LOGIC LMU217JC35

LMU217
LMU217
DEVICES INCORPORATED
16 x 16-bit Parallel Multiplier
16 x 16-bit Parallel multiplier
DEVICES INCORPORATED
FEATURES
DESCRIPTION
❑ 25 ns Worst-Case Multiply Time
❑ Low Power CMOS Technology
❑ Replaces Cypress CY7C517,
IDT 7217L, and AMD Am29517
❑ Single Clock Architecture with
Register Enables
❑ Two’s Complement, Unsigned, or
Mixed Operands
❑ Three-State Outputs
❑ 68-pin PLCC, J-Lead
LMU217 BLOCK DIAGRAM
TCA
The LMU217 is a high-speed, low RND is loaded on the rising edge of
power 16-bit parallel multiplier.
CLK, provided either ENA or ENB are
LOW. RND, when HIGH, adds ‘1’ to
The LMU217 produces the 32-bit prodthe most significant bit position of the
uct of two 16-bit numbers. Data present
least significant half of the product.
at the A inputs, along with the TCA
Subsequent truncation of the 16 least
control bit, is loaded into the A register
significant bits produces a result
on the rising edge of CLK. B data and
correctly rounded to 16-bit precision.
the TCB control bit are similarly
loaded. Loading of the A and B At the output, the Right Shift control
registers is controlled by the ENA and (RS) selects either of two output formats.
ENB controls. When HIGH, these con- RS LOW produces a 31-bit product
trols prevent application of the clock to with a copy of the sign bit inserted in the
the respective register. The TCA and MSB postion of the least significant half.
TCB controls specify the operands as RS HIGH gives a full 32-bit product. Two
two’s complement when HIGH, or 16-bit output registers are provided to
unsigned magnitude when LOW.
hold the most and least significant
halves of the result (MSP and LSP) as
defined by RS. These registers are
loaded on the rising edge of CLK, subject
to the ENR control. When ENR is
B 15-0/
HIGH, clocking of the result registers is
R 15-0
prevented.
A 15-0
TCB
16
16
CLK
ENA
A REGISTER
B REGISTER
ENB
The two halves of the product may be
routed to a single 16-bit three-state
output port (MSP) via a multiplexer.
MSPSEL LOW causes the MSP outputs
to be driven by the most significant half
of the result. MSPSEL HIGH routes the
least significant half of the result to the
MSP pins. In addition, the LSP is
available via the B port through a separate three-state buffer.
REGISTER
RND
32
RS
FORMAT ADJUST
16
For asynchronous output, these registers
may be made transparent by setting the
feed through control (FT) HIGH and
ENR LOW.
16
FT
ENR
RESULT
REGISTER
MSPSEL
OEM
16
OEL
16
R 31-16
Multipliers
1
08/16/2000–LDS.217-H
LMU217
DEVICES INCORPORATED
FIGURE 1A.
16 x 16-bit Parallel Multiplier
INPUT FORMATS
AIN
BIN
Fractional Two’s Complement (TCA, TCB = 1)
15 14 13
–20 2–1 2–2
2 1 0
2–13 2–14 2–15
15 14 13
–20 2–1 2–2
(Sign)
2 1 0
2–13 2–14 2–15
(Sign)
Integer Two’s Complement (TCA, TCB = 1)
15 14 13
–215 214 213
2 1 0
22 21 20
15 14 13
–215 214 213
(Sign)
2 1 0
22 21 20
(Sign)
Unsigned Fractional (TCA, TCB = 0)
15 14 13
2–1 2–2 2–3
2 1 0
2–14 2–15 2–16
15 14 13
2–1 2–2 2–3
2 1 0
2–14 2–15 2–16
Unsigned Integer (TCA, TCB = 0)
15 14 13
215 214 213
FIGURE 1B.
2 1 0
22 21 20
15 14 13
215 214 213
2 1 0
22 21 20
OUTPUT FORMATS
MSP
LSP
Fractional Two’s Complement (RS = 0)
31 30 29
–20 2–1 2–2
18 17 16
2–13 2–14 2–15
15 14 13
–20 2–16 2–17
(Sign)
2 1 0
2–28 2–29 2–30
(Sign)
Fractional Two’s Complement (RS = 1)
31 30 29
–21 20 2–1
18 17 16
2–12 2–13 2–14
15 14 13
2–15 2–16 2–17
2 1 0
2–28 2–29 2–30
(Sign)
Integer Two’s Complement (RS = 1)
31 30 29
–231 230 229
18 17 16
218 217 216
15 14 13
215 214 213
2 1 0
22 21 20
(Sign)
Unsigned Fractional (RS = 1)
31 30 29
2–1 2–2 2–3
18 17 16
2–14 2–15 2–16
15 14 13
2–17 2–18 2–19
2 1 0
2–30 2–31 2–32
Unsigned Integer (RS = 1)
31 30 29
231 230 229
18 17 16
218 217 216
15 14 13
215 214 213
2 1 0
22 21 20
Multipliers
2
08/16/2000–LDS.217-H
LMU217
DEVICES INCORPORATED
16 x 16-bit Parallel Multiplier
MAXIMUM RATINGS Above which useful life may be impaired (Notes 1, 2, 3, 8)
Storage temperature ........................................................................................................... –65°C to +150°C
Operating ambient temperature ........................................................................................... –55°C to +125°C
VCC supply voltage with respect to ground ............................................................................ –0.5 V to +7.0 V
Input signal with respect to ground ........................................................................................ –3.0 V to +7.0 V
Signal applied to high impedance output ............................................................................... –3.0 V to +7.0 V
Output current into low outputs ............................................................................................................. 25 mA
Latchup current ............................................................................................................................... > 400 mA
OPERATING CONDITIONS To meet specified electrical and switching characteristics
Mode
Temperature Range (Ambient)
Active Operation, Commercial
Active Operation, Military
Supply Voltage
0°C to +70°C
4.75 V ≤ VCC ≤ 5.25 V
–55°C to +125°C
4.50 V ≤ VCC ≤ 5.50 V
ELECTRICAL CHARACTERISTICS Over Operating Conditions (Note 4)
Symbol
Parameter
Test Condition
Min
VOH
Output High Voltage
VCC = Min., IOH = –2.0 mA
2.4
VOL
Output Low Voltage
VCC = Min., IOL = 8.0 mA
VIH
Input High Voltage
VIL
Input Low Voltage
(Note 3)
IIX
Input Current
IOZ
Typ
Max
Unit
V
0.5
V
2.0
VCC
V
0.0
0.8
V
Ground ≤ VIN ≤ VCC (Note 12)
±20
µA
Output Leakage Current
Ground ≤ VOUT ≤ VCC (Note 12)
±20
µA
ICC1
VCC Current, Dynamic
(Notes 5, 6)
25
mA
ICC2
VCC Current, Quiescent
(Note 7)
1.0
mA
12
Multipliers
3
08/16/2000–LDS.217-H
LMU217
DEVICES INCORPORATED
16 x 16-bit Parallel Multiplier
SWITCHING CHARACTERISTICS
COMMERCIAL OPERATING RANGE (0°C to +70°C) Notes 9, 10 (ns)
Symbol
Parameter
tMC
Clocked Multiply Time
tMUC
Unclocked Multiply Time
tPW
Clock Pulse Width
tS
Input Setup Time
tH
Input Hold Time
tD
Output Delay
tSEL
Output Select Delay
tENA
Three-State Output Enable Delay (Note 11)
tDIS
Three-State Output Disable Delay (Note 11)
LMU217–
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*
65
55
45*
35
25 12345678901
20*
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Min Max Min Max Min Max Min Max Min Max12345678901
Min Max
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65
55
45
35
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85
75
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38 12345678901
30
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10
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9
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12
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11
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3
3
3
1
1
1
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25
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MILITARY OPERATING RANGE (–55°C to +125°C) Notes 9, 10 (ns)
Symbol
Parameter
tMC
Clocked Multiply Time
tMUC
Unclocked Multiply Time
tPW
Clock Pulse Width
tS
Input Setup Time
tH
Input Hold Time
tD
Output Delay
tSEL
Output Select Delay
tENA
Three-State Output Enable Delay (Note 11)
tDIS
Three-State Output Disable Delay (Note 11)
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LMU217–
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*
*
75
65
55*
40*
30*
25*
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Min Max Min Max Min Max Min Max Min Max Min Max
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75
65
55
40
30
25
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95
85
75
60
43
38
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20
15
15
15
10
10
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15
15
15
15
12
12
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3
3
3
2
2
2
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35
30
30
25
20
20
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30
30
30
25
20
20
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25
25
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25
20
20
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25
25
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20
20
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SWITCHING WAVEFORMS
tS
tH
INPUT
ENA, ENB
tS
tH
ENR
tPW
tPW
tPW
CLK
tD
tMC
tMUC
MSPSEL
tSEL
OEM
OEL
tDIS
R31-0
tENA
HIGH IMPEDANCE
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*DISCONTINUED SPEED GRADE
Multipliers
4
08/16/2000–LDS.217-H
LMU217
DEVICES INCORPORATED
16 x 16-bit Parallel Multiplier
NOTES
1. Maximum Ratings indicate stress
specifications only. Functional operation of these products at values beyond
those indicated in the Operating Conditions table is not implied. Exposure to
maximum rating conditions for extended periods may affect reliability.
9. AC specifications are tested with
input transition times less than 3 ns,
output reference levels of 1.5 V (except
tDIS test), and input levels of nominally
0 to 3.0 V. Output loading may be a
resistive divider which provides for
specified IOH and IOL at an output
voltage of VOH min and VOL max
2. The products described by this spec- respectively. Alternatively, a diode
ification include internal circuitry de- bridge with upper and lower current
signed to protect the chip from damagsources of I OH and I OL respectively,
ing substrate injection currents and ac- and a balancing voltage of 1.5 V may be
cumulations of static charge. Neverthe- used. Parasitic capacitance is 30 pF
less, conventional precautions should minimum, and may be distributed.
be observed during storage, handling,
and use of these circuits in order to This device has high-speed outputs caavoid exposure to excessive electrical pable of large instantaneous current
stress values.
pulses and fast turn-on/turn-off times.
As a result, care must be exercised in the
3. This device provides hard clamping of testing of this device. The following
transient undershoot and overshoot. In- measures are recommended:
put levels below ground or above VCC
will be clamped beginning at –0.6 V and a. A 0.1 µF ceramic capacitor should be
VCC + 0.6 V. The device can withstand installed between VCC and Ground
indefinite operation with inputs in the leads as close to the Device Under Test
range of –0.5 V to +7.0 V. Device opera- (DUT) as possible. Similar capacitors
tion will not be adversely affected, how- should be installed between device VCC
ever, input current levels will be well in and the tester common, and device
ground and tester common.
excess of 100 mA.
4. Actual test conditions may vary from b. Ground and VCC supply planes
those designated but operation is guar- must be brought directly to the DUT
anteed as specified.
socket or contactor fingers.
5. Supply current for a given applica- c. Input voltages should be adjusted to
tion can be accurately approximated by: compensate for inductive ground and VCC
noise to maintain required DUT input
NCV2 F
levels relative to the DUT ground pin.
4
where
10. Each parameter is shown as a min-
11. For the tENA test, the transition is
measured to the 1.5 V crossing point
with datasheet loads. For the tDIS test,
the transition is measured to the
±200mV level from the measured
steady-state output voltage with
±10mA loads. The balancing voltage, V TH , is set at 3.5 V for Z-to-0
and 0-to-Z tests, and set at 0 V for Zto-1 and 1-to-Z tests.
12. These parameters are only tested at
the high temperature extreme, which is
the worst case for leakage current.
FIGURE A. OUTPUT LOADING CIRCUIT
S1
DUT
IOL
VTH
CL
IOH
FIGURE B. THRESHOLD LEVELS
tENA
OE
Z
tDIS
1.5 V
1.5 V
3.5V Vth
0
1.5 V
1.5 V
Z
1
VOL*
0.2 V
VOH*
0.2 V
0
Z
1
Z
0V Vth
VOL* Measured VOL with IOH = –10mA and IOL = 10mA
VOH* Measured VOH with IOH = –10mA and IOL = 10mA
imum or maximum value. Input requirements are specified from the point
of view of the external system driving
the chip. Setup time, for example, is
specified as a minimum since the exter6. Tested with all outputs changing ev- nal system must supply at least that
ery cycle and no load, at a 5 MHz clock much time to meet the worst-case requirements of all parts. Responses from
rate.
the internal circuitry are specified from
7. Tested with all inputs within 0.1 V of the point of view of the device. Output
VCC or Ground, no load.
delay, for example, is specified as a
8. These parameters are guaranteed maximum since worst-case operation of
any device always provides data within
but not 100% tested.
that time.
N = total number of device outputs
C = capacitive load per output
V = supply voltage
F = clock frequency
Multipliers
5
08/16/2000–LDS.217-H
LMU217
DEVICES INCORPORATED
16 x 16-bit Parallel Multiplier
ORDERING INFORMATION
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64-pin
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48
R31
A12
1
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47
R30
A11
2
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46
R29
A10
3
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45
R28
A9
4
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44
5
R27
A8
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43
6
R26
A7
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42
7
R25
A6
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41
8
R24
A5
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40
9
R23
A4
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39
10
R22
A3
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38
11
R21
A2
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37
12
R20
A1
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36
13
R19
A0
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35
14
R18
OEL
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34
15
CLK
R17
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33
16
ENB
R16
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Discontinued Package
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9
8
7
6
5
4
3
2
1 68 67 66 65 64 63 62 61
60
11
59
12
58
13
57
14
56
15
55
16
54
17
Top
View
18
19
53
52
51
20
50
21
49
22
48
23
47
24
46
25
45
26
44
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
NC
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
OEL
CLK
ENB
Top
View
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
10
Speed
R15, B15
R14, B14
R13, B13
R12, B12
R11, B11
R10, B10
R9, B9
R8, B8
R7, B7
R6, B6
R5, B5
R4, B4
R3, B3
R2, B2
R1, B1
R0, B0
R15, B15
R14, B14
R13, B13
R12, B12
R11, B11
R10, B10
R9, B9
R8, B8
R7, B7
R6, B6
R5, B5
R4, B4
R3, B3
R2, B2
R1, B1
R0, B0
NC
R31
R30
R29
R28
R27
R26
R25
R24
R23
R22
R21
R20
R19
R18
R17
R16
NC
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
NC
ENR
OEM
RS
FT
MSPSEL
GND
GND
VCC
VCC
TCB
TCA
RND
ENA
A15
A14
A13
ENR
OEM
RS
FT
MSPSEL
GND
GND
VCC
VCC
TCB
TCA
RND
ENA
A15
A14
A13
68-pin
Plastic J-Lead
Chip Carrier (J2)
Ceramic Flatpack
(F4)
0°C to +70°C — COMMERCIAL SCREENING
35 ns
25 ns
LMU217JC35
LMU217JC25
–55°C to +125°C — COMMERCIAL SCREENING
–55°C to +125°C — MIL-STD-883 COMPLIANT
Multipliers
6
08/16/2000–LDS.217-H