MOTOROLA MC13760

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MC13760
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GSM/DCS/TDMA/AMPS
Multi-Protocol Transceiver
The MC13760 Multi–Protocol, Multi–Band Digital Transceiver IC
combines, on a single Advanced BiCMOS chip, the major building blocks
required for next generation multi–purpose, multi–band wireless products.
The device includes the majority of the circuitry necessary for IF signal
processing between the RF front end and the DSP and backend. The
MC13760 contains two fractional–N synthesizers, a re–configurable zero IF
receiver with programmable bandwidth, receive A/D conversion, multi–rate
data interface to the baseband DSP, direct launch digital modulator, full
transmit support circuits, and general purpose support circuits such as D/A
and A/D converters, battery save and tri–state control switches.
Intended for use in a combined GSM/TDMA/AMPS/iDEN portable
wireless phone product in the 800/900/1800/1900 MHz bands. The
MC13760 can be used over a wide range of RF and IF frequencies. The
main PLL prescaler input is usable to over 2.0 GHz and the IF quadrature
downconverter operates up to 400 MHz.
The MC13760 has separate receive IF inputs and a common zero–IF IQ
receiver for TDMA and for GSM accommodating the receiver architectural
need to use different IF frequencies and filters without the need for additional
switches.
• Receiver Functions for all GSM/DCS/TDMA IS–136/AMPS Modes and
Frequencies Including GPRS
• Direct Interface to Motorola Baseband Processors, such as the
DSP56690 through a Common Programming and Data Interface
• Main Three Accumulator (24–Bit) Fractional–N Synthesizer
• Resolution Capability of 6.0 Hz
• Dual–Mode Charge Pump Output for TDMA TX VCO and all RX
• Independent Charge Pump Output for the GSM/DCS TX VCO
• GMSK Lookup ROM for Direct Transmission in GSM/DCS Mode
• Digital 16–Bit Automatic Frequency Control
•
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MULTI–PROTOCOL
TRANSCEIVER
SEMICONDUCTOR
TECHNICAL DATA
PLASTIC PACKAGE
CASE 1285
(BGA–104)
ORDERING INFORMATION
Device
Operating
Temperature Range
Package
MC13760
TA = –40 to 85°C
BGA–104
Secondary Three Accumulator (24–Bit) Fractional–N Synthesizer for
use as an Accurate Frequency–Corrected Clock in GSM, or as an
Additional Low Frequency LO
Coarse Tuning of the VCO(s) via a 6–Bit D/A with Adapt
Operates at 2.75 V Deep Sleep Mode with Current as low as 50 µA
Versatile Frequency Generation including Linear and Constant Envelope
Modulation Paths, Ramp and Power Level Control, Direct Gain Control
of the RFPA in the TDMA Mode
D/A Conversion of TDMA TXI and TXQ
Reference Crystal Oscillator with a Buffered Output, Compensation/Fine
Tuning via 9–Bit D/A
Receiver Gain Adjustment and Bandwidth Down to 6.0 kHz
Programmed over the SPI Bus
A/D Conversion of RXI and RXQ to 8–Bit or 10–Bit Resolution
Types of Applications
• GSM/DCS/TDMA/AMPS Global Roaming Multiband Cellular
Telephone
• VHF/UHF 2–Way or Trunked Radio, iDEN, Tetra, or Satellite
Communication Radios or Telephones
• Hand–Held Wireless PDA’s
• Wireless LAN’s, Industrial Devices, ISM Band Products
• Any New Device Containing Some Combination of the Above
Functions
This document contains information on a product under development. Motorola reserves the
right to change or discontinue this product without notice.
MOTOROLA WIRELESS SEMICONDUCTOR
SOLUTIONS – RF AND IF DEVICE DATA
 Motorola, Inc. 2000
Rev 0
1
MC13760
AGC Control
RFA0
On Channel
AGC Det.
On Channel
AGC Det.
AGC
Warp
I
PREINI
PREINIB
SPI
Control
DCOCL
Step
Alternator
Control
PRAVCC1
VACBYP
VAC
AGC
AGCGND
AGCVCC
BBEGND
BBEVCC
DCLICIN
DCLICP
DMKGND
DMKVCC
DMKGNDDIG
DMKVCCDIG
Figure 1. MC13760 Detailed Block Diagram
1 Pole
2 Pole
2 Pole
NVCC
2 Pole
Step
Atten
NGND
PRAGND
QVCC
AGC
Amp
PRAVCC2
Q
PREINGB
PREING
1 Pole
2 Pole
2 Pole
QGND
2 Pole
Step
Atten
PRAGNDDIG
LOIN
+2 Quadrature
Generator
DCLQCP
DCOCL
Tracking Loop &
BB Filter BW Control
DCLQCIN
S/H
Adapt
Timing
S/H
Addressable
Shift Register
SPII
REFVCC
SPICLK
TCAPP
CEX
Internal
Reference
& Bias
8
REFGND
24
Programmable
Divider
6
16 LSB
Look–Up
ROM
Accumulator #2
2
Reference
Oscillator
MNCPGND
TBD Order
Passive Filter
MNCPGND
MAINVCC
MAINGND
AOCDRIVE
2
PtC
Sw. Cap
Filter
TXE/TXKEY
RXFS/SFS
TSLOTB
TCLK
Cont.
Time
Filter
Cont.
Time
Filter
24
TCLKB
Clock
Gen.
200 kHz
1.0, 2.4 or 2.6 MHz
CLKGENIN
OUTI
OUTIB
8 6
Recombination
Logic
Accumulator #2
OUTQ
OUTQB
PtB
+7/
+14/
+21/
+28
MUX
From
PtD
8X6
3 Bit
6 Bit
6 Bit
Cosine
D/A 6 Reg 6 Lookup 3 Counter
8 Bit
8 Bit
Reg 8 Counter 8
8
5 Bit
5 Reg
Programmable
Divider
Accumulator #3
3
Control
Logic
8
400 KHz
Reference
Phase Detector/
+N
Charge Pump
13.0 – 16.8 MHz or
26.0 – 33.6 MHz
2
+1/+2/
+3/+4
16
From
PtD
TEST1
PLLCP
CLKOUT
PLLEMIT
PLLBASE
Tark
Circuit
VBLIN
8 Bit
D/A
ASW
VCNTO
Mixer & Preamp
Current
22
49
Test
Multiplex
(2 Outputs)
PLLCPVCC
REFPLLGND
CLKSEL
REFPLLVCC
OSCENB
DETSW
SATDET
Output
Enable
D or A
IREF
5
From PtB
TXKEYOUT
SEGND
SEBYP
SFOUT
SFVCC
+1/
+2/
+3/
+4
3
MUX
6
5
SPICLK
CEX
From
PtA
SPI
REG
PtD
MUX
From
PtA
From TXE/
PtC TXKEY
DMCS
SPII
Super Filter
2
Sw. Cap
Filter
RSTB
TSLOT
+65/ +84/
+130/ +168
+1/
+2
PtA
CLKGENIN
5 Bit
D/A
TXCLK/SCK
RXCLK
Clock
Generation &
Control Logic
Accumulator #1
+10/
+26
Wideb and
Charge Pump
8 Bit
D/A
STD
62
62
IF
Control
Channel
AFC
62
Addressable
Shift Register
CPGT
8 Bit
D/A
B16
D Q
dk
4
Dual Mode
Charge Pump
8 Bit
D/A
Addressable
Shift Register
ADAPT
+13/ +17/
+26/ +34
26 MHz
CPGITR
Transmit
Data Register
RXACQ
SPII
SPICLK
CEX
LONCGND
XTALEMIT
SRD
4
SPI
9 Bit Control
D/A
Phase
Detector
Startup
XTALBASE
26 MHz
4.333 MHz
GPO3
OSCGND
Receive
Data Register
13.0 or 16.8 MHz
IREF
LONCVCC
OSCVCC
B6
2
Comb
Filter
GPO2
Third Order
Passive Filter
Accumulator #3
Comb
Filter
TX DATA Buffer
Start
DO
Clk
GPO1
XTALWARP
SPI
6 Bit Control
D/A
SERIALGND
32
Recombination
Logic
TM
VCOCT1
Adapt
10 Bit, or 8 Bit
Cyclic A/D
3:1 Input Mux
24
AFC_SEL
24 Bit
Adder
26 MHz
VCOCT2
AGCI
Battery
Save
Fine Channel
Accumulator #1
PRSCIN
DIG_AFC
Enable
TESTD
CREF
Battery
Save
TEST2
TCAPM
SERIALVCC
S/H
Loop
Filter
MOTOROLA WIRELESS SEMICONDUCTOR
SOLUTIONS – RF AND IF DEVICE DATA
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MC13760
Table 1. BGA Contact Identification
BALL #
BALL NAME
DESCRIPTION
SIGNAL TYPE
A1
PRAGNDDIG
Ground for the preamp substrate.
Ground
A2
PRAGND
Ground for the preamp.
Ground
A3
PREINGB
GSM IF preamp input.
RF Input
A4
PREINIB
TDMA IF preamp input.
RF Input
A5
BBFGND
Ground for the baseband filters.
Ground
A6
DCLQCP
DC Offset Correction Loop (input) capacitor – Q channel
Analog Input
A7
CREF
Bypass capacitor for the bandgap regulator.
Analog
A8
OUTQ
TDMA Q channel analog transmit data.
Analog Output
A9
OUTIB
TDMA I channel analog transmit data.
Analog Output
A10
TSLOTB
TDMA low level transmit slot.
Analog Output
A11
TSLOT
TDMA low level transmit slot.
Analog Output
B1
RFA0
RF attenuator 0 control line. (This line is a driver for an external RF attenuator.)
Digital Output
B2
DMXGND
Ground for the mixer.
Ground
B3
PREING
GSM IF preamp input.
RF Input
B4
PREINI
TDMA IF preamp input.
RF Input
B5
PRAVCC2
Supply for the preamp output stage.
Supply 2.775 V
B6
DCLICP
DC Offset Correction Loop (input) capacitor – I channel
Analog Input
B7
GPO3/test_so2
SPI port expansion 3. Or scan data output for MODROM module.
Digital Output
B8
TCAPP
Differential reference capacitor.
Analog
B9
REFGND
Ground for the internal reference.
Ground
B10
REFVCC
Supply for the internal reference.
Supply 2.775 V
B11
TCLK
TDMA low level transmit clock.
Analog Output
C1
DMXVCC
Supply for the mixer.
Supply 2.775 V
C2
DMXGNDDIG
Ground for the mixer substrate and quadrature generator.
Ground
C3
PRAVCC1
Supply for the preamp.
Supply 2.775 V
C4
BBFVCC
Supply for the baseband filters.
Supply 2.775 V
C5
DCLICIN
DC Offset Correction Loop (output) capacitor – TDMA – I channel
Analog Output
C6
DCLQCIN
DC Offset Correction Loop (output) capacitor – TDMA – Q channel
Analog Output
C7
TCAPM
Differential reference capacitor.
Analog
C8
OUTQB
TDMA Q channel analog transmit data.
Analog Output
C9
CLKSEL
Selects the source for the clock output to the digital circuitry of the radio as
either the crystal reference/divided crystal reference or the Step Up
PLL/divided Step Up PLL. A low on this pin selects the crystal
reference/divided crystal reference. A high on this pin selects the Step Up
PLL/divided Step Up PLL. Integrated weak pulldown.
Digital Input
C10
TCLKB
TDMA low level transmit clock.
Analog Output
C11
QGND
Quiet analog ground for the PA D/A and the data processing circuits.
Ground
D1
LOIN
Input port for the second LO VCO signal.
RF Input
D2
DMXVCCDIG
Supply for the quadrature generator.
Supply 2.775 V
D3
TEST2/EERQ
Test input/MUX 2 output. (Various signals are buffered and MUX’d to this pin.
Output signal is determined by programming of test bits.) Or with EER active,
TDMA Q channel transmit data.
Analog Test Point
D4
TEST1/EERI
Test input/MUX 1 output. (Various signals are buffered and MUX’d to this pin.
Output signal is determined by programming of test bits.) Or with EER active,
TDMA I channel transmit data.
Analog Test Point
D6
PKGGND1
Ground for the package flag (no direct connection to die).
Pkg Ground
D8
OUTI
TDMA I channel analog transmit data.
Analog Output
D9
TESTD/GPO4
Digital test point. (Various digital signals are MUX’d to this pin. Output is
determined by programming of test bits.) Or SPI port expansion 4.
Digital Test Point
Digital Output
MOTOROLA WIRELESS SEMICONDUCTOR
SOLUTIONS – RF AND IF DEVICE DATA
3
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MC13760
Table 1. BGA Contact Identification (continued)
BALL #
BALL NAME
DESCRIPTION
SIGNAL TYPE
D10
QVCC
Quiet analog supply for the PA D/A and the data processing circuits.
Supply 2.775 V
D11
NGND
Noisy analog ground for the VCO D/A, AOC D/A and the data processing
circuits.
Ground
E1
VAG
Analog ground.
Analog
E2
AGCGND
Ground for the AGC.
Ground
E3
VAGBYP
Bypass capacitor for the analog ground voltage.
Analog
E9
NVCC
Noisy analog supply for the VCO D/A, AOC D/A and the data processing
circuits.
Supply 2.775 V
E10
RSTB
Reset. Low true input. Integrated weak pullup.
Digital Input
E11
TM
Enable for the internal scan test.
Digital Input
F1
AGCVCC
Supply for the AGC.
Supply 2.775 V
F2
TXKEYOUT/test_so4
Conditioned TXKEY out.
Or scan data output for reference clock module.
Digital Output
F3
AGC
Capacitor for the TDMA AGC.
Analog
F4
PKGGND2
Ground for the package flag (no direct connection to die).
Pkg Ground
F8
PKGGND3
Ground for the package flag (no direct connection to die).
Pkg Ground
F9
PLLCPVCC
Supply for the Step Up PLL phase detector and charge pump.
Supply 5.0 V
F10
CLKOUT
Clock output to the digital circuitry of the radio. Ranges are 13.0 to 16.8 MHz, or
26.0 to 33.6 MHz. The actual frequency provided will depend upon the
configuration of the Step Up PLL and the SPI selected configuration of the
MC13760.
Analog Output
F11
PLLCP
Charge pump output for the Step Up PLL.
Analog Output
G1
PRSCIN
Main LO prescaler input.
RF Input
G2
MAINGND
Ground for the main prescaler and divider.
Ground
G3
AOCDRIVE
Output to the PA bias circuitry drive input. (Output drive impedance is 620
Ohms.)
Analog Output
G9
PLLEMIT
Emitter of the oscillator transistor for the Step Up PLL.
RF Output
G10
REFPLLVCC
Supply for the Step Up PLL VCO and dividers.
Supply 2.775 V
G11
PLLBASE/vco_clk
Base of the oscillator transistor for the Step Up PLL.
Or scan clock input for VCO clock zone.
RF Input
H1
SATDET/test_si4
Input indicating saturation.
Or scan data input for reference clock module.
Digital Input
H2
GPO2/test_so8
SPI port expansion 2. Or Main PLL Adapt Timer output. Or scan data output for
SSI module.
Digital Output
H3
MAINVCC
Supply for the main prescaler and divider.
Supply 2.775 V
H4
MNCPVCC
Supply for the main phase detector and charge pump.
Supply 5.0 V
H6
PKGGND4
Ground for the package flag (no direct connection to die).
Pkg Ground
H8
TXE/TXKEY/test_si8
Transmit slot enable in TDMA mode; digital input to start/stop the PA Control
sequence in GSM mode. Or scan data input for SSI module.
Digital Input
H9
RXACQ/test_si7
Serial bus enable.
Or scan data input for 5 bit and 8 bit xtal clock dividers.
Digital Input
H10
REFPLLGND
Ground for the Step Up PLL.
Ground
H11
4
SERIALVCC
Supply for the SSI and SPI serial communication ports.
Supply 1.8 — 2.775V
J1
GPO1/test_so1
SPI port expansion 1. Or Coarse Tune Adapt Timer output. Or scan data output
for main Frac–N.
Digital Output
J2
VCOCT2
High current (ADAPT) output of the 6 bit main RX VCO Coarse Tune D/A.
Analog Output
J3
DETSW/test_si1
Output to the PA control circuitry power range input (open drain).
Or scan data input for main Frac–N.
Analog Output
J4
SFVCC
Supply for the super filter.
Supply 2.775 V
J5
ASW/sc_inp1
TDMA antenna switch control input. Or scan data input for reference clock
Frac–N accumulator module.
Digital Input
MOTOROLA WIRELESS SEMICONDUCTOR
SOLUTIONS – RF AND IF DEVICE DATA
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MC13760
Table 1. BGA Contact Identification (continued)
BALL #
BALL NAME
DESCRIPTION
SIGNAL TYPE
J6
VCNTO
TDMA RFPA gain control voltage output.
Analog Output
J7
OSCVCC
Supply for the crystal oscillator.
Supply 2.775 V
J8
XTALWARP
Output of the 9 bit WARP D/A to be used for compensation/correction of the
reference crystal frequency.
Analog Output
J9
OSCENB
Digital input used to control the crystal oscillator circuit. A logic low selects the
internal oscillator. Integrated weak pulldown.
Digital Input
J10
RXCLK/test_so3
SSI RX clock in GSM mode; not used in TDMA mode.
Or scan data output for transmit power amp control module.
Digital Output
J11
SRD/test_so6
SSI receive data. Or scan data output for Adapt Generator module.
Digital Output
K1
VCOCT1
Low current output of the 6 bit main RX VCO Coarse Tune D/A.
Analog Output
K2
MNCPGND
Ground for the main phase detector and charge pump.
Ground
K3
SFGND
Ground for the super filter.
Ground
K4
SFBYP
Bypass capacitor for the super filter. (1.0 µf)
Analog
K5
OSCGND
Ground for the crystal oscillator.
Ground
K6
XTALBASE/sc_clk26
Crystal oscillator base. Or scan clock input for xtal clock zone.
RF Input
K7
LOGICVCC
Supply for the main synthesizer logic, adapt control and test MUXs.
Supply 2.775 V
K8
CEX
Digital input that latches in the SPI data. (Low Active)
Digital Input
K9
SPICLK
SPI clock input.
Digital Input
K10
STD/test_si3
SSI transmit data. Or scan data input for transmit.
Digital Input
K11
TXCLK/SCK/test_so5
Bit clock for TX data transfer in GSM mode. Bit clock for RX and TX data
transfer in TDMA mode. Or scan data output for reference clock Frac–N
accumulator module.
Digital Output
L1
ADAPT
Synthesizer output to adapt the loop filter for the main PLL.
Analog Output
L2
CPGT
Charge pump output for the main TX LO (GSM).
Analog Output
L3
CPGITR
Charge pump output for the main RX LO (GSM, TDMA TX and RX).
Analog Output
L4
SFOUT
Super filter output. (45 mA max) (bypass with 0.01 µf)
Analog Output
L5
VBLIN
TDMA RFPA bias control voltage output.
Analog Output
L6
XTALEMIT
Crystal oscillator emitter.
RF Output
L7
LOGICGND
Ground for the main synthesizer logic, adapt control and test MUXs.
Ground
L8
SERIALGND
Ground for the SSI and SPI serial communication ports.
Ground
L9
SPII
SPI data input.
Digital Input
L10
DMCS/test_si2
Digital input that starts the GSM TX modulation.
Or scan data input for MODROM module.
Digital Input
L11
RXFS/SFS/test_so7
RX SSI frame sync in GSM mode; SSI frame sync in TDMA mode.
Or scan data output for 5 bit and 8 bit xtal clock dividers.
Digital Output
MOTOROLA WIRELESS SEMICONDUCTOR
SOLUTIONS – RF AND IF DEVICE DATA
5
MC13760
OUTLINE DIMENSIONS
PLASTIC PACKAGE
CASE 1224B–01
(BGA–104)
ISSUE B
D
X
LASER MARK FOR
PIN 1 IDENTIFICATION
IN THIS AREA
Y
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
M
K
E
DIM
A
A1
A2
b
D
E
e
M
0.20
e
8X
9
8
7
4
3
2
MILLIMETERS
MIN
MAX
0.95
1.30
0.20
0.34
0.94 REF
0.30
0.50
8.00 BSC
8.00 BSC
0.80 BSC
METALIZED MARK FOR
PIN A1 IDENTIFICATION
IN THIS AREA
1
5
A
B
8X
C
e
A
0.30 Z
A2
D
E
F
G
H
J
3
81X
A1
81X
Z
4
0.15 Z
DETAIL K
ROTATED 90 _ CLOCKWISE
b
0.25
M
Z X Y
0.10
M
Z
VIEW M–M
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HOME PAGE: http://www.motorola.com/semiconductors/
6
◊
MC13760PP/D
MOTOROLA WIRELESS SEMICONDUCTOR
SOLUTIONS – RF AND IF DEVICE DATA