Double side cooled Rth(j-c) Thermal resistance - junction to case C/W C/W Single side cooled Rth(c-h) Tvj Tstg - Thermal resistance - case to heatsink Clamping force 19.5kN with mounting compound C Virtual junction temperature C C kN 3/7 www.dynexsemi.com DS2004SF CHARACTERISTICS Symbol Conditions Parameter Min. Max. Units VFM Forward voltage At 3400A peak, Tcase = 25oC - 1.3 V IRRM Peak reverse current At VRRM, Tcase = 175oC - 50 mA QS Total stored charge IF = 2000A, dIRR/dt = 3A/µs, - 2500 µC IRR Peak recovery current Tcase = 175˚C, VR = 100V - 105 A VTO Threshold voltage At Tvj = 175˚C - 0.82 V Slope resistance At Tvj = 175˚C - 0.16 mΩ rT CURVES 5000 5000 Measured under pulse conditions 4000 Mean power dissipation - (W) Instantaneous forward current, IF - (A) 4000 3000 3000 2000 2000 Tj = 175˚C Tj = 25˚C 1000 1000 dc Half wave 3 phase 6 phase 0 0.5 1.0 1.5 Instantaneous forward voltage, VF - (V) 2.0 0 0 Fig.2 Maximum (limit) forward characteristics VFM Equation:VFM = A + Bln (IF) + C.IF+D.√IF 1000 2000 3000 Mean forward current, IF(AV) - (A) 4000 Fig.3 Dissipation curves Where A = –0.23148 B = 0.203801 C = 0.00023 D = –0.0443 these values are valid for Tj = 125˚C for IF 500A to 5000A 4/7 www.dynexsemi.com DS2004SF 100000 1000 Conditions: Tj = 175˚C VR = 100V IF = 2000A IF QS Conditions: Tj = 175˚C VR = 100V IF = 2000A dIF/dt Stored charge, QS - (µC) Reverse recovery current, Irr - (A) IRM 10000 1000 1.0 10 Rate of decay of forward current, dIF/dt - (A/µs) 100 10 0.1 100 Fig.4 Total stored charge 1.0 10 Rate of decay of forward current, dIF/dt - (A/µs) 100 Fig.5 Maximum reverse recovery current 60 0.1 3.8 50 3.4 40 3.0 30 2.6 I2t 20 2.2 10 1 10 1 ms 2 3 5 10 20 1.8 50 Cycles at 50Hz I2t value - (A2s x 106) Peak half sine forward current - (kA) 4.2 Thermal Impedance - junction to case - (˚C/W) I2t = Î2 x t 2 Anode side cooled Double side cooled 0.01 Conduction d.c. Halfwave 3 phase 120˚ 6 phase 60˚ 0.001 0.001 0.01 0.1 Time - (s) Effective thermal resistance Junction to case ˚C/W Double side 0.022 0.024 0.026 0.027 Single side 0.038 0.040 0.042 0.043 1.0 10 Duration Fig.6 Surge (non-repetitive) forward current vs time (with 50% VRRM at Tcase 175˚C) Fig.7 Maximum (limit) transient thermal impedance junction to case 5/7 www.dynexsemi.com DS2004SF PACKAGE DETAILS For further package information, please contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Hole Ø3.6x2.0 deep (in both electrodes) Cathode Ø76 max 27.0 25.4 Ø48 nom Ø48 nom Anode Nominal weight: 450g Clamping force: 19.6kN ± 10% Package outline type code: F Note: 1. Package maybe supplied with pins and/or tags. 6/7 www.dynexsemi.com DS2004SF POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). DEVICE CLAMPS Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-loaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies. Please refer to our application note on device clamping, AN4839 HEATSINKS Power Assembly has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or Customer Services. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. 99 Bank Street, Suite 410, Ottawa, Ontario, Canada, K1P 6B9 Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2001 Publication No. DS4188-5 Issue No. 5.1 December 2001 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. 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