STPS2L40 Low drop power Schottky rectifier Main product characteristics A IF(AV) 2A VRRM 40 V Tj (max) 150° C VF(max) 0.34 V K SMB STPS2L40U Features and Benefits A ■ Very small conduction losses ■ Negligible switching losses ■ Low forward voltage drop ■ Surface mount miniature package ■ Avalanche capability specified K SMB flat STPS2L40UF Description Order codes Single chip Schottky rectifiers suited to Switched Mode Power Supplies and high frequency DC to DC converters. Packaged in SMB, and low profile SMB, this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. Table 1. marking STPS2L40U GD4 STPS2L40UF FGD4 Absolute Ratings (limiting values) Symbol Parameter Value Unit 40 V 2 A VRRM Repetitive peak reverse voltage IF(AV) Average forward current IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25° C 2200 W -65 to + 150 °C 150 °C Tstg dPtot --------------dTj SMB TL = 130° C δ = 0.5 SMB flat TL = 140° C δ = 0.5 Storage temperature range Operating junction temperature Tj 1. Part number < 1 -------------------------Rth ( j – a ) February 2007 (1) condition to avoid thermal runaway for a diode on its own heatsink Rev 3 1/8 www.st.com 8 Characteristics 1 STPS2L40 Characteristics Table 2. Thermal resistances Symbol Parameter Rth (j-l) Value SMB 20 SMB flat 10 Junction to lead Table 3. ° C/W Static electrical characteristics Symb ol Tests Conditions Tests Conditions Min. Typ. Tj = 25° C IR (1) VR = 40 V Tj = 100° C Reverse leakage current Tj = 125° C 38 Tj = 25° C Unit 220 µA 20 mA 80 mA 0.25 0.28 V Tj = 25° C Forward voltage drop Max. 0.39 IF = 1 A Tj = 125° C VF(1) Unit 0.43 IF = 2 A Tj = 125° C Tj = 25° C 0.31 0.5 IF = 4 A Tj = 125° C 0.34 V 0.39 0.45 1. Pulse test: tp = 380 µs, δ < 2 To evaluate the conduction losses use the following equation: P = 0.22 x IF(AV) + 0.06 IF2(RMS) Figure 1. Average forward power dissipation Figure 2. versus average forward current Average forward current versus ambient temperature (δ = 0.5) SMB IF(AV)(A) PF(AV)(W) 2.2 1.2 δ = 0.1 δ = 0.2 Rth(j-a)=Rth(j-l) δ = 0.5 SMB 2.0 δ = 0.05 1.0 1.8 Rth(j-a)=100°C/W 1.6 0.8 δ=1 1.4 1.2 0.6 1.0 0.8 0.4 0.6 T T 0.4 0.2 IF(AV)(A) δ=tp/T 0.0 0.0 2/8 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 0.2 δ=tp/T tp 0.0 2.6 2.8 0 Tamb(°C) tp 25 50 75 100 125 150 STPS2L40 Characteristics Figure 3. Average forward current versus ambient temperature (δ = 0.5) SMB flat Figure 4. Non repetitive surge peak forward current versus overload duration (maximum values) SMB IM(A) IF(AV)(A) 12 2.2 Rth(j-a)=Rth(j-l) SMB 11 2.0 10 1.8 SMB flat Rth(j-a)=100°C/W 9 1.6 8 1.4 Ta=25°C 7 1.2 6 1.0 Ta=75°C 5 0.8 4 0.6 3 T 0.4 Ta=125°C IM 2 0.2 δ=tp/T 0.0 Tamb(°C) tp t 1 t(s) δ=0.5 0 0 25 Figure 5. 50 75 100 125 150 Non repetitive surge peak forward current versus overload duration (maximum values) SMB flat 1.E-03 1.E-02 Figure 6. IM(A) 1.E-01 1.E+00 Normalized avalanche power derating versus pulse duration PARM(tp) PARM(1µs) 30 SMB flat (non exposed pad) 1 25 20 0.1 TL=25°C 15 TL=75°C 10 0.01 TL=125°C IM 5 t t(s) δ=0.5 1.E-03 Figure 7. 1.E-02 tp(µs) 0.001 0 1.E-01 0.01 1.E+00 Normalized avalanche power derating versus junction temperature 0.1 Figure 8. 1 10 100 1000 Relative variation of thermal impedance junction to ambient versus pulse duration - SMB Zth(j-a)/Rth(j-a) PARM(tp) PARM(25°C) 1.0 SMB 0.9 1.2 0.8 1 0.7 0.8 0.6 0.5 0.6 0.4 0.4 0.3 T 0.2 0.2 Single pulse Tj(°C) 0.1 0 25 50 75 100 125 150 tp(s) δ=tp/T 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 tp 1.E+03 3/8 Characteristics Figure 9. STPS2L40 Relative variation of thermal impedance junction to lead versus pulse duration - SMB flat Figure 10. Reverse leakage current versus reverse voltage applied (typical values) IR(mA) Zth(j-l)/Rth(j-l) 1.E+02 1.0 SMB flat 0.9 Tj=125°C 1.E+01 0.8 0.7 1.E+00 0.6 0.5 1.E-01 0.4 0.3 Tj=25°C T 0.2 1.E-02 Single pulse 0.1 tp(s) δ=tp/T 0.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 VR(V) tp 1.E-03 1.E+01 Figure 11. Junction capacitance versus reverse voltage applied (typical values) 0 5 10 15 20 25 30 35 40 Figure 12. Forward voltage drop versus forward current (high level) IFM(A) C(pF) 10.0 1000 F=1MHz VOSC=30mVRMS Tj=25°C Tj=125°C (typical values) Tj=25°C (maximum values) Tj=125°C (maxmimum values) 100 1.0 VR(V) VFM(V) 10 0.1 1 10 100 Figure 13. Forward voltage drop versus forward current (low level) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU=35µm) IFM(A) Rth(j-a)(°C/W) 110 3.0 100 2.5 90 Tj=125°C (typical values) SMB 80 2.0 70 Tj=25°C (maximum values) 1.5 60 Tj=125°C (maxmimum values) 50 SMB flat 40 1.0 30 20 0.5 10 VFM(V) 0.0 4/8 SCU(cm²) 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 STPS2L40 2 Package Information Package Information ● Epoxy meets UL94,V0 Table 4. SMB dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L b Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.50 0.030 0.059 Figure 15. SMB footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 5/8 Package Information Table 5. STPS2L40 SMB Flat dimensions Dimensions Ref. D L L2 E E1 L L1 b Inches Min. Typ. Max. Min. A 0.90 1.10 0.035 0.043 b(1) 1.95 2.20 0.077 0.087 (1) 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.189 0.181 L 0.75 1.50 0.029 0.059 A c Millimeters c Typ. L1 0.40 0.016 L2 0.60 0.024 Max. 1. Applies to plated leads Figure 16. SMB Flat footprint (dimensions in mm) 5.84 2.07 1.20 3.44 1.20 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6/8 STPS2L40 3 4 Ordering Information Ordering Information Ordering type Marking Package Weight Base qty Delivery mode STPS2L40U GD4 SMB 0.107 g 2500 Tape and reel STPS2L40UF FGD4 SMB flat 0.50 g 5000 Tape and reel Revision history Date Revision Jul-2003 2A 31-Jan-2007 3 Description of Changes Last update. Reformatted to current standard. Added ECOPACK statement. Added SMB flat package. 7/8 STPS2L40 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8