FOD852 4-Pin High Operating Temperature Photodarlington Optocoupler Features Description ■ Applicable to Pb-free IR Reflow Soldering The FOD852 consists of gallium arsenide infrared emitting diode driving a silicon photodarlington output (with integral base-emitter resistor) in a 4-pin dual in-line package. ■ Compact 4-pin Package ■ High Current Transfer Ratio: 1000% Minimum ■ C-UL, UL, and VDE Approved ■ High Input-Output Isolation Voltage of 5000 VRMS ■ High Operating Temperature of 100°C Applications ■ Power Supply Regulators ■ Digital Logic Inputs ■ Microprocessor Inputs Functional Block Diagram ANODE 1 4 COLLECTOR 4 CATHODE 2 3 EMITTER Figure 1. Schematic ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.2 1 Figure 2. Package Outlines www.fairchildsemi.com FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler June 2013 Symbol Parameter Value Units Total Device TSTG Storage Temperature -55 to +125 °C TOPR Operating Temperature -30 to +100 °C TSOL Lead Solder Temperature 260 for 10 seconds °C PTOT Total Device Power Dissipation 200 mW IF Continuous Forward Current 50 mA VR Reverse Voltage 6 V PD LED Power Dissipation 70 mW VCEO Collector-Emitter Voltage 300 V VECO Emitter-Collector Voltage 0.1 V IC Continuous Collector Current 150 mA PC Collector Power Dissipation 150 mW Input Output ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.2 www.fairchildsemi.com 2 FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. TA = 25°C Unless otherwise specified. Individual Component Characteristics Symbol Parameter Test Conditions Min. Typ. Max. Unit 1.2 1.4 V 10 µA 250 pF 200 nA Input VF Forward Voltage IF = 10 mA IR Reverse Current VR = 4 V Ct Terminal Capacitance V = 0, f = 1 kHz 30 Output Collector Dark Current VCE = 200 V, IF = 0 BVCEO ICEO Collector-Emitter Breakdown Voltage IC = 0.1 mA, IF = 0 300 V BVECO Emitter-Collector Breakdown Voltage IE = 10 µA, IF = 0 0.1 V Transfer Characteristics Symbol IC CTR DC Characteristic Test Conditions Collector Current Current Transfer IF = 1 mA, VCE = 2 V Ratio(1) Collector-Emitter Saturation Voltage IF = 20 mA, IC = 100 mA RISO Isolation Resistance DC = 5000 V, 40% to 60% Relative Humidity CF Floating Capacitance V = 0, f = 1 MHz VCE(SAT) Min. Typ. Max. Unit 10 40 150 mA 1,000 4,000 15,000 % 1.2 V 5x1010 1x1011 Ω 0.6 fC Cut-Off Frequency VCE = 2 V, IC = 20 mA, RL = 100 Ω, -3 dB tR Response Time (Rise) VCE = 2 V, IC = 20 mA, RL = 100 Ω tF Response Time (Fall) 1 1 7 pF kHz 100 300 µs 20 100 µs Isolation Characteristics Symbol Characteristic Test Conditions VISO Input-Output Isolation Voltage f = 60 Hz, t = 1 minute, II-O ≤ 2 µA RISO Isolation Resistance VI-O = 500 VDC CISO Isolation Capacitance VI-O = 0, f = 1 MHz Min. Typ. Max. 5000 5 x 1010 Units VAC(RMS) 1011 0.6 Ω 1.0 pf Note: 1. Current Transfer Ratio (CTR) = IC / IF x 100%. ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.2 www.fairchildsemi.com 3 FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Electrical Characteristics TA = 25°C unless otherwise specified. COLLECTOR POWER DISSIPATION PC (mW) TA = 25°C unless otherwise specified. FORWARD CURRENT IF (mA) 60 50 40 30 20 10 0 -30 0 25 50 75 100 125 AMBIENT TEMPERATURE TA (°C) 200 150 100 50 0 -30 5 Figure 4. Collector Power Dissipation vs. Ambient Temperature 100 Ic =5 mA 10 mA 30 mA 50 mA 70 mA 100 mA 4. 5 4 3. 5 3 FORWARD CURRENT IF (mA) COLLECTOR-EMITTER SATURATION VOLTAGE VCE (sat) (V) Figure 3. Forward Current vs. Ambient Temperature 0 20 40 60 80 100 AMBIENT TEMPERATURE TA (°C) 2. 5 2 1. 5 1 100°C 20°C 60°C 10 0. 5 0 1 1 0 2 3 4 5 0. 5 0.7 FORWARD CURRENT IF (mA) 0.9 1. 3 1.5 1. 7 1.9 Figure 6. Forward Current vs. Forward Voltage 100 7000 VCE = 2 V 2. 5 mA COLLECTOR CURRENT IC (mA) 10 mA 6000 5000 4000 3000 2000 1000 0 0. 1 1.1 FORWARD VOLTAGE VF (V) Figure 5. Collector-Emitted Saturation Voltage vs. Forward Current CURRENT TRANSFER RATIO CTR ( %) 40 °C 80°C 80 2 mA 5 mA 3 mA 1. 5 mA 60 1 mA PC (M AX.) 40 20 IF = 0.5 mA 0 1 0 10 2 3 4 5 Figure 8. Collector Current vs. Collector-Emitter Voltage Figure 7. Current Transfer Ratio vs. Forward Current ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.2 1 COLLECTOR-EMITTER VOLTAGE VCE (V) FORWARD CURRENT IF (mA) www.fairchildsemi.com 4 FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Typical Electrical/Optical Characteristic Curves COLLECTOR-EMITTER SATURATION VOLTAGE VCE (sat) (V) TA = 25°C unless otherwise specified. RELATIVE CURRENT TRANSFER RATIO (%) 1.0 IF = 1 mA VCE = 2 V 0.8 0.6 0.4 0.2 0 20 IF = 20 mA IC = 100 mA 1.10 1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 20 40 60 80 100 AMBIENT TEMPERATURE TA (°C) 40 60 80 100 AMBIENT TEMPERATURE TA (°C) Figure 10. Collector-Emitter Saturation Voltage vs. Ambient Temperature Figure 9. Relative Current Transfer Ratio vs. Ambient Temperature 1000 1000 VCE = 200 V VCE = 2 V 500 I = 20 mA C RESPONSE TIME (μs) COLLECTOR DARK CURRENT ICEO (nA) 1.20 100 tr 200 100 tf 50 td ts 20 10 5 2 1 10 20 40 60 80 100 AMBIENT TEMPERATURE TA (°C) 0.1 Figure 11. Collector Dark Current vs. Ambient Temperature 10 Figure 12. Response Time vs. Load Resistance VCE = 2V IC = 2mA 0 VOLTAGE GAIN AV (dB) 1 LOAD RESISTANCE RL (kΩ) -5 -10 -15 RL=1kΩ 100Ω 10Ω -20 -25 0.1 1 10 100 FREQUENCY f (kHz) 500 Figure 13. Frequency Response ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.2 www.fairchildsemi.com 5 FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Typical Electrical/Optical Characteristic Curves (Continued) FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Test Circuits Vcc Input RD Input Output RL 10% Output 90% ts td tr tf Figure 14. Test Circuit for Response Time Vcc RD RL Output Figure 15. Test Circuit for Frequency Response ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.2 www.fairchildsemi.com 6 Temperature (°C) Tp Tsmax Ramp-down Tsmin 25°C tS (Preheat) Soldering zone Time (sec) Figure 16. Reflow Profile Profile Feature Pb-Sn solder assembly Lead Free assembly 100°C to 150°C 60 to 120 seconds 150°C to 200°C 60 to 120 seconds 183°C 60 to 120 seconds 217°C 30 to 90 seconds Peak Temperature (Tp) 240 +0°C/-5°C 260 +0°C/-5°C Ramp-down Rate 6°C/s maximum 6°C/s maximum Preheat Conditions Temperature: Tsmin to Tsmax Time: tS Melt Soldering Zone Recommended Wave Soldering Condition Profile Feature For all Solder Assembly Peak Temperature (Tp) ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.2 Maximum 260°C for 10 seconds www.fairchildsemi.com 7 FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Lead Free Recommended IR Reflow Condition Part Number Package Packing Method FOD852 DIP 4-Pin Tube (50 units per tube) FOD852S SMT 4-Pin (Lead Bend) Tube (50 units per tube) FOD852SD SMT 4-Pin (Lead Bend) Tape and Reel (1,000 units per reel) FOD852300 DIP 4-Pin, DIN EN/IEC60747-5-2 option Tube (50 units per tube) FOD8523S SMT 4-Pin (Lead Bend), DIN EN/IEC60747-5-2 option Tube (50 units per tube) FOD8523SD SMT 4-Pin (Lead Bend), DIN EN/IEC60747-5-2 option Tape and Reel (1,000 units per reel) FOD852300W DIP 4-Pin, 0.4” Lead Spacing, DIN EN/IEC60747-5-2 option Tube (50 units per tube) Marking Information 4 5 V X ZZ Y 3 852 6 2 1 Definitions 1 Fairchild logo 2 Device number 3 DIN EN/IEC60747-5-2 Option (only appears on parts ordered with this option) 4 One-digit year code 5 Two-digit work week, ranging from ‘01’ to ‘53’ 6 Assembly package code Y = manufactured in Thailand YA = manufactured in China ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.2 www.fairchildsemi.com 8 FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Ordering Information FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Package Dimensions Figure 17. 4-Pin DIP Through Hole Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.2 www.fairchildsemi.com 9 FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Package Dimensions (Continued) Figure 18. 4-Pin DIP 0.4” Lead Spacing Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.2 www.fairchildsemi.com 10 FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Package Dimensions (Continued) Figure 19. 4-Pin DIP Surface Mount Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.2 www.fairchildsemi.com 11 P2 Ø1.55±0.05 P0 1.75±0.1 F W B0 A0 P1 0.3±0.05 K0 Figure 20. Carrier Tape Specification Symbol W Description Dimensions in mm (inches) Tape wide 16 ± 0.3 (0.63) P0 Pitch of sprocket holes F P2 Distance of compartment 7.5 ± 0.1 (0.295) 2 ± 0.1 (0.079) 4 ± 0.1 (0.15) P1 Distance of compartment to compartment 12 ± 0.1 (0.472) A0 Compartment 10.45 ± 0.1 (0.411) B0 5.30 ± 0.1 (0.209) K0 4.25 ± 0.1 (0.167) ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.2 www.fairchildsemi.com 12 FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Carrier Tape Specifications FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.2 www.fairchildsemi.com 13