STV160NF02LA N-CHANNEL 20V - 0.0018Ω - 160A PowerSO-10 STripFET™ POWER MOSFET TYPE STV160NF02LA ■ ■ ■ ■ ■ ■ ■ VDSS RDS(on) ID 20 V < 0.0027 Ω 160 A TYPICAL RDS(on) = 0.0018 Ω LOW THRESHOLD DRIVE ULTRA LOW ON-RESISTANCE ULTRA FAST SWITCHING 100% AVALANCHE TESTED VERY LOW GATE CHARGE LOW PROFILE, VERY LOW PARASITIC INDUCTANCE PowerSO-10 PACKAGE DESCRIPTION The STV160NF02LA represents the second generation of Application Specific STMicroelectronics well established STripFET™ process based on a very unique strip layout design. The resulting MOSFET shows unrivalled high packing density with ultra low on-resistance and superior switching charactestics. Process simplification also translates into improved manufacturing reproducibility. This device is particularly suitable for high current, low voltage switching application where efficiency is crucial 10 1 PowerSO-10 INTERNAL SCHEMATIC DIAGRAM CONNECTION DIAGRAM (TOP VIEW) APPLICATIONS ■ BUCK CONVERTERS IN HIGH PERFORMANCE TELECOM AND VRMs DCDC CONVERTERS ABSOLUTE MAXIMUM RATINGS Symbol VDS VDGR Parameter Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 kΩ) Value Unit 20 V 20 V VGS Gate- source Voltage ± 15 V ID(**) Drain Current (continuos) at TC = 25°C 160 A ID Drain Current (continuos) at TC = 100°C 113 A IDM (●) PTOT EAS (1) Tstg Tj Drain Current (pulsed) 640 A Total Dissipation at TC = 25°C 210 W Derating Factor 1.4 W/°C Single Pulse Avalanche Energy 330 mJ Storage Temperature Max. Operating Junction Temperature (●) Pulse width limited by safe operating area Note: Marking will be STV160NF02AL December 2000 –65 to 175 °C 175 °C (1) VDD = 35V, ID = 45A, RG = 22Ω , L = 330µH, Starting Tj=25°C (**)Limited only maximum junction temperature allowed by PowerSO-10 1/8 STV160NF02LA THERMAL DATA Rthj-case Thermal Resistance Junction-case Max Rthj-amb Tl 0.71 °C/W Thermal Resistance Junction-ambient Max 50 °C/W Maximum Lead Temperature For Soldering Purpose 300 °C ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED) OFF Symbol V(BR)DSS IDSS IGSS Parameter Test Conditions Min. Typ. Max. 20 Unit Drain-source Breakdown Voltage ID = 250 µA, VGS = 0 V Zero Gate Voltage Drain Current (VGS = 0) VDS = Max Rating 1 µA VDS = Max Rating, TC = 125 °C 10 µA Gate-body Leakage Current (VDS = 0) VGS = ± 15 V ±100 nA Max. Unit ON (1) Symbol Parameter Test Conditions VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250µA RDS(on) Static Drain-source On Resistance VGS = 10 V, ID = 80 A VGS = 10 V, ID = 45 A VGS = 8 V, ID = 80 A VGS = 5 V, ID = 40 A VGS = 10 V, ID=80 A;Tj = 175 °C VGS = 8 V, ID=80 A; Tj = 175 °C VGS = 5 V, ID=40 A; Tj = 125 °C ID(on) On State Drain Current VDS > ID(on) x RDS(on)max, VGS = 10V Min. Typ. 1 V 1.8 1.76 1.9 3.8 2.7 2.7 3.7 6.4 6 8 14 160 mΩ mΩ mΩ mΩ mΩ mΩ mΩ A DYNAMIC Symbol gfs (1) Test Conditions Min. Typ. Max. Unit Forward Transconductance VDS > ID(on) x RDS(on)max, ID = 80A 210 S Gate resistance VDS = 0 V, f = 1 MHz, VGS = 0 1.1 Ω Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 15 V, f = 1 MHz, VGS = 0 5500 3210 750 pF pF pF Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 0 V, f = 1 MHz, VGS = 0 8400 14500 5800 pF pF pF LS Internal Source Inductance From the Lead End (6mm from Package Body) to the Die Center 3 nH LD Internal Drain Inductance Rg 2/8 Parameter Not Available on Surface Mounting Package STV160NF02LA ELECTRICAL CHARACTERISTICS (CONTINUED) SWITCHING ON Symbol td(on) tr Qg Qgs Qgd Parameter Turn-on Delay Time Rise Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Test Conditions Min. VDD = 15 V, ID = 80 A RG = 4.7Ω VGS = 10V (see test circuit, Figure 3) VDD = 16 V, ID = 160 A, VGS = 10 V Typ. Max. Unit 30 ns 650 ns 130 20 54 175 nC nC nC Typ. Max. Unit SWITCHING OFF Symbol Parameter Test Conditions Min. td(off) tf Turn-off-Delay Time Fall Time VDD = 15 V, ID = 80 A, RG = 4.7Ω, VGS = 10 V (see test circuit, Figure 5) 105 200 ns ns td(off) tr(Voff) tf tc Turn-off Delay Time Off-voltage Rise Time Fall Time Cross-over Time Vclamp = 16 V, ID = 40 A RG = 4.7Ω, VGS = 10V 90 45 125 180 ns ns ns ns SOURCE DRAIN DIODE Symbol ISD ISDM (1) VSD (2) trr Qrr IRRM Parameter Test Conditions Min. Typ. Source-drain Current Source-drain Current (pulsed) Forward On Voltage ISD = 160 A, VGS = 0 Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD = 160A, di/dt = 100A/µs, VDD = 15V, Tj = 25°C (see test circuit, Figure 5) Max. Unit 160 A 640 A 1.5 90 225 5 V ns nC A Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %. 2. Pulse width limited by safe operating area. Safe Operating Area Thermal Impedance 3/8 STV160NF02LA Output Characteristics Tranfer Characteristics Tranconductance Static Drain-Source On Resistance Gate Charge vs Gate-source Voltage Capacitance Variations 4/8 STV160NF02LA Normalized Gate Thereshold Voltage vs Temp. Normalized On Resistance vs Temperature Source-drain Diode Forward Characteristics Basic Schematic For Motherboard VRM Whith Synchronous Rectification Basic Schematic Mosfets Switch Used In Secondary Side Of a Froward Convert 5/8 STV160NF02LA Fig. 1: Unclamped Inductive Load Test Circuit Fig. 2: Unclamped Inductive Waveform Fig. 3: Switching Times Test Circuit For Resistive Load Fig. 4: Gate Charge test Circuit Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times 6/8 STV160NF02LA PowerSO-10 MECHANICAL DATA mm DIM. MIN. inch TYP. MAX. MIN. TYP. MAX. A 3.35 3.65 0.132 A1 0.00 0.10 0.000 0.004 B 0.40 0.60 0.016 0.024 C 0.35 0.55 0.013 0.022 D 9.40 9.60 0.370 0.378 D1 7.40 7.60 0.291 e 1.27 0.144 0.300 0.050 E 9.30 9.50 0.366 0.374 E1 7.20 7.40 0.283 0.291 E2 7.20 7.60 0.283 0.300 E3 6.10 6.35 0.240 0.250 E4 5.90 6.10 0.232 0.240 F 1.25 1.35 0.049 h 0.50 H 13.80 14.40 0.543 L 1.20 1.80 0.047 q 1.70 α 0.053 0.002 0.567 0.071 0.067 0o 8o B 0.10 A B 10 = E4 = = = E1 = E3 = E2 = E = = = H 6 = = 1 5 B e 0.25 SEATING PLANE DETAIL "A" A C M Q D h = D1 = = = SEATING PLANE A F A1 A1 L DETAIL "A" α 0068039-C 7/8 STV160NF02LA Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a trademark of STMicroelectronics © 2000 STMicroelectronics – Printed in Italy – All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 8/8