STTH310 High voltage ultrafast rectifier Main product characteristics IF(AV) 3A VRRM 1000 V Tj 175° C VF (max) 1.42 V trr (max) 75 ns SMC STTH310S Features and benefits ■ Low forward voltage drop ■ High reliability ■ High surge current capability ■ Soft switching for reduced EMI disturbances ■ Planar technology DO-201AD STTH310 DO-201AD C2 STTH310 Description The STTH310, which is using ST ultrafast high voltage planar technology, is specially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications. April 2007 Order codes Rev 2 Part Number Marking STTH310 STTH310B STTH310RL STTH310 STTH310S S10 STTH310-C2 STTH 310 1/7 www.st.com 7 Characteristics STTH310 1 Characteristics Table 1. Absolute ratings (limiting values) Symbol Parameter VRRM Repetitive peak reverse voltage IF(AV) Average forward current, δ = 0.5 IFSM Forward surge current Tstg Storage temperature range Table 2. V δ = 0.5 DO-201AD 3 TL = 75° C δ = 0.5 SMC 3 DO-201AD 55 SMC 45 tp = 8.3 ms Sinusoidal A A Parameter - 50 to + 175 °C + 175 °C Value L = 10 mm Rth(j-l) Junction to lead Rth(j-a) Junction to ambient Symbol 1000 Thermal parameters Symbol Table 3. Unit TL = 75° C Maximum operating junction temperature Tj Value L = 10 mm DO-201AD 20 SMC 20 DO-201AD 75 Unit °C/W Static electrical characteristics Parameter IR Reverse leakage current VF Forward voltage drop Test conditions Tj = 25° C Min. Typ Max. Unit 10 Tj = 125° C Tj = 25° C VR = VRRM µA 50 1.7 Tj = 150° C IF = 3 A V 0.98 1.42 To evaluate the conduction losses use the following equation: P = 1.20 x IF(AV) + 0.075 IF2(RMS) Table 4. Symbol Test conditions Parameter trr Reverse recovery time tfr Forward recovery time VFP 2/7 Dynamic electrical characteristics Forward recovery voltage IF = 0.5 A IR = 1 A Irr = 0.25 A Tj = 25° C IF = 3 A dIF/dt = 50 A/µs VFR = 1.1 x VFmax Tj = 25° C Min. Typ Max. Unit 75 ns 300 ns 12 V STTH310 Characteristics Figure 1. Conduction losses versus average current Figure 2. Forward voltage drop versus forward current IFM(A) P(W) 100.0 5.5 δ = 0.1 5.0 δ = 0.2 δ = 0.5 Tj=150°C (maximum values) δ = 0.05 4.5 Tj=150°C (typical values) 4.0 δ=1 10.0 3.5 3.0 Tj=25°C (maximum values) 2.5 2.0 1.0 1.5 T 1.0 0.5 IF(AV)(A) δ=tp/T 0.0 0.0 0.5 Figure 3. 1.0 1.5 2.0 2.5 VFM(V) tp 0.1 3.0 3.5 Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4, Lleads = 10 mm) (DO-201AD) 0.0 Figure 4. Zth(j-c)/Rth(j-c) 0.5 1.0 1.5 2.0 2.5 Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4, S = 1cm2) (SMC) Zth(j-c)/Rth(j-c) 1.0 1.0 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 δ = 0.5 δ = 0.5 0.5 0.5 0.4 0.4 0.3 0.3 δ = 0.2 0.2 T 1.E-01 Figure 5. 0.1 tp(s) Single pulse 0.0 1.E+00 δ=tp/T 1.E+01 1.E+02 δ = 0.1 T 0.2 δ = 0.1 0.1 δ = 0.2 tp Single pulse tp(s) 0.0 1.E+03 1.E-01 1.E+00 1.E+01 δ=tp/T 1.E+02 tp 1.E+03 Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board FR4, copper thickness: 35 µm) Rth(j-a)(°C/W) 110 100 90 80 70 SMB 60 50 DO-201AD Lleads=10mm 40 30 20 10 S(cm²) 0 0 1 2 3 4 5 3/7 Package mechanical data 2 STTH310 Package mechanical data ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) Table 5. SMC Dimensions Dimensions Ref. Millimeters E1 D E A1 A2 C E2 Figure 6. L b Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 5.55 6.25 0.218 0.246 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 L 0.75 1.50 0.030 0.059 Footprint (dimensions in mm) 1.54 5.11 1.54 3.14 8.19 4/7 Inches STTH310 Package mechanical data Table 6. DO-201AD dimensions Dimensions Ref. Millimeters Min. B E Min. Max. B A Note 1 Max. Inches E A Note 1 B 9.50 25.40 0.374 1.000 ØD Note 2 ØC C 5.30 0.209 D 1.30 0.051 E 1.25 0.049 Notes Table 7. 1 - The lead diameter ø D is not controlled over zone E 2 - The minimum length which must stay straight between the right angles after bending is 0.59"(15mm) DO-201AD C2 dimensions Dimensions Ref. Millimeters Min. Typ. A B J A E C K R0.5 I 55.9° Min. Typ. 9.5 13.75 Max. 0.374 17.75 0.541 0.699 C 5.3 0.208 D 1.3 0.051 E 3.1 3.6 4.1 0.122 0.142 0.161 F 2.4 3.15 3.9 0.094 0.124 0.153 R0.5 MAX MIN B Max. Inches F D 50.8° 10° max G 1.6 0.063 G = D + 0.2 to 0.4 mm (G = hole in the PCB) H H 14.9 I 0.5 J K 15.6 0.587 0.6 0.8 0.019 0.024 0.031 18.78 3.8 0.614 0.739 4.8 0.150 0.189 The difference between E dimensions on both sides of resinous body (which Note express the bending centering) musn’t be larger than 0.7 millimeter. In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5/7 Ordering information 3 4 6/7 STTH310 Ordering information Part Number Marking Package Weight Base qty Delivery mode STTH310S S10 SMC 0.245 g 2500 Tape & reel STTH310 STTH310 DO-201AD 1.16 g 600 Ammopack STTH310RL STTH310 DO-201AD 1.16 g 1900 Tape & reel STTH310-C2 STTH 310 DO-201AD C2 1.12 g 500 Box Revision history Date Revision Description of Changes Jan-2003 1 First release. 03-Apr-2007 2 DO-201AD C2 package added. SMC Package information updated. STTH310 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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