RI-UHF-IC116-00 www.ti.com ...................................................................................................................................................................................................... SCBS874 – JULY 2008 SMT EPC Gen2 IC FEATURES APPLICATIONS • • • 1 • • • • • • Meets EPCglobal™ Gen2 (v1.0.9) and ISO/IEC 18000-6C Global Frequency Operability: 840 MHz to 960 MHz Supports Optional Gen2 Commands: Block Write and Block Erase 192-bit Memory: 96-bit Electronic Product Code™ (EPC), 32-bit Access Password, 32-bit KILL Password, 32-bit TID Memory Designed for High Performance and Low Power Consumption, Based on the Most Advanced Silicon Node for RFID (130 nm) Fast Tag Singulation Using Most Advanced Anticollision Scheme Green (RoHS and No Sb/Br) Compliant PCB Tracking Specialized Tag Designs Dimensions in mm DESCRIPTION Printed circuit board (PCB) manufacturers want to track products and component parts through their manufacturing and distribution systems. As space is at a premium, the typical requirement is for a robust method that can survive the manufacturing processes and yet has a footprint which takes up very little of the valuable board space. This UHF Gen2 packaged IC is designed for just that purpose – it can be placed across a typical dipole, near field loop, or a small etched slot to communicate specific information about that PCB when interrogated by fixed or hand held readers on a production line. ORDERING INFORMATION DELIVERY (1) (2) PART NUMBER QUANTITY Texas Instruments UHF IC is packaged in a standard SMT (TLLGA) package and is delivered on 179-mm × 55-mm × 8-mm reels. RI-UHF-IC116-00 5000 (1) (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated RI-UHF-IC116-00 SCBS874 – JULY 2008 ...................................................................................................................................................................................................... www.ti.com ABSOLUTE MAXIMUM RATINGS MIN IIN Input current, from any active pin to any active pin VIN Input voltage to active pins (sustained) Tstg Storage temperature range Moisture Sensitivity Level 1 (MSL1) lead-free reflow (IPC/JEDEC J-STD-020C) Charged-Device Model (CDM) Electrostatic discharge immunity UNIT 1.5 mADC -40 Assembly survival temperature ESD MAX Human-Body Model (HBM) 1.5 VDC 125 °C 260 °C 0.5 kV 2 kV RECOMMENDED OPERATING CONDITIONS TA Operating temperature fres Carrier frequency MIN MAX Reading –40 85 UNIT Writing –25 65 840 960 MHz MAX UNIT °C ELECTRICAL CHARACTERISTICS PARAMETER TEST CONDITIONS Sensitivity (power level at the die terminals with a conjugate value) MIN TYP Reading –9 –13 Writing –6 –9 dBm ΔΓ Change in modulator reflection coefficient ≥0.2 T Data retention time TA = 25°C 10 Years W&E Write and erase endurance TA = 25°C 100 000 Cycles RECOMMENDED ANTENNA SERIES IMPEDANCE Use this data for the target impedance for antenna designs. Series impedance 2 EUROPE 866.5 MHz USA 915 MHz JAPAN 953 MHz UNIT 9.8 + j73 8.2 + j61 7.2 + j53 Ω Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): RI-UHF-IC116-00 RI-UHF-IC116-00 www.ti.com ...................................................................................................................................................................................................... SCBS874 – JULY 2008 DEVICE INFORMATION IC Layout The IC layout is shown in Figure 1 and Figure 2. Figure 1. Overall Dimensions and Pin Layout Figure 2. IC Dimensions (TI Package Designator DRY) Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): RI-UHF-IC116-00 3 RI-UHF-IC116-00 SCBS874 – JULY 2008 ...................................................................................................................................................................................................... www.ti.com The land pattern for board layout is shown in Figure 3. Figure 3. Board Layout With Solder Mask Clearance 4 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): RI-UHF-IC116-00 RI-UHF-IC116-00 www.ti.com ...................................................................................................................................................................................................... SCBS874 – JULY 2008 Shipping, Packaging, and Further Handling The packaged ICs are delivered in individual pockets on 179-mm (7-inch) reels. The overall dimensions of the reel are shown Figure 4. Figure 4. Reel Dimensions The dimensions of the sprocket holes and IC pockets are shown in Figure 5. Figure 5. Tape Dimensions The ICs are held in place by a continuous cover tape and are orientated in the pockets as shown in Figure 6. Figure 6. Die Orientation in Pocket Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): RI-UHF-IC116-00 5 RI-UHF-IC116-00 SCBS874 – JULY 2008 ...................................................................................................................................................................................................... www.ti.com The packaged IC is delivered on reels of 5000. Each reel is packaged as shown in Figure 7. Figure 7. Single Reel Packaging Terms and Abbreviations A list of the terms and abbreviations used in the various TI manuals can be found in a separate document: TI-RFID Product Manuals –Terms & Abbreviations (SCBU014) 6 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): RI-UHF-IC116-00 PACKAGE OPTION ADDENDUM www.ti.com 29-Jul-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing RI-UHF-IC116-00 ACTIVE SON DRY Pins Package Eco Plan (2) Qty 6 5000 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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