INTEGRATED CIRCUITS DATA SHEET PCB2421 1K dual mode serial EEPROM Preliminary specification Supersedes data of 1995 Oct 11 File under Integrated Circuits, IC12 1997 Apr 01 Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM PCB2421 CONTENTS 1 FEATURES 2 GENERAL DESCRIPTION 3 ORDERING INFORMATION 4 BLOCK DIAGRAM 5 PINNING 6 FUNCTIONAL DESCRIPTION 6.1 6.2 6.3 6.3.1 6.3.2 6.3.3 6.3.4 6.3.5 6.3.6 6.3.7 6.4 6.4.1 6.4.2 6.5 6.6 6.7 6.7.1 6.7.2 6.7.3 6.8 6.8.1 6.8.2 6.8.3 6.8.4 6.8.5 6.8.6 Transmit-only mode (DDC1) Initialization procedure Bidirectional mode (DDC2B, I2C-bus mode) Bidirectional mode bus characteristics Bus not busy (A) Start condition (B) Stop condition (C) Data valid (D) Acknowledge Slave address Write operation Byte write Page write Acknowledge polling Write protection Read operation Current address read Random read Sequential read Pin description SDA SCL VCLK WP Test n.c. 1997 Apr 01 2 7 LIMITING VALUES 8 DC CHARACTERISTICS 9 EEPROM CHARACTERISTICS 10 AC CHARACTERISTICS 11 APPLICATION INFORMATION 11.1 11.2 Diode protection Functional compatibility with microchip 24CL21 dual mode EEPROM 12 PACKAGE OUTLINES 13 SOLDERING 13.1 13.2 13.2.1 13.2.2 13.3 13.3.1 13.3.2 13.3.3 Introduction DIP Soldering by dipping or by wave Repairing soldered joints SO Reflow soldering Wave soldering Repairing soldered joints 14 DEFINITIONS 15 LIFE SUPPORT APPLICATIONS 16 PURCHASE OF PHILIPS I2C COMPONENTS Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM 1 PCB2421 FEATURES 2 • Single supply with operation 4.5 to 5.5 V GENERAL DESCRIPTION The Philips PCB2421 is a 128 × 8-bit dual mode serial Electrically Erasable PROM (EEPROM). This device is designed for use in applications requiring storage and serial transmission of configuration and control information. Two modes of operation have been implemented: transmit-only mode (DDC1 mode) and bidirectional mode (DDC2B, or I2C-bus mode). Upon power-up, the device will be in the transmit-only mode, sending a serial bitstream of the entire memory array contents, clocked by the VCLK pin. A valid HIGH-to-LOW transition on the SCL pin will cause the device to enter the bidirectional mode, with byte selectable read/write capability of the memory array. The PCB2421 is available in a standard 8-pin dual in-line and 8-pin small outline package operating in a commercial temperature range. • Completely implements DDC1/DDC2B interface for monitor identification • Low power CMOS technology • Two-wire I2C-bus interface • Self-timed write cycle (including auto-erase) • Page-write buffer for up to 8 bytes • Write-protect pin • 100 kHz I2C-bus compatibility • Designed for 10000 erase/write cycles minimum • Data retention greater than 10 years • 8-pin DIP and SO package • Temperature range 0 to +70 °C. 3 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION PCB2421P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 PCB2421T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 1997 Apr 01 3 Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM 4 PCB2421 BLOCK DIAGRAM book, full pagewidth VSS VDD 4 8 HV GENERATOR WP SDA SCL VCLK 3 5 6 7 I/O CONTROL LOGIC MEMORY CONTROL LOGIC EEPROM ARRAY X DECODER PAGE LATCHES Y DECODER PCB2421 n.c. TEST(1) 2 SENSE AMPLIFIER R/W CONTROL 1 MBG271 (1) Factory use only. Fig.1 Block diagram. 5 PINNING SYMBOL PIN DESCRIPTION TEST 1 factory use only: must be tied to VDD; may not be left open-circuit n.c. 2 may be tied to VSS, VDD, or left open-circuit WP 3 write protect input (LOW = write protected, HIGH = not write protected); may not be left open-circuit VSS 4 ground SDA 5 serial data input/output SCL 6 serial clock input/output (DDC2B) VCLK 7 serial clock input (transmit-only mode, DDC1) VDD 8 supply voltage 1997 Apr 01 handbook, halfpage TEST 1 n.c. 2 8 VDD 7 VCLK PCB2421 WP 3 6 SCL VSS 4 5 SDA MBG272 Fig.2 Pin configuration. 4 Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM 6 PCB2421 When the device has been switched into the bidirectional mode, the VCLK input is disregarded. This mode supports a two-wire bidirectional data transmission protocol (I2C-bus protocol). In the I2C-bus protocol, a device that sends data on the bus is defined to be the transmitter, and a device that receives data from the bus is defined to be the receiver. The bus must be controlled by a master device that generates the bidirectional mode clock, controls access to the bus, and generates the START and STOP conditions, while the PCB2421 acts as slave. Both master and slave can operate as transmitter or receiver, but the master device determines which mode is activated. FUNCTIONAL DESCRIPTION The PCB2421 operates in two modes, the transmit-only mode (DDC1) and the bidirectional mode (DDC2, or I2C-bus mode). There is a separate two-wire protocol to support each mode, each having a separate clock input and sharing a common data line (SDA). The device enters the transmit-only mode (DDC1) upon power-up. In this mode the device transmits data bits on the SDA pin in response to a clock signal on the VCLK pin. The device will remain in this mode until a valid HIGH-to-LOW transition is placed on the SCL input. When a valid transition on SCL is recognized, the device will switch into the bidirectional mode (see Fig.3). The only way to switch the device back to the transmit-only mode (DDC1) is to remove power from the device. 6.1 6.3.1 The following bus protocol has been defined: • Data transfer may be initiated only when the bus is not busy Transmit-only mode (DDC1) • During data transfer, the data line must remain stable whenever the clock line is HIGH. Changes in the data line while the clock line is HIGH will be interpreted as a START or STOP condition. The device will power-up in the transmit-only mode. This mode supports a unidirectional two-wire protocol for transmission of the contents of the memory array (see Fig.12). The PCB2421 requires that it be initialized prior to valid data being sent in the transmit-only mode (see Section “Initialization procedure”, and Fig.4). Accordingly, the following bus conditions have been defined (see Fig.6). In this mode, data is transmitted on the SDA pin in 8-bit bytes, each byte followed by a ninth clock pulse during which time SDA is left high-impedance. The clock source for the transmit-only mode is provided on the VCLK pin; a data bit is output on the rising edge on this pin. The 8 bits in each byte are transmitted most significant bit first. Each byte within the memory array will be output in sequence. When the last byte in the memory array is transmitted, the output will wrap around to the first location and continue. The bidirectional mode clock (SCL) pin must be held HIGH for the device to remain in the transmit-only mode. 6.2 6.3.2 6.3.3 START CONDITION (B) A HIGH-to-LOW transition of the SDA line while SCL is HIGH determines a START condition. All commands must be preceded by a START condition. 6.3.4 STOP CONDITION (C) A LOW-to-HIGH transition of the SDA line while SCL is HIGH determines a STOP condition. All operations must be ended with a STOP condition. Initialization procedure 6.3.5 DATA VALID (D) The state of the data line represents valid data when, after a START condition, the data line is stable for the duration of the HIGH period of the clock signal. The data on the line must be changed during the LOW period of the clock signal. There is one clock pulse per bit of data. Each data transfer is initiated with a START condition and terminated with a STOP condition. The maximum number of data bytes transferred between the START and STOP conditions during a write operation is 8 bytes (see Section “Page write” and Fig.5). Bidirectional mode (DDC2B, I2C-bus mode) The PCB2421 can be switched into the bidirectional mode (see Fig.3) by applying a valid HIGH-to-LOW transition on the bidirectional mode clock (SCL). 1997 Apr 01 BUS NOT BUSY (A) Both data (SDA) and clock (SCL) lines remain HIGH. At power-on, after VDD has stabilized, the device will be in the transmit-only mode. Nine clock cycles on the VCLK pin must be given to the device for it to perform internal synchronization. During this period, the SDA pin will be in a high-impedance state. On the rising edge of the tenth clock cycle, the device will output the first valid data bit which will be the most significant bit of a byte. The device will power-up with address pointer at 00H (see Fig.4). 6.3 BIDIRECTIONAL MODE BUS CHARACTERISTICS 5 Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM PCB2421 The maximum number of data bytes transferred between START and STOP conditions during a read operation is unlimited. 6.3.6 and will be written into the address pointer of the PCB2421. After receiving another acknowledge signal from the PCB2421, the master device will transmit the data word to be written into the addressed memory location. The PCB2421 acknowledges again and the master generates a STOP condition. This initiates the internal write cycle, and during this time the PCB2421 will not generate acknowledge signals. ACKNOWLEDGE The PCB2421, when addressed in DDC2B mode, is obliged to generate an acknowledge after the reception of each byte. The master device must generate an extra (9th) clock pulse which is associated with this acknowledge bit. The PCB2421 does not generate an acknowledge if an internal programming cycle is in progress (SDA line is left HIGH during the 9th clock pulse). The PCB2421 generates an acknowledge by pulling down the SDA line during the acknowledge pulse in such a way that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse. Set-up and hold times must also be taken into account. The master receiver must signal an end of data to the PCB2421 by not generating an acknowledge bit on the last byte that has been clocked out of the slave transmitter. In this case, the slave transmitter PCB2421 must leave the data line HIGH to enable the master to generate the STOP condition. 6.3.7 6.4.2 For a page write, the write control byte, word address, and the first data byte are transmitted to the PCB2421 in the same way as in a single byte write. But instead of generating a STOP condition the master transmits up to eight data bytes to the PCB2421 which are temporarily stored in the on-chip page buffer and will be written into the memory after the master has transmitted a STOP condition. After the receipt of each word, the three lower order address pointer bits are internally incremented by one. The higher order four bits of the word address remain constant. A maximum of 8 bytes can be written in one operation. As with the byte write operation, once the STOP condition is received an internal write cycle will begin (see Figs 5 and 8). SLAVE ADDRESS After generating a START condition, the bus master transmits the slave address (MSB first) consisting of a 7-bit device address (1010000) for the PCB2421. The eighth bit of the slave address determines if the master device wants to read or write to the PCB2421 (R/W bit) (see Fig.7). The PCB2421 monitors the bus for its corresponding slave address all the time. It generates an acknowledge bit if the slave address was true and it is not in a programming mode. Table 1 SLAVE ADDRESS R/W Read 1010000 1 Write 1010000 0 6.4 6.4.1 6.5 6.6 Write operation Write protection Pin 3 is a write protect input (WP). In the DDC1 mode, the PCB2421 can only be read according to the DDC1 protocol, hence the WP input has no effect in this mode. In the DDC2B mode, when WP is connected to ground, the entire EEPROM is write-protected, regardless of other pin states. When connected to VDD, write-protection is disabled and the EEPROM may be programmed. WP may not be left open-circuit. BYTE WRITE Following the START condition from the master, the device address (7 bits), and the R/W bit (logic LOW for write) is placed on the bus by the master transmitter. This indicates to the addressed slave receiver that a byte with a word address will follow after it has generated an acknowledge bit during the ninth clock cycle. Therefore the next byte transmitted by the master is the word address 1997 Apr 01 Acknowledge polling Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the STOP condition for a write command has been issued from the master, the device initiates the internally timed write cycle. Acknowledge (ACK) polling can be initiated immediately. This involves the master sending a START condition followed by the control byte for a write command (R/W = 0). If the device is still busy with the write cycle, then no ACK will be returned. If the cycle is complete, then the device will return the ACK and the master can then proceed with the next read or write command. See Fig.9 for flow diagram. Slave address OPERATION PAGE WRITE 6 Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM Table 2 PCB2421 opposed to a STOP condition in a random read. This directs the PCB2421 to transmit the next sequentially addressed 8-bit word. To provide sequential reads the PCB2421 contains an internal address pointer which is incremented by one at the completion of each operation. This address pointer allows the entire memory contents to be serially read during one operation. Mode configurations DDC WP MODE DCC1 X(1) R DCC2 1 R/W 0 R Note 6.8 1. Where X = don’t care. 6.8.1 6.7 Read operation CURRENT ADDRESS READ The PCB2421 contains an address counter that maintains the address of the last word accessed, internally incremented by one. Therefore, if the previous access (either a read or write operation) was to address ‘n’, the next current address read operation would access data from address n + 1. Upon receipt of the slave address with R/W set to logic 1, the PCB2421 issues an acknowledge and transmits the eight bit data word. The master will not acknowledge the transfer but does generate a STOP condition and the PCB2421 discontinues transmission (see Fig.10). 6.8.2 RANDOM READ VCLK This pin is the clock input for the transmit-only mode (DDC1). In the transmit-only mode, each bit is clocked out on the rising edge of this signal. In DDC2B mode, this input is a don’t care. Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, the word address must first be set. This is done by sending the word address to the PCB2421 as part of a normal write operation. After the word address is sent, the master generates a REPEATED START condition following the acknowledge. This terminates the write operation, but not before the internal address pointer is set. The master then issues the control byte again but with the R/W bit set to logic 1. The PCB2421 will then issue an acknowledge and transmits the 8-bit data word. The master will not acknowledge the transfer but does generate a STOP condition and the PCB2421 discontinues transmission (see Fig.11). 6.7.3 SCL This pin is the clock input for the bidirectional mode (I2C-bus, DDC2B), and is used to synchronize data transfer to and from the device. It is also used as the signalling input to switch the device from the transmit-only mode to the bidirectional mode. It must remain HIGH for the chip to continue operation in the transmit-only mode (DDC1). 6.8.3 6.7.2 SDA This pin is used to transfer addresses and data into and out of the device, when the device is in the bidirectional (I2C-bus, DDC2B) mode. In the transmit-only mode (DDC1), which only allows data to be read from the device, data is also transferred on the SDA pin. This pin is an open-drain terminal, therefore the SDA bus requires a pull-up resistor connected to VDD (typically 10 kΩ for 100 kHz). See brochure “The I2C-bus and how to use it” (order no. 9398 393 40011) or “Data Handbook IC12”. Read operations are initiated in the same way as write operations with the exception that the R/W bit of the slave address is set to logic 1. There are three basic types of read operations: current address read, random read, and sequential read. 6.7.1 Pin description 6.8.4 WP This pin is used to inhibit writing of the EEPROM. When this pin is connected to ground, writing of the EEPROM is inhibited. When connected to VDD (and VCLK = VDD), the EEPROM can be programmed. WP may not be left open-circuit. WP input is a ‘don’t care’ in DDC1 mode. 6.8.5 TEST Pins 1 is a TEST pin for factory use only. It must be connected to VDD in the application. SEQUENTIAL READ 6.8.6 Sequential reads are initiated in the same way as a random read except that after the PCB2421 transmits the first data byte, the master issues an acknowledge as 1997 Apr 01 N.C. This pin has no connection and may be tied to VSS, VDD or left open-circuit. 7 Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM PCB2421 transmit only mode (DDC1) handbook, full pagewidth bidirectional mode (DDC2) SCL tVHZ SDA VCLK MBG275 Fig.3 Mode transition diagram. dbook, full pagewidth VDD SCL tVAA SDA tVAA high-impedance for 9 clock cycles 1 bit 8 2 8 9 10 bit 7 11 VCLK MBG276 tVPU Fig.4 Device initialization diagram. 1997 Apr 01 8 Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM handbook, full pagewidth PCB2421 Word Address Row X0000000 0 X0001. . . 1 X0010101 2 X0011. . . 3 column 1 2 3 4 5 6 0 1 4 2 5 3 4 6 7 8 1 2 3 5 6 7 MBG277 X = don’t care. Fig.5 Example of writing 8 bytes with word address X0000000 and 6 bytes with word address X0010101. handbook, full pagewidth (A) (B) (D) (D) (C) SCL SDA START condition data or data allowed acknowledge to change valid Fig.6 DDC2B data transfer sequence on the I2C-bus. 1997 Apr 01 9 STOP condition MBG278 Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM handbook, halfpage 1 0 PCB2421 1 0 0 0 0 R/W MBG279 Fig.7 Slave address. handbook, full pagewidth S acknowledgement from slave SLAVE ADDRESS 0 A X acknowledgement from slave WORD ADDRESS A R/W don't care acknowledgement from slave DATA A P n bytes auto increment memory word address Fig.8 I2C-bus write protocol (n = maximum 8 bytes). 1997 Apr 01 10 WRITING t WR MBG280 Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM handbook, halfpage PCB2421 SEND WRITE COMMAND SEND STOP CONDITION TO INITIATE WRITE CYCLE SEND START SEND CONTROL BYTE WITH R/W = 0 DID DEVICE ACKNOWLEDGE (ACK = 0)? no yes NEXT OPERATION MBG281 Fig.9 Acknowledge polling. slave address + R/W handbook, full pagewidth data START STOP SDA S P R/W MBG282 NO ACK ACK Fig.10 Current address read. 1997 Apr 01 11 Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM handbook, full pagewidth slave address + R/W PCB2421 DATA rep START slave address + R/W DATA STOP START SDA S MBG283 S R/W R/W ACK ACK Fig.11 Random read. 1997 Apr 01 P 12 NO ACK Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM PCB2421 7 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT −0.3 +7.0 V −0.5 VDD(max) + 0.5 V DC input current −10 +10 mA IO DC output current −10 +10 mA Ptot total power dissipation − 150 mW Po power dissipation per output − 50 mW Tstg storage temperature −65 +150 °C Tamb operating ambient temperature Ves electrostatic discharge VDD supply voltage Vn input voltage on any pin II measured via 500 Ω resistor without EEPROM retention with EEPROM retention note 1 −65 +70 °C 0 +70 °C −2000 +2000 V Note 1. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. 8 DC CHARACTERISTICS VDD = 4.5 to 5.5 V; VSS = 0 V; Tamb = 0 to +70 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. VDD supply voltage 4.5 VIH HIGH level input voltage (pins 3, 5 and 6) VIL TYP. − MAX. UNIT 5.5 V 0.7VDD − − V LOW level input voltage (pins 3, 5 and 6) − − 0.3VDD V VIH(7) HIGH level input voltage (pin 7) 2.0 − − V VIL(7) LOW level input voltage (pin 7) − − 0.8 V VOL LOW level output voltage IOL = 3 mA; VDD = 4.5 V − − 0.4 V ILI input leakage current VI = 0 to 5.5 V −10 − +10 µA ILO output leakage current VO = 0 to 5.5 V −10 − +10 µA IDD(write) operating write current fSCL = 100 kHz; VDD = 5.5 V − − 1000 µA IDD(read) operating read current fSCL = 100 kHz; VDD = 5.5 V − − 400 µA IDD(st) standby current VDD = 5.5 V; DDC2B mode; VCLK = SDA = SCL = VDD − − 30 µA 9 EEPROM CHARACTERISTICS VDD = 4.5 to 5.5 V; VSS = 0 V; Tamb = 0 to +70 °C; unless otherwise specified. SYMBOL PARAMETER MIN. MAX. UNIT tWR EEPROM write time − 20 ms NCYC EEPROM endurance 10000 − E/W cycles tRET EEPROM retention 10 − years 1997 Apr 01 13 Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM PCB2421 10 AC CHARACTERISTICS VDD = 4.5 to 5.5 V; VSS = 0 V; Tamb = 0 to +70 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT DDC1 mode (transmit-only; unidirectional) tVAA output valid from VCLK see Fig.12; note 1 − 1 − µs tVHIGH VCLK HIGH time see Fig.12 20 − − µs tVLOW VCLK LOW time see Fig.12 20 − − µs see Fig.3; note 1 − 500 − ns − − 100 ns − 5 − µs tVHZ mode transition time tSP input filter spike suppression time tvpu DDC1 mode power-up time see Fig.4 DDC2B mode (bidirectional; I2C-bus mode); see Fig.13 fSCL serial clock frequency 0 − 100 kHz tHIGH serial clock HIGH time 4 − − µs tLOW serial clock LOW time 4.7 − − µs tr SCL and SDA rise time − − 1 µs tf SCL and SDA fall time − − 0.3 µs tHD;STA START condition hold time 4 − − µs tSU;STA START condition set-up time 4.7 − − µs tHD;DAT data input hold time 0 − − µs tSU;DAT data input set-up time 250 − − ns tSU;STO STOP condition set-up time 4 − − µs tBUF bus free time 4.7 − − µs tSP input filter spike suppression − − 100 ns note 2 Notes 1. The rise time for SDA returning HIGH must be observed after this period. 2. This is the time that the bus must be free before a new transmission can start. 1997 Apr 01 14 Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM PCB2421 handbook, full pagewidth SCL tVAA NULL BIT SDA BIT 1 (LSB) BIT 8 (MSB) BIT 7 VCLK tVHIGH MBG273 tVLOW Fig.12 Transmit-only mode (DDC1). handbook, full pagewidth t SU;STA BIT 6 (A6) BIT 7 MSB (A7) START CONDITION (S) PROTOCOL t LOW t HIGH BIT 0 LSB (R/W) ACKNOWLEDGE (A) STOP CONDITION (P) 1 / f SCL SCL t tr BUF tf SDA t HD;STA t SU;DAT t HD;DAT Fig.13 DDC2B (I2C-bus timing). 1997 Apr 01 15 MBG274 t SU;STO Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM PCB2421 11 APPLICATION INFORMATION 3. Maximum 100 kHz DDC2B clock frequency 11.1 4. Maximum 25 kHz DDC1 VCLK clock frequency Diode protection 5. During EEPROM programming a maximum write time of 20 ms must be observed There is no diode connection between VCLK and VDD, SCL and VDD and SDA and VDD (see Fig.14). This allows powering-down the device without affecting the I2C-bus operation or loading the VCLK driver. 11.2 6. 8-byte maximum during page write must be observed 7. During operation VDD must be between 4.5 and 5.5 V 8. An operating temperature between 0 and +70 °C must be observed Functional compatibility with microchip 24CL21 dual mode EEPROM 9. Output valid from VCLK (tVAA) typical 1 µs must be observed The Philips PCB2421 is pin and function compatible with the 24CL21 providing the following measures are taken in the application. 10. DDC1 mode power-up time (tVPU) typical 5 µs should be observed. 1. Pin 1 (TEST) must be tied to VDD Remark: VCLK is ‘don’t care’ in the DDC2B mode. 2. Pin 3 (WP) must be tied to VDD. This inhibits the write protection function which does not exist on the 24CL21 at this time handbook, halfpage PCB2421 TEST 1 8 VDD n.c. 2 7 VCLK WP 3 6 SCL VSS 4 5 SDA substrate MBG284 Fig.14 PCB2421 diode protection. 1997 Apr 01 16 Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM PCB2421 12 PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT97-1 050G01 MO-001AN 1997 Apr 01 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 17 Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM PCB2421 SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp L 4 1 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 θ Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03S MS-012AA 1997 Apr 01 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-05-22 18 o 8 0o Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM PCB2421 Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. 13 SOLDERING 13.1 Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. 13.3.2 This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). 13.2 13.2.1 Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 13.2.2 Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. 13.3 13.3.1 13.3.3 REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1997 Apr 01 WAVE SOLDERING 19 Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM PCB2421 14 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 15 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 16 PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 1997 Apr 01 20 Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM PCB2421 NOTES 1997 Apr 01 21 Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM PCB2421 NOTES 1997 Apr 01 22 Philips Semiconductors Preliminary specification 1K dual mode serial EEPROM PCB2421 NOTES 1997 Apr 01 23 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580/xxx France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 São Paulo, SÃO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2870, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com © Philips Electronics N.V. 1997 SCA53 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 417067/1200/02/pp24 Date of release: 1997 Apr 01 Document order number: 9397 750 01746