PHILIPS PCF2113DH

INTEGRATED CIRCUITS
DATA SHEET
PCF2113x
LCD controllers/drivers
Product specification
Supersedes data of 1997 Apr 04
File under Integrated Circuits, IC12
2001 Dec 19
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
CONTENTS
1
FEATURES
1.1
Note
2
APPLICATIONS
3
GENERAL DESCRIPTION
9.5
9.6
9.7
9.8
9.9
9.10
9.11
4
ORDERING INFORMATION
10
INTERFACES TO MICROCONTROLLER
5
BLOCK DIAGRAM
6
PINNING
10.1
10.2
Parallel interface
I2C-bus interface
7
FUNCTIONAL DESCRIPTION
11
LIMITING VALUES
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
7.13
7.14
7.15
7.16
LCD supply voltage generator
LCD bias voltage generator
Oscillator
External clock
Power-on reset
Power-down mode
Registers
Busy flag
Address Counter (AC)
Display Data RAM (DDRAM)
Character Generator ROM (CGROM)
Character Generator RAM (CGRAM)
Cursor control circuit
Timing generator
LCD row and column drivers
Reset function
12
HANDLING INSTRUCTIONS
13
DC CHARACTERISTICS
14
AC CHARACTERISTICS
15
DEVICE PROTECTION CIRCUITS
16
APPLICATION INFORMATION
16.1
16.2
16.4
16.5
General application information
4-bit operation, 1-line display using internal
reset
8-bit operation, 1-line display using internal
reset
8-bit operation, 2-line display
I2C-bus operation, 1-line display
17
BONDING PAD INFORMATION
18
TRAY INFORMATION
8
INSTRUCTIONS
19
PACKAGE OUTLINE
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
8.11
Clear display
Return home
Entry mode set
Display control (and partial Power-down mode)
Cursor or display shift
Function set
Set CGRAM address
Set DDRAM address
Read busy flag and read address
Write data to CGRAM or DDRAM
Read data from CGRAM or DDRAM
20
SOLDERING
20.1
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
9
9.1
9.2
9.3
9.4
16.3
20.2
20.3
20.4
20.5
Direct mode
Voltage multiplier control
Screen configuration
Display configuration
Temperature control
Set VLCD
Reducing current consumption
21
DATA SHEET STATUS
22
DEFINITIONS
EXTENDED FUNCTION SET
INSTRUCTIONS AND FEATURES
23
DISCLAIMERS
24
BARE DIE DISCLAIMER
New instructions
Icon control
Bit IM
Bit IB
25
PURCHASE OF PHILIPS I2C COMPONENTS
2001 Dec 19
2
Philips Semiconductors
Product specification
LCD controllers/drivers
1
PCF2113x
FEATURES
• Single-chip LCD controller/driver
• 2-line display of up to 12 characters + 120 icons, or
1-line display of up to 24 characters + 120 icons
• 5 × 7 character format plus cursor; 5 × 8 for kana
(Japanese) and user defined symbols
1.1
• Icon mode: reduced current consumption while
displaying
Note
Icon mode is used to save current. When only icons are
displayed, a much lower operating voltage VLCD can be
used and the switching frequency of the LCD outputs is
reduced. In most applications it is possible to use VDD as
VLCD.
• Icon blink function
• On-chip:
– Configurable 4, 3 or 2 voltage multiplier generating
LCD supply voltage, independent of VDD,
programmable by instruction (external supply also
possible)
2
APPLICATIONS
• Telecom equipment
– Temperature compensation of on-chip generated
VLCD: −0.16 to −0.24 %/K (programmable by
instruction)
• Portable instruments
• Point-of-sale terminals.
– Generation of intermediate LCD bias voltages
– Oscillator requires no external components
(external clock also possible).
3
The PCF2113x is a low power CMOS LCD controller and
driver, designed to drive a dot matrix LCD display of 2-line
by 12 or 1-line by 24 characters with 5 × 8 dot format.
All necessary functions for the display are provided in a
single chip, including on-chip generation of LCD bias
voltages, resulting in a minimum of external components
and lower system current consumption. The PCF2113x
interfaces to most microcontrollers via a 4 or 8-bit bus or
via the 2-wire I2C-bus. The chip contains a character
generator and displays alphanumeric and kana
(Japanese) characters. The letter ‘x’ in PCF2113x
characterizes the built-in character set. Various character
sets can be manufactured on request.
• Display data RAM: 80 characters
• Character generator ROM: 240, 5 × 8 characters
• Character generator RAM: 16, 5 × 8 characters;
3 characters used to drive 120 icons, 6 characters used
if icon blink feature is used in application
• 4 or 8-bit parallel bus and 2-wire I2C-bus interface
• CMOS compatible
• 18 row and 60 column outputs
• Multiplex rates 1 : 18 (for normal operation), 1 : 9 (for
single line operation) and 1 : 2 (for icon only mode)
• Uses common 11 code instruction set (extended)
• Logic supply voltage range VDD1 − VSS1 = 1.8 to 5.5 V
(chip may be driven with two battery cells)
• VLCD generator supply voltage range
VDD2 − VSS2 = 2.2 to 4.0 V
• Display supply voltage range VLCD − VSS2 = 2.2 to 6.5 V
• Direct mode to save current consumption for icon mode
and Mux 1 : 9 (depending on VDD2 value and LCD liquid
properties)
• Very low current consumption (20 to 200 µA):
– Icon mode: <25 µA
– Power-down mode: <2 µA.
2001 Dec 19
GENERAL DESCRIPTION
3
Philips Semiconductors
Product specification
LCD controllers/drivers
4
PCF2113x
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
PCF2113AU/10/F4
−
chip on flexible film carrier
−
PCF2113DU/10/F4
−
chip on flexible film carrier
−
PCF2113DU/F4
−
chip in tray
−
PCF2113DH/F4
LQFP100
plastic low profile quad flat package; 100 leads;
body 14 × 14 × 1.4 mm
SOT407-1
PCF2113DU/2/F4
−
chip with bumps in tray
−
PCF2113EU/2/F4
−
chip with bumps in tray
−
PCF2113WU/2/F4
−
chip with bumps in tray
−
2001 Dec 19
4
Philips Semiconductors
Product specification
LCD controllers/drivers
5
PCF2113x
BLOCK DIAGRAM
handbook, full pagewidth
C1 to C60
R1 to R18
18
60
COLUMN DRIVERS
BIAS
VOLTAGE
GENERATOR
VLCD1
ROW DRIVERS
60
18
DATA LATCHES
VLCDSENSE
VLCD
GENERATOR
VLCD2
SHIFT REGISTER 18-BIT
60
SHIFT REGISTER 5 × 12 BIT
5
OSC
OSCILLATOR
CURSOR AND DATA CONTROL
5
VDD1
VDD2
CHARACTER
GENERATOR
RAM (128 × 5)
(CGRAM)
16 CHARACTERS
VDD3
CHARACTER
GENERATOR
ROM
(CGROM)
240 CHARACTERS
TIMING
GENERATOR
VSS1
8
VSS2
DISPLAY DATA RAM
(DDRAM)
80 CHARACTERS/BYTES
7
T1
PD
T2
7
T3
7
DISPLAY
ADDRESS
COUNTER
ADDRESS COUNTER
(AC)
7
7
INSTRUCTION
DECODER
PCF2113x
DATA
REGISTER
(DR)
8
INSTRUCTION
REGISTER(IR)
BUSY
FLAG
8
POWER-ON
RESET
8
I/O BUFFER
DB0 to DB3/SA0
DB4 to DB7
E
R/W
RS
SCL
SDA
Fig.1 Block diagram.
2001 Dec 19
5
MGE990
Philips Semiconductors
Product specification
LCD controllers/drivers
6
PCF2113x
PINNING
PIN
PCF2113DH
PAD(1)
PCF2113XU
TYPE
VDD1
1
1
P
supply voltage 1 for all except VLCD generator
OSC
2
2
I
oscillator/external clock input; note 2
PD
3
3
I
power-down select input; for normal operation PD is LOW
SYMBOL
DESCRIPTION
T3
−
4
I
test pad; open circuit and not user accessible
T1
4
5
I
test pin; must be connected to VSS1
T2
−
6
I
test pad; must be connected to VSS1
VSS1
5
7
P
ground 1 for all except VLCD generator
VSS2
6
8
P
ground 2 for VLCD generator
VLCD2
7
9
O
VLCD output if VLCD is generated internally; note 7
VLCDSENSE
−
10
I
input (VLCD) for voltage multiplier regulation; notes 3 and 7
VLCD1
8
11
I
input for generation of LCD bias levels; note 7
9 to 16
12 to 19
O
LCD row driver outputs 9 to 16
R9 to R16
R18
17
20
O
LCD row driver output 18
C60 to C53
18 to 25
21 to 28
O
LCD column driver outputs 60 to 53
dummy pad
−
29
−
dummy pad
−
30
−
C52 to C28
26 to 50
31 to 55
O
dummy pad
−
56
−
dummy pad
−
57
−
C27 to C3
LCD column driver outputs 52 to 28
51 to 75
58 to 82
O
dummy pad
−
83
−
dummy pad
−
84
−
C2
76
85
O
LCD column driver output 2
C1
77
86
O
LCD column driver output 1
78 to 85
87 to 94
O
LCD row driver outputs 8 to 1
R17
86
95
O
LCD row driver output 17
SCL
87
96
I
I2C-bus serial clock input; note 4
SDA
88
97
I/O
E
89
98
I
data bus clock input; note 4
RS
90
99
I
register select input
R/W
91
100
I
read/write input
DB7
92
101
I/O
8-bit bidirectional data bus bit 7; note 5
DB6
93
102
I/O
8-bit bidirectional data bus bit 6
DB5
94
103
I/O
8-bit bidirectional data bus bit 5
DB4
95
104
I/O
8-bit bidirectional data bus bit 4
DB3/SA0
96
105
I/O
8-bit bidirectional data bus bit 3 or I2C-bus address pin;
notes 4 and 5
DB2
97
106
I/O
8-bit bidirectional data bus bit 2
DB1
98
107
I/O
8-bit bidirectional data bus bit 1
R8 to R1
2001 Dec 19
LCD column driver outputs 27 to 3
I2C-bus serial data input/output; note 4
6
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
PIN
PCF2113DH
PAD(1)
PCF2113XU
TYPE
DB0
99
108
I/O
VDD2
100
109
P
supply voltage 2 for VLCD generator; note 6
VDD3
−
110
P
supply voltage 3 for VLCD generator; notes 3 and 6
SYMBOL
DESCRIPTION
8-bit bidirectional data bus bit 0
Notes
1. Bonding pad location information is given in Chapter 17.
2. When the on-chip oscillator is used this pad must be connected to VDD1.
3. In the LQFP100 version this signal is connected internally and can not be accessed at any pin.
4. When the I2C-bus is used, the parallel interface pin E must be LOW. In the I2C-bus read mode DB7 to DB0 should
be connected to VDD1 or left open-circuit.
When the parallel bus is used, the pins SCL and SDA must be connected to VSS1 or VDD1; they must not be left
open-circuit.
When the 4-bit interface is used without reading out from the PCF2113x (R/W is set permanently to logic 0), the
unused ports DB0 to DB4 can either be set to VSS1 or VDD1 instead of leaving them open-circuit.
5. DB7 may be used as the busy flag, signalling that internal operations are not yet completed. In 4-bit operations the
four higher order lines DB7 to DB4 are used; DB3 to DB0 must be left open-circuit except for I2C-bus operations
(see note 4).
6. VDD2 and VDD3 should always be equal.
7. When VLCD is generated internally, pins VLCD1, VLCD2 and VLCDSENSE must be connected together. When external
VLCD is supplied, pin VLCD2 should be left open-circuit to avoid any stray current, pins VLCD1 and VLCDSENSE must be
connected together.
2001 Dec 19
7
Philips Semiconductors
Product specification
76 C2
77 C1
78 R8
79 R7
81 R5
80 R6
82 R4
83 R3
84 R2
85 R1
86 R17
87 SCL
88 SDA
89 E
90 RS
91 R/W
92 DB7
93 DB6
94 DB5
PCF2113x
95 DB4
97 DB2
98 DB1
99 DB0
100 VDD2
handbook, full pagewidth
96 DB3/SA0
LCD controllers/drivers
VDD1
1
75 C3
OSC
2
74 C4
PD
3
73 C5
T1
4
72 C6
VSS1
5
71 C7
VSS2
6
70 C8
VLCD2
VLCD1
7
69 C9
8
68 C10
R9
9
67 C11
R10 10
66 C12
R11 11
65 C13
R12 12
64 C14
PCF2113x
R13 13
63 C15
R14 14
62 C16
R15 15
61 C17
R16 16
60 C18
R18 17
59 C19
C60 18
58 C20
C59 19
57 C21
C58 20
56 C22
Fig.2 Pin configuration (LQFP100).
2001 Dec 19
8
C28 50
C29 49
C30 48
C31 47
C32 46
C33 45
C34 44
C35 43
C36 42
C37 41
C38 40
C39 39
C40 38
C41 37
C42 36
C43 35
C44 34
C45 33
51 C27
C46 32
C53 25
C47 31
52 C26
C48 30
53 C25
C54 24
C49 29
C55 23
C50 28
54 C24
C51 27
55 C23
C56 22
C52 26
C57 21
MGE989
Philips Semiconductors
Product specification
LCD controllers/drivers
7
PCF2113x
The generated VLCD is independent of VDD and is
temperature compensated. When the VLCD generator and
the direct mode are switched off, an external voltage may
be supplied at connected pins VLCD1 and VLCD2. VLCD1 and
VLCD2 may be higher or lower than VDD2.
FUNCTIONAL DESCRIPTION
7.1
LCD supply voltage generator
The LCD supply voltage may be generated on-chip. The
VLCD generator is controlled by two internal 6-bit registers:
VA and VB. The nominal LCD operating voltage at room
temperature is given by the relationship:
During direct mode (program DM register bit) the internal
VLCD generator is turned off and the VLCD2 output voltage
is directly connected to VDD2. This reduces the current
consumption during icon mode and Mux 1 : 9 (depending
on VDD2 value and LCD liquid properties).
VOP(nom) = (integer value of register × 0.08) + 1.82
7.1.1
PROGRAMMING RANGES
Programmed value: 1 to 63. Voltage: 1.90 to 6.86 V.
Tref = 27 °C.
The VLCD generator ensures that, as long as VDD is in the
valid range (2.2 to 4 V), the required peak voltage
VOP = 6.5 V can be generated at any time.
Values producing more than 6.5 V at operating
temperature are not allowed. Operation above this
voltage may damage the device. When programming the
operating voltage the VLCD tolerance and temperature
coefficient must be taken into account.
7.2
LCD bias voltage generator
The intermediate bias voltages for the LCD display are
also generated on-chip. This removes the need for an
external resistive bias chain and significantly reduces the
system current consumption. The optimum value of VLCD
depends on the multiplex rate, the LCD threshold voltage
(Vth) and the number of bias levels. Using a 5-level bias
scheme for 1 : 18 maximum rate allows VLCD < 5 V for
most LCD liquids. The intermediate bias levels for the
different multiplex rates are shown in Table 1. These bias
levels are automatically set to the given values when
switching to the corresponding multiplex rate.
Values below 2.2 V are below the specified operating
range of the chip and are therefore not allowed.
Value 0 for VA and VB switches the generator off
(i.e. VA = 0 in character mode, VB = 0 in icon mode).
Usually register VA is programmed with the voltage for
character mode and register VB with the voltage for icon
mode.
When VLCD is generated on-chip the VLCD pins should be
decoupled to VSS with a suitable capacitor.
Table 1
Bias levels as a function of multiplex rate; note 1
MULTIPLEX
NUMBER
RATE
OF LEVELS
V1
V2
V3
V4
V5
V6
3/
4
3/
4
2/
3
1/
2
1/
2
2/
3
1/
2
1/
2
1/
3
1/
4
1/
4
1/
3
VSS
1 : 18
5
VLCD
1:9
5
VLCD
1:2
4
VLCD
Note
1. The values in the table are given relative to VLCD − VSS, e.g. 3/4 means 3/4 × (VLCD − VSS).
2001 Dec 19
9
VSS
VSS
Philips Semiconductors
Product specification
LCD controllers/drivers
7.3
PCF2113x
The data register temporarily stores data to be read from
the DDRAM and CGRAM. When reading, data from the
DDRAM or CGRAM corresponding to the address in the
instruction register is written to the data register prior to
being read by the ‘read data’ instruction.
Oscillator
The on-chip oscillator provides the clock signal for the
display system. No external components are required and
the OSC pin must be connected to VDD1.
7.4
External clock
7.8
If an external clock is to be used this input is at the OSC
pin. The resulting display frame frequency is given by:
f OSC
f frame = ------------3 072
The busy flag indicates the internal status of the
PCF2113x. A logic 1 indicates that the chip is busy and
further instructions will not be accepted. The busy flag is
output to pin DB7 when bit RS = 0 and bit R/W = 1.
Instructions should only be written after checking that the
busy flag is at logic 0 or waiting for the required number of
cycles.
Only in the Power-down mode is the clock allowed to be
stopped (OSC connected to VSS), otherwise the LCD is
frozen in a DC state.
7.5
7.9
Power-on reset
Power-down mode
The chip can be put into Power-down mode by applying an
external active HIGH level to the PD pin. In Power-down
mode all static currents are switched off (no internal
oscillator, no bias level generation and all LCD outputs are
internally connected to VSS).
7.10
Registers
The PCF2113x has two 8-bit registers, an Instruction
Register (IR) and a Data Register (DR). The Register
Select (RS) signal determines which register will be
accessed. The instruction register stores instruction codes
such as ‘display clear’, ‘cursor shift’, and address
information for the Display Data RAM (DDRAM) and
Character Generator RAM (CGRAM).The instruction
register can be written to but not read from by the system
controller.
Table 2
Display Data RAM (DDRAM)
The DDRAM stores up to 80 characters of display data
represented by 8-bit character codes. RAM locations
which are not used for storing display data can be used as
general purpose RAM. The basic RAM to display
addressing scheme is shown in Fig.3. With no display shift
the characters represented by the codes in the first
24 RAM locations starting at address 00H in line 1 are
displayed. Figures 4 and 5 show the display mapping for
right and left shift respectively.
During power-down, information in the RAMs and the chip
state are preserved. Instruction execution during
power-down is possible when pin OSC is externally
clocked.
7.7
Address Counter (AC)
The address counter assigns addresses to the DDRAM
and CGRAM for reading and writing and is set by the
commands ‘set CGRAM address’ and ‘set DDRAM
address’. After a read/write operation the address counter
is automatically incremented or decremented by 1.
The address counter contents are output to the bus
(DB6 to DB0) when bit RS = 0 and bit R/W = 1.
The on-chip Power-on reset block initializes the chip after
power-on or power failure. This is a synchronous reset and
requires 3 oscillator cycles to be executed.
7.6
Busy flag
When data is written to or read from the DDRAM,
wrap-around occurs from the end of one line to the start of
the next line. When the display is shifted each line wraps
around within itself, independently of the others. Thus all
lines are shifted and wrapped around together.
The address ranges and wrap-around operations for the
various modes are shown in Table 2.
Address space and wrap-around operation
MODE
Address space
1 × 24
2 × 12
1 × 12
00 to 4F
00 to 27; 40 to 67
00 to 27
Read/write wrap-around (moves to next line)
4F to 00
27 to 40; 67 to 00
27 to 00
Display shift wrap-around (stays within line)
4F to 00
27 to 00; 67 to 40
27 to 00
2001 Dec 19
10
Philips Semiconductors
Product specification
LCD controllers/drivers
handbook, full pagewidth
display
position
DDRAM
address
PCF2113x
non-displayed DDRAM addresses
1 2 3 4 5
22 23 24
00 01 02 03 04
15 16 17 18 19
4C 4D 4E 4F
1-line display
non-displayed DDRAM address
DDRAM
address
1 2 3 4 5
10 11 12
00 01 02 03 04
09 0A 0B 0C 0D
1 2 3 4 5
10 11 12
40 41 42 43 44
49 4A 4B 4C 4D
24 25 26 27
line 1
64 65 66 67
line 2
MGE991
2-line display
Fig.3 DDRAM to display mapping; no shift.
handbook,display
halfpage
position
1
5
22 23 24
DDRAM
address
4F 00 01 02 03
2 3
4
14 15 16
1-line display
1
DDRAM
address
5
10 11 12
27 00 01 02 03
2 3
08 09 0A
1
5
10 11 12
67 40 41 42 43
48 49 4A
2 3
4
4
line 1
line 2
MGE992
2-line display
Fig.4 DDRAM to display mapping; right shift.
handbook,display
halfpage
position
DDRAM
address
5
22 23 24
01 02 03 04 05
1
2 3
4
16 17 18
1-line display
1
DDRAM
address
5
10 11 12
01 02 03 04 05
2 3
0A 0B 0C
1
5
10 11 12
41 42 43 44 45
4A 4B 4C
2 3
4
4
line 1
line 2
MGE993
2-line display
Fig.5 DDRAM to display mapping; left shift.
2001 Dec 19
11
Philips Semiconductors
Product specification
LCD controllers/drivers
7.11
PCF2113x
Character Generator ROM (CGROM)
7.14
The CGROM generates 240 character patterns in a
5 × 8 dot format from 8-bit character codes.
Figures 7, 8, 9 and 10 show the character sets that are
currently implemented.
The timing generator produces the various signals
required to drive the internal circuitry. Internal chip
operation is not disturbed by operations on the data buses.
7.15
7.12
Character Generator RAM (CGRAM)
LCD row and column drivers
The PCF2113x contains 18 row and 60 column drivers,
which connect the appropriate LCD bias voltages in
sequence to the display in accordance with the data to be
displayed. R17 and R18 drive the icon rows.
Up to 16 user defined characters may be stored in the
CGRAM. Some CGRAM characters (see Fig.16) are also
used to drive icons (6 if icons blink and both icon rows are
used in the application; 3 if no blink but both icon rows are
used in the application; 0 if no icons are driven by the icon
rows). The CGROM and CGRAM use a common address
space, of which the first column is reserved for the
CGRAM (see Fig.7). Figure 11 shows the addressing
principle for the CGRAM.
7.13
Timing generator
The bias voltages and the timing are selected
automatically when the number of lines in the display is
selected. Figures 12, 13, 14 and 15 show typical
waveforms. Unused outputs should be left unconnected.
Cursor control circuit
The cursor control circuit generates the cursor underline
and/or cursor blink as shown in Fig.6 at the DDRAM
address contained in the address counter.
When the address counter contains the CGRAM address
the cursor will be inhibited.
cursor
MGA801
5 x 7 dot character font
alternating display
cursor display example
blink display example
Fig.6 Cursor and blink display examples.
2001 Dec 19
12
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
handbook, full pagewidth
upper
4 bits
0000
xxxx
0000
1
xxxx
0001
2
xxxx
0010
3
xxxx
0011
4
xxxx
0100
5
xxxx
0101
6
xxxx
0110
7
xxxx
0111
8
xxxx
1000
9
xxxx
1001
10
xxxx
1010
11
xxxx
1011
12
xxxx
1100
13
xxxx
1101
14
xxxx
1110
15
xxxx
1111
16
lower
4 bits
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
MGE994
Fig.7 Character set ‘A’ in CGROM.
2001 Dec 19
13
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
handbook, full pagewidth
upper
4 bits
0000
xxxx
0000
1
xxxx
0001
2
xxxx
0010
3
xxxx
0011
4
xxxx
0100
5
xxxx
0101
6
xxxx
0110
7
xxxx
0111
8
xxxx
1000
9
xxxx
1001
10
xxxx
1010
11
xxxx
1011
12
xxxx
1100
13
xxxx
1101
14
xxxx
1110
15
xxxx
1111
16
lower
4 bits
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
MGD688
Fig.8 Character set ‘D’ in CGROM.
2001 Dec 19
14
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
handbook, full pagewidth
upper
4 bits
0000
xxxx
0000
1
xxxx
0001
2
xxxx
0010
3
xxxx
0011
4
xxxx
0100
5
xxxx
0101
6
xxxx
0110
7
xxxx
0111
8
xxxx
1000
9
xxxx
1001
10
xxxx
1010
11
xxxx
1011
12
xxxx
1100
13
xxxx
1101
14
xxxx
1110
15
xxxx
1111
16
lower
4 bits
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
MGD689
Fig.9 Character set ‘E’ in CGROM.
2001 Dec 19
15
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
handbook, full pagewidth
upper
4 bits
0000
xxxx
0000
1
xxxx
0001
2
xxxx
0010
3
xxxx
0011
4
xxxx
0100
5
xxxx
0101
6
xxxx
0110
7
xxxx
0111
8
xxxx
1000
9
xxxx
1001
10
xxxx
1010
11
xxxx
1011
12
xxxx
1100
13
xxxx
1101
14
xxxx
1110
15
xxxx
1111
16
lower
4 bits
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
MGU204
Fig.10 Character set ‘W’ in CGROM.
2001 Dec 19
16
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
character codes
handbook, full pagewidth
CGRAM
address
(DDRAM data)
7
6
5
4
3
2
higher
order
bits
0
0
0
0
0
0
1
0
6
lower
order
bits
0
0
0
0
0
0
0
0
5
4
3
2
higher
order
bits
0
1
0
0
0
0
0
0
character patterns
(CGRAM data)
1
0
4
lower
order
bits
0
1
3
higher
order
bits
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
0
0
0
0
0
1
0
0
0
1
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
2
1
character code
(CGRAM data)
0
4
3
2
1
0
0
1
1
1
1
1
1
1
0
1
0
0
1
0
0
0
0
1
0
0
1
1
0
0
0
1
0
0
1
0
1
0
0
0
1
1
0
0
0
1
0
1
0
1
0
1
0
0
0
0
1
1
0
1
0
0
0
0
0
1
1
1
1
1
0
0
1
1
0
1
0
0
0
1
0
1
0
1
0
0
0
lower
order
bits
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
cursor
position
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
character
pattern
example 1
character
pattern
example 2
MGE995
Character code bits 0 to 3 correspond to CGRAM address bits 3 to 6.
CGRAM address bits 0 to 2 designate the character pattern line position. The 8th line is the cursor position and display is performed by logical OR with
the cursor. Data in the 8th position will appear in the cursor position.
Character pattern column positions correspond to CGRAM data bits 0 to 4, as shown in this figure.
As shown in Figs 7 and 8, CGRAM character patterns are selected when character code bits 4 to 7 are all logic 0. CGRAM data = logic 1 corresponds
to selection for display.
Only bits 0 to 5 of the CGRAM address are set by the ‘set CGRAM address’ command. Bit 6 can be set using the ‘set DDRAM address’ command in
the valid address range or by using the auto-increment feature during CGRAM write. All bits 0 to 6 can be read using the ‘read busy flag’ and ‘address
counter’ command.
Fig.11 Relationship between CGRAM addresses, data and display patterns.
2001 Dec 19
17
Philips Semiconductors
Product specification
LCD controllers/drivers
frame n
handbook, full pagewidth
ROW 1
PCF2113x
frame n + 1
state 1 (ON)
state 2 (OFF)
VLCD
V2
V3/V4
V5
VSS
R1
R2
R3
R4
R5
ROW 9
R6
VLCD
V2
V3/V4
V5
VSS
ROW 2
VLCD
V2
V3/V4
V5
VSS
COL1
VLCD
V2
V3/V4
V5
VSS
COL2
VLCD
V2
V3/V4
V5
VSS
R7
R8
R9
VOP
0.5VOP
0.25VOP
state 1 0 V
−0.25VOP
−0.5VOP
−VOP
VOP
0.5VOP
0.25VOP
state 2 0 V
−0.25VOP
−0.5VOP
−VOP
MGE996
1 2 3
18 1 2 3
18
Fig.12 MUX 1 : 18 LCD waveforms; character mode.
2001 Dec 19
18
Philips Semiconductors
Product specification
LCD controllers/drivers
frame n + 1
frame n
handbook, full pagewidth
ROW 1
PCF2113x
state 1 (ON)
state 2 (OFF)
VLCD
V2
V3/V4
V5
VSS
R1
R2
R3
R4
R5
ROW 2
R6
VLCD
V2
V3/V4
V5
VSS
ROW 3
VLCD
V2
V3/V4
V5
VSS
COL1
VLCD
V2
V3/V4
V5
VSS
COL2
VLCD
V2
V3/V4
V5
VSS
R7
R8
R9
VOP
0.5VOP
0.25VOP
state 1 0 V
−0.25VOP
−0.5VOP
−VOP
VOP
0.5VOP
0.25VOP
state 2 0 V
−0.25VOP
−0.5VOP
−VOP
1
2
3
9
1
2
3
9
R10 to R18 to be left open.
Fig.13 MUX 1 : 9 LCD waveforms; character mode.
2001 Dec 19
19
MGU217
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
frame n + 1
frame n
handbook, full pagewidth
only icons are
driven (MUX 1 : 2)
VLCD
ROW 17
2/3
1/3
VSS
VLCD
ROW 18
2/3
1/3
VSS
VLCD
ROW 1 to 16
2/3
1/3
VSS
VLCD
COL 1 ON/OFF
2/3
1/3
VSS
VLCD
COL 2 OFF/ON
2/3
1/3
VSS
VLCD
COL 3 ON/ON
2/3
1/3
VSS
VLCD
COL 4 OFF/OFF
2/3
1/3
VSS
MGE997
Fig.14 MUX 1 : 2 LCD waveforms; icon mode.
2001 Dec 19
20
Philips Semiconductors
Product specification
LCD controllers/drivers
handbook, full pagewidth V
PIXEL
PCF2113x
frame n + 1
frame n
state 1 (ON)
state 1
COL 1 ROW 17
state 2
COL 2 ROW 17
VOP
2/3 VOP
1/3 VOP
state 2 (OFF)
R17
R18
0
R1-16
−1/3 VOP
−2/3 VOP
−VOP
state 3 (OFF)
VOP
2/3 VOP
1/3 VOP
0
−1/3 VOP
−2/3 VOP
−VOP
VOP
2/3 VOP
1/3 VOP
state 3
COL 1 0
ROW 1 to 16 −1/3 VOP
−2/3 VOP
−VOP
MGE998
VON(rms) = 0.745VOP
VOFF(rms) = 0.333VOP
V ON
D = ------------= 2.23
V OFF
Fig.15 MUX 1 : 2 LCD waveforms; icon mode.
2001 Dec 19
21
Philips Semiconductors
Product specification
LCD controllers/drivers
7.16
PCF2113x
Reset function
The PCF2113x automatically initializes (resets) when power is turned on. The chip executes a reset sequence, including
a ‘clear display’, requiring 165 oscillator cycles. After the reset the chip has the state shown in Table 3.
Table 3
State after reset
STEP
FUNCTION
1
clear display
2
entry mode set
3
4
display control
function set
CONTROL BIT STATE
CONDITIONS
I/D = 1
+1 (increment)
S=0
no shift
D=0
display off
C=0
cursor off
B=0
cursor character blink off
DL = 1
8-bit interface
M=0
1-line display
H=0
normal instruction set
SL = 0
MUX 1 : 18 mode
5
default address pointer to DDRAM; the Busy Flag (BF) indicates the busy state (BF = 1) until
initialization ends; the busy state lasts 2 ms; the chip may also be initialized by software;
see Tables 17 and 18
6
icon control
7
display/screen configuration
L = 0; P = 0; Q = 0
default configurations
8
VLCD temperature coefficient
TC1 = 0; TC2 = 0
default temperature coefficient
9
set VLCD
VA = 0; VB = 0
VLCD generator off
10
I2C-bus
11
Set HVgen stages
S1 = 1; S0 = 0
VLCD generator voltage
multiplier set at factor 4
2001 Dec 19
IM = 0; IB = 0; DM = 0
icons, icon blink and direct
mode disabled
interface reset
22
Philips Semiconductors
Product specification
LCD controllers/drivers
8
PCF2113x
INSTRUCTIONS
In normal use, category 3 instructions are used most
frequently. However, automatic incrementing by 1
(or decrementing by 1) of internal RAM addresses after
each data write lessens the microcontroller program load.
The display shift in particular can be performed
concurrently with display data write, enabling the designer
to develop systems in minimum time with maximum
programming efficiency.
Only two PCF2113x registers, the Instruction Register (IR)
and the Data Register (DR) can be directly controlled by
the microcontroller. Before internal operation, control
information is stored temporarily in these registers, to
allow interfacing to various types of microcontrollers which
operate at different speeds or to allow interface to
peripheral control ICs.
During internal operation, no instructions other than the
‘read busy flag’ and ‘read address’ instructions will be
executed. Because the busy flag is set to a logic 1 while an
instruction is being executed, check to ensure it is a logic 0
before sending the next instruction or wait for the
maximum instruction execution time, as given in Table 5.
An instruction sent while the busy flag is logic 1 will not be
executed.
The instruction set for I2C-bus commands is given in
Table 4.
The PCF2113x operation is controlled by the instructions
shown in Table 5 together with their execution time.
Details are explained in subsequent sections.
Instructions are of 4 types, those that:
1. Designate PCF2113x functions such as display
format, data length, etcetera.
2. Set internal RAM addresses
3. Perform data transfer with internal RAM
4. Others.
Table 4
Instruction set for I2C-bus commands
CONTROL BYTE
Co RS 0
0
0
0
COMMAND BYTE
0
0
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 note 1
Note
1. R/W is set together with the slave address.
2001 Dec 19
I2C-BUS COMMANDS
23
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INSTRUCTION
RS
R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
DESCRIPTION
REQUIRE
CLOCK
CYCLES
H = 0 or 1
NOP
0
0
0
0
0
0
0
0
0
0
no operation
3
Function set
0
0
0
0
1
DL
0
M
SL
H
sets interface Data Length (DL), number of display
lines (M), single line/MUX 1 : 9 (SL) and extended
instruction set control (H)
3
Read busy flag
and address
counter
0
1
BF
reads the Busy Flag (BF) indicating internal
operating is being performed and reads Address
counter (AC) contents
0
AC
Read data
1
1
read data
reads data from CGRAM or DDRAM
3
Write data
1
0
write data
writes data from CGRAM or DDRAM
3
Clear display
0
0
0
0
0
0
0
0
0
1
clears entire display and sets DDRAM address 0 in
address counter
165
Return home
0
0
0
0
0
0
0
0
1
0
sets DDRAM address 0 in address counter; also
returns shifted display to original position; DDRAM
contents remain unchanged
3
Entry mode set
0
0
0
0
0
0
0
1
I/D
S
sets cursor move direction (I/D) and specifies shift
of display (S); these operations are performed
during data write and read
3
Display control
0
0
0
0
0
0
1
D
C
B
sets entire display on/off (D), cursor on/off (C) and
blink of cursor position character (B); D = 0 (display
off) puts chip into the Power-down mode
3
Cursor/display
shift
0
0
0
0
0
1
S/C
R/L
0
0
moves cursor or shifts display (S/C) to right or left
(R/L) without changing DDRAM contents
3
Set CGRAM
address
0
0
0
1
sets CGRAM address; bit DB6 is to be set by the
command ‘set DDRAM address’; look at the
description of the commands
3
Set DDRAM
address
0
0
1
sets DDRAM address
3
Philips Semiconductors
Instruction set with parallel bus commands
LCD controllers/drivers
2001 Dec 19
Table 5
H=0
24
ACG
Product specification
PCF2113x
ADD
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R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
DESCRIPTION
REQUIRE
CLOCK
CYCLES
H=1
Reserved
0
0
0
0
0
0
0
0
0
1
do not use
−
Screen
configuration
0
0
0
0
0
0
0
0
1
L
set screen configuration (L)
3
Display
configuration
0
0
0
0
0
0
0
1
P
Q
set display configuration, columns (P) and rows (Q)
3
Icon control
0
0
0
0
0
0
1
IM
IB
Temperature
control
0
0
0
0
0
1
0
0
Set HVgen stages
0
0
0
1
0
0
0
0
Set VLCD
0
0
1
V
voltage
DM set Icon Mode (IM), Icon Blink (IB),
Direct Mode (DM)
TC1 TC2 set Temperature Coefficient (TCx)
S1
S0
3
Philips Semiconductors
RS
LCD controllers/drivers
2001 Dec 19
INSTRUCTION
3
set internal VLCD generator voltage multiplier stages
(S1 = 1 and S0 = 1 not allowed)
3
store VLCD in register VA or VB (V)
3
25
Product specification
PCF2113x
Philips Semiconductors
Product specification
LCD controllers/drivers
Table 6
PCF2113x
Explanations of symbols used in Tables 4 and 5.
BIT
LOGIC STATE 0
LOGIC STATE 1
Co
last control byte; see Table 4
another control byte follows after data/command
DL
4 bits
8 bits
M (no impact, 1-line by 24 display
if SL = 1)
2-line by 12 display
SL
MUX 1 : 18 (1 × 24 or 2 × 12 character display)
MUX 1 : 9 (1 × 12 character display)
H
use basic instruction set
use extended instruction set
I/D
decrement
increment
S
display freeze
display shift
D
display off
display on
C
cursor off
cursor on
B
cursor character blink off; character at cursor
position does not blink
cursor character blink on; character at cursor
position blinks
S/C
cursor move
display shift
R/L
left shift
right shift
L (no impact,
if M = 1 or
SL = 1)
left/right screen: standard connection
left/right screen; mirrored connection
1st 12 characters of 24; columns are from 1 to 60
1st 12 characters of 24; columns are from 1 to 60
P
column data: left to right; column data is displayed column data; right to left; column data is displayed
from 1 to 60
from 60 to 1
Q
row data; top to bottom; row data is displayed from row data; bottom to top; row data is displayed
1 to 16 and icon row data is in 17 and 18
from 16 to 1 and icon row data is in 18 and 17
IM
character mode; full display
icon mode; only icons displayed
IB
icon blink disabled
icon blink enabled
DM
direct mode disabled
direct mode enabled
V
set VA
set VB
8.1
2nd 12 characters of 24; columns are from 1 to 60 2nd 12 characters of 24; columns are from 60 to 1
Clear display
8.2
‘Clear display’ writes character code 20H into all DDRAM
addresses (the character pattern for character code 20H
must be a blank pattern), sets the DDRAM address
counter to logic 0 and returns the display to its original
position, if it was shifted. Thus, the display disappears and
the cursor or blink position goes to the left edge of the
display. Sets entry mode I/D = 1 (increment mode). S of
entry mode does not change.
‘Return home’ sets the DDRAM address counter to logic 0
and returns the display to its original position if it was
shifted. DDRAM contents do not change. The cursor or
blink position goes to the left of the first display line.
I/D and S of entry mode do not change.
The instruction ‘clear display’ requires extra execution
time. This may be allowed by checking the Busy Flag (BF)
or by waiting until the 165 clock cycles have elapsed.
The latter must be applied where no read-back options are
foreseen, as in some Chip-On-Glass (COG) applications.
2001 Dec 19
Return home
26
Philips Semiconductors
Product specification
LCD controllers/drivers
8.3
8.3.1
PCF2113x
Entry mode set
8.4.3
BIT I/D
The character indicated by the cursor blinks when B = 1.
The cursor character blink is displayed by switching
between display characters and all dots on with a period of
f OSC
approximately 1 second, with f blink = ---------------52 224
When I/D = 1 (0) the DDRAM or CGRAM address
increments (decrements) by 1 when data is written into or
read from the DDRAM or CGRAM. The cursor or blink
position moves to the right when incremented and to the
left when decremented. The cursor underline and cursor
character blink are inhibited when the CGRAM is
accessed.
8.3.2
The cursor underline and the cursor character blink can be
set to display simultaneously.
8.5
BIT S
8.4.1
Display control (and partial Power-down mode)
The Address Counter (AC) content does not change if the
only action performed is shift display, but increments or
decrements with the ‘cursor display shift’.
BIT D
The display is on when D = 1 and off when D = 0. Display
data in the DDRAM is not affected and can be displayed
immediately by setting D = 1.
8.6
8.6.1
When the display is off (D = 0) the chip is in partial
Power-down mode:
• The LCD generator and bias generator are turned off.
Three oscillator cycles are required after sending the
‘display off’ instruction to ensure all outputs are at VSS,
afterwards the oscillator can be stopped. If the oscillator is
running during partial Power-down mode (‘display off’) the
chip can still execute instructions. Even lower current
consumption is obtained by inhibiting the oscillator
(OSC = VSS).
BIT DL (PARALLEL MODE ONLY)
‘Function set’ from the I2C-bus interface sets the DL bit to
logic 1.
To ensure IDD < 1 µA, the parallel bus pins DB7 to DB0
should be connected to VDD; pins RS and R/W to VDD or
left open-circuit and pin PD to VDD. Recovery from
Power-down mode: PD back to VSS, if necessary pin OSC
back to VDD and send a ‘display control’ instruction with
D = 1.
8.6.2
BIT M
Selects either 1-line by 24 display (M = 0) or 2-line by
12 display (M = 1).
8.6.3
BIT C
BIT SL
Selects MUX 1 : 9, 1-line by 12 display (independent of
M and L). Only rows 1 to 8 and 17 are to be used. All other
rows must be left open-circuit. The DDRAM map is the
same as in the 2-line by 12 display mode, however, the
second line cannot be displayed.
The cursor is displayed when C = 1 and inhibited when
C = 0. Even if the cursor disappears, the display functions
I/D, etcetera, remain in operation during display data write.
The cursor is displayed using 5 dots in the 8th line (see
Fig.6).
2001 Dec 19
Function set
Sets interface data width. Data is sent or received in bytes
(DB7 to DB0) when DL = 1 or in two nibbles (DB7 to DB4)
when DL = 0. When 4-bit width is selected, data is
transmitted in two cycles using the parallel bus. In a 4-bit
application DB3 to DB0 should be left open-circuit (internal
pull-ups). Hence in the first ‘function set’ instruction after
power-on M, SL and H are set to logic 1. A second
‘function set’ must then be sent (2 nibbles) to set M,
SL and H to their required values.
• The LCD outputs are connected to VSS
8.4.2
Cursor or display shift
‘Cursor/display shift’ moves the cursor position or the
display to the right or left without writing or reading display
data. This function is used to correct a character or move
the cursor through the display. In 2-line displays, the
cursor moves to the next line when it passes the last
position (40) of the line. When the displayed data is shifted
repeatedly all lines shift at the same time; displayed
characters do not shift into the next line.
When S = 1, the entire display shifts either to the right
(I/D = 0) or to the left (I/D = 1) during a DDRAM write. Thus
it appears as if the cursor stands still and the display
moves. The display does not shift when reading from the
DDRAM, or when writing to or reading from the CGRAM.
When S = 0, the display does not shift.
8.4
BIT B
27
Philips Semiconductors
Product specification
LCD controllers/drivers
8.6.4
PCF2113x
8.10
BIT H
‘Write data’ writes binary 8-bit data DB7 to DB0 to the
CGRAM or the DDRAM.
When H = 0 the chip can be programmed via the standard
11 instruction codes used in the PCF2116 and other LCD
controllers.
Whether the CGRAM or DDRAM is to be written into is
determined by the previous ‘set CGRAM address’ or ‘set
DDRAM address’ command. After writing, the address
automatically increments or decrements by 1, in
accordance with the entry mode. Only bits DB4 to DB0 of
CGRAM data are valid, bits DB7 to DB5 are ‘don’t care’.
When H = 1 the extended range of instructions will be
used. These are mainly for controlling the display
configuration and the icons.
8.7
Write data to CGRAM or DDRAM
Set CGRAM address
‘Set CGRAM address’ sets bits DB5 to 0 of the CGRAM
address ACG into the address counter (binary A5 to A0).
Data can then be written to or read from the CGRAM.
8.11
Read data from CGRAM or DDRAM
‘Read data’ reads binary 8-bit data DB7 to DB0 from the
CGRAM or DDRAM.
Attention: the CGRAM address uses the same address
register as the DDRAM address and consists of 7 bits
(binary A6 to A0). With the ‘set CGRAM address’
command, only bits DB5 to DB0 are set. Bit DB6 can be
set using the ‘set DDRAM address’ command first, or by
using the auto-increment feature during CGRAM write. All
bits DB6 to DB0 can be read using the ‘read busy flag’ and
‘read address’ command.
The most recent ‘set address’ command determines
whether the CGRAM or DDRAM is to be read.
The ‘read data’ instruction gates the content of the Data
Register (DR) to the bus while pin E is HIGH. After pin E
goes LOW again, internal operation increments (or
decrements) the AC and stores RAM data corresponding
to the new AC into the DR.
When writing to the lower part of the CGRAM, ensure that
bit DB6 of the address is not set (e.g. by an earlier DDRAM
write or read action).
There are only three instructions that update the data
register:
8.8
• ‘Set DDRAM address’
• ‘Set CGRAM address’
Set DDRAM address
• ‘Read data’ from CGRAM or DDRAM.
‘Set DDRAM address’ sets the DDRAM address ADD into
the address counter (binary A6 to A0). Data can then be
written to or read from the DDRAM.
8.9
Other instructions (e.g. ‘write data’, ‘cursor/display shift’,
‘clear display’ and ‘return home’) do not modify the data
register content.
Read busy flag and read address
‘Read busy flag and address counter’ read the Busy Flag
(BF) and Address Counter (AC). BF = 1 indicates that an
internal operation is in progress. The next instruction will
not be executed until BF = 0. It is recommended that the
BF status is checked before the next write operation is
executed.
9
9.1
New instructions
H = 1 sets the chip into alternate instruction set mode.
9.2
At the same time, the value of the address counter
expressed in binary A6 to A0 is read out. The address
counter is used by both CGRAM and DDRAM, and its
value is determined by the previous instruction.
2001 Dec 19
EXTENDED FUNCTION SET INSTRUCTIONS AND
FEATURES
Icon control
The PCF2113x can drive up to 120 icons. See Fig.16 for
CGRAM to icon mapping.
28
Philips Semiconductors
Product specification
LCD controllers/drivers
handbook, full pagewidth
display:
PCF2113x
COL 1 to 5
COL 6 to 10
COL 56 to 60
ROW 17 –
1
2
3
4
5
6
7
8
9
10
ROW 18 –
61
62
63
64
65
66
67
68
69
70
56
57
58
59
60
116 117 118 119 120
MGE999
block of 5 columns
icon
no.
handbook, full
pagewidth
phase
ROW/COL
character codes
7
6
5
4
3
2
CGRAM address
1
MSB
0
6
LSB
MSB
5
4
3
2
1
CGRAM data
0
4
3
2
1
LSB MSB
icon view
0
LSB
1-5
even
17/1-5
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
1
6-10
even
17/6-10
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
11-15
even
17/11-15
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
1
1
0
56-60
even
17/56-60
0
0
0
0
0
0
0
1
0
0
0
1
0
1
1
1
1
1
1
1
61-65
even
18/1-5
0
0
0
0
0
0
0
1
0
0
0
1
1
0
0
1
1
0
0
0
116-120
even
18/56-60
0
0
0
0
0
0
1
0
0
0
1
0
1
1
1
1
1
1
0
1
1-5
odd (blink)
17/1-5
0
0
0
0
0
1
0
0
0
1
0
0
0
0
0
0
0
0
0
0
116-120
odd (blink)
18/56-60
0
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
MGG001
CGRAM data bit = logic 1 turns the icon on, data bit = logic 0 turns the icon off.
Data in character codes 0 to 3 define the icon state when icon blink is disabled or during the even phase when icon blink is enabled.
Data in character codes 4 to 7 define the icon state during the odd phase when icon blink is enabled (not used for icons when icon blink is disabled).
Fig.16 CGRAM to icon mapping.
2001 Dec 19
29
Philips Semiconductors
Product specification
LCD controllers/drivers
9.3
PCF2113x
When DM = 1, the chip is in direct mode. The internal VLCD
generator is turned off and the VLCD2 output is directly
connected to the VLCD generator supply voltage VDD2.
Bit IM
When IM = 0, the chip is in character mode. In the
character mode characters and icons are driven
(MUX 1 : 18). The VLCD generator, if used, produces the
VLCD voltage programmed in register VA.
The direct mode can be used to reduce the current
consumption when the required VLCD2 output voltage is
close to the VDD2 supply voltage. This can be the case in
icon mode or in Mux 1:9 (depending on LCD liquid
properties).
When IM = 1, the chip is in icon mode. In the icon mode
only the icons are driven (MUX 1 : 2) and the VLCD
generator, if used, produces the VLCD voltage as
programmed in register VB.
Table 7
Normal/icon mode operation
IM
MODE
Voltage multiplier control
Bits S1 and S0
A software configurable voltage multiplier is incorporated
in the VLCD generator and can be set via the ‘Set HVgen
stages’ command.
VLCD
0
character mode
generates VA
1
icon mode
generates VB
9.4
9.6
The voltage multiplier control can be used to reduce
current consumption by disconnecting internal voltage
multiplier stages, depending on the required VLCD output
voltage (see Table 8).
Bit IB
Icon blink control is independent of the cursor/character
blink function.
Table 8
When IB = 0, the icon blink is disabled. Icon data is stored
in CGRAM character 0 to 2 (3 × 8 × 5 = 120 bits for
120 icons).
S1 and S0 control of voltage multiplier
S1
S0
DESCRIPTION
0
0
When IB = 1, the icon blink is enabled. In this case each
icon is controlled by two bits. Blink consists of two half
phases (corresponding to the cursor on and off phases
called even and odd phases hereafter).
set VLCD generator stages to 1
(2 x voltage multiplier)
0
1
set VLCD generator stages to 2
(3 x voltage multiplier)
1
0
Icon states for the even phase are stored in CGRAM
characters 0 to 2 (3 × 8 × 5 = 120 bits for 120 icons).
These bits also define icon state when icon blink is not
used (see Table 9).
set VLCD generator stages to 3
(4 x voltage multiplier)
1
1
do not use
9.7
Icon states for the odd phase are stored in CGRAM
character 4 to 6 (another 120 bits for the 120 icons). When
icon blink is disabled CGRAM characters 4 to 6 may be
used as normal CGRAM characters.
9.5
Bit L
L = 0: the two halves of a split screen are connected in a
standard way i.e. column 1/61, 2/62 to 60/120; default.
L = 1: the two halves of a split screen are connected in a
mirrored way i.e. column 1/120, 2/119 to 60/61. This
allows single layer PCB or glass layout.
Direct mode
When DM = 0, the chip is not in the direct mode. Either the
internal VLCD generator or an external voltage may be
used to achieve VLCD.
Table 9
Screen configuration
Blink effect for icons and cursor character blink
PARAMETER
EVEN PHASE
ODD PHASE
Cursor character blink
block (all on)
normal (display character)
Icons
state 1; CGRAM character 0 to 2
state 2; CGRAM character 4 to 6
2001 Dec 19
30
Philips Semiconductors
Product specification
LCD controllers/drivers
9.8
PCF2113x
VLCD programming:
Display configuration
Bit P
1. Send ‘function set’ instruction with H = 1
P = 0: default.
2. Send ‘set VLCD’ instruction to write to voltage register:
a) DB7, DB6 = 10: DB5 to DB0 are VLCD of character
mode (VA)
P = 1: mirrors the column data.
Bit Q
b) DB7, DB6 = 11: DB5 to DB0 are VLCD of icon
mode (VB)
Q = 0: default.
Q = 1: mirrors the row data.
c) DB5 to DB0 = 000000 switches VLCD generator off
(when selected)
9.9
d) During ‘display off’ and power-down the VLCD
generator is also disabled.
Temperature control
Default is TC1 = 0 and TC2 = 0. Selects the default
temperature coefficient for the internally generated VLCD
(see Table 10).
3. Send ‘function set’ instruction with H = 0 to resume
normal programming.
The ranges for TC are given in Chapter 13.
9.11
Table 10 TC1 and TC2 selection of VLCD temperature
coefficient
Reducing current consumption can be achieved by one of
the options given in Table 11.
TC1
TC2
0
0
VLCD temperature coefficient 0
0
VLCD temperature coefficient 1
0
1
VLCD temperature coefficient 2
1
1
VLCD temperature coefficient 3
9.10
When VLCD lies outside the VDD range and must be
generated, it is usually more efficient to use the on-chip
generator than an external regulator.
DESCRIPTION
1
Table 11 Reducing current consumption
ORIGINAL MODE
Set VLCD
The VLCD value is programmed by instruction. Two on-chip
registers, VA and VB hold VLCD values for the character
mode and the icon mode respectively. The generated
VLCD value is independent of VDD, allowing battery
operation of the chip.
2001 Dec 19
Reducing current consumption
31
ALTERNATIVE MODE
Character mode
Icon mode (control bit IM)
Display on
Display off (control bit D)
VLCD generator operating
Direct mode
Any mode
power-down (PD pin)
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
10 INTERFACES TO MICROCONTROLLER
10.2
10.1
The I2C-bus is for bidirectional, two-line communication
between different ICs or modules. The two lines are the
Serial Data line (SDA) and the Serial Clock Line (SCL).
Both lines must be connected to a positive supply via
pull-up resistors. Data transfer may be initiated only when
the bus is not busy.
Parallel interface
The PCF2113x can send data in either two 4-bit operations
or one 8-bit operation and can thus interface to 4-bit or
8-bit microcontrollers.
In 8-bit mode data is transferred as 8-bit bytes using the
8 data lines DB7 to DB0. Three further control lines E,
RS and R/W are required (see Chapter 6).
I2C-bus interface
Each byte of eight bits is followed by an acknowledge bit.
The acknowledge bit is a HIGH level signal put on the bus
by the transmitter during which time the master generates
an extra acknowledge related clock pulse. A slave receiver
which is addressed must generate an acknowledge after
the reception of each byte.
In 4-bit mode data is transferred in two cycles of 4 bits
each using pins DB7 to DB4 for the transaction.
The higher order bits (corresponding to DB7 to DB4 in
8-bit mode) are sent in the first cycle and the lower order
bits (DB3 to DB0 in 8-bit mode) in the second cycle. Data
transfer is complete after two 4-bit data transfers. It should
be noted that two cycles are also required for the busy flag
check. 4-bit operation is selected by instruction, see
Figs 17 to 19 for examples of bus protocol.
Also a master receiver must generate an acknowledge
after the reception of each byte that has been clocked out
of the slave transmitter.
The device that acknowledges must pull-down the SDA
line during the acknowledge clock pulse, so that the SDA
line is stable LOW during the HIGH period of the
acknowledge related clock pulse (set-up and hold times
must be taken into consideration).
In 4-bit mode, pins DB3 to DB0 must be left open-circuit.
They are pulled up to VDD internally.
RS
R/W
E
DB7
IR7
IR3
BF
AC3
DR7
DR3
DB6
IR6
IR2
AC6
AC2
DR6
DR2
DB5
IR5
IR1
AC5
AC1
DR5
DR1
DB4
IR4
IR0
AC4
AC0
DR4
DR0
instruction
write
busy flag and
address counter read
Fig.17 4-bit transfer example.
2001 Dec 19
32
data register
read
MGA804
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
RS
R/W
E
internal
internal operation
DB7
IR7
IR3
busy
instruction
write
not
busy
AC3
busy flag
check
AC3
D7
busy flag
check
D3
instruction
write
MGA805
IR7, IR3: instruction 7th, 3rd bit.
AC3: address counter 3rd bit.
D7, D3: data 7th, 3rd bit.
Fig.18 An example of 4-bit data transfer timing sequence.
RS
R/W
E
internal
DB7
internal operation
data
busy
instruction
write
busy flag
check
busy
busy flag
check
not
busy
busy flag
check
Fig.19 Example of busy flag checking timing sequence.
2001 Dec 19
33
data
instruction
write
MGA806
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
10.2.2
A master receiver must signal an end of data to the
transmitter by not generating an acknowledge bit on the
last byte that has been clocked out of the slave. In this
event the transmitter must leave the data line HIGH to
enable the master to generate a STOP condition.
10.2.1
DEFINITIONS
• Transmitter: the device which sends the data to the bus
• Receiver: the device which receives the data from the
bus
• Master: the device which initiates a transfer generates
clock signals and terminates a transfer
I2C-BUS PROTOCOL
• Slave: the device addressed by a master
Before any data is transmitted on the I2C-bus, the device
which should respond is addressed first. The addressing is
always carried out with the first byte transmitted after the
START procedure. The I2C-bus configuration for the
different PCF2113x read and write cycles is shown in
Figs 24 to 26. The slow down feature of the I2C-bus
protocol (receiver holds SCL LOW during internal
operations) is not used in the PCF2113x.
MASTER
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
• Multi-master: more than one master can attempt to
control the bus at the same time without corrupting the
message
• Arbitration: procedure to ensure that if more than one
master simultaneously tries to control the bus, only one
is allowed to do so and the message is not corrupted
• Synchronization: procedure to synchronize the clock
signals of two or more devices.
SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER
MASTER
TRANSMITTER/
RECEIVER
SDA
SCL
MGA807
Fig.20 System configuration.
handbook, full pagewidth
SDA
SCL
data line
stable;
data valid
change
of data
allowed
Fig.21 Bit transfer.
2001 Dec 19
34
MBC621
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
handbook, full pagewidth
SDA
SDA
SCL
SCL
S
P
START condition
STOP condition
MBC622
Fig.22 Definition of START and STOP conditions.
handbook, full pagewidth
DATA OUTPUT
BY TRANSMITTER
not acknowledge
DATA OUTPUT
BY RECEIVER
acknowledge
SCL FROM
MASTER
1
2
8
9
S
clock pulse for
acknowledgement
START
condition
MBC602
Fig.23 Acknowledgement on the I2C-bus.
2001 Dec 19
35
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Philips Semiconductors
LCD controllers/drivers
handbook, full pagewidth
2001 Dec 19
acknowledgement
from PCF2113x
S
S 0 1 1 1 0 1 A 0 A 1 RS CONTROL BYTE A
DATA BYTE
A 0 RS CONTROL BYTE A
DATA BYTE
A P
0
slave address
R/W
Co
2n ≥ 0 bytes
1 byte
Co
n ≥ 0 bytes
update
data pointer
36
MGG002
S
0 1 1 1 0 1 A 0
0
PCF2113x
slave address
R/W
Product specification
PCF2113x
Fig.24 Master transmits to slave receiver; write mode.
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S
S 0 1 1 1 0 1 A 0 A 1 RS CONTROL BYTE A
DATA BYTE
A 0 RS CONTROL BYTE A
DATA BYTE(1)
Philips Semiconductors
LCD controllers/drivers
handbook, full pagewidth
2001 Dec 19
acknowledgement
A
0
slave address
2n
R/W
0 bytes
n ≥ 0 bytes
1 byte
Co
Co
37
acknowledgement
S
SLAVE
ADDRESS
S
A 1 A
0
acknowledgement
DATA BYTE
A
n bytes
R/W
Co
no acknowledgement
DATA BYTE
1 P
last byte
update
data pointer
update
data pointer
MGG003
Product specification
Fig.25 Master reads after setting word address; writes word address, set RS; ‘read data’.
PCF2113x
Last data byte is a dummy byte (may be omitted).
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
acknowledgement
from PCF2113x
handbook, full pagewidth
S
SLAVE
ADDRESS
S
A 1 A
0
acknowledgement
from master
DATA BYTE
A
no acknowledgement
from master
n bytes
R/W
Co
1 P
DATA BYTE
last byte
update
data pointer
update
data pointer
MGG004
Fig.26 Master reads slave immediately after first byte; read mode (RS previously defined).
11 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDD1
logic supply voltage
−0.5
+5.5
V
VDD2, VDD3
VLCD generator supply voltages
−0.5
+4
V
VLCD
LCD supply voltage
−0.5
+6.5
V
Vi/o(n)
voltage on
any VDD related input or output
−0.5
VDD + 0.5
V
any VLCD related input or output
−0.5
VLCD + 0.5 V
II
DC input current
−10
+10
mA
IO
DC output current
−10
+10
mA
IDD, ISS and ILCD VDD, VSS or VLCD supply current
−50
+50
mA
Ptot
total power dissipation
−
400
mW
PO
power dissipation per output
−
100
mW
Ves
electrostatic handling voltage
human body model;
C = 100 pF; R = 1.5 kΩ
−
2000
V
electrostatic handling voltage
machine model;
C = 200 pF; L = 0.75 µH
−
150
V
−65
+150
°C
Tstg
storage temperature
12 HANDLING INSTRUCTIONS
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices”).
2001 Dec 19
38
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
13 DC CHARACTERISTICS
VDD1 = 1.8 to 5.5 V; VDD2 = VDD3 = 2.2 to 4.0 V; VSS = 0 V; VLCD = 2.2 to 6.5 V; Tamb = −40 to +85 °C; unless otherwise
specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VDD1
logic supply voltage
VDD2, VDD3 VLCD generator supply
voltages
VLCD
LCD supply voltage
VPOR
Power-on reset voltage
note 1
1.8
−
5.5
V
internal VLCD generation
(VDD2 and VDD3 < VLCD)
2.2
−
4.0
V
2.2
−
6.5
V
0.9
−
1.6
V
−
70
120
µA
note 1 and 2
GROUND SUPPLY CURRENT; EXTERNAL VLCD; note 3
ISS1
ground supply current 1
ISS3
ground supply current 3
VDD = 3 V; VLCD = 5 V; note 4
−
45
80
µA
ISS4
ground supply current 4
icon mode; VDD = 3 V;
VLCD = 2.5 V; note 4
−
25
45
µA
ISS5
ground supply current 5
−
Power-down mode;
VDD = 3 V; VLCD = 2.5 V;
DB7 to DB0, RS and R/W = 1;
OSC = 0; PD = 1
2
5
µA
−
190
400
µA
GROUND SUPPLY CURRENT; INTERNAL VLCD; notes 3 and 5
ISS6
ground supply current 6
ISS8
ground supply current 8
VDD = 3 V; VLCD = 5 V; note 4
−
160
400
µA
ISS9
ground supply current 9
icon mode; VDD = 2.5 V;
VLCD = 2.5 V; note 4
−
120
−
µA
Logic
VIL
LOW-level input voltage
VSS1
−
0.3VDD1
V
VIH
HIGH-level input voltage
0.7VDD1
−
VDD1
V
VIL(OSC)
LOW-level input voltage on
pin OSC
VSS1
−
VDD1 − 1.2 V
VIH(OSC)
HIGH-level voltage pin OSC
VDD1 − 0.1
−
VDD1
V
IOL(DB)
LOW-level output current on
pins DB7 to DB0
VOL = 0.4 V; VDD1 = 5 V
1.6
4
−
mA
IOH(DB)
HIGH-level output current on
pins DB7 to DB0
VOH = 4 V; VDD1 = 5 V
−1
−8
−
mA
Ipu
pull-up current at
pins DB7 to DB0
VI = VSS1
0.04
0.15
1
µA
IL
leakage current
VI = VDD1 or VSS1
−1
−
+1
µA
2001 Dec 19
39
Philips Semiconductors
Product specification
LCD controllers/drivers
SYMBOL
PCF2113x
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
I2C-bus; pins SDA and SCL
VIL
LOW-level input voltage
0
−
0.3VDD1
V
VIH
HIGH-level input voltage
0.7VDD1
−
5.5
V
ILI
input leakage current
VI = VDD1 or VSS1
−1
−
+1
µA
Ci
input capacitance
note 6
−
5
−
pF
IOL (SDA)
LOW-level output current on
pin SDA
VOL = 0.4 V; VDD1 > 2 V
3
−
−
mA
VOL = 0.2 VDD1; VDD1 < 2 V
2
−
−
mA
LCD outputs
RO(ROW)
row output resistance of
pins R1 to R18
note 7
−
10
30
kΩ
RO(COL)
column output resistance of
pins C1 to C60
note 7
−
15
40
kΩ
Vbias(tol)
bias voltage tolerance on
pins R1 to R18 and C1 to C60
note 8
−
20
130
mV
VLCD2(tol)
VLCD voltage tolerance
Tamb = 25 °C; note 5
VLCD < 3 V
−
−
160
mV
VLCD < 4 V
−
−
200
mV
VLCD < 5 V
−
−
260
mV
VLCD < 6 V
−
−
340
mV
TC0
VLCD temperature coefficient 0
−
−0.16
−
%/K
TC1
VLCD temperature coefficient 1
−
−0.18
−
%/K
TC2
VLCD temperature coefficient 2
−
−0.21
−
%/K
TC3
VLCD temperature coefficient 3
−
−0.24
−
%/K
Notes
1. Spikes on VDD1 or VSS1 which cause VDD1 − VSS1 ≤ 1.6 V can cause a Power-on reset.
2. Resets all logic when VDD1 < VPOR; 3 OSC cycles required.
3. LCD outputs are open-circuit; inputs at VDD1 or VSS1; bus inactive.
4. Tamb = 25 °C; fOSC = 200 kHz.
5. LCD outputs are open-circuit; VLCD generator is on; load current IVLCD = 5 µA (at VLCD).
6. Tested on sample basis.
7. Resistance of output pins (R1 to R18 and C1 to C60) with a load current of 10 µA; outputs measured one at a time;
external VLCD = 3 V, VDD1, 2, 3 = 3 V.
8. LCD outputs open-circuit; external VLCD.
2001 Dec 19
40
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
14 AC CHARACTERISTICS
VDD1 = 1.8 to 5.5 V; VDD2 = VDD3 = 2.2 to 4.0 V; VSS = 0 V; VLCD = 2.2 to 6.5 V; Tamb = −40 to +85 °C; unless otherwise
specified.
SYMBOL
PARAMETER
CONDITIONS
VDD = 5.0 V
MIN.
TYP.
MAX.
UNIT
fFR
LCD frame frequency (internal clock)
45
95
147
Hz
fosc
oscillator frequency (not available at any pin)
140
250
450
kHz
fOSC(ext)
external clock frequency
140
−
450
kHz
tosc(st)
oscillator start-up time after power-down
−
200
300
µs
tW(PD)
power-down HIGH-level pulse width
1
−
−
µs
tSW(PD)
tolerable spike width on PD pin
−
−
90
ns
note 1
note 1
Timing characteristics of parallel interface; note 2
WRITE OPERATION (WRITING DATA FROM MICROCONTROLLER TO PCF2113X); see Fig.27
Tcy(en)
enable cycle time
500
−
−
ns
tW(en)
enable pulse width
220
−
−
ns
tsu(A)
address set-up time
50
−
−
ns
th(A)
address hold time
25
−
−
ns
tsu(D)
data set-up time
60
−
−
ns
th(D)
data hold time
25
−
−
ns
READ OPERATION (READING DATA FROM PCF2113X TO MICROCONTROLLER); see Fig.28
Tcy(en)
enable cycle time
500
−
−
ns
tW(en)
enable pulse width
220
−
−
ns
tsu(A)
address set-up time
50
−
−
ns
th(A)
address hold time
25
−
−
ns
td(D)
data delay time
VDD1 > 2.2 V
−
−
150
ns
VDD1 > 1.5 V
−
−
250
ns
th(D)
data hold time
5
−
100
ns
Timing characteristics of I2C-bus interface; see Fig.29; note 2
fSCL
SCL clock frequency
−
−
400
kHz
tLOW
SCL clock LOW period
1.3
−
−
µs
tHIGH
SCL clock HIGH period
0.6
−
−
µs
tSU;DAT
data set-up time
100
−
−
ns
tHD;DAT
data hold time
0
−
−
ns
tr
SCL and SDA rise time
note 1 and 3
15 + 0.1 Cb
−
300
ns
tf
SCL and SDA fall time
note 1 and 3
15 + 0.1 Cb
−
300
ns
Cb
capacitive bus line load
−
−
400
pF
tSU;STA
set-up time for a repeated START condition
0.6
−
−
µs
tHD;STA
START condition hold time
0.6
−
−
µs
2001 Dec 19
41
Philips Semiconductors
Product specification
LCD controllers/drivers
SYMBOL
PCF2113x
PARAMETER
CONDITIONS
MIN.
TYP.
tSU;STO
set-up time for STOP condition
0.6
−
tSW
tolerable spike width on bus
−
tBUF
bus free time between STOP and START
condition
1.3
MAX.
UNIT
−
µs
−
50
ns
−
−
µs
Notes
1. Tested on sample base.
2. All timing values are valid within the operating supply voltage and ambient temperature range and are referenced to
VIL and VIH with an input voltage swing of VSS to VDD.
3. Cb = total capacitance of one bus line in pF.
handbook, full pagewidth
RS
VIH1
V IL1
VIH1
VIL1
t su(A)
R/W
t h(A)
V IL1
VIL1
t h(A)
tW(en)
E
VIH1
VIH1
VIL1
VIL1
VIL1
t h(D)
t su(D)
VIH1
valid data
VIL1
DB0 to DB7
Tcy(en)
VIH1
VIL1
MBK474
Fig.27 Parallel bus write operation sequence; writing data from microcontroller to PCF2113x.
2001 Dec 19
42
Philips Semiconductors
Product specification
LCD controllers/drivers
handbook, full pagewidth
PCF2113x
VIH1
V IL1
RS
VIH1
VIL1
tsu(A)
t h(A)
VIH1
VIH1
R/W
tW(en)
VIL1
E
VIH1
t h(A)
VIH1
VIL1
t h(D)
t d(D)
VOH1
VOL1
DB0 to DB7
VIL1
VOH1
VOL1
MBK475
Tcy(en)
Fig.28 Parallel bus read operation sequence; writing data from PCF2113x to microcontroller.
handbook, full pagewidth
SDA
t BUF
tf
t LOW
SCL
t HD;STA
t HD;DAT
tr
t HIGH
t SU;DAT
SDA
MGA728
t SU;STA
Fig.29 I2C-bus timing diagram.
2001 Dec 19
43
t
SU;STO
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
15 DEVICE PROTECTION CIRCUITS
SYMBOL
VDD1
PAD
INTERNAL CIRCUIT
1
VDD1
VSS1
MGU200
VDD2
109
VDD2
VSS1
VSS2
MGU201
VDD3
110
VDD3
VSS1
MGU202
VSS1
7
VSS2
8
8
7
VSS2
VSS1
MGU203
VLCDSENSE
10
VLCD1
11
VLCD2
9
VSS1
MGU196
SCL
96
SDA
97
VDD1
VSS1
MGU198
2001 Dec 19
44
Philips Semiconductors
Product specification
LCD controllers/drivers
SYMBOL
PCF2113x
PAD
OSC
2
PD
3
T1
5
T2
6
INTERNAL CIRCUIT
VDD1
T3
4
E
98
VSS1
RS
99
MGU199
R/W
100
DB0 to DB7
108 to 101
R1 to R8
94 to 87
R9 to R16
12 to 19
R17
95
R18
20
VLCD2
C1 to C2
86 to 85
C3 to 27
82 to 58
VSS1
C28 to C52
55 to 31
MGU197
C53 to C60
28 to 21
2001 Dec 19
45
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
16 APPLICATION INFORMATION
handbook, full pagewidth
P80CL51
P10
RS
P11
R/W
P12
E
P17 to P14
2
R1 to R16
2 × 12 CHARACTER
LCD DISPLAY
PLUS 120 ICONS
PCF2113x
16
C1 to C60
DB7 to DB4
4
R17, R18
60
MGG006
Fig.30 Direct connection to 8-bit microcontroller; 4-bit bus.
handbook, full pagewidth
P80CL51
P20
RS
P21
R/W
P22
E
P17 to P10
2
R1 to R16
2 × 12 CHARACTER
LCD DISPLAY
PLUS 120 ICONS
PCF2113x
16
C1 to C60
DB7 to DB0
8
R17, R18
60
MGG005
Fig.31 Direct connection to 8-bit microcontroller; 8-bit bus.
handbook, full pagewidth
OSC
VDD
R17, R18
2
R1 to R16
2 × 12 CHARACTER
LCD DISPLAY
PLUS 120 ICONS
VDD
PCF2113x
100
nF
VSS
16
VLCD
100
nF
C1 to C60
60
VSS
8
DB7 to DB0 E
MGG007
RS R/W
Fig.32 Typical application using parallel interface.
2001 Dec 19
46
Philips Semiconductors
Product specification
LCD controllers/drivers
handbook, full pagewidth
PCF2113x
VDD VDD
VDD
OSC
VDD
DB3/SAO
R17, R18
2
R1 to R16
2 × 12 CHARACTER
LCD DISPLAY
PLUS 120 ICONS
VDD
PCF2113x
100
nF
16
VLCD
100
nF
VSS
VSS
C1 to C60
60
R17, R18
2
R1 to R16
1 × 24 CHARACTER
LCD DISPLAY
PLUS 120 ICONS
SCL SDA
VSS
OSC
VDD
DB3/SAO
VDD
PCF2113x
470
nF
100
nF
VSS
SCL SDA
16
VLCD
C1 to C60
VSS
60
SCL SDA
MASTER TRANSMITTER
PCF84C81A; P80CL410
MGG008
Fig.33 Application using I2C-bus interface.
16.1
Optimized values for these tracks are below 50 Ω for the
supply and below 100 Ω for the I/O connections. Higher
track resistance reduce performance and increase current
consumption.
General application information
The required minimum value for the external capacitors in
an application with the PCF2113x are: CExt for
VLCD/VSS = 100 nF min., for VDD/VSS = 470 nF. Higher
capacitor values are recommended for ripple reduction.
To avoid accidental triggering of Power-on reset
(especially in COG applications), the supplies must be
adequately decoupled. Depending on power supply
quality, VDD1 may have to be risen above the specified
minimum.
For COG applications the recommended ITO track
resistance is to be minimized for the I/O and supply
connections.
2001 Dec 19
47
Philips Semiconductors
Product specification
LCD controllers/drivers
16.2
PCF2113x
4-bit operation, 1-line display using internal
reset
16.4
For a 2-line display the cursor automatically moves from
the first to the second line after the 40th digit of the first line
has been written. Thus, if there are only 8 characters in the
first line, the DDRAM address must be set after the 8th
character is completed (see Table 15). It should be noted
that both lines of the display are always shifted together;
data does not shift from one line to the other.
The program must set functions prior to a 4-bit operation
(see Table 12). When power is turned on, 8-bit operation
is automatically selected and the PCF2113x attempts to
perform the first write as an 8-bit operation. Since nothing
is connected to DB0 to DB3, a rewrite is then required.
However, since one operation is completed in two
accesses of 4-bit operation, a rewrite is required to set the
functions (see Table 12 step 3). Thus, DB4 to DB7 of the
‘function set’ are written twice.
16.3
8-bit operation, 2-line display
16.5
I2C-bus operation, 1-line display
A control byte is required with most commands
(see Table 16).
8-bit operation, 1-line display using internal
reset
Tables 13 and 14 show an example of a 1-line display in
8-bit operation. The PCF2113x functions must be set by
the ‘function set’ instruction prior to display. Since the
DDRAM can store data for 80 characters, the RAM can be
used for advertising displays when combined with display
shift operation. Since the display shift operation changes
display position only and the DDRAM contents remain
unchanged, display data entered first can be displayed
when the ‘return home’ operation is performed.
Table 12 4-bit operation, 1-line display example using internal reset
STEP
INSTRUCTION
1
power supply on (PCF2113x is initialized by
the internal reset)
2
function set
3
4
5
6
DISPLAY
RS
R/W
DB7
DB6
DB5
DB4
0
0
0
0
1
0
OPERATION
initialized; no display appears
sets to 4-bit operation; in this instance operation
is handled as 8-bits by initialization and only this
instruction completes with one write
function set
0
0
0
0
1
0
0
0
0
0
0
0
sets to 4-bit operation, selects 1-line display and
VLCD = V0; 4-bit operation starts from this point
and resetting is needed
display control
0
0
0
0
0
0
0
0
1
1
1
0
_
turns on display and cursor; entire display is
blank after initialization
_
sets mode to increment the address by 1 and to
shift the cursor to the right at the time of write to
the DD/CGRAM; display is not shifted
P_
writes ‘P’; the DDRAM has already been selected
by initialization at power-on; the cursor is
incremented by 1 and shifted to the right
entry mode set
0
0
0
0
0
0
0
0
0
1
1
0
‘write data’ to CGRAM/DDRAM
1
0
0
1
0
1
1
0
0
0
0
0
2001 Dec 19
48
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INSTRUCTION
DISPLAY
1
power supply on (PCF2113x is initialized by the internal
reset)
2
function set
3
RS
R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
49
1
0
0
0
0
0
0
0
0
0
1
1
1
0
_
turns on display and cursor; entire display is blank after
initialization
0
0
0
0
0
0
1
1
0
_
sets mode to increment the address by 1 and to shift the
cursor to the right at the time of the write to the
DD/CGRAM; display is not shifted
0
0
0
0
P_
writes ‘P’; the DDRAM has already been selected by
initialization at power-on; the cursor is incremented by 1
and shifted to the right
1
0
0
0
PH_
‘write data’ to CGRAM/DDRAM
1
6
1
entry mode set
0
5
sets to 8-bit operation, selects 1-line display and
VLCD = V0
0
display control
0
4
initialized; no display appears
0
0
OPERATION
Philips Semiconductors
STEP
LCD controllers/drivers
2001 Dec 19
Table 13 8-bit operation, 1-line display example; using internal reset (character set ‘A’)
0
0
1
0
1
‘write data’ to CGRAM/DDRAM
1
0
0
1
0
7 to 10
0
writes ‘H’
|
writes ‘ILIP’
|
11
‘write data’ to CGRAM/DDRAM
1
12
1
0
1
0
0
1
1
PHILIPS_
writes ‘S’
0
0
0
0
0
0
1
1
1
PHILIPS_
sets mode for display shift at the time of write
0
0
0
0
HILIPS _
writes space
1
1
0
1
ILIPS
writes ‘M’
‘write data’ to CGRAM/DDRAM
1
0
0
0
1
0
‘write data’ to CGRAM/DDRAM
0
0
1
0
15 to 19
0
M_
|
writes ‘ICROK’
|
20
‘write data’ to CGRAM/DDRAM
1
0
0
1
0
0
1
1
1
1
MICROKO_
writes ‘O’
PCF2113x
1
Product specification
14
0
entry mode set
0
13
0
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1
0
0
0
0
MICROKO
shifts only the cursor position to the left
0
0
0
0
1
0
0
0
0
MICROKO
shifts only the cursor position to the left
0
0
1
0
0
0
0
1
1
ICROCO
writes ‘C’ correction; the display moves to the left
0
0
0
0
1
1
1
0
0
MICROCO
shifts the display and cursor to the right
0
0
0
0
1
0
1
0
0
MICROCO_
shifts only the cursor to the right
‘write data’ to CGRAM/DDRAM
1
27
0
cursor/display shift
0
26
0
cursor/display shift
0
25
0
‘write data’ to CGRAM/DDRAM
1
24
0
cursor/display shift
0
23
OPERATION
cursor/display shift
0
22
DISPLAY
Philips Semiconductors
21
INSTRUCTION
LCD controllers/drivers
2001 Dec 19
STEP
0
0
1
0
0
1
1
0
1
ICROCOM_
writes ‘M’
0
0
0
0
0
0
1
0
PHILIPS M
returns both display and cursor to the original position
(address 0)
return home
0
0
50
Product specification
PCF2113x
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INSTRUCTION
DISPLAY
1
power supply on (PCF2113x is initialized by the internal
reset)
2
function set
3
RS
R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
1
0
0
0
0
sets to 8-bit operation, selects 1-line display and
VLCD = V0
0
0
51
0
0
0
1
1
1
0
_
turns on display and cursor; entire display is blank after
initialization
0
0
0
0
0
0
1
1
0
_
sets mode to increment the address by 1 and to shift the
cursor to the right at the time of the write to the
DD/CGRAM; display is not shifted
0
0
0
0
0
0
_
sets the CGRAM address to position of character 0;
the CGRAM is selected
0
1
0
1
0
_
writes data to CGRAM for icon even phase; icons appears
1
0
0
0
0
_
sets the CGRAM address to position of character 4;
the CGRAM is selected
0
1
0
1
0
_
writes data to CGRAM for icon odd phase
set CGRAM address
0
6
1
entry mode set
0
5
0
display mode on/off control
0
4
initialized; no display appears
0
0
OPERATION
Philips Semiconductors
STEP
LCD controllers/drivers
2001 Dec 19
Table 14 8-bit operation, 1-line display and icon example; using internal reset (character set ‘A’)
0
0
1
‘write data’ to CGRAM/DDRAM
1
0
0
0
0
7
|
|
8
set CGRAM address
0
9
0
0
1
1
‘write data’ to CGRAM/DDRAM
1
0
0
0
0
10
|
|
function set
12
0
0
1
1
0
0
0
1
_
sets H = 1
0
0
0
0
1
0
1
0
_
icons blink
0
0
1
1
0
0
0
1
_
sets H = 0
icon control
0
13
0
0
function set
0
0
PCF2113x
0
Product specification
11
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0
1
0
0
0
0
0
0
0
sets the DDRAM address to the first position; DDRAM is
selected
0
0
0
0
P_
writes ‘P’; the cursor is incremented by 1 and shifted to
the right
1
0
0
0
PH_
writes ‘H’
‘write data’ to CGRAM/DDRAM
1
16
OPERATION
set DDRAM address
0
15
DISPLAY
0
0
1
0
1
‘write data’ to CGRAM/DDRAM
1
0
0
1
0
17 to 21
0
|
writes ‘ILIPS’
|
22
Philips Semiconductors
14
INSTRUCTION
LCD controllers/drivers
2001 Dec 19
STEP
return home
0
0
0
0
0
0
0
0
1
0
PHILIPS
returns both display and cursor to the original position
(address 0)
52
Product specification
PCF2113x
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INSTRUCTION
DISPLAY
1
power supply on (PCF2113x is initialized by the internal
reset)
2
function set
3
RS
R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
sets to 8-bit operation; selects 2-line display and VLCD
generator off
1
0
1
0
0
0
0
0
0
0
1
1
1
0
_
turns on display and cursor; entire display is blank after
initialization
0
0
0
0
0
0
1
1
0
_
sets mode to increment the address by 1 and to shift the
cursor to the right at the time of write to the CG/DDRAM;
display is not shifted
0
0
0
0
P_
writes ‘P’; the DDRAM has already been selected by
initialization at power-on; the cursor is incremented by 1
and shifted to the right
‘write data’ to CGRAM/DDRAM
1
53
1
entry mode set
0
5
0
display on/off control
0
4
initialized; no display appears
0
0
OPERATION
Philips Semiconductors
STEP
LCD controllers/drivers
2001 Dec 19
Table 15 8-bit operation, 2-line display example; using internal reset
0
0
1
0
6 to 10
1
|
writes ‘HILIP’
|
11
‘write data’ to CGRAM/DDRAM
12
set DDRAM address
1
0
13
0
0
0
1
1
1
0
1
0
0
1
1
PHILIPS_
writes ‘S’
0
0
0
0
0
0
PHILIPS
_
sets DDRAM address to position the cursor at the head of
the 2nd line
1
1
0
1
PHILIPS
M_
writes ‘M’
‘write data’ to CGRAM/ DDRAM
1
0
0
1
0
14 to 18
0
|
writes ‘ICROC’
‘write data’ to CGRAM/DDRAM
1
0
0
1
0
0
1
1
1
1
PHILIPS
MICROCO_
writes ‘O’
Product specification
19
PCF2113x
|
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0
0
0
0
0
0
1
1
1
PHILIPS
MICROCO_
sets mode for display shift at the time of write
‘write data’ to CGRAM/DDRAM
1
23
OPERATION
‘write data’ to CGRAM/DDRAM
0
21
DISPLAY
0
0
1
0
0
1
1
0
1
HILIPS
ICROCOM_
writes ‘M’; display is shifted to the left; the first and second
lines shift together
0
0
0
0
0
0
1
0
PHILIPS
MICROCOM
returns both display and cursor to the original position
(address 0)
return home
0
0
Philips Semiconductors
20
INSTRUCTION
LCD controllers/drivers
2001 Dec 19
STEP
54
Product specification
PCF2113x
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1
I2C-bus
2
slave address for write
DISPLAY
start
initialized; no display appears
SA6 SA5 SA4 SA3 SA2 SA1 SA0 R/W Ack
0
3
4
1
1
1
0
1
0
0
1
during the acknowledge cycle SDA will be pulled-down by the
PCF2113x
control byte sets RS for following data bytes
send a control byte for ‘function set’
Co
RS
0
0
0
0
0
0
Ack
0
0
0
0
0
0
0
0
1
function set
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack
0
5
0
1
X
0
0
0
0
display on/off control
0
0
0
0
1
1
1
0
55
0
0
0
7
I2C-bus start
8
slave address for write
0
1
1
0
_
sets mode to increment the address by 1 and to shift the cursor
to the right at the time of write to the DDRAM or CGRAM; display
is not shifted
_
for writing data to DDRAM, RS must be set to 1; therefore a
control byte is needed
1
SA6 SA5 SA4 SA3 SA2 SA1 SA0 R/W Ack
0
1
1
1
0
1
0
0
1
_
send a control byte for ‘write data’
Co
RS
0
0
0
0
0
0
Ack
0
1
0
0
0
0
0
0
1
_
‘write data’ to DDRAM
1
0
1
0
0
0
0
writes ‘P’; the DDRAM has been selected at power-up; the
cursor is incremented by 1 and shifted to the right
PH_
writes ‘H’
1
‘write data’ to DDRAM
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack
0
1
0
0
1
0
0
0
1
Product specification
0
P_
PCF2113x
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack
11
turns on display and cursor; entire display shows character 20H
(blank in ASCII-like character sets)
entry mode set
0
10
_
1
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack
9
selects 1-line display and VLCD = V0; SCL pulse during
acknowledge cycle starts execution of instruction
1
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack
6
OPERATION
Philips Semiconductors
I2C-BUS BYTE
STEP
LCD controllers/drivers
2001 Dec 19
Table 16 Example of I2C-bus operation; 1-line display (using internal reset, assuming SA0 = VSS; note 1)
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12 to 15
|
DISPLAY
OPERATION
|
16
‘write data’ to DDRAM
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack
0
1
0
1
0
0
1
1
17
(optional I2C-bus stop) I2C-bus start start + slave
address for write (as step 8)
18
control byte
19
PHILIPS_
RS
0
0
0
0
0
0
Ack
1
0
0
0
0
0
0
0
1
0
0
0
56
20
I2C-bus start
21
slave address for read
0
0
1
0
1
1
PHILIPS
1
sets DDRAM address 0 in address counter (also returns shifted
display to original position; DDRAM contents unchanged); this
instruction does not update the Data Register (DR)
PHILIPS
SA6 SA5 SA4 SA3 SA2 SA1 SA0 R/W Ack
0
1
0
1
0
1
PHILIPS
during the acknowledge cycle the content of the DR is loaded
into the internal I2C-bus interface to be shifted out; in the
previous instruction neither a ‘set address’ nor a ‘read data’ has
been performed; therefore the content of the DR was unknown;
the R/W has to be set to 1 while still in I2C-write mode
PHILIPS
DDRAM content will be read from following instructions
PHILIPS
8 × SCL; content loaded into interface during previous
acknowledge cycle is shifted out over SDA; MSB is DB7; during
master acknowledge content of DDRAM address 01 is loaded
into the I2C-bus interface
PHILIPS
8 × SCL; code of letter ‘H’ is read first; during master
acknowledge code of ‘I’ is loaded into the I2C-bus interface
1
control byte for read
Co
RS
0
0
0
0
0
0
Ack
0
1
1
0
0
0
0
0
1
‘read data’: 8 × SCL + master acknowledge; note 2
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack
X
X
X
X
X
X
X
X
0
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack
0
1
0
0
1
0
0
0
0
Product specification
‘read data’: 8 × SCL + master acknowledge; note 2
PCF2113x
24
PHILIPS_
return home
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack
23
writes ‘S’
1
Co
0
22
PHILIPS_
Philips Semiconductors
I2C-BUS BYTE
LCD controllers/drivers
2001 Dec 19
STEP
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25
‘read data’: 8 × SCL + no master acknowledge; note 2
DISPLAY
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack
0
26
1
I2C-bus stop
0
0
1
0
0
1
PHILIPS
1
OPERATION
no master acknowledge; after the content of the I2C-bus
interface register is shifted out no internal action is performed;
no new data is loaded to the interface register, data register is
not updated, address counter is not incremented and cursor is
not shifted
PHILIPS
Notes
1. X = don’t care.
2. SDA is left at high-impedance by the microcontroller during the read acknowledge.
Philips Semiconductors
I2C-BUS BYTE
LCD controllers/drivers
2001 Dec 19
STEP
57
Product specification
PCF2113x
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DESCRIPTION
power-on or unknown state
|
wait 2 ms after internal reset has been applied
|
RS
R/W
DB7
DB6
DB5
0
0
0
0
1
DB4
DB3
DB2
DB1
DB0
BF cannot be checked before this instruction
1
X
X
X
X
function set (interface is 8 bits long)
|
wait 2 ms
|
RS
R/W
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
BF cannot be checked before this instruction
0
0
0
0
1
1
X
X
X
X
function set (interface is 8 bits long)
DB4
DB3
DB2
DB1
DB0
BF cannot be checked before this instruction
1
X
X
X
X
Philips Semiconductors
STEP
LCD controllers/drivers
2001 Dec 19
Table 17 Initialization by instruction, 8-bit interface (note 1)
|
wait more than 40 µs
|
58
RS
R/W
DB7
DB6
DB5
0
0
0
0
1
|
|
RS
R/W
DB7
DB6
DB5
function set (interface is 8 bits long)
BF can be checked after the following instructions; when BF is not checked,
the waiting time between instructions is the specified instruction time
(see Table 3)
DB4
DB3
DB2
DB1
DB0
function set (interface is 8 bits long); specify the number of display lines
0
0
0
0
1
1
0
M
0
H
0
0
0
0
0
0
1
0
0
0
display off
0
0
0
0
0
0
0
0
0
1
clear display
0
0
0
0
0
0
0
1
I/D
S
entry mode set
|
Initialization ends
Product specification
1. X = don’t care.
PCF2113x
Note
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DESCRIPTION
power-on or unknown state
|
Wait 2 ms after internal reset has been applied
|
RS
R/W
DB7
DB6
DB5
DB4
BF cannot be checked before this instruction
0
0
0
0
1
1
function set (interface is 8 bits long)
|
Wait 2 ms
|
RS
R/W
DB7
DB6
DB5
DB4
BF cannot be checked before this instruction
0
0
0
0
1
1
function set (interface is 8 bits long)
Philips Semiconductors
STEP
LCD controllers/drivers
2001 Dec 19
Table 18 Initialization by instruction, 4-bit interface; not applicable for I2C-bus operation
|
Wait 40 µs
|
59
RS
R/W
DB7
DB6
DB5
DB4
BF cannot be checked before this instruction
0
0
0
0
1
1
function set (interface is 8 bits long)
|
BF can be checked after the following instructions; when BF is not checked, the waiting time
between instructions is the specified instruction time (see Table 3)
RS
R/W
DB7
DB6
DB5
DB4
function set (set interface to 4 bits long)
0
0
0
0
1
0
interface is 8 bits long
0
0
0
1
0
function set (interface is 4 bits long)
0
0
0
M
0
H
specify number of display lines
0
0
0
0
0
0
0
0
1
0
0
0
display off
0
0
0
0
0
0
clear display
0
0
0
0
0
1
0
0
0
0
0
0
0
0
1
I/D
S
|
Initialization ends
entry mode set
PCF2113x
0
Product specification
0
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
17 BONDING PAD INFORMATION
SYMBOL
VDD1
OSC
PD
T3
T1
T2
VSS1
VSS2
VLCD2
VLCDSENSE
VLCD1
R9
R10
R11
R12
R13
R14
R15
R16
R18
C60
C59
C58
C57
C56
C55
C54
C53
dummy pad 1
dummy pad 2
C52
C51
C50
C49
C48
C47
C46
C45
C44
C43
C42
C41
2001 Dec 19
PAD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
SYMBOL
COORDINATES(1)
X
Y
−1345
−1155
−1 055
−845
−765
−665
−525
−455
−295
−145
+15
+175
+245
+315
+385
+455
+525
+595
+665
+735
+805
+875
+995
+1065
+1135
+1205
+1275
+1345
+1435
+1630
+1630
+1630
+1630
+1630
+1630
+1630
+1630
+1630
+1630
+1630
+1630
+1630
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1550
−1395
−1255
−1155
−1055
−955
−735
−635
−535
−435
−335
−235
−135
−35
C40
C39
C38
C37
C36
C35
C34
C33
C32
C31
C30
C29
C28
dummy pad 3
dummy pad 4
C27
C26
C25
C24
C23
C22
C21
C20
C19
C18
C17
C16
C15
C14
C13
C12
C11
C10
C9
C8
C7
C6
C5
C4
C3
dummy pad 5
dummy pad 6
C2
60
PAD
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
COORDINATES(1)
X
Y
+1630
+1630
+1630
+1630
+1630
+1630
+1630
+1630
+1630
+1630
+1630
+1630
+1630
+1630
+1435
+1335
+1225
+1115
+1005
+765
+665
+565
+465
+365
+265
+165
+65
−35
−135
−235
−335
−435
−535
−635
−735
−835
−965
−1065
−1165
−1265
−1465
−1630
−1630
+65
+165
+265
+365
+465
+565
+665
+765
+865
+965
+1065
+1165
+1265
+1335
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1550
+1355
+1255
Philips Semiconductors
Product specification
LCD controllers/drivers
SYMBOL
C1
R8
R7
R6
R5
R4
R3
R2
R1
R17
SCL
SDA
E
RS
R/W
2001 Dec 19
PAD
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
PCF2113x
COORDINATES(1)
X
Y
−1630
−1630
−1630
−1630
−1630
−1630
−1630
−1630
−1630
−1630
−1630
−1630
−1630
−1630
−1630
+1185
+1115
+1045
+975
+905
+835
+765
+695
+625
+555
+375
+305
+85
−15
−115
SYMBOL
PAD
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
VDD2
VDD3
dummy pad 7
dummy pad 8
101
102
103
104
105
106
107
108
109
110
111
112
COORDINATES(1)
X
Y
−1630
−1630
−1630
−1630
−1630
−1630
−1630
−1630
−1630
−1630
−1630
−1465
−215
−315
−415
−515
−615
−715
−815
−915
−1015
−1235
−1395
−1550
Note
1. All x and y coordinates are referenced to centre of chip
and dimensions are in µm (see Fig.34).
61
Philips Semiconductors
Product specification
C20
C21
C22
C23
C24
C25
C26
C27
dummy pad 4
63
62
61
60
59
58
57
C14
71
64
C13
72
C19
C12
73
65
C11
74
C18
C10
75
66
C9
76
C17
C8
77
67
C7
78
C16
C6
79
68
C5
80
C15
C4
81
69
C3
82
70
dummy pad 5
handbook, full pagewidth
PCF2113x
83
LCD controllers/drivers
y
56
dummy pad 3
55
C28
C29
C30
C31
C32
C33
C34
C35
C36
C37
C38
C39
C40
C41
C42
C43
C44
C45
C46
C47
C48
dummy pad 6
C2
C1
R8
R7
R6
R5
R4
R3
R2
R1
R17
84
SCL
SDA
96
97
E
98
RS
99
RW
100
DB7
101
40
DB6
102
39
DB5
103
38
DB4
104
37
DB3
105
36
DB2
106
35
DB1
107
DB0
VDD2
109
VDD3
110
31
C49
C50
C51
C52
dummy pad 7
111
30
dummy pad 2
85
86
87
88
89
90
91
92
93
94
95
54
53
52
51
50
49
PC2113x
48
47
46
45
44
3.36
mm
x
0
43
42
0
41
108
34
33
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
VLCDSENSE
VLCD1
R9
R10
R11
R12
R13
R14
R15
R16
R18
C60
C59
C58
C57
C56
C55
C54
C53
dummy pad 1
29
9
VLCD2
8
7
6
T2
VSS1
VSS2
5
4
T3
T1
3
2
1
VDD1
OSC
PD
112
dummy pad 8
32
3.52 mm
MGU205
Fig.34 Bonding pad locations.
2001 Dec 19
62
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
18 TRAY INFORMATION
x
handbook, full pagewidth
A
C
y
D
B
F
E
MGU206
For dimensions see Table 19.
Fig.35 Tray details.
Table 19 Tray dimensions
DIMENSION
handbook, halfpage
DESCRIPTION
VALUE
A
pocket pitch x direction
6.35 mm
B
pocket pitch y direction
5.59 mm
C
pocket width x direction
3.82 mm
D
pocket width y direction
3.66 mm
E
tray width x direction
50.8 mm
F
tray width y direction
50.8 mm
x
pockets in x direction
7
y
pockets in y direction
8
PC2113x
Table 20 Bump size
PARAMETER
MGU207
Type
Bump width
Bump length
Bump height
Height difference in one die
Convex deformation
Pad size, aluminium
Passivation opening CBB
Wafer thickness
The orientation of the IC in a pocket is indicated by the position of the
IC type name on the die surface with respect to the chamfer on the
upper left corner of the tray. Refer to the bonding pad location
diagram for the orientating and position of the type name on the die
surface.
Fig.36 Tray alignment.
2001 Dec 19
63
VALUE
galvanic pure Au
50 ±6
90 ±6
17.5 ±5
<2
<5
62 × 100
36 × 76
380 ±25
UNIT
−
µm
µm
µm
µm
µm
µm
µm
µm
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
19 PACKAGE OUTLINE
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
SOT407-1
c
y
X
A
51
75
50
76
ZE
e
E HE
A A2
(A 3)
A1
w M
θ
bp
Lp
L
pin 1 index
100
detail X
26
1
25
ZD
e
v M A
w M
bp
D
B
HD
v M B
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
14.1
13.9
14.1
13.9
0.5
HD
HE
16.25 16.25
15.75 15.75
L
Lp
v
w
y
1.0
0.75
0.45
0.2
0.08
0.08
Z D (1) Z E (1)
θ
1.15
0.85
7
0o
1.15
0.85
o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT407-1
136E20
MS-026
2001 Dec 19
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
00-01-19
00-02-01
64
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
If wave soldering is used the following conditions must be
observed for optimal results:
20 SOLDERING
20.1
Introduction to soldering surface mount
packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
20.2
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
20.3
20.4
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
2001 Dec 19
Manual soldering
65
Philips Semiconductors
Product specification
LCD controllers/drivers
20.5
PCF2113x
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable(2)
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
REFLOW(1)
suitable
suitable
suitable
not
recommended(3)(4)
suitable
not
recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2001 Dec 19
66
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
21 DATA SHEET STATUS
PRODUCT
STATUS
DATA SHEET STATUS
DEFINITIONS (1)
Objective specification
Development
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
22 DEFINITIONS
23 DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
24 BARE DIE DISCLAIMER
All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of
ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately
indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors
has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips
Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing,
handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in
which the die is used.
2001 Dec 19
67
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
25 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
2001 Dec 19
68
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
NOTES
2001 Dec 19
69
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
NOTES
2001 Dec 19
70
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
NOTES
2001 Dec 19
71
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected].
SCA73
© Koninklijke Philips Electronics N.V. 2001
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
403502/03/pp72
Date of release: 2001
Dec 19
Document order number:
9397 750 06995