UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com 8-Pin Quasi-Resonant Flyback Green-Mode Controller Check for Samples: UCC28600 FEATURES APPLICATIONS • • 1 2 • • • • • • • • • Green-Mode Controller With Advanced Energy Saving Features Quasi-Resonant Mode Operation for Reduced EMI and Low Switching Losses (Low Voltage Switching) Low Standby Current for System No-Load Power Consumption Low Startup Current: 25 μA Maximum Programmable Overvoltage Protection, Line and Load Internal Overtemperature Protection Current Limit Protection – Cycle-by-Cycle Power Limit – Primary-Side Overcurrent Hiccup Restart Mode 1-A Sink TrueDrive™, -0.75-A Source Gate Drive Output Programmable Soft-Start Green-Mode Status Pin (PFC Disable Function) . . Bias Supplies for LCD-Monitors, LCD-TV, PDP-TV, and Set Top Boxes AC/DC Adapters and Offline Battery Chargers Energy Efficient Power Supplies up to 200 W • • DESCRIPTION The UCC28600 is a PWM controller with advanced energy features to meet stringent world-wide energy efficiency requirements. UCC28600 integrates built-in advanced energy saving features with high level protection features to provide cost effective solutions for energy efficient power supplies. UCC28600 incorporates frequency fold back and green mode operation to reduce the operation frequency at light load and no load operations. UCC28600 is offered in the 8-pin SOIC (D) package. Operating junction temperature range is -40°C to 105°C. TYPICAL APPLICATION Primary CBULK RSU NP Secondary NS NB CB 18 V ROVP1 UCC28600 CSS 1 SS STATUS 8 CVDD UCC28051 1 VO_SNS VCC 8 2 FB OVP 7 2 COMP DRV 7 3 CS VDD 6 3 MULTIN GND 6 4 GND OUT 5 4 CS ZCD 5 ROVP2 Feedback CBP M1 RPL RCS TL431 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. TrueDrive is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2011, Texas Instruments Incorporated UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com DESCRIPTION (CONT.) The Design Calculator, (Texas Instruments Literature number SLVC104), located in the Tools and Software section of the UCC28600 product folder, provides a user-interactive iterative process for selecting recommended component values for an optimal design. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted (1) UCC28600 IDD < 20 mA VDD Supply voltage range IDD Supply current IOUT(sink) Output sink current (peak) 1.2 IOUT(source) Output source current (peak) -0.8 Analog inputs FB, CS, SS V 20 mA A -0.3 to 6.0 VOVP V -1.0 to 6.0 IOVP(source) -1.0 VSTATUS Power dissipation mA VDD = 0 V to 30 V 30 V SOIC-8 package, TA = 25°C 650 mW TJ Operating junction temperature range –55 to 150 Tstg Storage temperature –65 to 150 TLEAD Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds (1) UNIT 32 °C 300 Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to GND. Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the databook for thermal limitations and considerations of packages. RECOMMENDED OPERATING CONDITIONS MIN VDD Input voltage IOUT Output sink current TJ Operating junction temperature NOM MAX UNIT 21 V 105 °C 0 A -40 ELECTROSTATIC DISCHARGE (ESD) PROTECTION MIN MAX Human body model 2000 CDM 1500 2 UNIT V Copyright © 2005–2011, Texas Instruments Incorporated UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com ELECTRICAL CHARACTERISTICS VDD = 15 V, 0.1-μF capacitor from VDD to GND, 3.3-nF capacitor from SS to GND charged over 3.5 V, 500-Ω resistor from OVP to -0.1 V, FB = 4.8 V, STATUS = not connected, 1-nF capacitor from OUT to GND, CS = GND, TA = -40°C to 105°C, (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX 12 25 UNIT Overall ISTARTUP Startup current VDD = VUVLO -0.3 V ISTANDBY Standby current VFB = 0 V 350 550 IDD Operating current Not switching 2.5 3.5 130 kHz, QR mode 5.0 7.0 21 26 32 VDD clamp FB = GND, IDD = 10 mA μA mA V Undervoltage Lockout VDD(uvlo) ΔVDD(uvlo) Startup threshold 10.3 13.0 15.3 Stop threshold 6.3 8 9.3 Hysteresis 4.0 5.0 6.0 V PWM (Ramp) (1) DMIN Minimum duty cycle VSS = GND, VFB = 2 V DMAX Maximum duty cycle QR mode, fS = max, (open loop) 0% 99% Oscillator (OSC) fQR(max) Maximum QR and DCM frequency 117 130 143 fQR(min) Minimum QR and FFM frequency fSS Soft start frequency VFB = 1.3 V 32 40 48 VSS = 2.0 V 32 40 48 dTS/dFB VCO gain TS for 1.6 V < VFB < 1.8 V -38 -30 -22 μs/V kΩ kHz Feedback (FB) RFB Feedback pullup resistor VFB FB, no load QR mode 12 20 28 3.30 4.87 6.00 Green-mode ON threshold VFB threshold 0.3 0.5 0.7 Green-mode OFF threshold VFB threshold 1.2 1.4 1.6 Green-mode hysteresis VFB threshold 0.7 0.9 1.1 FB threshold burst-ON VFB during green mode 0.3 0.5 0.7 FB threshold burst-OFF VFB during green mode 0.5 0.7 0.9 Burst Hysteresis VFB during green mode 0.13 0.25 0.42 RDS(on) STATUS on resistance VSTATUS = 1 V 1.0 2.4 3.8 kΩ ISTATUS(leakage) STATUS leakage/off current VFB = 0.44 V, VSTATUS = 15 V 2.0 μA V Status (1) -0.1 RSCT and CCST are not connected in the circuit for maximum and minimum duty cycle tests, current sense tests and power limit tests. Copyright © 2005–2011, Texas Instruments Incorporated 3 UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com ELECTRICAL CHARACTERISTICS (continued) VDD = 15 V, 0.1-μF capacitor from VDD to GND, 3.3-nF capacitor from SS to GND charged over 3.5 V, 500-Ω resistor from OVP to -0.1 V, FB = 4.8 V, STATUS = not connected, 1-nF capacitor from OUT to GND, CS = GND, TA = -40°C to 105°C, (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Current Sense (CS) (2) Gain, FB = ΔVFB / ΔVCS QR mode Shutdown threshold VFB = 2.4 V, VSS = 0 V 1.13 1.25 1.38 CS to output delay time (power limit) CS = 1.0 VPULSE 100 175 300 CS to output delay time (over current fault) CS = 1.45 VPULSE 50 100 150 CS discharge impedance CS = 0.1 V, VSS = 0 V 25 115 250 Ω CS offset SS mode, VSS ≤ 2.0 V, via FB 0.35 0.40 0.45 V CS current OVP = -300 μA -165 -150 -135 μA CS working range QR mode, peak CS voltage 0.70 0.81 0.92 PL threshold Peak CS voltage + CS offset 1.05 1.20 1.37 ISS(chg) Softstart charge current VSS = GND -8.3 -6.0 -4.5 μA ISS(dis) Softstart discharge current VSS = 0.5 V 2.0 5.0 10 mA VSS Switching ON threshold Output switching start 0.8 1.0 1.2 V -450 -370 μA -25 mV V ACS(FB) VCS(os) 2.5 V/V V ns Power Limit (PL) (2) IPL(cs) VPL V Soft Start (SS) Overvoltage Protection (OVP) IOVP(line) Line overvoltage protection IOVP threshold, OUT = HI -512 VOVP(on) OVP voltage at OUT = HIGH VFB = 4.8 V, VSS = 5.0 V, IOVP(on), = -300 μA -125 VOVP(load) Load overvoltage protection VOVP threshold, OUT = LO 3.37 3.75 4.13 130 140 150 Thermal Protection (TSP) Thermal shutdown (TSP) temperature (3) Thermal shutdown hysteresis 15 °C OUT tRISE Rise time tFALL Fall time (2) (3) 4 10% to 90% of 13 V typical out clamp 50 75 10 20 ns RSCT and CCST are not connected in the circuit for maximum and minimum duty cycle tests, current sense tests and power limit tests. Ensured by design. Not production tested. Copyright © 2005–2011, Texas Instruments Incorporated UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com OPEN LOOP TEST CIRCUIT RCST + 5V 37.4 kΩ See Note CCST 560 pF See Note VFB UCC28600 1 SS STATUS 8 STATUS CSS 3.3 nF ROVP 500 Ω 2 FB OVP 7 3 CS VDD 6 4 GND OUT 5 IOVP CFB 47 pF VCS ICS IDD ROUT 10 Ω GND CDD 100 nF CBIAS 1 µF VOVP VDD VOUT COUT 1.0 nF NOTE RCST and CCST are not connected for maximum and minimum duty cycle tests, current sense tests and power limit tests. BLOCK DIAGRAM/TYPICAL APPLICATION RSU CBULK RVDD CVDD ROVP1 OVP VDD ROVP2 6 7 UCC28600 REF + UVLO 5.0 VREF 26 V 13/8 V On-Chip Thermal Shutdown STATUS Fault Logic 8 REF_OK UVLO OVR_T STATUS LOAD_OVP LINE_OVP SS_DIS VDD CS CS SS_OVR SS QR DETECT ____ LOAD_OVP OUT LINE_OVP BURST RUN BURST QR_DONE OSCILLATOR 1 CSS SS_OVR RUN QR_DONE OSC_CL CLK REF D SET + CLR GREEN MODE Q 5 OUT Q OSC_CL FB FB_CLAMP PL 1.2 V REF CS GAIN = 1/2.5 Feedback Modulation Comparison 20 kW FB 2 3 RPL RCS + R 4 GND + 1.5R 400 mV Copyright © 2005–2011, Texas Instruments Incorporated 5 UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com ORDERING INFORMATION TA PACKAGES -40°C to 105°C (1) SOIC (D) (1) PART NUMBER UCC28600D SOIC (D) package is available taped and reeled by adding “R” to the above part numbers. Reeled quantities for UCC28600DR is 2,500 devices per reel. DEVICE INFORMATION UCC28600 D PACKAGE (TOP VIEW) SS FB CS GND 1 8 2 7 3 6 4 5 STATUS OVP VDD OUT TERMINAL FUNCTIONS TERMINAL NAME CS NO. 3 I/O DESCRIPTION I Current sense input. Also programs power limit, and used to control modulation and activate overcurrent protection. The CS voltage input originates across a current sense resistor and ground. Power limit is programmed with an effective series resistance between this pin and the current sense resistor. FB 2 I Feedback input or control input from the optocoupler to the PWM comparator used to control the peak current in the power MOSFET. An internal 20-kΩ resistor is between this pin and the internal 5-V regulated voltage. Connect the collector of the photo-transistor of the feedback optocoupler directly to this pin; connect the emitter of the photo-transistor to GND. The voltage of this pin controls the mode of operation in one of the three modes: quasi resonant (QR), frequency foldback mode (FFM) and green mode (GM). GND 4 - Ground for internal circuitry. Connect a ceramic 0.1-μF bypass capacitor between VDD and GND, with the capacitor as close to these two pins as possible. OUT 5 O 1-A sink (TrueDrive™ ) and 0.75-A source gate drive output. This output drives the power MOSFET and switches between GND and the lower of VDD or the 13-V internal output clamp. OVP 7 I Over voltage protection (OVP) input senses line-OVP, load-OVP and the resonant trough for QR turn-on. Detect line, load and resonant conditions using the primary bias winding of the transformer, adjust sensitivity with resistors connected to this pin. SS 1 I Soft-start programming pin. Program the soft-start rate with a capacitor to ground; the rate is determined by the capacitance and the internal soft-start charge current. Placement of the soft-start capacitor is critical and should be placed as close as possible to the SS pin and GND, keeping trace length to a minimum. All faults discharge the SS pin to GND through an internal MOSFET with an RDS(on) of approximately 100 Ω. The internal modulator comparator reacts to the lowest of the SS voltage, the internal FB voltage and the peak current limit. STATUS 8 O ACTIVE HIGH open drain signal that indicates the device has entered standby mode. This pin can be used to disable the PFC control circuit (high impedance = green mode). STATUS pin is high during UVLO, (VDD < startup threshold), and softstart, (SS < FB). VDD 6 I Provides power to the device. Use a ceramic 0.1-μF by-pass capacitor for high-frequency filtering of the VDD pin, as described in the GND pin description. Operating energy is usually delivered from auxiliary winding. To prevent hiccup operation during start-up, a larger energy storage cap is also needed between VDD and GND. 6 Copyright © 2005–2011, Texas Instruments Incorporated UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com TERMINAL COMPONENTS TERMINAL NAME NO. I/O DESCRIPTION (1) R CS + (2) (3) ǒVPL * VCS(os)ǓǒI CS(2) * I CS(1)Ǔ I CS(2)I P(1) * I CS(1)I P(2) (1) CS 3 I R PL + ǒVPL * VCS(os)ǓǒI P(2) * I P(1)Ǔ I CS(1)I P(2) * I CS(2)I P(1) where: • IP1 is the peak primary current at low line, full load (3) • IP2 is the peak primary current at high line, full load (3) • ICS1 is the power limit current that is sourced at the CS pin at low-line voltage (3) • ICS2 is the power limit current that is sourced at the CS pin at high-line voltage (3) • VPL is the Power Limit (PL) threshold (2) • VCS(os) is the CS offset voltage (2) FB 2 I Opto-isolator collector GND 4 - Bypass capacitor to VDD, CBP = 0.1 μF OUT 5 O Power MOSFET gate R OVP1 + OVP (1) (2) (3) 7 I 1 I OVP(line) ǒ Ǔ NB V N P BULK(ov) ȣ ȡ VOVP(load) ȧ R OVP2 + ROVP1ȧ ȧ ȧNB ǒ Ǔ VOUT(shutdown) ) V F * V OVP(load) Ȥ ȢNS where: • IOVP(line) is OVPline current threshold (2) • VBULK(ov) is the allowed input over- voltage level (3) • VOVP(load) is OVPload (2) • VOUT(shutdown) is the allowed output over-voltage level (3) • VF is the forward voltage of the secondary rectifier • NB is the number of turns on the bias winding (3) • NS is the number of turns on the secondary windings (3) • NP is the number of turns on the primary windings (3) Refer to Figure 1 for all reference designators in the Terminal Components Table. Refer to the Electrical Characteristics Table for constant parameters. Refer to the UCC28600 Design Calculator (TI Literature Number SLVC104) or laboratory measurements for currents, voltages and times in the operational circuit. Copyright © 2005–2011, Texas Instruments Incorporated 7 UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com TERMINAL COMPONENTS (continued) TERMINAL NAME NO. I/O DESCRIPTION (1) (2) (3) t SS(min)(due power limit) C SS u I SS ACS(FB) ǒVPL * V CS(os)Ǔ where tSS(min) is the greater of: 2 ȱ* R ȡ ǒ VOUT * DVOUT(step)Ǔ ȣȳ C LOAD(ss) OUT t SS(min) +ȧ ȏnȧ1 * 2 RLOAD(ss)P OUT(max)limitȧȧ Ȥȴ Ȣ Ȳ SS 1 I or 2 COUTV OUT ȳ ȱ t SS(min) +ȧ Ȳ 2 PLIM ȧ ȴ • • • • • • • R ST2 + VBE(off) I STATUS(leakage) RST2 R ST1 + STATUS 8 O (2) RLOAD(ss) is the effective load impedance during soft-start (4) ΔVOUT(step) is the allowed change in VOUT due to a load step (4) POUT(max limit) Programmed power limit level, in W (4) ACS(FB) is the current sense gain (5) VCS(os) is the CS offset voltage (5) ISS is the soft-start charging current (5) VPL is the power limit threshold (5) ƪ VDD(uvlo*on) * VBE(sat) * R DS(on) ǒǒ Ǔ I CC b sat ǒ Ǔƫ I CC b sat * RDS(on)V BE(sat) Ǔ RST2 ) VBE(sat) where: • βSAT is the gain of transistor QST in saturation • VBE(sat) is the base-emitter voltage of transistor QST in saturation • VDD(uvlo-on) is the startup threshold (5) • ICC is the collector current of QST • ISTATUS(leakage) is the maximum leakage/off current of the STATUS pin (5) • VBE(off) is the maximum allowable voltage across the base emitter junction that will not turn QST on • RDS(on) is the RDS(on) of STATUS (5) (4) (5) 8 Refer to the UCC28600 Design Calculator (TI Literature Number SLVC104) or laboratory measurements for currents, voltages and times in the operational circuit. Refer to the Electrical Characteristics Table for constant parameters. Copyright © 2005–2011, Texas Instruments Incorporated UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com TERMINAL COMPONENTS (continued) TERMINAL NAME NO. I/O DESCRIPTION (1) (2) (3) CVDD is the greater of: C VDD + Ǔ DVTBURST ƫ t SS Ǔ DVDD ƫ ƪǒ I DD ) CISSV OUT(hi)f QR(max) ƪǒ I DD ) CISSV OUT(hi)f QR(max) DD(burst) or C VDD + (uvlo) (3) ȡǒVDS1(os) f QR(max) ǸLLEAKAGEǒCD ) CSNUBǓȣ NB p ǒ Ǔ ǒ Ǔ R VDD + ȧ 4 NP ȧ I DD ) CISS V OUT(hi) f QR(max) Ȥ Ȣ VDD 6 I R SU + VBULK(min) I STARTUP where: • IDD is the operating current of the UCC28600 (6) • CISS is the input capacitance of MOSFET M1 • VOUT(hi) is VOH of the OUT pin, either 13 V (typ) VOUT clamp or less as measured • fQR(max) is fS at high line, maximum load (6) • TBURST is the measured burst mode period • ΔVDD(burst) is the allowed VDD ripple during burst mode • ΔVDD(uvlo) is the UVLO hysteresis (6) • VDS1(os) is the amount of drain-source overshoot voltage • LLEAKAGE is the leakage inductance of the primary winding • CD is the total drain node capacitance of MOSFET M1 • ISTARTUP is IDD start-up current of the UCC28600 (6) • CSNUB is the snubber capacitor value • tSS is the soft start charge time (7) (6) (7) Refer to the Electrical Characteristics Table for constant parameters. Refer to the UCC28600 Design Calculator (TI Literature Number SLVC104) or laboratory measurements for currents, voltages and times in the operational circuit. Copyright © 2005–2011, Texas Instruments Incorporated 9 UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com PFC OUTPUT or BRIDGE RECTIFIER PRIMARY + CBULK RSU RSNUB CSNUB N1 VBULK SECONDARY + N2 COUT - D2 RVDD CVDD PFC CONTROLLER BIAS (if used) QST VOUT ROUT - D1 NB CBIAS ROVP1 RST2 ICC RST1 UCC28600 1 SS STATUS 8 2 FB OVP 7 3 CS VDD 6 4 GND OUT 5 CSS FEEDBACK ROVP2 M1 TL431 CBP 100nF RPL RCS Figure 1. Pin Termination Schematic 10 Copyright © 2005–2011, Texas Instruments Incorporated UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com APPLICATION INFORMATION Functional Description The UCC28600 is a multi-mode controller, as illustrated in Figure 3 and Figure 4. The mode of operation depends upon line and load conditions. Under all modes of operation, the UCC28600 terminates the OUT = HI signal based on the switch current. Thus, the UCC28600 always operates in current mode control so that the power MOSFET current is always limited. Under normal operating conditions, the FB pin commands the operating mode of the UCC28600 at the voltage thresholds shown in Figure 2. Soft-start and fault responses are the exception. Soft-start mode hard-switch controls the converter at 40 kHz. The soft-start mode is latched-OFF when VFB becomes less than VSS for the first time after UVLOON. The soft-start state cannot be recovered until after passing UVLOOFF, and then, UVLOON. At normal rated operating loads (from 100% to approximately 30% full rated power) the UCC28600 controls the converter in quasi-resonant mode (QRM) or discontinuous conduction mode (DCM), where DCM operation is at the clamped maximum switching frequency (130 kHz). For loads that are between approximately 30% and 10% full rated power, the converter operates in frequency foldback mode (FFM), where the peak switch current is constant and the output voltage is regulated by modulating the switching frequency for a given and fixed VIN. Effectively, operation in FFM results in the application of constant volt-seconds to the flyback transformer each switching cycle. Voltage regulation in FFM is achieved by varying the switching frequency in the range from 130 kHz to 40 kHz. For extremely light loads (below approximately 10% full rated power), the converter is controlled using bursts of 40-kHz pulses. Keep in mind that the aforementioned boundaries of steady-state operation are approximate because they are subject to converter design parameters. InternalReference V FB Control Range Limit 40kHz < f S < 130kHz Green Mode-OFF, GreenMode-ON, Burst-OFF Burst-ON Refer to the typical applications block diagram for the electrical connections to implement the features. FFM GreenMode QR Mode or DCM Mode GreenMode Hysteresis Burst Hysteresis V FB 0V 0.5V 0.7V 1.4V 2.0V 4.0V 5.0V Figure 2. Mode Control with FB Pin Voltage Copyright © 2005–2011, Texas Instruments Incorporated 11 UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com START N RUN = Logic Low STATUS = Hi Z N VDD > 13V? Y Continuous Fault Monitor VDD < 8V? REF < 4V? OVP = Logic High? OT = Logic High? OC = Logic High Y RUN = Logic High STATUS = Hi Z Soft Start RUN = Logic Low Monitor V FB V FB < 1.4V 1.4V < V FB < 2.0V V FB > 2.0V Fixed V/s 40kHz STATUS = 0V (In Run-Mode) STATUS = 0V (In Run-Mode) V FB < 0.5V Fixed V/s Freq. Foldback (Light Load) Quasi-Resonant Mode or DCM (Normal Load) N Y Zero Pulses STATUS = Hi Z (In Green-Mode) STATUS = 0V (In Run-Mode) Fixed V-sec 40kHz Burst N Y Y V FB > 1.5V? N V FB > 1.2V? Figure 3. Control Flow Chart 12 Copyright © 2005–2011, Texas Instruments Incorporated UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com SS Mode (Fixed fSW ) QR Mode (Valley Switching, VS) Switching Frequency fsw DCM (maximum fs) (VS) FFM, (VS) fMAX = Oscillator Frequency (130 kHz) Green Mode This mode applies bursts of 40kHz soft−start pulses to the power MOSFET gate. The average fsw is shown in this operating mode. fGRMODE_MX (40 kHz) fSS (40 kHz) fQR_MIN Internally Limited to 40 kHz t VFB Feedback Voltage Hysteretic Transition into Green Mode Burst Hysteresis Power Supply Output Voltage t VOUT Status, pulled up to VDD t VSTATUS Green Mode, PFC bias OFF Peak MOSFET Current t Load shown is slightly less than overcurrent threshold Load Power IC Off Softstart Regular Operation POUT Fixed Frequency Frequency Foldback Green Mode t POUT, (max) t Figure 4. Operation Mode Switching Frequencies Copyright © 2005–2011, Texas Instruments Incorporated 13 UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com Details of the functional boxes in the Block Diagram/Typical Application drawing are shown in Figure 5, Figure 6, Figure 7 and Figure 8. These figures conceptualize how the UCC28600 executes the command of the FB voltage to have the responses that are shown in Figure 2, Figure 3 and Figure 4. The details of the functional boxes also conceptualize the various fault detections and responses that are included in the UCC28600. During all modes of operation, this controller operates in current mode control. This allows the UCC28600 to monitor the FB voltage to determine and respond to the varying load levels such as heavy, light or ultra-light. Quasi-resonant mode and DCM occurs for feedback voltages VFB between 2.0 V and 4.0 V, respectively. In turn, the CS voltage is commanded to be between 0.4 V and 0.8 V. A cycle-by-cycle power limit imposes a fixed 0.8-V limit on the CS voltage. An overcurrent shutdown threshold in the fault logic gives added protection against high-current, slew-rate shorted winding faults, shown in Figure 8. The power limit feature in the QR DETECT circuit of Figure 7 adds an offset to the CS signal that is proportional to the line voltage. The power limit feature is programmed with RPL, as shown in the typical applications diagram. REF Oscillator + OSC Peak Comparator 4.0V SS_OVR S Q R Q QR_DONE + OSC_CL 0.1V CLK 130 kHz OSC Clamp Comparator + OSC Valley Comparator RUN Figure 5. Oscillator Details Mode Clamps 1.4 V OSC_CL + 450 kΩ + 100 kΩ FB 2.0 V 450 kΩ 100 kΩ + FB_CL Figure 6. Mode Clamp Details 14 Copyright © 2005–2011, Texas Instruments Incorporated UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com CIN RSU NP CVDD Auxiliary Winding ROVP1 NS COUT NB ROVP2 VDD OVP 7 UCC28600 QR Detect 0.1 V + Slope RCS + QR_DONE (Oscillator) -0.1 V OUT (From Driver) 0.1 V + + + REF (5 V) ILINE REF (5 V) Power Limit Offset 3.75 V RPL1 ILINE ILINE 2 Burst (from FAULT logic) 1 LOAD_OVP (Fault Logic) + 1 kW LINE_OVP (Fault Logic) 0.45 V 0 CS CS 3 RPL2 Figure 7. QR Detect Details Copyright © 2005–2011, Texas Instruments Incorporated 15 UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com UCC28600 Fault Logic REF UVLO REF_OK SET D Q Thermal Shutdown Q CLR OVR_T RUN LINE_OVP REF (5 V) (QR Detect) SS/DIS LOAD_OVP (QR Detect) Over−Current 20 kΩ Shutdown + 0.5 V/0.7 V FB 1.25 V + Burst S Q R Q Power−Up Reset BURST 8 STATUS 7 0.5 V/1.4 V FB + SS_OVR CS 3 CS Figure 8. Fault Logic Details Quasi-Resonant / DCM Control Quasi-resonant (QR) and DCM operation occur for feedback voltages VFB between 2.0 V and 4.0 V. In turn, the peak CS voltage is commanded to be between 0.4 V and 0.8 V. During this control mode, the rising edge of OUT always occurs at the valley of the resonant ring after demagnetization. Resonant valley switching is an integral part of QR operation. Resonant valley switching is also imposed if the system operates at the maximum switching frequency clamp. In other words, the frequency varies in DCM operation in order to have the switching event occur on the first resonant valley that occurs after a 7.7-μs (130-kHz) interval. Notice that the CS pin has an internal dependent current source, 1/2 ILINE. This current source is part of the cycle-by-cycle power limit function that is discussed in the Protection Features section. Frequency Foldback Mode Control Frequency foldback mode uses elements of the FAULT LOGIC, shown in Figure 8 and the mode clamp circuit, shown in Figure 6. At the minimum operating frequency, the internal oscillator sawtooth waveform has a peak of 4.0 V and a valley of 0.1 V. When the FB voltage is between 2.0 V and 1.4 V, the FB_CL signal in Figure 6 commands the oscillator in a voltage controlled oscillator (VCO) mode by clamping the peak oscillator voltage. The additional clamps in the OSCILLATOR restrict VCO operation between 40 kHz and 130 kHz. The FB_CL voltage is reflected to the modulator comparator effectively clamping the reflected CS command to 0.4 V. Green-Mode Control Green mode uses element of the fault logic, shown in Figure 8 and the mode clamps circuit, shown in Figure 6. The OSC_CL signal clamps the Green-mode operating frequency at 40 kHz. Thus, when the FB voltage is between 1.4 V and 0.5 V, the controller is commanding an excess of energy to be transferred to the load which in turn, drives the error higher and FB lower. When FB reaches 0.5 V, OUT pulses are terminated and do not resume until FB reaches 0.7 V. In this mode, the converter operates in hysteretic control with the OUT pulse terminated at a fixed CS voltage level of 0.4 V. The power limit offset is turned OFF during Green mode and it returns to ON when FB is above 1.4 V, as depicted in Figure 8. Green mode reduces the average switching frequency in order to minimize switching losses and increase the efficiency at light load conditions. 16 Copyright © 2005–2011, Texas Instruments Incorporated UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com Fault Logic Advanced logic control coordinates the fault detections to provide proper power supply recovery. This provides the conditioning for the thermal protection. Line overvoltage protection (line OVP) and load OVP are implemented in this block. It prevents operation when the internal reference is below 4.5 V. If a fault is detected in the thermal shutdown, line OVP, load OVP, or REF, the UCC28600 undergoes a shutdown/retry cycle. Refer to the fault logic diagram in Figure 8 and the QR detect diagram in Figure 7 to program line OVP and load OVP. To program the load OVP, select the ROVP1 – ROVP2 divider ratio to be 3.75 V at the desired output shut-down voltage. To program line OVP, select the impedance of the ROVP1 – ROVP2 combination to draw 450 μA when the VOVP is 0.45 V during the ON-time of the power MOSFET at the highest allowable input voltage. Oscillator The oscillator, shown in Figure 5, is internally set and trimmed so it is clamped by the circuit in Figure 5 to a nominal 130-kHz maximum operating frequency. It also has a minimum frequency clamp of 40 kHz. If the FB voltage tries to drive operation to less than 40 kHz, the converter operates in green mode. Status The STATUS pin is an open drain output, as shown in Figure 8. The status output goes into the OFF-state when FB falls below 0.5 V and it returns to the ON-state (low impedance to GND) when FB rises above 1.4 V. This pin is used to control bias power for a PFC stage, as shown in Figure 9. Key elements for implementing this function include QST, RST1 and RST2, as shown in the figure. Resistors RST1 and RST2 are selected to saturate QST when it is desirable for the PFC to be operational. During green mode, the STATUS pin becomes a high impedance and RST1 causes QST to turn-OFF, thus saving bias power. If necessary, use a zener diode and a resistor (DZ1 and RCC) to maintain VCC in the safe operating range of the PFC controller. Note the DVDD - CVDD combination is in addition to the standard DBIAS - CBIAS components. This added stage is required to isolate the STATUS circuitry from the startup resistor, RSU, to ensure there is no conduction through STATUS when VDD is below the UVLO turn-on threshold. Primary CBULK NP RSU Secondary NS DBIAS To Zero Current Detection RVCC Q1 NB DVDD CBIAS RST2 RST1 10 V DZ1 UCC28600 UCC28051 VCC STATUS M2 8 Feedback 8 M1 2 CVDD FB VDD CVCC 0.1 mF 4 6 RCS GND TL431 GND 5 Figure 9. Using STATUS for PFC Shut-Down During Green Mode Copyright © 2005–2011, Texas Instruments Incorporated 17 UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com Operating Mode Programming Boundaries of the operating modes are programmed by the flyback transformer and the four components RPL, RCS, ROVP1 and ROVP2; shown in the Block Diagram/Application drawing. The transformer characteristics that predominantly affect the modes are the magnetizing inductance of the primary and the magnitude of the output voltage, reflected to the primary. To a lesser degree (yet significant), the boundaries are affected by the MOSFET output capacitance and transformer leakage inductance. The design procedure here is to select a magnetizing inductance and a reflected output voltage that operates at the DCM/CCM boundary at maximum load and maximum line. The actual inductance should be noticeably smaller to account for the ring between the magnetizing inductance and the total stray capacitance measured at the drain of the power MOSFET. This programs the QR/DCM boundary of operation. All other mode boundaries are preset with the thresholds in the oscillator and green-mode blocks. The four components RPL, RCS, ROVP1 and ROVP2 must be programmed as a set due to the interactions of the functions. The use of the UCC28600 design calculator, TI Literature Number SLVC104, is highly recommended in order to achieve the desired results with a careful balance between the transformer parameters and the programming resistors. Protection Features The UCC28600 has many protection features that are found only on larger, full featured controllers. Refer to the Block Diagram/Typical Application and Figures 1, 4, 5, 6 and 7 for detailed block descriptions that show how the features are integrated into the normal control functions. Overtemperature Overtemperature lockout typically occurs when the substrate temperature reaches 140°C. Retry is allowed if the substrate temperature reduces by the hysteresis value. Upon an overtemperature fault, CSS on softstart is discharged and STATUS is forced to a high impedance. 18 Copyright © 2005–2011, Texas Instruments Incorporated UCC28600 www.ti.com SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 Cycle-by-Cycle Power Limit The cycle terminates when the CS voltage plus the power limit offset exceeds 1.2 V. In order to have power limited over the full line voltage range of the QR Flyback converter, the CS pin voltage must have a component that is proportional to the primary current plus a component that is proportional to the line voltage due to predictable switching frequency variations due to line voltage. At power limit, the CS pin voltage plus the internal CS offset is compared against a constant 1.2-V reference in the PWM comparator. Thus during cycle-by-cycle power limit, the peak CS voltage is typically 0.8 V. The current that is sourced from the OVP pin (ILINE) is reflected to a dependent current source of ½ ILINE, that is connected to the CS pin. The power limit function can be programmed by a resistor, RPL, that is between the CS pin and the current sense resistor. The current, ILINE, is proportional to line voltage by the transformer turns ratio NB/NP and resistor ROVP1. Current ILINE is programmed to set the line over voltage protection. Resistor RPL results in the addition of a voltage to the current sense signal that is proportional to the line voltage. The proper amount of additional voltage has the effect of limiting the power on a cycle-by-cycle basis. Note that RCS, RPL, ROVP1 and ROVP2 must be adjusted as a set due to the functional interactions. Current Limit When the primary current exceeds maximum current level which is indicated by a voltage of 1.25 V at the CS pin, the device initiates a shutdown. Retry occurs after a UVLOOFF/UVLOON cycle. Over-Voltage Protection Line and load over voltage protection is programmed with the transformer turn ratios, ROVP1 and ROVP2. The OVP pin has a 0-V voltage source that can only source current; OVP cannot sink current. Line over voltage protection occurs when the OVP pin is clamped at 0 V. When the bias winding is negative, during OUT = HI or portions of the resonant ring, the 0-V voltage source clamps OVP to 0 V and the current that is sourced from the OVP pin is mirrored to the Line_OVP comparator and the QR detection circuit. The Line_OVP comparator initiates a shutdown-retry sequence if OVP sources any more than 450 μA. Load-over voltage protection occurs when the OVP pin voltage is positive. When the bias winding is positive, during demagnetization or portions of the resonant ring, the OVP pin voltage is positive. If the OVP voltage is greater than 3.75 V, the device initiates a shutdown. Retry occurs after a UVLOOFF/UVLOON cycle. Undervoltage Lockout Protection is provided to guard against operation during unfavorable bias conditions. Undervoltage lockout (UVLO) always monitors VDD to prevent operation below the UVLO threshold. Copyright © 2005–2011, Texas Instruments Incorporated 19 UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com TYPICAL CHARACTERISTICS SWITCHING FREQUENCY vs TEMPERATURE 31 142 29 137 fS – Switching Frequency – kHz VDD – Clamp Voltage – V CLAMP VOLTAGE vs TEMPERATURE 27 25 23 21 –50 132 127 122 117 0 50 100 150 –50 0 TJ – Temperature – °C Figure 10. Figure 11. PL THRESHOLD vs TEMPERATURE OVER VOLTAGE PROTECTION THRESHOLD vs TEMPERATURE IOVP – Over Voltage Protection Threshold – µA PL Threshold, QR Mode, Peak CS Voltage – V 150 –372 0.90 0.85 0.80 0.75 0.70 –392 –412 –432 –452 –472 –492 –512 0 50 TJ – Temperature – °C Figure 12. 20 100 TJ – Temperature – °C 0.95 –50 50 100 150 –50 0 50 100 150 TJ – Temperature – °C Figure 13. Copyright © 2005–2011, Texas Instruments Incorporated UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com PRACTICAL DESIGN NOTES Non-Ideal Current Sense Value Resistors RCS, RPL, ROVP1 and ROVP2 must be programmed as a set due to functional interactions in the converter. Often, the ideal value for RCS is not available because the selection range of current sense resistors is too coarse to meet the required power limit tolerances. This issue can be solved by using the next larger available value of RCS and use a resistive divider with a Thevenin resistance that is equal to the ideal RPL value in order to attenuate the CS signal to its ideal value, as shown in Figure 14. The equations for modifying the circuit are: RCS R PL1 + RPL RDCS ǒ Ǔ (4) • • RDCS = ideal, but non-standard, value of current sense resistor. RPL = previously calculated value of the power limit resistor. R PL1 R PL2 + RCS *1 RDCS ǒ Ǔ • (5) RCS = available, standard value current sense resistor. The board should be laid out to include RPL2 in order to fascillitate final optimization of the design based upon readily available components. From power From power MOSFET MOSFET R PL To CS R PL1 To CS R (a) DCS R R PL2 CS (b) Figure 14. Modifications to Fit a Standard Current Sense Resistor Value Copyright © 2005–2011, Texas Instruments Incorporated 21 UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com Snubber Damping Resonance between the leakage inductance and the MOSFET drain capacitance can cause false load-OVP faults, in spite of the typical 2-μs delay in load-OVP detection. The bias winding is sensitive to the overshoot and ringing because it is well coupled to the primary winding. A technique to eliminate the problem is to use an R2CD snubber instead of an RCD snubber, shown in Figure 15. A damping resistor added to the RCD snubber reduces ringing between the drain capacitor and the inductance when the snubber diode commutates OFF. PRIMARY SECONDARY LLEAK CD Resonance + VIN CBULK RSNUB1 VD LM CSNUB ∆VSNUB − VBULK LLEAK DS VR M1 CD + VD + VG 0V VG − RCS 0V − (b) (a) PRIMARY VD + VIN Reduced LLEAK CD Resonance SECONDARY CBULK RSNUB1 VBULK CSNUB − ∆VSNUB LM RSNUB2 LLEAK DS M1 VR + VD + VG 0V CD VG − 0V RCS − (c) (d) Figure 15. (a) RCD Snubber, (b) RCD Snubber Waveform, (c) R2CD Snubber, (d) R2CD Snubber Waveform 22 Copyright © 2005–2011, Texas Instruments Incorporated UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com Begin the design of the R2CD using the same procedure as designing an RCD snubber. Then, add the damping resistor, RSNUB2. The procedure is as follows: DV SNUB Pick + between 0.5 and 1 VR (6) Select a capacitor for ΔVSNUB: 2 C SNUB + I cs(peak) L LEAK ǒVR ) DVSNUBǓ 2 * VR 2 (7) Pick RSNUB to discharge CSNUB: ǒ ǒ Ǔ Ǔ L I VR 1 1 * LEAK CS(peak) R SNUB1 + 1 ) 2 DV SNUB CSNUB f S(max) DVSNUB é é ùù ê ê úú DVSNUB ö ê æ 1 ö 1 æ ú ê ú V 1 + ´ + ´ ç R 1 úú 2 ÷ø ê èç 3 ø÷ ê VR è + ê êë VSNUB 2 úû ú ë û P (RSNUB1 ) = RSNUB1 (8) 2 2 (9) Pick RSNUB2 to dampen the LLEAK-CSNUB resonance with a Q that is between 1.7 and 2.2: DVSNUB R SNUB2 + I CS(peak) (10) ȡ ȣ ȧ LLEAKf S(max) ȧ 2 PǒR SNUBǓ + I CS(peak) R SNUB2ȧ1 ȧ ȧ3 ǒV ) DVSNUBǓȧ 2 Ȣ R Ȥ (11) For the original selection of ΔVSNUB, Q+ Ǹ 2V R )1 DV SNUB Copyright © 2005–2011, Texas Instruments Incorporated (12) 23 UCC28600 SLUS646J – NOVEMBER 2005 – REVISED JULY 2011 www.ti.com REFERENCES 1. Power Supply Seminar SEM-1400 Topic 2: Design And Application Guide For High Speed MOSFET Gate Drive Circuits, by Laszlo Balogh, Texas Instruments Literature Number SLUP133 2. Datasheet, UCC3581 Micro Power PWM Controller, Texas Instruments Literature Number SLUS295 3. Datasheet, UCC28051 Transition Mode PFC Controller, Texas Instruments Literature Number SLUS515 4. UCC28600 Design Calculator, A QR Flyback Designer.xls, spreadsheet for Microsoft Excel 2003, Texas Instruments Literature Number SLVC104 5. Design Considerations for the UCC28600, Texas Instruments Literature Number SLUA399 RELATED PRODUCTS • • UCC28051 Transition Mode PFC Controller (SLUS515) UCC3581 Micro Power PWM Controller (SLUS295) REVISION HISTORY Changes from Revision H (November 2005) to Revision I • 24 Page Changed Equation 9 ........................................................................................................................................................... 23 Copyright © 2005–2011, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) UCC28600D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 28600D UCC28600DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 28600D UCC28600DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 28600D UCC28600DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 28600D (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. 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Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 OTHER QUALIFIED VERSIONS OF UCC28600 : • Automotive: UCC28600-Q1 NOTE: Qualified Version Definitions: • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device UCC28600DR Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.4 B0 (mm) K0 (mm) P1 (mm) 5.2 2.1 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC28600DR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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