TI TPS2590RSA

TPS2590
SLUS960D – JULY 2009 – REVISED OCTOBER 2011
www.ti.com
3-V to 20-V High-Current Load Switch
Check for Samples: TPS2590
FEATURES
DESCRIPTION
•
•
•
•
•
•
•
•
•
•
•
•
The TPS2590 provides highly integrated hot-swap
power management and superior protection in
applications where the load is powered by voltages
between 3.0 V and 20 V. This device is intended for
systems where a voltage bus must be protected to
prevent load shorts from interrupting or damaging
other system components. The TPS2590 is in a
16-pin QFN package.
1
Integrated Pass MOSFET
3-V to 20-V Bus Operation
Programmable Fault Timer
Programmable Fault Current
Programmable Hard Current Limit
Fast Disable
Thermal Shutdown
Load Fault Alert
Latching and Auto-retry Operation
4-mm x 4-mm QFN
-40°C to 125°C Junction Temperature Range
UL Listed - File Number E169910
The TPS2590 has multiple programmable protection
features. Load protection is accomplished by a
non-current limiting fault threshold, a hard current
limit threshhold, and a fault timer. The dual current
thresholds allow the system to draw high current for
short periods without causing a voltage droop at the
load. An example of this is a disk drive startup. This
technique is ideal for loads that experience brief high
demand, but benefit from protection levels consistent
with average current draw.
APPLICATIONS
•
•
•
•
•
RAID Arrays
Telecommunications
Plug-In Circuit Boards
Disk Drive
Notebooks / Netbooks
Hotswap MOSFET protection is provided by power
limit circuitry which protects the internal MOSFET
against SOA related failures.
The TPS2590 provides a fault indicator output and
allows latch off or retry on fault.
12-V, 3.5-A Application
Figure 1.
IN
OUT
TPS2590
16 EN
RTRY
FLT 15
GND
6
Input
Voltage Bus
ILIM
IFLT
CT
7
8
9
40.2 kW 49.9 kW
CLOAD
Optional: To
System Monitor
Output To Voltage Bus
or DC-to-DC Converter
0.1 mF
UDG-10102
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009–2011, Texas Instruments Incorporated
TPS2590
SLUS960D – JULY 2009 – REVISED OCTOBER 2011
www.ti.com
ORDERING INFORMATION
DEVICE
JUNCTION
TEMPERATURE
PACKAGE
ORDERING CODE
MARKING
TPS2590
-40°C to 125°C
RSA (4-mm x 4-mm QFN)
TPS2590RSA
TPS2590
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1) (2)
UNIT
Input voltage range IN, OUT
-0.3 to 25
Voltage range FLT
-0.3 to 20
V
Voltage IFAULT, ILIM
1.75
Voltage CT
3.0
Output sink current FLT
10
Input voltage range, EN
-0.3 to 6
V
35
uA
Input current, RTRY ( RTRY internally clamped to 3 V ) RTRY = 0 V
Voltage range CT (3), IFLT (3) ,ILIM (3), RTRY
-0.3 to 3
ESD rating, HBM
2 .5 k
ESD rating, CDM
Internally Limited
Storage temperature range, Tstg
(2)
(3)
(3)
(4)
°C
-65 to 150
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
All voltage values are with respect to GND.
Do not apply voltage to pin.
DISSIPATION RATINGS (1)
(1)
(2)
V
400
Operating junction temperature range, TJ
(1)
mA
(2) (3) (4)
PACKAGE
θJA LOW K, °C/W
θJA HIGH K, °C/W
θJA BEST 4, °C/W
RSA
211
55
50
Tested per JEDEC JESD51, natural convection. The definitions of high-k and low-k are per JESD 51-7and JESD 51-3.
Low-k (2 signal - no plane, 3 in. by 3 in. board, 0.062 in. thick, 1 oz. copper) test board with the pad soldered, and an additional 0.12
in.2 of top-side copper added to the pad.
High-k is a (2 signal – 2 plane) test board with the pad soldered.
The best case thermal resistance is obtained using the recommendations per SLMA002A (2 signal - 2 plane with the pad connected to
the plane).
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
MIN
NOM
MAX
UNIT
Input voltage range IN, OUT
3
Voltage range EN
0
5
Voltage range FLT
0
20
Output sink current FLT
0
1
mA
Voltage range RTRY
0
3
V
100 p
10 m
F
-40
125
°C
CCT
Junction temperature
2
Submit Documentation Feedback
20
V
Copyright © 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): TPS2590
TPS2590
SLUS960D – JULY 2009 – REVISED OCTOBER 2011
www.ti.com
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
IN
UVLO
Bias current
VIN ↑
2.6
2.85
2.9
V
Hysteresis
150
mV
EN = 2.4 V
25
100
μA
EN = 0 V
3.9
5
mA
29.5
42.0
mΩ
OUT
RON
RVIN-VOUT, IVOUT < IRLIM or IVOUT < (ISET x 1.25), 1
A ≤ IVOUT ≤ 4.5 A
Power limit
VIN: 12 V, COUT = 1000 μF, EN: 3 V → 0 V
Reverse diode voltage
VOUT > VIN , EN = 5 V, IIN = - 1 A
3
5
7.5
W
0.77
1.0
V
IFLT
IFLT
Fault current threshold
IVOUT ↑, ICT: sinking → sourcing, pulsed test (RRFLT
= 200 kΩ)
0.8
1
1.2
IVOUT ↑, ICT: sinking → sourcing, pulsed test (RRFLT
= 100 kΩ)
1.8
2
2.2
IVOUT ↑, ICT: sinking → sourcing, pulsed test (RRFLT
= 49.9 kΩ)
3.6
4
4.4
1.6
2
2.4
2.6
3
3.4
4.6
5
5.4
A
ILIM
RRLIM = 100 kΩ
Current limit program IVOUT ,
RRLIM = 66.5 kΩ
VVIN-VOUT = 0.3 V, pulsed test
RRLIM = 40.2 kΩ
A
CT
Charge/discharge current
Threshold voltage
ON/OFF fault duty cycle
ICT sourcing, VCT = 1 V
29
35
41
ICT sinking, VCT = 1 V
1.0
1.4
1.8
VCT ↑
1.3
1.4
1.5
VCT ↓
0.1
0.16
0.3
VVOUT = 0 V
2.8
3.7
4.6
Submit Documentation Feedback
Copyright © 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): TPS2590
μA
V
%
3
TPS2590
SLUS960D – JULY 2009 – REVISED OCTOBER 2011
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
EN
Threshold voltage
Input bias current
V EN ↓
0.8
1.0
1.5
V
Hysteresis
50
150
250
mV
-1.5
0
0.5
-2
1
0.5
350
500
V EN = 2.4 V (sinking)
V EN = 0.2 V (sourcing)
μA
Turn on propagation delay
VIN = 3.3 V, ILOAD = 1 A, V
: 2.4 V → 0.2 V, VOUT: ↑
EN
90% x VIN
Turn off propagation delay
VIN = 3.3 V, ILOAD = 1 A, V
: 0.2 V → 2.4 V, VOUT:
EN
↓10% x VIN
10
20
VOUT LOW
VCT = 1.8 V, I FLT = 1 mA
0.2
0.4
V
Leakage current
V FLT = 18 V
1
μA
Low threshold voltage
Auto Retry Mode
High threshold
Latch mode
μs
FLT
RTRY
Input bias current
0.8
2.0
V RTRY = 3.0 V
-1.0
0.2
1.0
V RTRY = 0.2 V
-50
-25
0
V
mA
Thermal Shutdown
Thermal shutdown
TJ
160
Hysteresis
4
Submit Documentation Feedback
10
°C
Copyright © 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): TPS2590
TPS2590
SLUS960D – JULY 2009 – REVISED OCTOBER 2011
www.ti.com
DEVICE INFORMATION
TPS2590 Functional Block Diagram
IN
IOUT
1
2
3
4
V(DS) Detector
+
S
10 uA
Q
Pump
Constant
Power
Engine
14
GND 13
5
R
R
R
FT
LCA
+
+
1.0V
+
I(D)
Detector
-
1.6 x ILIM
ILIM 7
12
11 OUT
10
15 FAULT\
+
+
IOUT
______
200k
8
PWRG\
+
IFLT
CT
Charge
THERMAL
SHUTDOWN
34 uA
CT
1.35 V
9
S
Q
R
Q
FLT
+
FLT
1.25 uA
33 uA
+
3V
200 mV
100 k
3V
1.5V
+
RTRY\ 6
PWRG\
VIN
EN\ 16
Internal Rail
+
2.7 / 2.6
Figure 2.
Submit Documentation Feedback
Copyright © 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): TPS2590
5
TPS2590
SLUS960D – JULY 2009 – REVISED OCTOBER 2011
www.ti.com
VIN
1
VIN
2
EN
FLT
GND
GND
TPS2590 PINOUT
16
15
14
13
12 VOUT
11 VOUT
TPS2590
4
9
5
6
7
8
IFLT
VIN
ILIM
10 VOUT
RTRY
3
GND
VIN
CT
TERMINAL FUNCTIONS
FUNCTION
TPS2590
DESCRIPTION
EN
16
Device is enabled when this pin is pulled low.
IN
1-4
Power In and control supply voltage.
RTRY
6
If low, the TPS2590 will attempt to restart after an overcurrent fault. If floating (high) the device will
latch off after an overcurrent fault and will not attempt to restart until EN or Vin is cycled off and on.
ILIM
7
A resistor to ground sets the current limit level.
IFLT
8
A resistor to ground sets the fault current level.
CT
9
A capacitor to ground sets the fault time.
GND
5, 13, 14
GND
OUT
10, 11, 12
Output to the load.
FLT
15
Fault low indicated the fault time has expired and the FET is switched off.
PIN DESCRIPTION
CT: Connect a capacitor form CT to GND to set the fault time. The fault timer starts when the fault current
threshold is exceeded, charging the capacitor with 36 μA from GND towards an upper threshold of 1.4 V. If the
capacitor reaches the upper threshold, the internal pass MOSFET is turned off. The MOSFET will stay off until
EN is cycled if a latching version is used. If an auto-retry version is used, the capacitor will discharge at 5 μA to
0.2 V and then re-enable the pass MOSFET. When the device is disabled, CT is pulled to GND through a
100-kΩ resistor.
The timer period must be chosen long enough to allow the external load capacitance to charge. The fault timer
period is selected using the following formula where TFAULT is the minimum timer period in seconds and CCT is in
Farads.
C CT =
TFAULT
38.9 ´ 10 3
(1)
This equation does not account for component tolerances. In autoretry versions, the second and subsequent
retry timer periods will be approximately 85 % as long as the first retry period.
In autoretry versions, the fault timer discharges the capacitor for a nominal tSD in seconds with CCT in Farads per
the following equation.
6
Submit Documentation Feedback
Copyright © 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): TPS2590
TPS2590
SLUS960D – JULY 2009 – REVISED OCTOBER 2011
www.ti.com
tSD = 1.0 ´ 106 ´ CCT
(2)
The nominal ratio of on-to-off times represents about a 3% duty cycle when a hard fault is present on the output
of an autoretry version part.
FLT: Open-drain output that pulls low on any condition that causes the output to open. These conditions are
either an overload with a fault time-out, or a thermal shutdown. FLT becomes operational before UV, when VIN is
greater than 1 V. IFLT may not be set below 1 A to maintain the Fault Current Limit threshold accuracy listed in
Electrical Characteristics. Some parts may not current limit or fault as expected.
GND: This is the most negative voltage in the circuit and is used as reference for all voltage measurements
unless otherwise specified.
IFLT: A resistor connected from this pin to ground sets the fault current threshold (IFAULT). Currents between the
fault current threshold and the current limit are permitted to flow unimpeded for the period set by the fault timer
programmed on CT. This permits loads to draw momentary surges while maintaining the protection provided by a
lower average-current limit.
The fault timer implemented by CT starts charging CT when current through VIN exceeds IFAULT. If the current
doesn’t drop below the IFAULT level before VCT reaches its upper threshold, the output will be shut off. The fault
current resistor is set by the following formula where IFAULT is in Amperes and RRFLT is in Ohms.
RRFLT =
200kW
IFAULT
(3)
ILIM: A resistor connected from this pin to ground sets ILIM. The TPS2590 will limit current to ILIM. If the current
doesn’t drop below the IFAULT level before the timer times out then the output will be shut off. RLIM is set by the
formula:
RLIM =
201kW
ILIM
(4)
ILIM must be set sufficiently larger than IFAULT to ensure that lLIM could never be less than IFAULT, even after taking
tolerances into account.
EN: When this pin is pulled low, the IC is enabled. The input threshold is hysteretic, allowing the user to program
a startup delay with an external RC circuit. EN is pulled to VIN by a 10-MΩ resistor, pulled to GND by 16.8 MΩ
and is clamped to ground by a 7-V Zener diode. Because high impedance pullup/down resistors are used to
reduce current draw, any external FET controlling this pin should be low leakage.
IN: Input voltage to the TPS2590. The recommended operating voltage range is 3 V to 18 V. All VIN pins should
be connected together and to the power source.
OUT: Output connection for the TPS2590. When switched on the output voltage will be approximately:
VOUT = VIN - 0.04 ´ IOUT
(5)
All OUT pins should be connected together and to the load.
RTRY: When pulled low the TPS2590 will attempt to restart after a fault. If left floating or pulled high the
TPS2590 will latch off after a fault. This pin is internally clamped at 3 V and is pulled to the internal 3-V supply by
a diode in series with a 100-kΩ resistor.
Submit Documentation Feedback
Copyright © 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): TPS2590
7
TPS2590
SLUS960D – JULY 2009 – REVISED OCTOBER 2011
www.ti.com
TYPICAL CHARACTERISTICS
CURRENT LIMIT
vs
JUNCTION TEMPERATURE
FAULT CURRENT
vs
JUNCTION TEMPERATURE
2.20
2.20
RMAX = 100 kW
2.15
IFAULT – Fault Current – A
2.10
IL IM – Current Limit – A
RFLT = 100 k
2.15
2.50
2.00
1.95
1.90
1.85
1.80
–50
0
50
100
150
2.10
2.50
2.00
1.95
1.90
1.85
TJ – Junction Temperature– °C
1.80
–50
TJ
50
100
– Junction
Temperature – °C
Figure 3.
Figure 4.
POWER LIMIT
vs
JUNCTION TEMPERATURE
SLEEP MODE SUPPLY CURRENT
(VCC = 12 V)
vs
JUNCTION TEMPERATURE
8.0
7.5
0
150
24
ILOAD = 1 A
Sleep Mode
7.0
ISUPPLY – Supply Current – mA
PLIMIT – Power Limit Level – W
22
6.5
6.0
5.5
5.0
4.5
4.0
20
18
16
14
12
3.5
3.0
–50
0
TJ
50
100
150
10
–50
– Junction Temperature – °C
Figure 5.
8
TJ
0
50
100
– Junction
Temperature – °C
150
Figure 6.
Submit Documentation Feedback
Copyright © 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): TPS2590
TPS2590
SLUS960D – JULY 2009 – REVISED OCTOBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
Figure 7. 12-V Startup into 15-Ω, 700-μF Load
Figure 8. 12-V Input Addded to an 8-Ω Load
Figure 9. Failed Startup into a 4-Ω Load
Figure 10. 12-V Soft Overload, 3-A to 4.2-A, Power Limit
Not Tripped
Figure 11. Firm Overload, 3-A to 5.4 A,
Power Limit Tripped
Figure 12. 12-V Hard Overload, 3.6-A Load then Short
Submit Documentation Feedback
Copyright © 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): TPS2590
9
TPS2590
SLUS960D – JULY 2009 – REVISED OCTOBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
10
Figure 13. Power Dissipation During 12-V Startup into a
60-Ω, 660-μF Load
Figure 14. Power Dissipation During 12-V Startup into a
15-Ω, 110-μF Load
Figure 15. Startup into a 1-Ω Load
Figure 16. Firm Overload, Load Stepped
From 3.8 A to 5.5 A
Submit Documentation Feedback
Copyright © 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): TPS2590
TPS2590
SLUS960D – JULY 2009 – REVISED OCTOBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
Figure 17. Hard Overload, Load Stepped
from 3.8 A to 7.1 A
Submit Documentation Feedback
Copyright © 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): TPS2590
11
TPS2590
SLUS960D – JULY 2009 – REVISED OCTOBER 2011
www.ti.com
APPLICATION INFORMATION
Maximum Load at Startup
The power limiting function of the TPS2590 provides very effective protection for the internal FET. Expectedly,
there is a supply voltage dependent maximum load which the device will be able to power up. Loads above this
level may cause the device to shut off current before startup is complete. Neglecting any load capacitance, the
maximum load ( minimum load resistance ) is calculated using the equation;
V 2
RMIN = IN
12
(6)
Adding load capacitance may reduce the maximum load which can be present at start up.
If EN is tied to GND at startup and IN does not ramp quickly the TPS2590 may momentarily turn off then on
during startup. This can happen if a capacitive load momentarily pulls down the input voltage below the UV
threshold. If necessary, this can be avoided by delaying EN assertion until VIN is fully up.
Transient Protection
The need for transient protection in conjunction with hot-swap controllers should always be considered. When
the TPS2590 interrupts current flow, input inductance generates a positive voltage spike on the input and output
inductance generates a negative voltage spike on the output. Such transients can easily exceed twice the supply
voltage if steps are not taken to address the issue. Typical methods for addressing transients include;
• Minimizing lead length/inductance into and out of the device.
• Transient Voltage Suppressors (TVS) on the input to absorb inductive spikes.
• Shottky diode across the output to absorb negative spikes.
• A combination of ceramic and electrolytic capacitors on the input and output to absorb energy.
The following equation estimates the magnitude of these voltage spikes:
Where;
VSPIKE(absolute ) = VNOM + ILOAD ´ L
•
•
•
•
C
(7)
VNOM equals the nominal supply voltage.
ILOAD equals the load current.
C equals the capacitance present at the input or output of the TPS2590.
L equals the effective inductance seen looking into the source or the load.
The inductance due to a straight length of wire equals approximately.
Where;
æ 4´L
ö
- 0.75 ÷ (nH)
Lstraightwire » 0.2 ´ L ´ ln ç
è D
ø
•
•
(8)
L equals the length of the wire.
D equals wire diameter.
Some applications may require the addition of a TVS to prevent transients from exceeding the absolute ratings if
sufficient capacitance cannot be included.
12
Submit Documentation Feedback
Copyright © 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): TPS2590
TPS2590
SLUS960D – JULY 2009 – REVISED OCTOBER 2011
www.ti.com
REVISION HISTORY
Changes from Original (July 2009) to Revision A
•
Page
Changed , fixed typo in Application ...................................................................................................................................... 1
Changes from Revision A (July 2010) to Revision B
Page
•
Added UL Listed - File Number E169910 ............................................................................................................................. 1
•
Changed , updated application diagram ............................................................................................................................... 1
Changes from Revision B (August 2010) to Revision C
Page
•
Added updated IFLT description ........................................................................................................................................... 7
•
Changed Current Limit vs Junction Temperature graph ....................................................................................................... 8
Changes from Revision C (September 2011) to Revision D
Page
•
Changed Figure 7 through Figure 17. .................................................................................................................................. 8
•
Changed Figure 7 through Figure 17. .................................................................................................................................. 9
•
Changed Figure 7 through Figure 17. ................................................................................................................................ 10
•
Changed Figure 7 through Figure 17. ................................................................................................................................ 11
Submit Documentation Feedback
Copyright © 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): TPS2590
13
PACKAGE OPTION ADDENDUM
www.ti.com
20-Oct-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
TPS2590RSAR
ACTIVE
QFN
RSA
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
TPS2590RSAT
ACTIVE
QFN
RSA
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPS2590RSAR
QFN
RSA
16
3000
330.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
TPS2590RSAT
QFN
RSA
16
250
180.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS2590RSAR
QFN
RSA
16
3000
367.0
367.0
35.0
TPS2590RSAT
QFN
RSA
16
250
210.0
185.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated