HMC258CB1 MICROWAVE CORPORATION HMC258CB1 SUB-HARMONIC SMT MIXER 14 - 20 GHz FEBRUARY 2001 Features General Description RUGGED SMT BGA PACKAGE The HMC258CB1 is a 14 – 20 GHz surface mount sub-harmonically pumped (x2) MMIC mixer with an integrated LO amplifier in a rugged Ball Grid Array (BGA) package. The 2LO to RF isolation is an excellent 38 dB, eliminating the need for additional filtering. The LO amplifier is a single bias (+5V) two stage design with only 0dBm drive requirement. This MESFET based single-ended mixer chip was designed to be used in microwave point-to-point radios, VSAT and other SATCOM applications. All data is with the non-hermetic, epoxy sealed BGA packaged device mounted in a 50 ohm test fixture. Utilizing the HMC258CB1 eliminates the need for wirebonding, thereby providing a consistent connection interface for the customer. INTEGRATED LO AMPLIFIER: 0 dBm INPUT SUB-HARMONICALLY PUMPED (x2) LO HIGH 2LO/RF ISOLATION: 38 dB SMT MIXERS 4 Guaranteed Performance, LO Drive = 0 dBm, Vdd = +5V, - 55 to + 85 deg C IF = 1 GHz Vdd = +5.0V Parameter Min. Typ. IF = 1 GHz Vdd = +5.0V Max. Min. Typ. Units Max. Frequency Range, RF 14 - 20 17 - 20 GHz Frequency Range, LO 7 - 10.5 8.5 - 10 GHz Frequency Range, IF DC - 3 DC - 3 GHz Conversion Loss 10 13.5 9 11.5 dB Noise Figure (SSB) 10 13.5 9 11.5 dB 2LO to RF Isolation 33 38 33 38 dB 2LO to IF Isolation 35 40 ~ 50 42 48 dB IP3 (Input) 0 7 0 7 dBm 1 dB Compression (Input) -5 0 -5 0 dBm Local Oscillator Drive Level -4 0 +6 -4 0 +6 dBm 4.5 5.0 5.5 4.5 5.0 5.5 Vdc 50 65 50 65 mA Supply Voltage (Vdd) Supply Current (Idd) ( Vdd = +5.0 Vdc) 12 Elizabeth Drive, Chelmsford, MA 01824 4 - 106 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com HMC258CB1 MICROWAVE CORPORATION HMC258CB1 SUB-HARMONIC SMT MIXER 14 - 20 GHz FEBRUARY 2001 Conversion Gain vs. Temperature @ LO = 0 dBm Isolation @ LO = 0 dBm 0 10 LO/IF 0 -5 LO/RF ISOLATION (dB) CONVERSION GAIN (dB) -55 C -10 -15 +85 C -10 RF/IF -20 2LO/RF -30 -40 +25 C -20 -50 2LO/IF -25 -60 16 18 20 22 14 16 RF FREQUENCY (GHz) Conversion Gain vs. LO Drive 22 0 -5 -10 -15 +4 dBm +2 dBm -2 dBm -10 -15 -20 -25 RF -30 -20 -25 LO IF -35 -4 dBm -40 14 16 18 20 22 0 5 RF FREQUENCY (GHz) 10 15 20 FREQUENCY (GHz) Upconverter Performance Conversion Gain vs LO Drive IF Bandwidth @ LO = 0 dBm 0 CONVERSION GAIN (dB) 0 -5 -10 -15 -20 -5 -10 -15 0 dBm -20 -25 -25 -30 0 1 2 3 4 5 6 IF FREQUENCY (GHz) 12 Elizabeth Drive, Chelmsford, MA 01824 14 16 18 20 22 RF FREQUENCY (GHz) Phone: 978-250-3343 4 SMT 0 dBm -5 RETURN LOSS (dB) CONVERSION GAIN (dB) 20 Return Loss @ LO = 0 dBm 0 IF CONVERSION GAIN (dB) 18 RF FREQUENCY (GHz) MIXERS 14 Fax: 978-250-3373 Web Site: www.hittite.com 4 - 107 HMC258CB1 MICROWAVE CORPORATION HMC258CB1 SUB-HARMONIC SMT MIXER 14 - 20 GHz FEBRUARY 2001 Input IP2 vs. LO Drive Input IP3 vs. LO Drive SECOND ORDER INTERCEPT (dBm) THIRD ORDER INTERCEPT (dBm) 20 +2 dBm 15 10 5 0 0 dBm -2 dBm -5 50 +2 dBm 40 30 -2 dBm 20 10 0 dBm 0 -10 4 60 13 15 17 19 21 13 23 14 15 MIXERS 17 18 19 20 21 22 23 MXN Spurious Outputs @LO Drive = 0 dBm P1dB 6 5 mRF 4 -3 -2 -1 0 1 2 3 P1dB (dBm) 3 SMT 16 RF FREQUENCY (GHz) RF FREQUENCY (GHz) 2 1 0 -1 -2 -3 -4 13 14 15 16 17 18 19 20 21 22 23 ±5 ±4 nLO ±3 ±2 ±1 0 -105.5 -87.5 X -97 -33.8 -71.5 -44.7 -11.7 -105 RF = 18 GHz @ -10 dBm LO = 8.5 GHz @ 0 dBm All values in dBc below IF power level RF FREQUENCY (GHz) 12 Elizabeth Drive, Chelmsford, MA 01824 4 - 108 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com HMC258CB1 MICROWAVE CORPORATION HMC258CB1 SUB-HARMONIC SMT MIXER 14 - 20 GHz FEBRUARY 2001 Schematic Absolute Maximum Ratings RF (14 - 20 GHz) +13 dBm LO Drive (Vdd = +5V) +13 dBm Vdd +8 Vdc Storage Temperature -65 to +150 deg C Operating Temperature -55 to +85 deg C LO In (7 - 10 GHz @0 dBm TYP.) ( See, Mounting, Note Page 4 - 110) SMT Outline Drawing 4 MIXERS Vdd (+5V) IF (DC - 3 GHz) RF / IF Input (Vdd = +5V) 1. MATERIAL: PACKAGE BODY: WHITE ALUMINA (99.0%) BALL CONTACTS : SILVER-COPPER BALL, EUTECTICALLY ATTACHED LID : PLASTIC, B-STAGE EPOXY ATTACHED 2. PLATING : ELECTROLYTIC GOLD 50-225 MICROINCHES OVER ELECTROLYTIC NICKEL 75 TO 225 MICROINCHES. 3. DIMENSIONS ARE IN INCHES (MILLIMETERS).UNLESS OTHERWISE SPECIFIED ALL TOLERANCES ARE ± 0.005 (± 0.13). 4. ALL UNLABELED BALL CONTACTS ARE GROUND. 5. ALL GROUNDS MUST BE SOLDERED TO THE PCB RF GROUND 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com 4 - 109 HMC258CB1 MICROWAVE CORPORATION HMC258CB1 SUB-HARMONIC SMT MIXER 14 - 20 GHz FEBRUARY 2001 Mounting The BGA package is back-metallized and can be mounted with either eutectic solder or electrically conductive epoxy. The mounting surface should be clean and flat. Placement of the BGA package can be done manually or with available automatic placement machines. Eutectic Attach: SMT MIXERS 4 Eutectic solder paste may be applied manually or automatically by screen print/dispense methods to the PCB. Geometry and process should be such as to supply sufficient solder volume to obtain adequate solder fillets around the balls of the package after reflow without shorting RF/DC ball signal contacts. The solder should be reflowed in an infrared reflow oven with the appropriate temperature profile for that solder. The finished fillet should resemble a cylindrical column with a flared pedestal at the substrate surface when viewed from the side. Do not expose the BGA package to temperature greater than 220oC for more than 20 seconds. Epoxy Attach: Electrically conductive epoxy may be applied in the same manner as mentioned above. Again geometry and process parameters should be such as to supply sufficient epoxy around each of the balls of the package without shorting RF/DC ball signal contact . Cure the epoxy per the recommended manufacture's schedule. Handling Precautions: Follow these precautions to avoid permanent damage. Cleanliness: Handle the devices in a clean environment. Static Sensitivity: Follow ESD precautions to protect against ESD strikes ( see page 8 - 2 ). Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the BGA package along the edges with a vacuum collet or with a sharp pair of bent tweezers. Avoiding damaging the solder balls on the package bottom. 12 Elizabeth Drive, Chelmsford, MA 01824 4 - 110 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com HMC258CB1 MICROWAVE CORPORATION HMC258CB1 SUB-HARMONIC SMT MIXER 14 - 20 GHz FEBRUARY 2001 NOTES: SMT MIXERS 4 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com 4 - 111