Freescale Semiconductor, Inc. MOTOROLA Document order number: MC33661 Rev 3.0, 10/2004 SEMICONDUCTOR TECHNICAL DATA Advance Information 33661 LIN Enhanced Physical Interface Freescale Semiconductor, Inc... Local Interconnect Network (LIN) is a serial communication protocol designed to support automotive networks in conjunction with Controller Area Network (CAN). As the lowest level of a hierarchical network, LIN enables cost-effective communication with sensors and actuators when all the features of CAN are not required. LIN INTERFACE The 33661 is a Physical Layer component dedicated to automotive LIN subbus applications. It offers slew rate selection for optimized operation at 10 kbps and 20 kbps, fast baud rate (above 100 kbps) for test and programming modes, excellent radiated emission performance, and safe behavior in the event of LIN bus short-to-ground or LIN bus leakage during low-power mode. Features • Operational from VSUP 6.0 V to 18 V DC, Functional up to 27 V DC, and Handles 40 V During Load Dump • Active Bus Waveshaping Offering Excellent Radiated Emission Performance • 5.0 kV ESD on LIN Bus Terminal • 30 kΩ Internal Pullup Resistor • LIN Bus Short-to-Ground or High Leakage in Sleep Mode • -18 V to +40 V DC Voltage at LIN Terminal • 8.0 µA Standby Current in Sleep Mode • Local and Remote Wake-Up Capability Reported by INH and RXD Terminals • 5.0 V and 3.3 V Compatible Digital Inputs Without Any External Components Required D SUFFIX CASE 751-06 8-TERMINAL SOICN ORDERING INFORMATION Device Temperature Range (TA) Package MC33661D/R2 -40°C to 125°C 8 SOICN 33661 Simplified Application Diagram VPWR 33661 WAKE VSUP INH 12.0 V / 5.0 V Regulator EN MCU RXD LIN TXD GND LIN Bus This document contains certain information on a new product. Specifications and information herein are subject to change without notice. © Motorola, Inc. 2004 For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. VSUP WAKE 20 µA INH Control EN INH Control Freescale Semiconductor, Inc... RXD 30 kΩ Receiver LIN TXD Slope Control GND Figure 1. 33661 Simplified Internal Block Diagram 33661 2 MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. RXD 1 8 INH EN 2 7 VSUP WAKE 3 6 LIN TXD 4 5 GND Freescale Semiconductor, Inc... TERMINAL DEFINITIONS A functional description of each terminal can be found in the System/Application Information section beginning on page 13. Terminal Terminal Name Formal Name 1 RXD Receiver Output 2 EN Enable Control 3 WAKE Wake Input 4 TXD Transmitter Input 5 INH Inhibit Output This terminal can have two main functions: controlling an external switchable voltage regulator or driving a bus external resistor in the master node application. 6 VSUP Power Supply Device power supply terminal. 7 LIN LIN Bus Represents the single-wire bus transmitter and receiver. 8 GND Ground Device ground terminal. Definition MCU interface that reports the state of the LIN bus voltage. Controls the operation mode of the interface. A high-voltage input used to wake up the device from sleep mode. MCU interface to control the state of the LIN output. MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA For More Information On This Product, Go to: www.freescale.com 33661 3 Freescale Semiconductor, Inc. MAXIMUM RATINGS All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit ELECTRICAL RATINGS Power Supply Voltage VSUP 27 Transient Voltage (Load Dump) 40 WAKE DC and Transient Voltage (Through a 33 kΩ Serial Resistor) Freescale Semiconductor, Inc... V Continuous Supply Voltage VWAKE -18 to 40 V Logic Terminals (RXD, TXD, EN) VLOG -0.3 to 5.5 V LIN VBUS V -18 to 40 DC Voltage Transient (Coupled Through 1.0 nF Capacitor) -150 to 100 INH DC Voltage VINH -0.3 to VSUP + 0.3 V DC Current IINH 40 mA ESD Human Body Model (Note 1) VESD1 V All Terminals ±2000 LIN Terminal with Respect to Ground ±5000 ESD Machine Model (Note 2) VESD2 V ±200 All Terminals THERMAL RATINGS °C Operating Temperature Ambient TA -40 to 125 Junction TJ -40 to 150 TS -40 to 150 °C RθJA 150 °C/W TSOLDER 240 °C Thermal Shutdown TSHUT 150 to 200 °C Thermal Shutdown Hysteresis THYST 8.0 to 20 °C Storage Temperature Thermal Resistance Junction to Ambient Peak Package Reflow Temperature During Solder Mounting (Note 3) Notes 1. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω). 2. ESD2 testing is performed in accordance with the Machine Model (CZAP = 220 pF, RZAP = 0 Ω). 3. Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 33661 4 MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. STATIC ELECTRICAL CHARACTERISTICS Characteristics noted under conditions 7.0 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max Unit Nominal DC Voltage VSUP 7.0 13.5 18.0 V Functional DC Voltage VSUP 6.0 – – 8.0 12 VSUP TERMINAL (DEVICE POWER SUPPLY) TA ≥ 25°C V µA Freescale Semiconductor, Inc... Supply Current in Sleep Mode VSUP ≤ 13.5 V, Bus Recessive IS1 – 13.5 V < VSUP < 18 V IS2 – – 200 IS3 – 300 – Bus Recessive, Excluding INH Output Current IS(N-REC) – 4.0 6.0 Bus Dominant, Total Bus Load >500 Ω, Excluding INH Output Current IS(N-DOM) – 6.0 8.0 0 – 0.9 VEN = 5.0 V, IOUT ≤ 250 µA 4.25 – 5.25 VEN = 3.3 V, IOUT ≤ 250 µA 3.0 – 3.5 VSUP ≤ 13.5 V, Bus Dominant or Shorted to GND Supply Current in Normal, Slow or Fast Mode mA RXD OUTPUT TERMINAL (LOGIC) Low-Level Voltage Output VOL IIN ≤ 1.5 mA High-Level Voltage Output V VOH V TXD INPUT TERMINAL (LOGIC) Low-Level Voltage Input VIL – – 1.2 V High-Level Voltage Input VIH 2.5 – – V VINHYST 100 300 800 mV -60 -35 -20 Input Threshold Hysteresis Pullup Current Source µA IS1 VEN = 5.0 V, 1.0 V < VTXD < 3.5 V ENABLE INPUT TERMINAL (LOGIC) Low-Level Voltage Input VIL – – 1.2 V High-Level Voltage Input VIH 2.5 – – V VINHYST 100 300 800 mV 5.0 20 30 – 20 40 – – 1.4 VSUP - 1.0 – – Input Threshold Hysteresis Low-Level Input Current µA IIL VIN = 1.0 V High-Level Input Current µA IIH VIN = 4.0 V LIN BUS TERMINAL (VOLTAGE EXPRESSED VERSUS VSUP VOLTAGE) Low-Level Dominant Voltage VLINlow External Bus Pullup 500 Ω High-Level Voltage V VLINhigh TXD High, IOUT = 1.0 µA, Recessive State MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA V For More Information On This Product, Go to: www.freescale.com 33661 5 Freescale Semiconductor, Inc. STATIC ELECTRICAL CHARACTERISTICS (continued) Characteristics noted under conditions 7.0 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max Unit LIN BUS TERMINAL (VOLTAGE EXPRESSED VERSUS VSUP VOLTAGE) (continued) Pullup Resistor to VSUP (Normal Mode) RPU 20 30 47 kΩ Pullup Current Source (Sleep Mode) IPU – 20 – µA IOV-CUR 50 75 150 mA IOV-DELAY – 10 – µs 0 3.0 20 -1.0 – 1.0 – 1.0 10 0 – 0.4 VSUP Overcurrent Shutdown Threshold Overcurrent Shutdown Delay (Note 4) Leakage Current to GND Freescale Semiconductor, Inc... µA IBUS-PAS-REC Recessive State, 8.0 V ≤ VSUP ≤ 18 V, 8.0 V ≤ VLIN ≤ 18 V GND Disconnected IBUS no GND VGND = VSUP, VLIN at -18 V Leakage Current to GND mA µA IBUS VSUP Disconnected, VLIN at +18 V LIN Receiver VIL VLIN-VIL TXD High, RXD Low LIN Receiver VIH V VLIN-VIH TXD High, RXD High LIN Receiver Threshold Center V 0.6 VSUP – VSUP 0.475 0.5 0.525 VLINTHRES (VLIN-VIH - VLIN-VIL) / 2 LIN Receiver Input Hysteresis VSUP VLINHYST VLIN-VIH - VLIN-VIL VSUP – – 0.175 VLINWU – 0.5 – VSUP INHON – 35 70 Ω 0 – 5.0 HIGH-to-LOW Transition VWUTHRESHL 0.3 VSUP 0.43 VSUP 0.55 VSUP LOW-to-HIGH Transition VWUTHRESLH 0.4 VSUP 0.55 VSUP 0.65 VSUP Wake-Up Threshold Hysteresis VWUHYST 0.1 VSUP 0.16 VSUP 0.2 VSUP LIN Wake-Up Threshold INHIBIT OUTPUT TERMINAL INH Driver ON Resistance (Normal Mode) Leakage Current (Sleep Mode) µA ILEAK 0 < VINH < VSUP WAKE TERMINAL Typical Wake-Up Threshold (EN = 0 V, 7.0 V ≤ VSUP ≤ 18 V) (Note 5) WAKE Input Current V < 27 V V V µA IWIN1 – 1.0 5.0 Notes 4. This parameter is guaranteed by design; however, it is not production tested. 5. When VSUP > 18 V, the wake-up thresholds remain identical to the wake-up thresholds at 18 V. 33661 6 MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. DYNAMIC ELECTRICAL CHARACTERISTICS Characteristics noted under conditions 7.0 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max t DOM (MIN) – – 50 t DOM (MAX) – – 50 Measurement Threshold (50% TXD to 42.2% VSUP) t REC (MIN) – – 50 Measurement Threshold (50% TXD to 74.4% VSUP) t REC (MAX) – – 50 t DOM (MIN) to t REC (MAX) dt1 -10.44 – 8.12 t DOM (MAX) to t REC (MIN) dt2 -10.44 – 8.12 Measurement Threshold (50% TXD to 61.6% VSUP) t DOM (MIN) – – 100 Measurement Threshold (50% TXD to 25.1% VSUP) t DOM (MAX) – – 100 Measurement Threshold (50% TXD to 38.9% VSUP) t REC (MIN) – – 100 Measurement Threshold (50% TXD to 77.8% VSUP) t REC (MAX) – – 100 Unit LIN OUTPUT TIMING CHARACTERISTICS FOR NORMAL SLEW RATE µs Dominant Propagation Delay TXD to LIN (Note 6) Measurement Threshold (50% TXD to 58.1% VSUP) Measurement Threshold (50% TXD to 28.4% VSUP) µs Freescale Semiconductor, Inc... Recessive Propagation Delay TXD to LIN (Note 6) µs Propagation Delay Symmetry LIN OUTPUT TIMING CHARACTERISTICS FOR SLOW SLEW RATE µs Dominant Propagation Delay TXD to LIN (Note 6) µs Recessive Propagation Delay TXD to LIN (Note 6) µs Propagation Delay Symmetry t DOM (MIN) to t REC (MAX) dt1S -21.88 – 17.44 t DOM (MAX) to t REC (MIN) dt 2S -21.88 – 17.44 – 15 – – 3.5 6.0 – 3.5 6.0 -2.0 – 2.0 LIN OUTPUT DRIVER FAST SLEW RATE LIN Fast Slew Rate (Programming Mode) dv/dt fast V/µs Fast Slew Rate LIN RECEIVER CHARACTERISTICS Receiver Dominant Propagation Delay (Note 7) µs t RL LIN LOW to RXD LOW Receiver Recessive Propagation Delay (Note 7) µs t RH LIN HIGH to RXD HIGH Receiver Propagation Delay Symmetry µs t R-SYM t RL - t RH Notes 6. 7.0 V ≤ VSUP ≤ 18 V. Bus load R0 and C0: 1.0 nF/1.0 kΩ, 6.8 nF/660 Ω, 10 nF/500 Ω. 7. Measured between LIN signal threshold LIN-VIL or LIN-VIH and 50% of RXD signal. MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA For More Information On This Product, Go to: www.freescale.com 33661 7 Freescale Semiconductor, Inc. DYNAMIC ELECTRICAL CHARACTERISTICS (continued) Characteristics noted under conditions 7.0 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max Unit LIN Terminal Wake-Up Filter Time (LIN Bus Wake-Up) t WUF 40 70 120 µs EN Terminal Wake-Up Time t LWUE – 5.0 15 µs WAKE Terminal Filter Time t WF 10 – 70 µs Sleep Mode Delay t SD – 40 – t D_MS 5.0 – – µs t D_COM 50 – – µs SLEEP MODE AND WAKE-UP TIMINGS Freescale Semiconductor, Inc... EN HIGH to LOW Delay Between EN and TXD for Mode Selection (Note 8) Delay Between First TXD after Device Mode Selection (Note 8) µs Notes 8. This parameter is guaranteed by design; however, it is not production tested. 33661 8 MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. Timing Diagrams VSUP VSUP TXD R0 LIN RXD GND C0 Freescale Semiconductor, Inc... Note R0 and C0: 1.0 kΩ/1.0 nF, 660 Ω/6.8 nF, and 500 Ω/10 nF. Figure 2. Test Circuit for Timing Measurements TXD Recessive State VREC t REC(MAX) LIN 74.4% VSUP 58.1% VSUP t DOM(MIN) 60% VSUP 40% VSUP 42.2% VSUP 28.4% VSUP t DOM(MAX) t REC(MIN) RXD tRH tRL Figure 3. Timing Measurements for Normal Slew Rate TXD Recessive State t REC(MAX) VREC LIN 77.8% VSUP 61.6% VSUP t DOM(MIN) 60% VSUP 40% VSUP t DOM(MAX) 38.9% VSUP 25.1% VSUP t REC(MIN) RXD t RL t RH Figure 4. Timing Measurements for Slow Slew Rate MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA For More Information On This Product, Go to: www.freescale.com 33661 9 Freescale Semiconductor, Inc. Functional Diagrams EN EN INH INH t LWUE t LWUE TXD TXD t D_MS t D_MS t D_COM LIN Freescale Semiconductor, Inc... LIN RXD RXD (High Z) (High Z) Figure 8. EN Terminal Wake-Up and Slow Baud Rate Selection Figure 5. EN Terminal Wake-Up and Normal Baud Rate Selection WAKE WAKE t WF t WF INH INH EN EN TXD TXD t D_MS t D_COM t D_MS RXD (High Z) (High Z) Figure 9. WAKE Terminal Wake-Up and Slow Baud Rate Selection Figure 6. WAKE Terminal Wake-Up and Normal Baud Rate Selection Wake-Up Frame LIN 0.4 VSUP t WUF INH INH EN EN TXD TXD t D_MS t D_COM (High Z) t D_MS RXD Figure 7. LIN Bus Wake-Up and Normal Baud Rate Selection 33661 10 Wake-Up Frame 0.4 VSUP LIN tWUF RXD t D_COM LIN LIN RXD t D_COM t D_COM (High Z) Figure 10. LIN Bus Wake-Up and Slow Baud Rate Selection MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. EN = 1 and TXD = 1 EN EN TXD t 2 (5.0 µs) EN = 0 and TXD = 1 Toggle t 1 (35 µs) Reset to Previous Baud Rate Freescale Semiconductor, Inc... Figure 11. Fast Baud Rate Selection (Toggle Function) EN TXD (H) Device in Communication Mode Preparation to Sleep Mode Sleep Mode t SD Figure 12. Sleep Mode Enter MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA For More Information On This Product, Go to: www.freescale.com 33661 11 Freescale Semiconductor, Inc. Unpowered TXD HIGH and EN LOW > t1 (35 µs) Fast TXD HIGH and EN LOW to HIGH Toggle function Bus or WAKE terminal wake-up Awake Freescale Semiconductor, Inc... Sleep TXD HIGH and EN LOW to HIGH TXD LOW and EN LOW to HIGH Normal EN LOW for t 1 < 5.0 µs, then HIGH EN LOW for t 1 < 5.0 µs, then HIGH TXD HIGH Wait Slow TXD LOW and EN LOW to HIGH EN LOW for t 1 < 5.0 µs, then HIGH Slow Toggle function TXD HIGH and EN LOW > t1 (35 µs) EN LOW for t 1 < 5.0 µs, then HIGH Fast Note See Table 1 for explanation of mode transitions. Figure 13. Mode Transitions Table 1. Explanation of Mode Transitions Mode Bus INH EN TXD RXD Sleep Recessive state, driver off. 20 µA pullup current source. OFF LOW X High impedance. HIGH if external pullup to VDD. Awake Recessive state, driver off. 30 kΩ pullup active. ON LOW X Low. If external pullup, HIGH-toLOW transition reports wake-up. Normal Driver active. 30 kΩ pullup active. Slew rate normal (20 kbps). ON HIGH HIGH to enter normal mode. Once in normal mode: LOW to drive bus in dominant, HIGH to drive bus in recessive. Wait Slow Recessive state. Driver off. 30 kΩ pullup active. ON HIGH LOW Slow Driver active. 30 kΩ pullup active. Slew rate slow (10 kbps). ON HIGH LOW to enter slow mode. Once in slow mode: LOW to drive bus in dominant, HIGH to drive bus in recessive. Report bus level: • Low bus dominant • High bus recessive Fast Driver active. 30 kΩ pullup active. Slew rate slow (> 100 kbps). ON HIGH LOW to drive bus in dominant, HIGH to drive bus in recessive. Report bus level: • Low bus dominant • High bus recessive Report bus level: • Low bus dominant • High bus recessive HIGH X = Don’t care. 33661 12 MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. SYSTEM/APPLICATION INFORMATION INTRODUCTION The 33661 is a Physical Layer component dedicated to automotive LIN sub-bus applications. Digital inputs are 5.0 V and 3.3 V compatible without any external component required. The 33661 features include slew rate selection for optimized operation at 10 kbps and 20 kbps, fast baud rate for test and programming modes, excellent radiated emission performance, and safe behavior in case of LIN bus short-to-ground or LIN bus leakage during low power mode. The INH output may be used to control an external voltage regulator or to drive a LIN bus pullup resistor. Freescale Semiconductor, Inc... FUNCTIONAL TERMINAL DESCRIPTION VSUP Supply Terminal The VSUP supply terminal is the power supply terminal for the 33661. level at EN defines the VOH at RXD. The sleep mode is entered by setting EN LOW while TXD is HIGH. Sleep mode is active after the t1 filter time (see Figure 12, page 11). INH Output Terminal LIN Bus Terminal This I/O terminal represents the single-wire bus transmitter and receiver. TXD Input Terminal The TXD input terminal is the MCU interface to control the state of the LIN output. When TXD is LOW, LIN output is LOW; when TXD is HIGH, the LIN output transistor is turned OFF. The threshold is 3.3 V and 5.0 V compatible. The baud rate selection (normal or slow mode) is done at device wake-up by the state of the TXD terminal prior to a HIGH level at the EN terminal (see Figures 5 through 10, page 10). RXD Output Terminal The RXD output terminal is the MCU interface, which reports the state of the LIN bus voltage. LIN HIGH (recessive) is reported by a high voltage on RXD; LIN LOW (dominant) is reported by a low voltage on RXD. The RXD output structure is a CMOS-type push-pull output stage. The low level is fixed. The high level is dependant on the EN voltage. If EN is set at 3.3 V, RXD VOH is 3.3 V. If EN is set at 5.0 V, RXD VOH is 5.0 V. In the sleep mode, RXD is high impedance. When a wake-up event is recognized from WAKE terminal or from the LIN bus terminal, RXD is pulled LOW to report the wake-up event. An external pullup resistor may be needed. EN Input Terminal The EN input terminal controls the operation mode of the interface. If EN = 1, the interface is in normal mode, with transmission path from TXD to LIN and from LIN to RXD both active. The threshold is 3.3 V and 5.0 V compatible. The high MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA The INH output terminal may have two main functions. It may be used to control an external switchable voltage regulator having an inhibit input. The high drive capability also allows it to drive the bus external resistor in the master node application. This is illustrated in Figures 16 and 17, page 17. In sleep mode, INH is turned OFF. If a voltage regulator inhibit input is connected to INH, the regulator will be disabled. If the master node pullup resistor is connected to INH, the pullup resistor will be disabled from the LIN bus. WAKE Input Terminal The WAKE terminal is a high-voltage input used to wake up the device from the sleep mode. WAKE is usually connected to an external switch in the application. The typical wake thresholds are VSUP /2. The WAKE terminal has a special design structure and allows wake-up from both HIGH-to-LOW or LOW-to-HIGH transitions. When entering into sleep mode, the LIN monitors the state of the WAKE terminal and stores it as a reference state. The opposite state of this reference state will be the wake-up event used by the device to enter again into normal mode. An internal filter is implemented (40 µs typical filtering time delay). WAKE terminal input structure exhibits a high impedance, with extremely low input current when voltage at this terminal is below 14 V. When voltage at the WAKE terminal exceeds 14 V, input current starts to sink into the device. A serial resistor should be inserted in order to limit the input current mainly during transient pulses. Recommended resistor value is 33 kΩ. Important The WAKE terminal should not be left open. If the wake-up function is not used, WAKE should be connected to ground to avoid false wake-up. For More Information On This Product, Go to: www.freescale.com 33661 13 Freescale Semiconductor, Inc. OPERATIONAL MODES Introduction Sleep Mode The 33661 has two communication modes, transmitting and receiving modes, and two operational modes, normal and sleep. The normal mode is differentiated by the slew rate— normal, slow, or fast—of the LIN output. In the sleep mode, the transmission path is disabled and the 33661 is in low power mode. Supply current from VSUP is very low. Wake-up can occur from LIN bus activity from node internal wake-up through the EN terminal and from the WAKE input terminal. Operational Modes In the sleep mode, the 33661 has an internal 20 µA pullup source to VSUP. This avoids the high current path from the battery to ground in the event the bus is shorted to ground. (Refer to succeeding paragraphs describing wake-up behavior.) Freescale Semiconductor, Inc... Normal Mode In the normal mode, the 33661 has slew rate and timing compatible with the LIN protocol specification and can operate at 20 kbps. This mode is selected after sleep mode by setting the TXD terminal HIGH prior to setting EN from LOW to HIGH. Once normal mode is selected, it is impossible to select the slow mode unless the 33661 is set to sleep mode. Slow Mode In the slow mode, the slew rate is around half the normal slew rate, and bus speed operation is limited up to 10 kbps. The radiated emission is significantly reduced compared to the already excellent emission level of the normal mode. Slow mode is entered after sleep mode by setting the TXD terminal LOW prior to setting EN from LOW to HIGH. Once the slow mode is selected, it is impossible to select the normal mode unless the device is set to sleep mode. Fast Mode Device Wake-Up Events The 33661 can be awakened from sleep mode by three wake-up events: remote wake-up via LIN bus activity, internal node wake-up via the EN terminal, or toggling the WAKE terminal. Remote Wake from LIN Bus The LIN bus wake-up is recognized by a recessive-todominant transition, followed by a dominant level with a duration greater than 70 µs, followed by a dominant-torecessive transition. This is illustrated in Figures 7 and 10 on page 10. Once the wake-up is detected, the 33661 enters the “awake” mode, with INH HIGH and RXD pulled LOW. Wake-Up from Internal Node Activity In the fast mode, the slew rate is around 10 times faster than the normal mode. This allows very fast data transmission (>100 kbps)—for instance, for ECU tests and microcontroller program download. The bus pullup resistor might be reduced to ensure a correct RC time constant in line with the high baud rate used. Fast mode is entered via a special sequence (call toggle function) at the TXD and EN terminals described in Figure 11 on page 11. Fast mode can be selected from either normal or slow mode. Once in fast mode, the toggle function will bring the device back in the previously selected mode (normal or slow). A glitch on EN will also reset the device to the previously selected mode (normal or slow) as shown in Figure 11 on page 11. The 33661 can wake up by internal node activity through a LOW-to-HIGH transition of the EN terminal. When EN is switched from LOW to HIGH, the device is awakened and enters either the “normal” or the “wait slow” mode depending on the level of TXD input. The MCU must set the TXD terminal LOW or HIGH prior to waking up the device through the EN terminal. Wake-Up from WAKE Terminal If the WAKE input terminal is toggled, the 33661 enters the “awake” mode, with INH HIGH and RXD pulled LOW. Device Power-Up At power-up (VSUP rises from zero), the 33661 automatically switches in the “awake” mode. It switches the INH terminal to HIGH state and RXD to LOW state. The MCU of the application will then confirm normal or slow mode by setting the TXD and EN terminals appropriately. 33661 14 MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. ELECTROMAGNETIC COMPATIBILITY INFORMATION Radiated Emission in Normal and Slow Modes Freescale Semiconductor, Inc... The 33661 has been tested for radiated emission performances. Figures 14 and 15 show the results in the frequency range 100 kHz to 2.0 MHz. Test conditions are in accordance with CISPR25 recommendations, bus length of 1.5 meter, device loaded with 10 nF and 500 Ω bus impedance. Figure 14 displays the results when the device is set in the normal mode, optimized for baud rate up to 20 kbps. Figure 15 displays the results when the device is set in the slow mode, optimized for baud rate up to 10 kbps. The level of emissions is significantly reduced compared to the already excellent level of the normal mode. Figure 14. Radiated Emission in Normal Mode Figure 15. Radiated Emission in Slow Mode MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA For More Information On This Product, Go to: www.freescale.com 33661 15 Freescale Semiconductor, Inc. APPLICATIONS Motorola Device Compatibility: 33661 and 33399 The two Motorola devices are terminal-to-terminal compatible. Table 2 summarizes the differences between the two devices. Table 2. Compatibility Comparison Parameter Terminal Out and Package 33399 8-terminal SOICN. 2 baud rate operations: from 1.0 to 10 kbps and from 1.0 to 20 kbps. 1 baud rate operation from 1.0 to 20 kbps. Capable of: • Controlling an external switchable voltage regulator. • Driving a bus master termination resistor. Capable of controlling an external switchable voltage regulator. WAKE Terminal Identical to 33399. Identical to 33661. TXD, RXD, EN 5.0 V and 3.3 V compatible. 5.0 V compatible only. In normal, slow, and fast mode, 30 kΩ pullup. In sleep mode and bus short-to-ground, 20 µA pullup. 30 kΩ pullup in normal and sleep modes. Typical 8.0 µA. Typical 20 µA, maximum 50 µA. Normal, slow, fast, and sleep modes. Normal and sleep modes. Normal Mode Selected by TXD HIGH, then EN HIGH at device wake-up. Operation up to 20 kbps. Selected by TXD high and EN high at device wake-up. Operation up to 20 kbps. Slow Mode Selected by TXD LOW, then EN HIGH at device wake-up. Operation up to 10 kbps. N/A Fast Mode Selected by sequence at TXD and EN. Operation at baud rate >100 kbps. N/A Sleep Mode and Bus Wake-Up Recessive-to-dominant transition, followed by a dominant state of more than 70 µs, followed by a dominant-torecessive transition. Dominant level, 50 µs duration. Slew Rate Three slew rates: Normal (20 kbps), Slow (10 kbps), and Fast (>100 kbps). Normal and slow mode selected by EN and TXD terminal sequence at device wake-up. The sequence to enter normal mode is the same for both the 33399 and 33661. One slew rate: 20 kbps. Wake-Up from Internal Node Activity (LOW to HIGH transition of EN) If TXD is set HIGH and then EN is switched HIGH, the 33661 wakes up and the Normal Mode is selected. In this setup sequence, there is a direct compatibility between 33399 and 33661. TXD must be set HIGH prior to setting EN HIGH in order to avoid having the device send a dominant level on the bus at wake-up. Radiated Emission The level of radiated emissions measured in identical configurations is lower for the 33661 compared to the 33399 in the normal mode, allowing operation up to 20 kbps. If the 33661 device is set to the slow mode, allowing operation up to 10 kbps, the radiated emission level is significantly reduced. The level of radiated emissions measured in identical configurations is higher for the 33399 compared to the 33661 in the normal mode. Baud Rate Operation INH Output Freescale Semiconductor, Inc... 33661 8-terminal SOICN. LIN Bus Termination Sleep Current Mode 33661 16 MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. Typical Applications Figures 16 and 17 show typical applications of the 33661. VBAT 33661 VSUP > 33 kΩ External Switch WAKE EN I/O 20 µA INH Control Master Node Pullup Freescale Semiconductor, Inc... VDD INH Control MCU * VDD RXD VREG 12 V VDD 5.0 V 30 kΩ LIN Receiver LIN Bus TXD TXD (* optional) 1.0 kΩ RXD GND Slope Control Figure 16. Master Node Typical Application VBAT 33661 VSUP > 33 kΩ External Switch WAKE EN I/O 20 µA INH Control VDD INH Control MCU * VDD RXD VREG 12 V 5.0 V RXD VDD 30 kΩ Receiver LIN LIN Bus INH TXD TXD (* optional) Slope Control GND Figure 17. Slave Node Typical Application MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA For More Information On This Product, Go to: www.freescale.com 33661 17 Freescale Semiconductor, Inc. PACKAGE DIMENSIONS D SUFFIX 8-TERMINAL SOIC NARROW BODY PLASTIC PACKAGE CASE 751-06 ISSUE T D A 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETER. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. C 5 0.25 H E M B M 1 Freescale Semiconductor, Inc... 4 h B e X 45˚ θ A C SEATING PLANE L 0.10 A1 B 0.25 33661 18 M C B S A S DIM A A1 B C D E e H h L θ MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.19 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0˚ 7˚ MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. Freescale Semiconductor, Inc... NOTES MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA For More Information On This Product, Go to: www.freescale.com 33661 19 Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. Information in this document is provided solely to enable system and software implementers to use Motorola products. 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MOTOROLA and the Stylized M Logo are registered in the US Patent and Trademark Office. All other product or service names are the property of their respective owners. © Motorola, Inc. 2004 HOW TO REACH US: USA/EUROPE/LOCATIONS NOT LISTED: Motorola Literature Distribution P.O. Box 5405, Denver, Colorado 80217 1-800-521-6274 or 480-768-2130 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center 3-20-1 Minami-Azabu. Minato-ku, Tokyo 106-8573, Japan 81-3-3440-3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong 852-26668334 HOME PAGE: http://motorola.com/semiconductors For More Information On This Product, Go to: www.freescale.com MC33661