TPA6045A4C www.ti.com.............................................................................................................................................................................................. SLOS614 – OCTOBER 2008 2-W STEREO AUDIO POWER AMPLIFIER WITH DirectPath™ STEREO HEADPHONE DRIVE AND REGULATOR FEATURES 1 • Microsoft™ Windows Vista™ Compliant • Fully Differential Architecture and High PSRR Provide Excellent RF Rectification Immunity • 2.1-W, 1% THD+N Into 4-Ω Speakers and 85-mW, 1% THD+N Into 16-Ω Headphones From 5-V Supply • DirectPath™ Headphone Amplifier Eliminates Output Capacitors (1) • Internal 4-Step Speaker Gain Control: 10, 12, 15.6, 21.6 dB and Fixed –1.5-V/V Headphone • 3.3-V Low Dropout Regulator for CODEC • Independent Shutdown Controls for Speaker, Headphone Amplifier, and Low Dropout Regulator (LDO) • Output Short-Circuit and Thermal Protection 23 DESCRIPTION The TPA6045A4C is a stereo audio power amplifier and DirectPath™ headphone amplifier in a thermally enhanced, space-saving, 32-pin QFN package. The speaker amplifier is capable of driving 2.1 W per channel continuously into 4-Ω loads at 5 V. The headphone amplifier achieves a minimum of 85 mW at 1% THD+N from a 5-V supply. A built-in internal 4-step gain control for the speaker amplifier and a fixed –1.5 V/V gain for the headphone amplifier minimizes external components needed. Independent shutdown control and dedicated inputs for the speaker and headphone allow the TPA6045A4C to simultaneously drive both headphones and internal speakers. Differential inputs to the speaker amplifiers offer superior power-supply and common-mode noise rejection. APPLICATIONS • • Notebook Computers Portable DVD SIMPLIFIED APPLICATION CIRCUIT Speaker Enable LDO (V) Gain (dB) TPA6040A4 Active Low 4.75 6, 10, 15.6, 21.6 TPA6041A4 Active Low 3.3 10, 12, 15.6, 21.6 TPA6043A4 Active Low 3.3 6, 10, 15.6, 21.6 TPA6045A4C Active High 3.3 10, 12, 15.6, 21.6 TPA6047A4 Active High 4.75 10, 12, 15.6, 21.6 TPA6045A4C CODEC SPKR SPKR_RIN+ HPR SPKR_RIN– HPL SPKL VDD ROUT+ ROUT– LOUT+ LOUT– SPKR_LIN+ SPKR_LIN– SPVDD BYPASS SPGND GAIN0 Shutdown Control HP_EN SPKR_EN OUTL HP_INR SGND OUTR HP_INL 3 V – 5.5 V GAIN1 HPVDD CPVDD Gain Control HPVSS CPVSS CPGND VDD 4.5 V – 5.5 V Regulator Enable 4.5 V – 5.5 V C1P C1N REG_EN REG_OUT 3.3 V (To CODEC) (1) US Patent Number 5289137 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DirectPath, PowerPAD are trademarks of Texas Instruments. Microsoft, Windows Vista are trademarks of Microsoft Corporation. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated TPA6045A4C SLOS614 – OCTOBER 2008.............................................................................................................................................................................................. www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Functional Block Diagram REG_EN BYPASS (3.3-V Output) REG_OUT SPKR_EN Bias Control 0.47 mF LDO HP_EN 1 mF VDD SPVDD 1 mF SPKR_RIN+ 1 mF + ROUT+ – + SPKR_RIN– ROUT– – 1 mF GAIN0 SPGND Gain Control GAIN1 SPVDD SPKR_LIN+ 1 mF SPKR_LIN– 1 mF 4.5 V – 5.5 V + – – + LOUT+ LOUT– SPVDD SPGND 1 mF HPVDD HP_INL – HP_OUTL 1 mF + HPVSS + HP_INR HP_OUTR – 3 V – 5.5 V 1 mF HPVDD HPVDD CPVDD 1 mF Charge Pump CPGND C1P GND HPVSS C1N CPVSS SPGND 1 mF 1 mF 2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C TPA6045A4C www.ti.com.............................................................................................................................................................................................. SLOS614 – OCTOBER 2008 AVAILABLE PACKAGE OPTIONS (1) TA PACKAGED DEVICE (1) (2) 32-Pin QFN (RHB) –40°C to 85°C TPA6045A4CRHB The RHB package is available taped and reeled. To order a taped and reeled part, add the suffix R to the part number (e.g., TPA6045A4CRHBR). For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (2) GAIN1 GAIN0 VDD REG_OUT SGND HP_INL HP_INR REG_EN TPA6045A4CRHB (TOP VIEW) 32 31 30 29 28 27 26 25 24 SPKR_RIN– 1 SPKR_RIN+ 2 23 SPKR_EN SPKR_LIN+ 3 22 HP_EN SPKR_LIN– 4 21 SPGND SPGND 5 20 ROUT+ LOUT+ 6 19 ROUT– LOUT– 7 18 SPVDD SPVDD 8 HPVDD 10 11 12 13 14 15 C1P CPGND CPVSS HPVSS HP_OUTR HP_OUTL C1N 9 17 16 CPVDD Thermal Pad BYPASS TERMINAL FUNCTIONS TERMINAL NAME NO. I/O/P DESCRIPTION SPKR_RIN– 1 I Right-channel negative differential audio input for speaker amplifier SPKR_RIN+ 2 I Right-channel positive differential audio input for speaker amplifier SPKR_LIN+ 3 I Left-channel positive differential audio input for speaker amplifier SPKR_LIN– 4 I Left-channel negative differential audio input for speaker amplifier SPGND 5, 21 P Speaker power ground LOUT+ 6 O Left-channel positive audio output LOUT– 7 O Left-channel negative audio output SPVDD 8, 18 P Supply voltage terminal for speaker amplifier Charge pump positive supply, connect to HPVDD via star connection CPVDD 9 P C1P 10 I/O CPGND 11 P C1N 12 I/O CPVSS 13 P Charge pump output (negative supply for headphone amplifier), connect to HPVSS HPVSS 14 P Headphone amplifier negative supply, connect to CPVSS HP_OUTR 15 O Right-channel capacitor-free headphone output HP_OUTL 16 O Left-channel capacitor-free headphone output HPVDD 17 P Headphone amplifier supply voltage, connect to CPVDD Charge pump flying capacitor positive terminal Charge pump ground Charge pump flying capacitor negative terminal Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C 3 TPA6045A4C SLOS614 – OCTOBER 2008.............................................................................................................................................................................................. www.ti.com TERMINAL FUNCTIONS (continued) TERMINAL I/O/P DESCRIPTION NAME NO. ROUT– 19 O Right-channel negative audio output ROUT+ 20 O Right-channel positive audio output HP_EN 22 I Headphone channel enable logic input; active high enable. HIGH=ENABLE. SPKR_EN 23 I Speaker channel enable logic input; active high enable. HIGH=ENABLE. BYPASS 24 P Common-mode bias voltage for speaker preamplifiers REG_EN 25 I Enable pin for turning on/off LDO. HIGH=ENABLE HP_INR 26 I Headphone right-channel audio input HP_INL 27 I Headphone left-channel audio input SGND 28 P Signal ground, connect to CPGND and SPGND REG_OUT 29 O Regulated 3.3-V output VDD 30 P Positive power supply GAIN0 31 I Bit 0, MSB, of gain select bits GAIN1 32 I Bit 1, LSB, of gain select bits Die Pad P Solder the thermal pad on the bottom of the QFN package to the GND plane of the PCB. It is required for mechanical stability and will enhance thermal performance. Thermal Pad ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) Supply voltage VI HPVDD, VDD, SPVDD, CPVDD Input voltage VALUE UNIT –0.3 to 6 V SPKR_LIN+, SPKR_LIN-, SPKR_RIN+, SPKR_RIN-, HP_EN,GAIN0, GAIN1, SPK_EN, REG_EN –0.3 to 6.3 HP_INL, HP_INR HP Enabled –3.5 to 3.5 HP_INL, HP_INR HP not Enabled Continuous total power dissipation V –0.3 to 3.5 See Dissipation Rating Table TA Operating free-air temperature range –40 to 85 °C TJ Operating junction temperature range –40 to 150 °C Tstg Storage temperature range –65 to 150 °C 8 kV (1) Electrostatic discharge HBM for HP_OUTL and HP_OUTR Electrostatic discharge, all other pins CDM 500 V HBM 2 kV Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATINGS (1) PACKAGE (1) TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C RHB 5.06 W 40 mW/°C 4.04 W 3.23 W The PowerPAD™ must be soldered to a thermal land on the printed-circuit board. Refer to the Texas Instruments document, PowerPAD™ Thermally Enhanced Package application report (literature number SLMA002) for more information regarding the PowerPAD™ package. RECOMMENDED OPERATING CONDITIONS 4 Supply voltage VDD, SPVDD Supply voltage HPVDD, CPVDD Submit Documentation Feedback MIN MAX 4.5 5.5 UNIT V 3 5.5 V Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C TPA6045A4C www.ti.com.............................................................................................................................................................................................. SLOS614 – OCTOBER 2008 RECOMMENDED OPERATING CONDITIONS (continued) MIN VIH High-level input voltage SPKR_EN, HP_EN, GAIN0, GAIN1, REG_EN VIL Low-level input voltage SPKR_EN, HP_EN, GAIN0, GAIN1, REG_EN TA Operating free-air temperature MAX 2 UNIT V 0.8 V –40 85 °C TYP MAX GENERAL DC ELECTRICAL CHARACTERISTICS TA = 25°C, VDD = SPVDD = HPVDD = CPVDD = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN UNIT IIH High-level input current SPKR_EN, HP_EN, GAIN0, GAIN1, REG_EN = VDD 0.02 1 µA IIL Low-level input current SPKR_EN, HP_EN, GAIN0, GAIN1, REG_EN = 0 V 0.02 1 µA IDD(Speaker) Supply current, speaker amplifier ONLY enabled SPKR_EN = 2 V, HP_EN = REG_EN = 0 V 5 12 mA IDD(HP) Supply current, headphone amplifier ONLY enabled HP_EN = 2 V, SPKR_EN = REG_EN = 0 V 7.5 14 mA IDD(REG) Supply current, regulator ONLY enabled REG_EN = 2 V, SPKR_EN = HP_EN = 0 V 0.65 1 mA IDD(SD) Supply current, shutdown mode SPKR_EN = HP_EN = REG_EN = 0 V 2.5 5 µA TYP MAX 0.5 10 SPEAKER AMPLIFIER DC CHARACTERISTICS TA = 25°C, VDD = SPVDD = 5 V, RL = 4 Ω, Gain = 10 dB (unless otherwise noted) PARAMETER TEST CONDITIONS MIN | VOO | Output offset voltage (measured differentially) Inputs AC-coupled to GND, Gain = 10 dB PSRR Power supply rejection ratio VDD = SPVDD = 4.5 V to 5.5 V -60 –74 UNIT mV dB SPEAKER AMPLIFIER AC CHARACTERISTICS TA = 25°C, VDD = SPVDD = 5 V, RL = 4 Ω, Gain = 10 dB (unless otherwise noted) PARAMETER PO THD+N Output power Total harmonic distortion plus noise TEST CONDITIONS THD+N = 10%, f = 1 kHz, RL = 8 Ω 1.6 THD+N = 1%, f = 1 kHz, RL = 4 Ω 2.1 THD+N = 10%, f = 1 kHz, RL = 4 Ω 2.6 PO = 1 W, RL = 8 Ω, f = 20 Hz to 20 kHz 0.06% PO = 1 W, RL = 4 Ω, f = 20 Hz to 20 kHz 0.1% kSVR Supply ripple rejection ratio SNR Signal-to-noise rejection ratio Maximum output at THD+N <1%, f = 1 kHz, Gain = 10 dB W 90 dB f = 1 kHz, Po = 1 W, Gain = 10 dB –110 dB f = 10 kHz, Po = 1 W, Gain = 10 dB –100 dB Noise output voltage ZI Input Impedance Gain = 21.6 dB GAIN0, GAIN1 = 0.8 V Gain Matching UNIT dB Vn Gain MAX –53 CBYPASS = 0.47 µF, f = 20 Hz to 20 kHz, Gain = 10 dB, No weighting G TYP 1.3 f = 1 kHz, CBYPASS = 0.47 µF, RL = 8 Ω VRIPPLE = 200 mVPP Crosstalk (Left-Right; Right-Left) MIN THD+N = 1%, f = 1 kHz, RL = 8 Ω 21 µVrms 15 20 kΩ 9.4 10 10.6 GAIN0 = 0.8 V; GAIN1 = 2 V 11.4 12 12.6 GAIN0 = 2 V, GAIN1 = 0.8 V 15 15.6 16.2 GAIN0, GAIN1 = 2 V 21 21.6 22.2 Channel-to Channel 0.01 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C dB dB 5 TPA6045A4C SLOS614 – OCTOBER 2008.............................................................................................................................................................................................. www.ti.com SPEAKER AMPLIFIER AC CHARACTERISTICS (continued) TA = 25°C, VDD = SPVDD = 5 V, RL = 4 Ω, Gain = 10 dB (unless otherwise noted) PARAMETER TEST CONDITIONS MIN CBYPASS = 0.47 µF Start-up time from shutdown TYP MAX 25 UNIT ms HEADPHONE AMPLIFIER DC ELECTRICAL CHARACTERISTICS TA = 25°C, HPVDD = CPVDD = VDD = 5 V, RL = 16 Ω (unless otherwise noted) PARAMETER TEST CONDITIONS | VOS | Output offset voltage Inputs grounded PSRR Power supply rejection ratio HPVDD = 4.5 V to 5.5 V MIN TYP MAX 1 3 –75 –100 MIN TYP UNIT mV dB HEADPHONE AMPLIFIER AC CHARACTERISTICS TA = 25°C, HPVDD = 5 V, RL = 16 Ω (unless otherwise noted) PARAMETER PO THD+N TEST CONDITIONS Output power (outputs in phase) Total harmonic distortion plus noise THD+N = 10%, RL = 16 Ω, f = 1 kHz 200 THD+N = 10%, RL = 32 Ω, f = 1 kHz 100 PO = 85 mW, f = 20 Hz to 20 kHz, RL = 16 Ω 0.03% PO = 50 mW, f = 20 Hz to 20 kHz, RL = 32 Ω 0.04% MAX UNIT mW Dynamic Range with Signal Present A-Weighted, f = 20 Hz to 20 kHz Supply ripple rejection ratio f = 1 kHz, 200-mVPP ripple -60 dB Crosstalk Po = 35 mW, f = 20 Hz to 20 kHz -80 dB SNR Signal-to-noise ratio Maximum output at THD+N 1%, f = 1 kHz 95 dB Vn Noise output voltage f = 20 Hz to 20 kHz, No weighting 20 µVrms ZI Input Impedance Gain Closed-loop voltage gain kSVR RL = 16 Ω –100 15 20 –1.45 –1.5 Start-up time from shutdown dB FS kΩ –1.55 7.5 V/V ms LDO CHARACTERISTICS TA = 25°C, VDD = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS VI Input voltage IO Continuous output current VO Output voltage 0 < IO < 120 mA; 4.9 V < Vin < 5.5 V Line regulation IL = 5 mA; 4.9 V < Vin < 5.5 V Load regulation IL = 0 – 120 mA, Vin = 5 V Power supply ripple rejection VDD = 4.9 V, IL = 10 mA 6 MIN VDD TYP 4.5 MAX 5.5 120 3.2 f = 100 Hz Submit Documentation Feedback UNIT V mA 3.3 3.4 1.8 10 0.13 0.23 -46 V mV mV/ mA dB Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C TPA6045A4C www.ti.com.............................................................................................................................................................................................. SLOS614 – OCTOBER 2008 TYPICAL CHARACTERISTICS Default graph conditions: VCC = 5 V, Freq = 1 kHz, AES17 Filter. TOTAL HARMONIC DISTORTION + NOISE (SP) vs FREQUENCY TOTAL HARMONIC DISTORTION + NOISE (SP) vs FREQUENCY 1 Gain = 10 dB, RL = 4 W, VDD = 5 V THD+N - Total Harmonic Distortion - % THD+N - Total Harmonic Distortion + Noise - % 1 PO = 1 W PO = 0.25 W 0.1 PO = 1.5 W 0.01 1k 10 k f - Frequency - Hz 100 k PO = 1 W 0.001 100 1k 10 k f - Frequency - Hz 100 k TOTAL HARMONIC DISTORTION + NOISE (HP) vs FREQUENCY TOTAL HARMONIC DISTORTION + NOISE (HP) vs FREQUENCY Gain = 3.5 dB RL = 16 Ω VDD = 5 V 0.1 0.001 10 0.01 Figure 2. 1 0.01 PO = 0.25 W Figure 1. THD+N − Total Harmonic Distortion + Noise − % THD+N − Total Harmonic Distortion + Noise − % 100 PO = 0.1 W 0.1 0.0001 10 0.001 10 Gain = 10 dB, RL = 8 W, VDD = 5 V PO = 2.8 mW PO = 100 mW PO = 50 mW 100 1k 10k 100k 1 Gain = 3.5 dB RL = 32 Ω VDD = 5 V 0.1 PO = 50 mW PO = 1.4 mW PO = 25 mW 0.01 0.001 10 f − Frequency − Hz 100 1k 10k 100k f − Frequency − Hz G003 Figure 3. G004 Figure 4. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C 7 TPA6045A4C SLOS614 – OCTOBER 2008.............................................................................................................................................................................................. www.ti.com TYPICAL CHARACTERISTICS (continued) TOTAL HARMONIC DISTORTION + NOISE (SP) vs OUTPUT POWER TOTAL HARMONIC DISTORTION + NOISE (SP) vs OUTPUT POWER 100 Gain = 10 dB, RL = 4 W VDD = 4.5 V 10 VDD = 5 V VDD = 5.5 V 1 0.1 0.01 0.01 0.1 1 PO - Output Power - W Gain = 10 dB, RL = 8 W 10 VDD = 4.5 V VDD = 5 V 1 VDD = 5.5 V 0.1 0.01 0.01 10 0.1 1 PO - Output Power - W Figure 5. Figure 6. TOTAL HARMONIC DISTORTION + NOISE (HP) vs OUTPUT POWER TOTAL HARMONIC DISTORTION + NOISE (HP) vs OUTPUT POWER 10 THD+N − Total Harmonic Distortion + Noise − % THD+N − Total Harmonic Distortion + Noise − % THD+N - Total Harmonic Distortion + Noise - % THD+N - Total Harmonic Distortion + Noise - % 100 Gain = 3.5 dB RL = 16 Ω VDD = 5 V 1 0.1 VDD = 5 V In Phase 0.01 0.001 100µ 1m 10m 100m PO − Output Power − W 1 10 Gain = 3.5 dB RL = 32 Ω VDD = 5 V 1 0.1 In Phase 0.01 VDD = 5 V 0.001 100µ G007 Figure 7. 8 10 1m 10m 100m PO − Output Power − W 1 G008 Figure 8. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C TPA6045A4C www.ti.com.............................................................................................................................................................................................. SLOS614 – OCTOBER 2008 TYPICAL CHARACTERISTICS (continued) CROSSTALK (SP) vs FREQUENCY 0 -10 -20 0 -10 Gain = 10 dB, Power = 1 W, RL = 4 W, VDD = 5 V -40 -50 -50 -60 -70 -80 -90 L to R -100 -60 -70 -80 -90 -110 R to L -120 -120 -30 -140 100 1k 10 k f - Frequency - Hz 100 k 10 CROSSTALK (LDO) vs FREQUENCY CROSSTALK (HP) vs FREQUENCY -10 RL = 4 W, VDD = 5 V -20 -30 Crosstalk - dB Crosstalk - dB Gain = 3.5 dB, PO = 2.8 m W, RL = 16 W, VDD = 5 V -40 L to LDO -90 -50 -60 -70 -80 R to LDO R to L -90 -110 -100 -120 -130 -140 10 100 k 0 Gain = 10 dB, PO = 2 W, -60 -100 1k 10 k f - Frequency - Hz Figure 10. -50 -80 100 Figure 9. -40 -70 R to L -130 0 -20 L to R -100 -110 -10 RL = 8 W, VDD = 5 V -30 -40 -130 -140 10 Gain = 10 dB, PO = 1 W, -20 Crosstalk - dB Crosstalk - dB -30 CROSSTALK (SP) vs FREQUENCY L to R -110 100 1k 10 k 100 k -120 10 f - Frequency - Hz Figure 11. 100 1k 10 k f - Frequency - Hz 100 k Figure 12. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C 9 TPA6045A4C SLOS614 – OCTOBER 2008.............................................................................................................................................................................................. www.ti.com TYPICAL CHARACTERISTICS (continued) CROSSTALK (HP) vs FREQUENCY CROSSTALK (HP) vs FREQUENCY 0 −10 −20 –20 –30 −40 −50 −60 −70 Gain = 3.5 dB PO = 2.8 mW RL = 32 W VDD = 5 V –10 Crosstalk – dB Crosstalk − dB −30 0 Gain = 3.5 dB PO = 35 mW RL = 16 Ω VDD = 5 V R to L −80 –40 –50 –60 –70 –80 −90 –90 −100 –100 L to R −110 –110 −120 10 100 1k 10k 100k –120 10 100 f − Frequency − Hz 100k 1k 10k f – Frequency – Hz G012 Figure 13. Figure 14. CROSSTALK (HP) vs FREQUENCY OUTPUT POWER (SP) vs SUPPLY VOLTAGE 0 −20 Crosstalk − dB −30 3 −40 −50 −60 −70 −80 R to L −90 −120 10 THD+N = 10% 2.8 2.7 2.6 2.5 THD+N = 1% 2.4 2.3 2.2 2.1 2 1.9 1.8 −100 −110 Gain = 10 dB, RL = 4 W 2.9 PO - Output Power - W −10 3.2 3.1 Gain = 3.5 dB PO = 35 mW RL = 32 Ω VDD = 5 V L to R 1.7 100 1k 10k 100k 1.6 4.5 4.6 f − Frequency − Hz G013 Figure 15. 10 4.7 4.8 4.9 5 5.1 5.2 5.3 VDD - Supply Voltage - V 5.4 5.5 Figure 16. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C TPA6045A4C www.ti.com.............................................................................................................................................................................................. SLOS614 – OCTOBER 2008 TYPICAL CHARACTERISTICS (continued) OUTPUT POWER (SP) vs SUPPLY VOLTAGE OUTPUT POWER (HP) vs SUPPLY VOLTAGE 0.30 2.05 Gain = 10 dB, RL = 8 W 1.95 PO − Output Power − W THD+N = 10% 1.85 PO - Output Power - W THD+N = 10% 0.25 1.75 1.65 THD+N = 1% 1.55 1.45 1.35 1.25 0.20 0.15 0.10 0.05 Gain = 3.5 dB RL = 16 Ω 1.15 0.00 4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5 1.05 4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 VDD - Supply Voltage - V 5.4 5.5 VDD − Supply Voltage − V Figure 17. Figure 18. SUPPLY CURRENT (SP) vs TOTAL OUTPUT POWER SUPPLY CURRENT (SP) vs TOTAL OUTPUT POWER 1.6 0.9 VDD = 5 V 1.2 Gain = 10 dB, RL = 8 W 0.8 VDD = 4.5 V ICC - Supply Current - A Gain = 10 dB, RL = 4 W 1.4 ICC - Supply Current - A THD+N = 1% VDD = 5.5 V 1 0.8 0.6 VDD = 5 V VDD = 4.5 V 0.7 VDD = 5.5 V 0.6 0.5 0.4 0.3 0.4 0.2 0.2 0.1 0 0 0 1 2 3 4 PO - Output Power - W 5 6 0 0.4 Figure 19. 0.8 1.2 1.6 2 2.4 2.8 3.2 PO - Output Power - W 3.6 4 Figure 20. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C 11 TPA6045A4C SLOS614 – OCTOBER 2008.............................................................................................................................................................................................. www.ti.com TYPICAL CHARACTERISTICS (continued) POWER DISSIPATION (SP) vs TOTAL OUTPUT POWER 3.2 3 2.8 1.6 VDD = 5.5 V PD - Power Dissipation - W 2.4 2.2 1.4 VDD = 5 V 2 1.8 VDD = 4.5 V 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 1.2 1 1 2 3 4 PO - Output Power - W 5 0.6 0.4 6 Gain = 10 dB, RL = 8 W 0 0.5 1.5 2 2.5 3 PO - Output Power - W Figure 22. REGULATOR OUTPUT VOLTAGE (LDO) vs SUPPLY VOLTAGE SUPPLY VOLTAGE (LDO) vs LOAD CURRENT 3.40 3.38 3.36 3.36 3.32 3.34 IL = -10 mA IL = -1 mA 3.32 3.30 3.28 IL = -50 mA 3.26 IL = -120 mA VDD = 5 V 3.5 4 VDD = 5.5 V 3.28 VDD = 4.5 V 3.24 3.20 3.16 3.12 3.24 3.08 3.22 3.04 3 4.6 4.7 4.8 4.9 5 5.1 5.2 VDD - V 5.3 5.4 5.5 0 0.025 0.05 0.075 0.1 0.125 0.15 0.175 0.2 IL - Load Current - A Figure 23. 12 1 Figure 21. 3.40 3.20 4.5 VDD = 5 V VDD = 4.5 V 0.8 0 0 VDD = 5.5 V 0.2 Gain = 10 dB, RL = 4 W VCC - Supply Voltage - V PD - Power Dissipation - W 2.6 VCC - Regulator Output Voltage - V POWER DISSIPATION (SP) vs TOTAL OUTPUT POWER Figure 24. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C TPA6045A4C www.ti.com.............................................................................................................................................................................................. SLOS614 – OCTOBER 2008 TYPICAL CHARACTERISTICS (continued) COMMON-MODE REJECTION RATIO (SP) vs FREQUENCY COMMON-MODE REJECTION RATIO (SP) vs FREQUENCY 0 -10 -20 Gain = 10 dB, Input Level = 0.2 VPP, CMRR - Common Mode Rejection Ratio - dB CMRR - Common Mode Rejection Ratio - dB 0 R L = 4 W, VDD = 5 V -30 -40 -50 -60 -70 -80 -90 -100 10 100 1k 10 k f - Frequency - Hz RL = 8 W, VDD = 5 V -30 -40 -50 -60 -70 -80 -90 10 100 1k 10 k f - Frequency - Hz Figure 26. POWER SUPPLY REJECTION RATIO (LDO) vs FREQUENCY POWER SUPPLY REJECTION RATIO (SP) vs FREQUENCY 100 k 0 IO = 10 mA, Vripple = 0.20 VPP, VDD = 5 V PSRR - Power Supply Rejection Ratio - dB PSRR - Power Supply Rejection Ratio - dB -20 Figure 25. -20 -30 -40 -50 -60 -70 -80 10 Gain = 10 dB, Input Level = 0.2 VPP, -100 100 k 0 -10 -10 Gain = 10 dB, RL = 8 W, VDD = 5 V -10 -20 -30 -40 -50 -60 -70 -80 100 1k 10 k f - Frequency - Hz 100 k 10 Figure 27. 100 1k 10 k f - Frequency - Hz 100 k Figure 28. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C 13 TPA6045A4C SLOS614 – OCTOBER 2008.............................................................................................................................................................................................. www.ti.com TYPICAL CHARACTERISTICS (continued) POWER SUPPLY REJECTION RATIO (HP) vs FREQUENCY OUTPUT POWER (HP) vs LOAD RESISTANCE −10 −20 500 Gain = 3.5 dB RL = 16 Ω VDD = 5 V 400 −30 −40 −50 −60 −70 350 300 200 −90 50 1k 10k THD+N = 1% 150 100 100 THD+N = 10% 250 −80 −100 10 fIN = 1 kHz Gain = 3.5 dB VDD = 5 V 450 PO − Output Power − mW PSRR − Power Supply Rejection Ratio − dB 0 0 10 100k 100 RL − Load Resistance − Ω f − Frequency − Hz G028 Figure 29. 1k G029 Figure 30. OUTPUT POWER (SP) vs LOAD RESISTANCE 2.6 fI = 1 kHz Gain = 10 dB, VDD = 5 V 2.4 PO - Output Power - W 2.2 2 1.8 1.6 1.4 THD+N = 10% 1.2 1 0.8 THD+N = 1% 0.6 0.4 4 6 8 10 12 14 16 18 20 22 24 26 28 30 RL - Load Resistance - W Figure 31. 14 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C TPA6045A4C www.ti.com.............................................................................................................................................................................................. SLOS614 – OCTOBER 2008 TYPICAL CHARACTERISTICS (continued) SPEAKER SHUTDOWN - 8 Ω - 10 dB SPEAKER STARTUP - 8 Ω - 10 dB Figure 32. Figure 33. LDO SHUTDOWN - 120 mA LDO STARTUP - 120 mA Figure 34. Figure 35. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C 15 TPA6045A4C SLOS614 – OCTOBER 2008.............................................................................................................................................................................................. www.ti.com TYPICAL CHARACTERISTICS (continued) 16 HP SHUTDOWN - 32 Ω HP STARTUP - 32 Ω Figure 36. Figure 37. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C TPA6045A4C www.ti.com.............................................................................................................................................................................................. SLOS614 – OCTOBER 2008 APPLICATION INFORMATION 3.3 V (Output) 4.5 V - 5.5 V 0.1 mF 2.2 mF HP Left Input HP Right Input 1 mF 1 mF 1 mF { 0.47 mF SPKR Right Input HP_INR REG_EN SGND HP_EN SPKR_LIN– SPGND TPA6045A4C SPGND 4.5 V - 5.5 V SPVDD HP_OUTR HP_OUTL CPVSS HPVSS CPGND C1N C1P SPVDD Right Speaker ROUT- LOUT- 4.5 V - 5.5 V Headphone Enable ROUT+ LOUT+ Left Speaker Speaker Enable SPKR_EN SPKR_LIN+ 0.47 mF 0.47 mF 0.47 mF BYPASS SPKR_RIN+ CPVDD SPKR Left Input 0.47 mF HP_INL VDD SPKR_RIN– REG_OUT GAIN0 Regulator Enable GAIN1 4-Step Gain Control 3 V - 5.5 V HPVDD 1 mF 3 V - 5.5 V 10 mF 1 mF 1 mF 1 mF Headphone Output Figure 38. Single-Ended Input Application Circuit Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C 17 TPA6045A4C SLOS614 – OCTOBER 2008.............................................................................................................................................................................................. www.ti.com 3.3 V (Output) 4.5 V - 5.5 V 0.1 mF 2.2 mF HP Left Input HP Right Input 1 mF 1 mF 1 mF { 0.47 mF SPKR Right (+) Input 0.47 mF SPKR Left (+) Input REG_EN HP_INL HP_INR SGND VDD SPKR_RIN– REG_OUT SPKR Right (–) Input GAIN0 Regulator Enable GAIN1 0.47 mF BYPASS SPKR_RIN+ SPKR_LIN– SPGND HP_OUTL SPVDD HPVSS SPVDD HP_OUTR LOUT- CPVSS ROUT- C1N 4.5 V - 5.5 V ROUT+ LOUT+ CPVDD Left Speaker SPGND TPA6045A4C C1P 0.47 mF Headphone Enable HP_EN 0.47 mF SPKR Left (–) Input Speaker Enable SPKR_EN SPKR_LIN+ CPGND 4-Step Gain Control Right Speaker 3 V - 5.5 V HPVDD 1 mF 10 mF 1 mF 1 mF 1 mF Headphone Output Figure 39. Differential Input Application Circuit Power Enable Modes The TPA6045A4C allows disable of any or all of the main circuit blocks when not in use in order to reduce operating power to an absolute minimum. The SPKR_EN control can be used to disable the speaker amplifier while the HP_EN can be used separately to turn off the headphone amplifier. The LDO also has an independent power control, REG_EN. With all circuit blocks disabled, the supply current in shutdown mode is only 5 µA. See the General DC Electrical Characteristics for operating currents with each circuit block operating independently. Speaker Amplifier Description The speaker amplifier is capable of driving 2.1 W/ch of continuous RMS power into a 4-Ω load at 5 V. An internal 4-step control allows variation of the gain from 10 dB to 21.6 dB. Fully Differential Amplifier The TPA6045A4C speaker amplifier is a fully differential amplifier with differential inputs and outputs. The fully differential architecture consist of a differential amplifier and a common mode amplifier. The differential amplifier ensures that the amplifier outputs a differential voltage that is equal to the differential input times the gain. The common-mode voltage at the output is biased around VDD/2 regardless of the common-mode voltage at the input. 18 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C TPA6045A4C www.ti.com.............................................................................................................................................................................................. SLOS614 – OCTOBER 2008 One of the primary advantages of the fully differential amplifier is improved RF immunity. GSM handsets save power by turning on and off the RF transmitter at a rate of 217 Hz. The transmitted signal is picked up on input and output traces. The fully differential amplifier cancels the signal and others of this type much better than typical audio amplifiers. Gain Setting via GAIN0 and GAIN1 Inputs The gain of the TPA6045A4C is set by two terminals, GAIN0 and GAIN1. The gains listed in Table 1 are realized by changing the taps on the input resistors and feedback resistors inside the amplifier. This causes the input impedance (ZI) to vary as a function of the gain setting. Gain Setting AMPLIFIER GAIN (dB) INPUT IMPEDANCE (kΩ) TYPICAL TYPICAL 10 78 1 12 65 0 15.6 46 1 21.6 20 GAIN1 GAIN0 0 0 0 1 1 Input Capacitor, CI The input capacitor allows the amplifier to bias the input signal to the proper dc level for proper operation. In this case, the input capacitor, CI, and the input impedance of the amplifier, RI, form a high-pass filter with the corner frequency determined in Equation 1. Figure 40 shows how the input capacitor and the input resistor within the amplifier interact. Figure 40. Input Resistor and Input Capacitor (1) The value of CI is important to consider as it directly affects the low-frequency, or bass, performance of the circuit. Furthermore, the input impedance changes with a change in volume. The higher the volume, the lower the input impedance is. To determine the appropriate capacitor value, reconfigure Equation 1 into Equation 2. The value of the input resistor, RI, can be determined from Equation 2. 1 CI + 2pRI f c (2) Low-leakage tantalum or ceramic capacitors are recommended. When polarized capacitors are used, the positive side of the capacitor should face the amplifier input in most applications as the dc level there is held at VCC/2, which is likely higher than the source dc level. Note that it is important to confirm the capacitor polarity in each specific application. Recommended capacitor values are between 0.1 µF and 1 µF. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C 19 TPA6045A4C SLOS614 – OCTOBER 2008.............................................................................................................................................................................................. www.ti.com Windows Vista™ Premium Mobile Mode Specifications Device Type Requirement Windows Premium Mobile Vista Specifications TPA6045A4C Typical Performance THD+N ≤ –65 dB FS [20 Hz, 20 kHz] –88 dB FS[20 Hz, 20 kHz] Analog Speaker Line Jack (RL = 10 kΩ, FS = 0.707 Vrms) Dynamic Range with Signal Present ≤ –80 dB FS A-Weight –88 dB FS A-Weight Analog Headphone Out Jack (RL = 32Ω, FS = 0.300 Vrms) Line Output Crosstalk ≤ –60 dB [20 Hz, 20 kHz] –105 dB [20 Hz, 20 kHz] THD+N ≤ –45 dB FS [20 Hz, 20 kHz] –88 dB FS [20 Hz, 20 kHz] Dynamic Range with Signal Present ≤ –80 dB FS A-Weight –89 dB FS A-Weight Headphone Output Crosstalk ≤ –60 dB [20 Hz, 20 kHz] –100 dB [20 Hz, 20 kHz] Bridge-Tied Load Versus Single-Ended Mode Figure 41 shows a Class-AB audio power amplifier (APA) in a bridge-tied-load (BTL) configuration. The TPA6045A4C speaker amplifier consists of two Class-AB differential amplifiers per channel driving the positive and negative terminals of the load. Specifically, differential drive means that as one side of the amplifier (the positive terminal, for example) is slewing up, the other side is slewing down, and vice versa. This doubles the voltage swing across the load as opposed to a ground-referenced load, or a single-ended load. Power is proportional to the square of the voltage. Plugging 2x VO(PP) into the power equation yields 4X the output power from the same supply rail and load impedance as would have been obtained with a ground-referenced load (see Equation 3). VO(PP) V (RMS) + 2 Ǹ2 Power + V (RMS) 2 RL (3) VDD VO(PP) RL VDD 2x VO(PP) −VO(PP) Figure 41. Differential Output Configuration VDD –3 dB VO(PP) CC RL VO(PP) fc Figure 42. Single-Ended Configuration and Frequency Response 20 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C TPA6045A4C www.ti.com.............................................................................................................................................................................................. SLOS614 – OCTOBER 2008 Bridge-tying the outputs in a typical computer audio, LCD TV, or multimedia LCD monitor application drastically increases output power. For example, if an amplifier in a single-ended configuration was capable of outputting a maximum of 250 mW for a given load with a supply voltage of 12 V, then that same amplifier would be able to output 1 W of power in a BTL configuration with the same supply voltage and load. In addition to the increase in output power, the BTL configuration does not suffer from the same low-frequency issues that plague the single-ended configuration. In a BTL configuration, there is no need for an output capacitor to block dc, so no unwanted filtering occurs. In addition, the BTL configuration saves money and space, as the dc-blocking capacitors needed for single-ended operation are large and expensive. For example, with an 8-Ω load in SE operation, the user needs a 1000-µF capacitor to obtain a cutoff frequency below 20 Hz. This capacitor is expensive and large. Headphone Amplifier Description The headphone amplifier has a fixed gain of –1.5 V/V. It uses single-ended (SE) inputs. The DirectPath™ amplifier architecture operates from a single supply but makes use of an internal charge pump to provide a negative voltage rail. Combining the user-provided positive rail and the negative rail generated by the IC, the device operates in what is effectively a split supply mode. The output voltages are now centered at zero volts with the capability to swing to the positive rail or negative rail. The DirectPath™ amplifier requires no output dc blocking capacitors and does not place any voltage on the sleeve. The block diagram and waveform of Figure 43 illustrate the ground-referenced headphone architecture. This is the architecture of the TPA6045A4C. Single-supply headphone amplifiers typically require dc-blocking capacitors. The capacitors are required because most headphone amplifiers have a dc bias on the outputs pin. If the dc bias is not removed, the output signal is severely clipped, and large amounts of dc current rush through the headphones, potentially damaging them. The left-side drawing in Figure 43 illustrates the conventional headphone amplifier connection to the headphone jack and output signal. DC blocking capacitors are often large in value. The headphone speakers (typical resistive values of 16 Ω or 32 Ω) combine with the dc blocking capacitors to form a high-pass filter. Equation 4 shows the relationship between the load impedance (RL), the capacitor (CO), and the cutoff frequency (fC). 1 fc + 2pRLC O (4) CO can be determined using Equation 5, where the load impedance and the cutoff frequency are known. 1 CO + 2pRLf c (5) If fc is low, the capacitor must then have a large value because the load resistance is small. Large capacitance values require large package sizes. Large package sizes consume PCB area, stand high above the PCB, increase cost of assembly, and can reduce the fidelity of the audio output signal. Two different headphone amplifier applications are available that allow for the removal of the output dc blocking capacitors. The capacitor-less amplifier architecture is implemented in the same manner as the conventional amplifier with the exception of the headphone jack shield pin. This amplifier provides a reference voltage, which is connected to the headphone jack shield pin. This is the voltage on which the audio output signals are centered. This voltage reference is half of the amplifier power supply to allow symmetrical swing of the output voltages. Do not connect the shield to any GND reference, or large currents will result. The scenario can happen if, for example, an accessory other than a floating GND headphone is plugged into the headphone connector. See the second block diagram and waveform in Figure 43. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C 21 TPA6045A4C SLOS614 – OCTOBER 2008.............................................................................................................................................................................................. www.ti.com Conventional VDD CO VOUT CO VDD/2 GND Capacitor-Less VDD VOUT VBIAS GND VBIAS DirectPathTM VDD GND VSS Figure 43. Amplifier Applications Input-Blocking Capacitors DC input-blocking capacitors block the dc portion of the audio source and allow the inputs to properly bias. Maximum performance is achieved when the inputs of the TPA6045A4C are properly biased. Performance issues such as pop are optimized with proper input capacitors. The dc input-blocking capacitors can be removed, provided the inputs are connected differentially and within the input common-mode range of the amplifier, the audio signal does not exceed ±3 V, and pop performance is sufficient. CIN is a theoretical capacitor used for mathematical calculations only. Its value is the series combination of the dc input-blocking capacitors, C(DCINPUT-BLOCKING). Use Equation 6 to determine the value of C(DCINPUT-BLOCKING). For example, if CIN is equal to 0.22 µF, then C(DCINPUT-BLOCKING) is equal to about 0.47 µF. 1 C CIN = (DCINPUT-BLOCKING) 2 (6) The two C(DCINPUT-BLOCKING) capacitors form a high-pass filter with the input impedance of the TPA6045A4C. Use Equation 6 to calculate CIN, then calculate the cutoff frequency using CIN and the differential input impedance of the TPA6045A4C, RIN, using Equation 7. Note that the differential input impedance changes with gain. See Figure 39 for input impedance values. The frequency and/or capacitance can be determined when one of the two values are given. 22 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C TPA6045A4C www.ti.com.............................................................................................................................................................................................. SLOS614 – OCTOBER 2008 fc IN + 1 2p RIN C IN or C IN + 1 2p fcIN R IN (7) If a high-pass filter with a -3-dB point of no more than 20 Hz is desired over all gain settings, the minimum impedance would be used in the Equation 7. The minimum input impedance for TPA6045A4C is 20 kΩ. The capacitor value by Equation 7 would be 0.399 µF. However, this is CIN, and the desired value is for C(DCINPUT-BLOCKING). Multiplying CIN by 2 yields 0.80 µF, which is close to the standard capacitor value of 1 µF. Place 1-µF capacitors at each input terminal of the TPA6045A4C to complete the filter. Charge Pump Flying Capacitor and CPVSS Capacitor The charge pump flying capacitor serves to transfer charge during the generation of the negative supply voltage. The CPVSS capacitor must be at least equal to the flying capacitor in order to allow maximum charge transfer. Low ESR capacitors are an ideal selection, and a value of 1 µF is typical. Decoupling Capacitors The TPA6045A4C is a DirectPath™ headphone amplifier that requires adequate power supply decoupling to ensure that the noise and total harmonic distortion (THD) are as low as possible. To filter high-frequency transients, spikes, and digital hash on the power line, use good low equivalent-series-resistance (ESR) ceramic capacitors, typically 1 µF. Find the smallest package possible, and place as close as possible to the device VDD lead. Placing the decoupling capacitors close to the TPA6045A4C is important for the performance of the amplifier. Use a 10 µF or greater capacitor near the TPA6045A4C to filter lower frequency noise signals; however, the high PSRR of the TPA6045A4C makes the 10-µF capacitor unnecessary in most applications. Midrail Bypass Capacitor, CBYPASS The midrail bypass capacitor, C(BYPASS), has several important functions. During start-up or recovery from shutdown mode, CBYPASS determines the rate at which the amplifier starts up. A 1-µF capacitor yields a start-up time of approximately 25 ms. CBYPASS also reduces the noise coupled into the output signal by the power supply. This improves the power supply ripple rejection (PSRR) of the amplifier. Ceramic or polyester capacitors with low ESR and values in the range of 0.47 µF to 1 µF are recommended. Low Dropout Regulator (LDO) Description The TPA6045A4C contains a 3.3-V output low dropout regulator (LDO) capable of providing a maximum of 120 mA with a drop of less than 150 mV from the 5-V supply. This can be used to power an external CODEC. A 10-µF decoupling capacitor is recommended at the output of the LDO as well as 0.1-µF capacitor to filter high-frequency noise from the supply line. Layout Recommendations Solder the exposed thermal pad (metal pad on the bottom of the part) on the TPA6045A4C QFN package to a pad on the PCB. It is important to keep the TPA6045A4C external components close to the body of the amplifier to limit noise pickup. One should lay out the differential input leads symmetrical and close together to take advantage of the inherent common mode rejection of the TPA6045A4C. The layout of the TPA6045A4C evaluation module (EVM) is a good example of component placement and the layout files are available at www.ti.com. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA6045A4C 23 PACKAGE OPTION ADDENDUM www.ti.com 20-Nov-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing TPA6045A4CRHBR ACTIVE QFN RHB Pins Package Eco Plan (2) Qty 32 3000 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 27-Nov-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPA6045A4CRHBR Package Package Pins Type Drawing QFN RHB 32 SPQ Reel Reel Diameter Width (mm) W1 (mm) 3000 330.0 12.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 5.3 5.3 1.5 8.0 W Pin1 (mm) Quadrant 12.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 27-Nov-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPA6045A4CRHBR QFN RHB 32 3000 346.0 346.0 29.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2008, Texas Instruments Incorporated