DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC3211GR AGC AMPLIFIER FOR DIGITAL CATV RETURN PASS DESCRIPTION The µPC3211GR is a silicon monolithic integrated circuit designed as AGC amplifier for digital CATV systems. This IC is the AGC amplifier with 55 dB gain control range which is packaged in 20-pin SSOP. The device is able to use for digital QPSK system, therefore it contributes to make design of transmission system simplicity. FEATURES • Wide gain control range 55 dB TYP. • Low distortion IM3 = 57 dBc TYP. @Pout = −10 dBm IM2 = 44 dBc TYP. @Pout = −10 dBm • Supply Voltage 9V • Packaged in 20-pin SSOP suitable for high-density surface mount. ORDERING INFORMATION Part Number µPC3211GR-E1 Package Supplying Form 20-pin plastic SSOP (225 mil) Embossed tape 12 mm wide. Pin 1 indicates pull-out direction of tape. Qty 2.5 kp/reel To order evaluation samples, please contact your local NEC office. (Part number for sample order: µPC3211GR) Caution electro-static sensitive device The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P13564EJ3V0DS00 (3rd edition) Date Published October 1999 N CP(K) Printed in Japan The mark shows major revised points. © 1998, 1999 µPC3211GR INTERNAL BLOCK DIAGRAM AND PIN CONFIGURATION (TOP VIEW) 20 BY1 19 AGC IN1 3 18 GND1A GND2B 4 17 AGC IN2 VCC1 5 16 GND1B VCC2 6 15 PSAVE GND2C 7 14 PA_BIAS GND2D 8 13 GND3 GND2E 9 12 OUT1 BY3 10 11 OUT2 BY2 1 VAGC 2 GND2A Cont. REG TYPICAL APPLICATION LPF RF IN 50-750 MHz RF Return 5-42 MHz µ PC2799GR µ PC2798GR µ PC1686GV 1st IF SAW HPF DC-10 MHz 2nd IF SAW A/D Video Amplifier QAM Demo. &FEC DUAL PLL µ PC3211GR Bias LPF 2 Data Sheet P13564EJ3V0DS00 Digital QPSK Modulator µPC3211GR PIN FUNCTIONS Pin Voltage TYP. (V) Pin No. Pin Name 1 BY2 – 2 VAGC 0 to 3 3 GND2A 0.0 4 GND2B 0.0 5 Vcc1 9.0 Power supply pin of AGC amplifier block. 6 Vcc2 9.0 Power supply pin of differential amplifier and output block. 7 GND2C 0.0 Ground pins of differential amplifier. 8 GND2D 0.0 9 GND2E 0.0 10 BY3 1.64 Bypass pin of regulator block. 11 OUT2 6.9 12 OUT1 6.9 Signal output pins. This pins feature low-impedance because of its emitter-follower output port. The pin that is not used should be grounded through 50 ohm resistor. 13 GND3 0.0 Ground pin of output block. 14 PA_BIAS 2.45 This is the pin to feed base bias in case of connection to transistor as power amplifier. Function and Explanation Non Connection pin. This pin should be opened. Automatic gain control pin. Ground pins of differential amplifier. 15 Psave 9.0 (+5 kΩ) Power-save pin. Vcc : ON GND : SLEEP The 5 kΩ resistor should be connected between 15 pin and Vcc. 16 GND1B 0.0 Ground pin of AGC amplifier block. 18 GND1A 0.0 17 AGC IN2 2.43 19 AGC IN1 2.43 20 BY1 – Equivalent Circuit 6 11 12 REG 5 VCC (9 V) Signal input pin. In the case of single input, 17 or 19 pin should be grounded through capacitor. 15 5 kΩ 14 5 19 17 Non Connection pin. This pin should be opened. Data Sheet P13564EJ3V0DS00 3 µPC3211GR ABSOLUTE MAXIMUM RATINGS (TA = +25°C unless otherwise specified) Parameter Symbol Supply Voltage Power-save Voltage Test Condition VCC Note 1 V (Psave) AGC Voltage VAGC TA = +75°C Note 2 Rating Unit 11.0 V 11.0 V 3.6 V 500 mW Power Dissipation PD Operating Ambient Temperature TA −40 to +75 °C Storage Temperature Tstg −55 to +150 °C Maximum Input Level Pin (MAX) +5 dBm Notes 1. Bias to 15 pin through 5 kΩ resistor. 2. Mounted on 50 mm × 50 mm × 1.6 mm double epoxy glass board. RECOMMENDED OPERATING RANGE Parameter Symbol Supply Voltage Test Condition VCC Note MIN. TYP. MAX. Unit 8.0 9.0 10.0 V 0 – 10.0 V Power-save Voltage V (Psave) AGC Control Voltage VAGC 0 – 3.3 V Operating Ambient Temperature TA −40 +25 +75 °C Input Frequency fin 5 – 100 MHz Pin (MAX) – – 0 dBm Maximum Input Level Note Bias to 15 pin through 5 kΩ resistor. ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = 9 V, VAGC = 0 V, V (Psave) = 9 V (+5 kΩ Ω), unless otherwise specified) Parameter Symbol Test Conditions TYP. MAX. Unit Circuit Current 1 ICC1 No input signal Note 1 29 38 51 mA Maximum Gain GMAX fin = 65 MHz, Pin = −20 dBm Note 2 14 16 18 dB Gain Control Range GCR fin = 65 MHz, Pin = −20 dBm, VAGC = 0 to 3 V Note 2 47 55 – dB Isolation at sleep mode Isol fin = 65 MHz, Pin = −20 dBm, V (Psave) = 0 V (+5 kΩ) Note 2 60 65 – dB 2nd order intermodulation distortion IM2 fin1 = 65 MHz, fin2 = 66.8 MHz, Pout = −10 dBm Note 2 – –44 –40 dBc 3rd order intermodulation distortion IM3 fin1 = 65 MHz, fin2 = 66.8 MHz, Pout = −10 dBm Note 2 – –57 –50 dBc Notes 1. By measurement circuit 1 2. By measurement circuit 2 4 MIN. Data Sheet P13564EJ3V0DS00 µPC3211GR STANDARD CHARACTERISTICS (TA = +25°C, VCC = 9 V, VAGC = 0 V, V (Psave) = 9 V (+5 kΩ Ω), unless otherwise specified) Parameter Maximum Output Power Circuit Current at Power-save mode Symbol PO (sat) ICC (P/S) Noise Figure NF Test Conditions Reference Value Unit Note 1 +5 dBm No input signal, V (Psave) = 0 V (+5 kΩ) Note 2 3 mA fin = 65 MHz Note 3 10 dB fin = 65 MHz, Pin = −5 dBm Output Intercept Point OIP3 fin1 = 65 MHz, fin2 = 66.8 MHz Note 1 +16 dBm Gain Flatness Gflat fin = 5 to 100 MHz, 6 MHz Band width Pin = −20 dBm Note 1 ±0.1 dB Circuit Current 2 ICC2 No input signal, VAGC = 3 V Note 2 43 mA ON Time tON fin = 65 MHz, V (Psave) = 0 → 9 V (+5 kΩ) 200 µsec Note 4 fin = 65 MHz, V (Psave) = 9 → 0 V (+5 kΩ) 1.7 msec Note 4 OFF Time tOFF Notes 1. By measurement circuit 2 2. By measurement circuit 1 3. By measurement circuit 3 4. By measurement circuit 4 Data Sheet P13564EJ3V0DS00 5 µPC3211GR TYPICAL CHARACTERISTICS (TA = +25°C) 50 CIRCUIT CURRENT vs. SUPPLY VOLTAGE CIRCUIT CURRENT vs. POWER-SAVE VOLTAGE 40 35 30 Circuit Current ICC (mA) Circuit Current ICC (mA) 40 30 20 25 20 15 10 no input signal VCC = 9 V measurement circuit1 10 0 0 no input signal measurement circuit1 2 4 6 8 10 5 0 12 0 2 Supply Voltage VCC (V) Power-save Voltage V(Psave) (V) CIRCUIT CURRENT vs. AGC VOLTAGE 45 4 6 8 10 12 Power-save Voltage V(Psave) (V) 14PIN VOLTAGE vs. SUPPLY VOLTAGE 3 44 2.5 42 41 40 39 38 no input signal VCC = 9 V V(Psave) = 9V measurement circuit1 37 36 35 0 0.5 1 1.5 2 2.5 3 14 pin Voltage V(14) (V) Circuit Current ICC (mA) 43 2 1.5 1 no input signal VAGC = 0 V measurement circuit1 0.5 0 0 3.5 2 AGC Voltage VAGC (V) 20 GAIN vs. INPUT FREQUENCY −20 6 8 10 12 −30 GAIN vs. INPUT FREQUENCY Pin = −20 dBm VAGC = 3 V measurement circuit2 Gain (dB) Gain (dB) 18 16 −40 14 VCC = V(Psave) = 8 to 10 V 12 Pin = −20 dBm VAGC = 0 V measurement circuit2 10 0 20 −50 40 60 80 100 Vcc = V(Psave) = 8 V Vcc = V(Psave) = 9 V Vcc = V(Psave) = 10 V −60 0 Input Frequency fin (MHz) 6 4 Supply Voltage VCC (V) Power-save Voltage V(Psave) (V) Data Sheet P13564EJ3V0DS00 20 40 60 Input Frequency fin (MHz) 80 100 µPC3211GR GAIN vs. AGC VOLTAGE 20 OUTPUT POWER vs. INPUT POWER 0 Gain (dB) fin = 65 MHz VAGC = 0 V 5 measurement circuit2 Output Power Pout (dBm) 10 −10 −20 0 −5 −10 −30 −40 −50 10 fin = 65 MHz Pin = −20 dBm measurement circuit2 −15 VCC = V(Psave) = 8 V VCC = V(Psave) = 9 V VCC = V(Psave) = 10 V 0 0.5 1 1.5 2 2.5 3 3.5 −20 −30 −25 NOISE FIGURE vs. INPUT FREQUENCY OUTPUT POWER vs. INPUT POWER 20 12 VAGC = 1.1 V VAGC = 1.5 V −40 VAGC = 2.2 V −60 VAGC = 3 V −80 −30 −25 VAGC = 0 V measurement circuit3 11 −20 −15 VCC = 9 V V(Psave) = 9 V fin = 65 MHz measurement circuit2 −10 −5 0 Noise Figure NF (dB) Output Power Pout (dBm) VAGC = 0 V −20 −20 Input Power Pin (dBm) AGC Voltage VAGC (V) 0 VCC = V(Psave) = 8 V VCC = V(Psave) = 9 V VCC = V(Psave) = 10 V −10 −5 0 −15 10 9 8 0 Input Power Pin (dBm) 20 40 VCC = V(Psave) = 8 V VCC = V(Psave) = 9 V VCC = V(Psave) = 10 V 60 80 100 Input Frequency fin (MHz) GAIN vs. INPUT FREQUENCY 30 VAGC = 0 V 20 10 VAGC = 1.1 V 0 Gain (dB) −10 VAGC = 1.5 V −20 VAGC = 2.2 V −30 VAGC = 3 V −40 VAGC = 3.3 V VCC = 9 V V(Psave) = 9 V Pin = −20 dBm measurement circuit2 −50 −60 −70 −80 0 20 40 60 80 100 Input Frequency fin (MHz) Data Sheet P13564EJ3V0DS00 7 µPC3211GR STANDARD CHARACTERISTICS (TA = +25°C) 20 10 10 0 −10 −20 −30 −40 −50 VCC = V(Psave) = 9 V fin1 = 65 MHz fin2 = 66.8 MHz VAGC = 0 V Pout = −13 dBm/tone = −10 dBm(total) measurement circuit2 −30 −20 −10 Input Power Pin (dBm) −60 −70 −80 −40 Output Power Pout / tone (dBm) Output Power Pout / tone (dBm) 3rd ORDER INTERMODULATION DISTORTION 20 0 −10 −20 −30 −40 −50 −70 −80 −40 0 3rd Order Intermodulation Distortion IM3 (dBc) 2nd Order Intermodulation Distortion IM2 (dBc) VCC = V(Psave) = 9 V fin1 = 65 MHz −20 fin2 = 66.8 MHz VAGC = 0 V Pout = −13 dBm/tone = −10 dBm(total) −30 measurement circuit2 −40 −50 −60 −70 −20 −15 −5 −10 0 IM2 vs. OUTPUT POWER −50 −60 −20 ATT 10 dB VCC = 9 V fin= 65 MHz Pin = −20 dBm Input Voltage = 9 V measurement circuit4 RBW 3 MHz VBW 3 MHz SWP 7.5 ms 8 −10 −40 ON/OFF TIME OF POWERSAVE CENTER 65.000000 MHz −30 −20 Input Power Pin (dBm) VCC = V(Psave) = 9 V fin1 = 65 MHz −10 fin2 = 66.8 MHz VAGC = 0 V Pout = −13 dBm/tone = −10 dBm(total) −20 measurement circuit2 −30 Output Power Pout/tone (dBm) REF 0.0 dBm 10 dB/ VCC = V(Psave) = 9 V fin1 = 65 MHz fin2 = 66.8 MHz VAGC = 0 V Pout = −13 dBm/tone = −10 dBm(total) measurement circuit2 −60 IM3 vs. OUTPUT POWER −10 2nd ORDER INTERMODULATION DISTORTION SPAN 0 Hz Data Sheet P13564EJ3V0DS00 −15 −10 −5 Output Power Pout/tone (dBm) 0 µPC3211GR THERMAL CHARACTERISTICS (FOR REFERENCE) 50 CIRCUIT CURRENT vs. AMBIENT TEMPERATURE 20 GAIN vs. INPUT FREQUENCY TA = −40 °C TA = +25 °C TA = +75 °C VAGC = 3 V 18 VAGC = 0 V 30 Gain (dB) Circuit Current ICC (mA) 40 20 no input signal VCC = 9 V V(Psave) = 9 V measurement circuit1 10 0 −50 −25 0 25 50 75 100 16 14 VCC = 9 V V(Psave) = 9 V 12 Pin = −20 dBm VAGC = 0 V measurement circuit2 10 0 20 80 100 GAIN vs. AGC VOLTAGE VCC = 9 V V(Psave) = 9 V fin = 65 MHz Pin = −20 dBm measurement circuit2 10 0 Gain (dB) 60 Input Frequency fin (MHz) Ambient Temperature TA (°C) 20 40 −10 −20 −30 −40 −50 0 TA = −40 °C TA = +25 °C TA = +75 °C 0.5 1 1.5 2 2.5 3 3.5 AGC Voltage VAGC (V) Data Sheet P13564EJ3V0DS00 9 µPC3211GR STANDARD CHARACTERISTICS INPUT IMPEDANCE (19 PIN) S11 1 U FS hp ∆ 1: 5 MHz 533.6 Ω −16.4 Ω ∆ 2: 40 MHz 515.2 Ω −81.4 Ω ∆ 3: 65 MHz 493.7 Ω 3 −123.3 Ω ∆ 4: 100 MHz 455.9 Ω −190.3 Ω TA = +25°C VCC = 9 V V (Psave) = 9 V START .100 000 MHz STOP 100.000 000 MHz Pin = −20 dBm OUTPUT IMPEDANCE (11 PIN) S22 1 U FS hp ∆ 1: 5 MHz 9.779 Ω −2.306 Ω ∆ 2: 40 MHz 10.066 Ω 3.033 Ω 3 ∆ 3: 65 MHz 4 10.574 Ω 2 5.237 Ω 1 ∆ 4: 100 MHz 11.88 Ω 7.805 Ω TA = +25°C VCC = 9 V V (Psave) = 9 V START 10 5.000 000 MHz STOP 100.000 000 MHz Data Sheet P13564EJ3V0DS00 Pin = −20 dBm µPC3211GR MEASUREMENT CIRCUIT 1 1 0.01 µ F VAGC 2 20 0.1 µ F Cont. 19 AGC IN 100 pF 18 4 17 0.1 µ F 0.01 µ F VCC 3 100 pF 5 16 6 15 REG 7 5 kΩ 0.01 µ F V(Psave) 100 pF 14 10 kΩ 8 13 9 12 10 11 AGC OUT 0.1 µ F AGC OUT Note 0.1 µ F 0.1 µ F Note The pin that is not connected to Spectrum Analyzer should be grounded through 50 Ω resistor. MEASUREMENT CIRCUIT 2 Note 1 SG1 (50 Ω) 1 0.01 µ F VAGC 2 20 SG2 (50 Ω) MIXPAD 0.1 µ F Cont. 19 100 pF VCC 3 18 4 17 0.1 µ F 0.01 µ F 5 16 6 15 5 kΩ 0.01 µ F 100 pF REG 7 V(Psave) 100 pF 14 10 kΩ 8 13 9 12 10 11 Spectrum Analyzer (50 Ω) 0.1 µ F 0.1 µ F Note 2 0.1 µ F Notes 1. Connect in the case of measurement of IM2/IM3 2. The pin that is not connected to Spectrum Analyzer should be grounded through 50 Ω resistor. Data Sheet P13564EJ3V0DS00 11 µPC3211GR MEASUREMENT CIRCUIT 3 1 20 0.01 µ F VAGC 0.1 µF Cont. 2 19 100 pF VCC 0.01 µ F 3 18 4 17 5 16 6 15 Noise Source 0.1 µF 5 kΩ 0.01 µ F 100 pF REG 100 pF 7 14 8 13 9 12 10 11 NF METER V(Psave) 10 kΩ 0.1 µF 0.1 µF 0.1 µF Note Note The pin that is not connected to Spectrum Analyzer should be grounded through 50 Ω resistor. MEASUREMENT CIRCUIT 4 1 0.01 µ F VAGC 2 20 0.1 µF Cont. SG1 (50 Ω) 19 100 pF VCC 0.01 µ F 3 18 4 17 5 16 6 15 0.1 µF 5 kΩ 0.01 µ F 100 pF REG 7 100 pF Pulse Generator (9 V, 2.3 msec) 14 10 kΩ 8 13 9 12 10 11 0.1 µF 0.1 µF 0.1 µ F 12 Data Sheet P13564EJ3V0DS00 Spectrum Analyzer (50 Ω) 50 Ω µPC3211GR ILLUSTRATION OF THE EVALUATION BOARD FOR MEASUREMENT CIRCUIT V(Psave) AGC IN1 OUT 1 100 p 0.1 µ 0.1 µ 5k 0.01 µ 0.1 µ 10 k 0.1 µ OUT 2 100 p 0.1 µ 100 p 0.01 µ 0.01 µ µ PC3211GR VAGC VCC Notes 1. 50 × 50 × 1.6 mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through holes Data Sheet P13564EJ3V0DS00 13 µPC3211GR PACKAGE DIMENSIONS 20 PIN PLASTIC SSOP (225 mil) (UNIT: mm) 20 11 detail of lead end +7˚ 3˚–3˚ 1 10 6.7 ± 0.3 6.4 ± 0.2 1.8 MAX. 4.4 ± 0.1 1.5 ± 0.1 1.0 ± 0.2 0.5 ± 0.2 0.15 0.65 +0.10 0.22 –0.05 0.15 +0.10 –0.05 0.575 MAX. 0.10 M 0.1 ± 0.1 NOTE 14 Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. Data Sheet P13564EJ3V0DS00 µPC3211GR RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235°C or below Time: 30 seconds or less (at 210°C) Note Count: 3, Exposure limit : None IR35-00-3 VPS Package peak temperature: 215°C or below Time: 40 seconds or less (at 200°C) Note Count: 3, Exposure limit : None VP15-00-3 Partial Heating Pin temperature: 300°C Time: 3 seconds or less (per side of device) Note Exposure limit : None – Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of the recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Data Sheet P13564EJ3V0DS00 15 µPC3211GR • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8