STMICROELECTRONICS STPS15LB-TR

STPS5L25B/B-1
®
LOW DROP POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
IF(AV)
5A
VRRM
25 V
Tj (max)
150°C
VF (max)
0.35 V
2
4 (TAB)
3
4
4
FEATURES AND BENEFITS
2
VERY LOW FORWARD VOLTAGE DROP FOR
LESS POWER DISSIPATION AND REDUCED
HEATSINK
OPTIMIZED CONDUCTION/REVERSE LOSSES
TRADE-OFF WHICH MEANS THE HIGHEST
EFFICIENCY IN THE APPLICATIONS
HIGH POWER SURFACE MOUNT MINIATURE
PACKAGE
AVALANCHE RATED
3
1
3
NC
2
1
NC
DPAK
STPS5L25B
IPAK
STPS5L25B-1
DESCRIPTION
Single Schottky rectifier suited to Switched Mode
Power Supplies and high frequency DC to DC converters.
This device is especially intended for use as a Rectifier at the secondary of 3.3V SMPS units.
ABSOLUTE RATINGS (limiting values)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
25
V
IF(RMS)
RMS forward current
7
A
IF(AV)
Average forward current
Tc = 145°C δ = 0.5
5
A
IFSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
75
A
IRRM
Repetitive peak reverse current
tp=2 µs square F=1kHz
1
A
IRSM
Non repetitive peak reverse current
tp = 100 µs square
2
A
Tstg
Storage temperature range
- 65 to + 150
°C
150
°C
10000
V/µs
Tj
dV/dt
* :
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
dPtot
1
<
thermal runaway condition for a diode on its own heatsink
Rth(j−a)
dTj
August 1999 - Ed: 3A
1/5
STPS5L25B/B-1
THERMAL RESISTANCES
Symbol
Rth(j-c)
Parameter
Junction to case
Value
Unit
2.5
°C/W
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Tests Conditions
IR *
Reverse leakage current
Tests Conditions
Tj = 25°C
Min.
Typ.
VR = VRRM
Tj = 125°C
VF *
Forward voltage drop
55
Tj = 25°C
IF = 5 A
Tj = 125°C
IF = 5 A
Tj = 25°C
IF = 10 A
Tj = 125°C
IF = 10 A
0.31
Max.
Unit
350
µA
115
mA
0.47
V
0.35
0.59
0.41
0.50
* tp = 380 µs, δ < 2%
Pulse test :
To evaluate the maximum conduction losses use the following equation :
P = 0.2 x IF(AV) + 0.030 IF2(RMS)
Fig. 1: Average forward power dissipation versus
average forward current.
Fig. 2: Average forward current versus ambient
temperature (δ=0.5).
PF(av)(W)
6
2.5
δ = 0.1
δ = 0.2
δ = 0.5
Rth(j-a)=Rth(j-c)
5
δ = 0.05
2.0
IF(av)(A)
4
δ=1
1.5
3
1.0
2
T
T
0.5
1
δ=tp/T
IF(av) (A)
0.0
2/5
Rth(j-a)=70°C/W
0
1
2
3
4
5
δ=tp/T
tp
6
0
0
Tamb(°C)
tp
25
50
75
100
125
150
STPS5L25B/B-1
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values).
100
Fig. 4: Relative variation of thermal impedance
junction to case versus pulse duration.
Zth(j-c)/Rth(j-c)
IM(A)
1.0
80
0.8
60
Tc=25°C
δ = 0.5
0.6
Tc=75°C
40
0.4
δ = 0.2
T
Tc=100°C
IM
20
0.2
t
δ = 0.1
t(s)
δ=0.5
0
1E-3
δ=tp/T
tp(s)
1E-2
1E-1
1E+0
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values).
3E+2
1E+2
Single pulse
0.0
1.0E-4
1.0E-3
1.0E-2
tp
1.0E-1
1.0E+0
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).
IR(mA)
C(pF)
2000
Tj=150°C
F=1MHz
Tj=25°C
1E+1
Tj=125°C
1000
1E+0
500
1E-1
Tj=25°C
200
1E-2
VR(V)
VR(V)
1E-3
0
5
10
15
20
25
Fig. 7: Forward voltage drop versus forward current (maximum values).
100.0
100
1
2
5
10
20
30
Fig. 8: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit
board FR4, copper thickness: 35µm).
Rth(j-a) (°C/W)
IFM(A)
100
Typical values
Tj=150°C
80
10.0
60
Tj=125°C
40
Tj=25°C
1.0
20
VFM(V)
0.1
0.0
0.2
0.4
0.6
0.8
1.0
0
1.2
1.4
1.6
1.8
2.0
0
2
4
6
8
10
12
S(Cu) (cm²)
14
16
18
20
3/5
STPS5L25B/B-1
PACKAGE MECHANICAL DATA
DPAK
DIMENSIONS
REF.
Millimeters
Min.
A
A1
A2
B
B2
C
C2
D
E
G
H
L2
L4
V2
FOOT PRINT DIMENSIONS (in millimeters)
6.7
6.7
3
3
1.6
1.6
2.3
4/5
2.3
Max
2.20
2.40
0.90
1.10
0.03
0.23
0.64
0.90
5.20
5.40
0.45
0.60
0.48
0.60
6.00
6.20
6.40
6.60
4.40
4.60
9.35
10.10
0.80 typ.
0.60
1.00
0°
8°
Inches
Min.
Max.
0.086
0.094
0.035
0.043
0.001
0.009
0.025
0.035
0.204
0.212
0.017
0.023
0.018
0.023
0.236
0.244
0.251
0.259
0.173
0.181
0.368
0.397
0.031 typ.
0.023
0.039
0°
8°
STPS5L25B/B-1
PACKAGE MECHANICAL DATA
IPAK
DIMENSIONS
REF.
A
E
C2
B2
L2
D
H
L
L1
B3
B6
A1
B
V1
B5
C
G
A3
A
A1
A3
B
B2
B3
B5
B6
C
C2
D
E
G
H
L
L1
L2
V1
Millimeters
Inches
Min.
Typ. Max. Min.
2.2
0.9
0.7
0.64
5.2
2.4
1.1
1.3
0.9
5.4
0.85
Typ. Max.
0.086
0.035
0.027
0.025
0.204
0.3
0.45
0.48
6
6.4
4.4
15.9
9
0.8
0.8
10°
0.094
0.043
0.051
0.035
0.212
0.033
0.035
0.95
0.6
0.6
6.2
6.6
4.6
16.3
9.4
1.2
1
0.017
0.019
0.236
0.252
0.173
0.626
0.354
0.031
0.037
0.023
0.023
0.244
0.260
0.181
0.641
0.370
0.047
0.031 0.039
10°
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS5L25B
STPS5L25B
DPAK
0.30g
75
Tube
STPS15LB-TR
STPS5L25B
DPAK
0.30g
2500
Tape & reel
STPS5L25B-1
STPS5L25B
IPAK
0.35g
75
Tube
Epoxy meets UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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