MICROCHIP TC1427

TC1426/TC1427/TC1428
1.2A Dual High-Speed MOSFET Drivers
Features:
Package Type
• Low Cost
• Latch-Up Protected: Will Withstand 500 mA
Reverse Output Current
• ESD Protected ±2kV
• High Peak Output Current: 1.2A
• Wide Operating Range:
- 4.5V to 16V
• High Capacitive Load Drive Capability: 1000 pF in
38 nsec
• Low Delay Time: 75 nsec Max
• Logic Input Threshold Independent of Supply
Voltage
• Output Voltage Swing to Within 25 mV of Ground
or VDD
• Low Output Impedance: 8Ω
Power MOSFET Drivers
Switched Mode Power Supplies
Pulse Transformer Drive
Small Motor Controls
Print Head Drive
Package
Temp. Range
8-Pin SOIC
0°C to +70°C
TC1426CPA
8-Pin PDIP
0°C to +70°C
TC1427COA
8-Pin SOIC
0°C to +70°C
TC1427CPA
8-Pin PDIP
0°C to +70°C
TC1428COA
8-Pin SOIC
0°C to +70°C
TC1428CPA
8-Pin PDIP
0°C to +70°C
TC1426COA
GND 3
TC1426CPA
6 VDD
IN B 4
GND 3
7 OUT A
TC1427CPA
5 OUT B IN B 4
2, 4
NC 1
7 OUT A
TC1426COA
IN B 4
7, 5
Inverting
GND 3
7, 5
6 VDD
NC 1
8 NC
IN A 2
TC1427COA
GND 3
7 OUT A
6 VDD
5 OUT B IN B 4
2, 4
8 NC
7 OUT A
TC1428CPA
6 VDD
5 OUT B
2
7
4
5
Noninverting
8 NC
IN A 2
6 VDD
NC 1
IN A 2
5 OUT B IN B 4
2, 4
7, 5
Inverting
GND 3
8 NC
IN A 2
NC 1
IN A 2
8 NC
TC1428COA
GND 3
5 OUT B IN B 4
2, 4
7, 5
7 OUT A
6 VDD
5 OUT B
2
7
4
5
Noninverting
NC = No connection
General Description:
These devices are fabricated using an epitaxial layer to
effectively short out the intrinsic parasitic transistor
responsible for CMOS latch-up. They incorporate a
number of other design and process refinements to
increase their long-term reliability.
Device Selection Table
Part Number
7 OUT A
IN A 2
NC 1
The TC1426/TC1427/TC1428 are a family of 1.2A dual
high-speed drivers. CMOS fabrication is used for lowpower consumption and high efficiency.
Applications:
•
•
•
•
•
8-Pin PDIP/SOIC
8 NC
NC 1
The TC1426 is compatible with the bipolar DS0026, but
only draws 1/5 of the quiescent current. The TC1426/
TC1427/TC1428 are also compatible with the TC426/
TC427/TC428, but with 1.2A peak output current rather
than the 1.5A of the TC426/TC427/TC428 devices.
Other compatible drivers are the TC4426/TC4427/
TC4428 and the TC4426A/TC4427A/TC4428A. The
TC4426/TC4427/TC4428 have the added feature that
the inputs can withstand negative voltage up to 5V with
diode protection circuits. The TC4426A/TC4427A/
TC4428A have matched input to output leading edge
and falling edge delays, tD1 and tD2, for processing
short duration pulses in the 25 nanoseconds range. All
of the above drivers are pin compatible.
The high-input impedance TC1426/TC1427/TC1428
drivers are CMOS/TTL input-compatible, do not require
the speed-up needed by the bipolar devices, and can
be directly driven by most PWM ICs.
This family of devices is available in inverting and noninverting versions. Specifications have been optimized
to achieve low-cost and high-performance devices,
well-suited for the high-volume manufacturer.
© 2006 Microchip Technology Inc.
DS21393C-page 1
TC1426/TC1427/TC1428
Functional Block Diagram
V+
≈500 μA
≈2.5 μA
TC1426 Inverting
TC1427 Noninverting
TC1428 Inverting/Noninverting
Noninverting
Output
Inverting
Output
(TC1427)
(TC1426)
Input
GND
NOTE: TC1428 has one inverting and one noninverting driver.
Ground any unused driver input.
DS21393C-page 2
© 2006 Microchip Technology Inc.
TC1426/TC1427/TC1428
1.0
ELECTRICAL
CHARACTERISTICS
*Stresses above those listed under "Absolute
Maximum Ratings" may cause permanent damage to
the device. These are stress ratings only and functional
operation of the device at these or any other conditions
above those indicated in the operation sections of the
specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods may
affect device reliability.
Absolute Maximum Ratings*
Supply Voltage ..................................................... +18V
Input Voltage, Any Terminal
................................... VDD + 0.3V to GND – 0.3V
Power Dissipation (TA ≤ 70°C)
PDIP........................................................ 730 mW
SOIC ....................................................... 470 mW
Derating Factor
PDIP....................................................... 8 mW/°C
SOIC ...................................................... 4 mW/°C
Operating Temperature Range
C Version ........................................ 0°C to +70°C
Storage Temperature Range.............. -65°C to +150°C
TC1426/TC1427/TC1428 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = +25°C, with 4.5V ≤ VDD ≤ 16V, unless otherwise noted.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
Input
VIH
Logic 1, High Input Voltage
3
—
—
V
VIL
Logic 0, Low Input Voltage
—
—
0.8
V
IIN
Input Current
-1
—
1
μA
0V ≤ VIN ≤ VDD
Output
VOH
High Output Voltage
VDD – 0.025
—
—
V
Figure 3-1, Figure 3-2
VOL
Low Output Voltage
—
—
0.025
V
Figure 3-1, Figure 3-2
RO
Output Resistance
—
—
12
8
18
12
Ω
IOUT = 10 mA, VDD = 16V
IPK
Peak Output Current
—
1.2
—
A
IREV
Latch-Up Current
Withstand Reverse Current
—
>500
—
mA
Switching Time (Note 1)
tR
Rise Time
—
—
35
nsec
tF
Fall Time
—
—
25
nsec
Figure 3-1, Figure 3-2
tD1
Delay Time
—
—
75
nsec
Figure 3-1, Figure 3-2
tD2
Delay Time
—
—
75
nsec
Figure 3-1, Figure 3-2
—
—
—
—
9
0.5
mA
VIN = 3V (Both Inputs)
VIN = 0V (Both Inputs)
Figure 3-1, Figure 3-2
Power Supply
Power Supply Current
IS
Note
1:
Switching times ensured by design.
© 2006 Microchip Technology Inc.
DS21393C-page 3
TC1426/TC1427/TC1428
TC1426/TC1427/TC1428 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Over operating temperature range with 4.5V ≤ VDD ≤ 16V, unless otherwise noted.
Symbol
Parameter
Min
Typ
Max
Units
V
Test Conditions
Input
VIH
Logic 1, High Input Voltage
3
—
—
VIL
Logic 0, Low Input Voltage
—
—
0.8
V
IIN
Input Current
-10
—
10
μA
0V ≤ VIN ≤ VDD
Output
VOH
High Output Voltage
VDD – 0.025
—
—
V
Figure 3-1, Figure 3-2
VOL
Low Output Voltage
—
—
0.025
V
Figure 3-1, Figure 3-2
RO
Output Resistance
—
—
15
10
23
18
Ω
IOUT = 10 mA, VDD = 16V
IREV
Latch-Up Current
Withstand Reverse Current
—
>500
—
mA
Switching Time (Note 1)
tR
Rise Time
—
—
60
nsec
Figure 3-1, Figure 3-2
tF
Fall Time
—
—
40
nsec
Figure 3-1, Figure 3-2
tD1
Delay Time
—
—
125
nsec
Figure 3-1, Figure 3-2
tD2
Delay Time
—
—
125
nsec
Figure 3-1, Figure 3-2
—
—
—
—
13
0.7
mA
VIN = 3V (Both Inputs)
VIN = 0V (Both Inputs)
Power Supply
Power Supply Current
IS
Note
1:
Switching times ensured by design.
DS21393C-page 4
© 2006 Microchip Technology Inc.
TC1426/TC1427/TC1428
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No.
(8-Pin PDIP,
SOIC)
PIN FUNCTION TABLE
Symbol
Description
1
NC
No connection.
2
IN A
Control input A, TTL/CMOS compatible logic input.
3
GND
Ground.
4
IN B
Control input B, TTL/CMOS compatible logic input.
5
OUT B
6
VDD
7
OUT A
8
NC
© 2006 Microchip Technology Inc.
Output B, CMOS totem-pole output.
Supply input, 4.5V to 16V.
Output A, CMOS totem-pole output.
No connection.
DS21393C-page 5
TC1426/TC1427/TC1428
3.0
APPLICATIONS INFORMATION
3.1
SUPPLY BYPASSING
Large currents are required to charge and discharge
capacitive loads quickly. For example, charging a 1000
pF load to 16V in 25 nsec requires a 0.8A current from
the device's power supply.
To ensure low supply impedance over a wide frequency
range, a parallel capacitor combination is recommended for supply bypassing. Low-inductance ceramic
MLC capacitors with short lead lengths (<0.5-in.)
should be used. A 1.0 μF film capacitor in parallel with
one or two 0.1 μF ceramic MLC capacitors normally
provides adequate bypassing.
3.2
GROUNDING
The TC1426 and TC1428 contain inverting drivers.
Individual ground returns for the input and output
circuits or a ground plane should be used. This will
reduce negative feedback that causes degradation in
switching speed characteristics.
VDD = 16V
Test Circuit
3.3
INPUT STAGE
The input voltage level changes the no-load or
quiescent supply current. The N-channel MOSFET
input stage transistor drives a 2.5 mA current source
load. With a logic ‘1’ input, the maximum quiescent
supply current is 9 mA. Logic ‘0’ input level signals
reduce quiescent current to 500 μA maximum. Unused
driver inputs must be connected to VDD or GND.
Minimum power dissipation occurs for logic ‘0’ inputs
for the TC1426/TC1427/TC1428.
The drivers are designed with 100 mV of hysteresis.
This provides clean transitions and minimizes output
stage current spiking when changing states. Input
voltage thresholds are approximately 1.5V, making a
logic ‘1’ input any voltage greater than 1.5V up to VDD.
Input current is less than 1 μA over this range.
The TC1426/TC1427/TC1428 may be directly driven
by the TL494, SG1526/27, TC38C42, TC170 and
similar switch-mode power supply integrated circuits.
VDD = 16V
Test Circuit
1 μF
WIMA
MKS-2
1 μF
WIMA
MKS-2
0.1 μF MLC
Input
Input
Output
1
Output
1
0.1 μF MLC
CL = 1000 pF
CL = 1000 pF
2
2
TC1427
(1/2 TC1428)
TC1426
(1/2 TC1428)
+5V
+5V
Input
Input
0V
90%
90%
0V
10%
VDD
tD1
tF
tD2
VDD
tR
90%
90%
FIGURE 3-1:
Time
DS21393C-page 6
10%
tD1
90%
90%
tD2
tF
tR
Output
0V
Output
0V
10%
10%
10%
10%
Inverting Driver Switching
FIGURE 3-2:
Switching Time
Noninverting Driver
© 2006 Microchip Technology Inc.
TC1426/TC1427/TC1428
4.0
TYPICAL CHARACTERISTICS
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Rise Time vs. Supply Voltage
550
Fall Time vs. Supply Voltage
330
TA = +25°C
TA = +25°C
264
220
4700 pF
110
CL = 1000 pF
TA = +25°C
70
198
TIME (nsec)
10,000 pF
330
TIME (nsec)
TIME (nsec)
440
Delay Time vs. Supply Voltage
80
10,000 pF
132
60
50
tD1
4700 pF
66
2200 pF
40
2200 pF
tD2
0
5
7
9
11
VDD (V)
13
0
15
Rise and Fall Times vs. Temperature
13
15
8
tD2
48
tD1
42
36
125
25
Rise Time vs. Capacitive Load
1000
45
65
85
105
TEMPERATURE (°C)
CL = 1000 pF
VDD = +15V
TA = +25°C
24
200 kHz
12
20 kHz
6
100
Fall Time vs. Capacitive Load
5 VDD
100
10 VDD
15VDD
15 VDD
2200
Supply Current vs. Frequency
SUPPLY CURRENT (mA)
TIME (nsec)
10 VDD
520
940 1360 1780
CAPACITIVE LOAD (pF)
100
CL = 1000 pF
TA = +25°C
TA = +25°C
TA = +25°C
5 VDD
500 kHz
18
125
1000
100
15
0
0
45
65
85
105
TEMPERATURE (°C)
13
Supply Current vs. Capacitive Load
SUPPLY CURRENT (mA)
16
11
9
VDD (V)
7
30
54
tFALL
0
25
5
CL = 1000 pF
VDD = +15V
CL = 1000 pF
VDD = +15V tRISE
24
TIME (nsec)
9
11
VDD (V)
60
TIME (nsec)
TIME (nsec)
7
Delay Time vs. Temperature
40
32
5
30
80
VDD = 15V
VDD = 10V
60
40
20
VDD = 5V
10
100
1000
CAPACITIVE LOAD (pF)
© 2006 Microchip Technology Inc.
10,000
10
100
10,000
1000
CAPACITIVE LOAD (pF)
0
10
100
1000
FREQUENCY (kHz)
10,000
DS21393C-page 7
TC1426/TC1427/TC1428
TYPICAL CHARACTERISTICS (CONTINUED)
Low-State Output Resistance
High-State Output Resistance
15
50
42
R OUT (Ω)
50 mA
11
9
100 mA
34
26
A (sec)
13
ROUT (Ω)
TA = +25°C
TA = +25°C
100 mA
Crossover Energy Loss
10-8
50 mA
10-9
10 mA
18
7
10 mA
10
5
5
7
9
11
VDD (V)
13
5
15
7
Quiescent Power Supply
Current vs. Supply Voltage
20
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
BOTH INPUTS LOGIC ‘0’
10
5
13
15
10-10
4
6
8
10 12
VDD (V)
14
16
18
Quiescent Power Supply
Current vs. Supply Voltage
20
15
9
11
VDD (V)
0
BOTH INPUTS LOGIC ‘1’
15
10
5
0
0
50
100
150
200
300
1
400
SUPPLY CURRENT (μA)
2
3
4
5
6
SUPPLY CURRENT (mA)
Thermal Derating Curves
1600
MAX. POWER (mW)
1400
8 Pin DIP
1200
1000
800
8 Pin SOIC
600
400
200
0
0
10
20
30
40
50
60
70
80
90
100
110
120
AMBIENT TEMPERATURE (°C)
DS21393C-page 8
© 2006 Microchip Technology Inc.
TC1426/TC1427/TC1428
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
Package marking data not available at this time.
5.2
Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
Pin 1
W
P
Standard Reel Component Orientation
for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin MSOP
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
Pin 1
W
P
Standard Reel Component Orientation
for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin SOIC (N)
© 2006 Microchip Technology Inc.
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
DS21393C-page 9
TC1426/TC1427/TC1428
5.3
Package Dimensions
8-Pin Plastic DIP
Pin 1
.260 (6.60)
.240 (6.10)
.045 (1.14)
.030 (0.76)
.070 (1.78)
.040 (1.02)
.310 (7.87)
.290 (7.37)
.400 (10.16)
.348 (8.84)
.200 (5.08)
.140 (3.56)
.040 (1.02)
.020 (0.51)
.150 (3.81)
.115 (2.92)
.110 (2.79)
.090 (2.29)
.015 (0.38)
.008 (0.20)
3° Min.
.400 (10.16)
.310 (7.87)
.022 (0.56)
.015 (0.38)
Dimensions: inches (mm)
8-Pin SOIC
Pin 1
.157 (3.99)
.150 (3.81)
.244 (6.20)
.228 (5.79)
.050 (1.27) Typ.
.197 (5.00)
.189 (4.80)
.069 (1.75)
.053 (1.35)
.020 (0.51) .010 (0.25)
.013 (0.33) .004 (0.10)
.010 (0.25)
.007 (0.18)
8° Max.
.050 (1.27)
.016 (0.40)
Dimensions: inches (mm)
DS21393C-page 10
© 2006 Microchip Technology Inc.
TC1426/TC1427/TC1428
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© 2006 Microchip Technology Inc.
DS21393C-page 11
TC1426/TC1427/TC1428
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
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Device: TC1426/TC1427/TC1428
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Literature Number: DS21393C
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DS21393C-page 12
© 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
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•
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Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
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© 2006 Microchip Technology Inc.
DS21393C-page 13
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02/16/06
DS21393C-page 14
© 2006 Microchip Technology Inc.