NEC's 1.8 V L, S-BAND UPG2006TB SPDT SWITCH FEATURES DESCRIPTION • LOW INSERTION LOSS: LINS = 0.3 dB TYP. @ Vcont = 1.8 V/0 V, f = 1 GHz LINS = 0.45 dB TYP. @ Vcont = 1.8 V/0 V, f = 2.5 GHz NEC's UPG2006TB is a L, S-band SPDT (Single Pole Double Throw) switch for digital cellular or cordless telephone applications. • HIGH ISOLATION: ISL = 29 dB TYP. @ Vcont = 1.8 V/0 V, f = 2 GHz The device can operate from 500 MHz to 2.5 GHz, with low insertion loss and high isolation with 1.8 V control voltage. ISL = 25 dB TYP. @ Vcont = 1.8 V/0 V, f = 2.5 GHz • 6-PIN SUPER MINIMOLD PACKAGE: (2.0 X 1.25 X 0.9MM) APPLICATIONS • L, S-band digital cellular or cordless telephones • BluetoothTM , W-LAN and WLL • Short Range Wireless ORDERING INFORMATION Part Number UPG2006TB-E3 Package 6-pin super minimold Marking G2J Supplying Form • Embossed tape 8 mm wide • Pin 1, 2, 3 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: UPG2006TB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. California Eastern Laboratories UPG2006TB PIN CONNECTIONS 3 2 1 G2J (Top View) (Bottom View) 4 5 6 4 Pin No. Pin Name 1 OUT1 2 GND 3 OUT2 4 Vcont2 3 5 2 6 1 ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Control Voltage 1, 2 Symbol Ratings −6.0 to Vcont1, 2 Input Power (Vcont = 1.8 V) Pin Unit +6.0 Note +23 V dBm Total Power Dissipation Ptot 0.15 W Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C Note |Vcont1-Vcont2| ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = 25°C) Parameter Symbol MIN. TYP. MAX. Unit Control Voltage (High) Vcont(H) +1.6 +1.8 +5.3 V Control Voltage (Low) Vcont(L) −0.2 0 +0.2 V 5 IN 6 VDD1 UPG2006TB ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont1 = 1.8 V, Vcont2 = 0 V or Vcont1 = 0 V, Vcont2 = 1.8 V, ZO = 50 Ω, Off chip DC blocking capacitors value; 51 pF, unless otherwise specified) Parameter Symbol Insertion Loss LINS Isolation ISL Test Conditions MIN. TYP. MAX. Unit f = 0.1 to 1.0 GHz Note1 − 0.30 0.55 dB f = to 2.0 GHz − 0.40 0.60 dB f = to 2.5 GHz − 0.45 0.65 dB f = 0.1 to 2.0 GHz Note1 25 29 − dB dB f = to 2.5 GHz 20 25 − Input Return Loss RLin f = 0.1 to 1.0 GHz Note1 13 − − dB f = to 2.5 GHz 16 21 − dB Output Return Loss RLout f = 0.1 to 1.0 GHz Note1 13 − − dB Input Power at 1 dB Pin(1 dB) Compression Point Note2 Input Power at 0.1 dB Compression Point Pin(0.1 dB) Note2 Switching Speed tSW Control Current Icont f = to 2.5 GHz 16 21 − dB f = 2.0 GHz, Vcont = 1.8 V/0 V 17 20 − dBm f = 2.0 GHz, Vcont = 2.8 V/0 V 22 25 − dBm f = 2.0 GHz, Vcont = 1.8 V/0 V − 18 − dBm f = 2.0 GHz, Vcont = 2.8 V/0 V − 23 − dBm − 50 200 ns − 0.5 10 μA Vcont = 1.8 V/0 V, RF Non Notes 1. Off chip DC blocking capacitors at frequency range of 0.1 to 0.5 GHz 1,000 pF 2. Pin(1 dB) or Pin(0.1 dB) is the input power level when the insertion loss increase 1 dB or 0.1 more than that of linear range. All other characteristics are measured in linear range. Cautions 1. It is necessary to use DC blocking capacitors for No.1 (OUT1), No.3 (OUT2) and No.5 (IN). The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with the actual board of the system. The range of recommended DC blocking capacitor value is less than 100 pF. 2. The distance between the GND pin and ground pattern of the substrate should be as short as possible to reduce parasitic parameters. UPG2006TB EVALUATION CIRCUIT (Vcont1 = 1.8 V, Vcont2 = 0 V or Vcont2 = 0 V, Vcont1 = 1.8 V, off chip DC blocking capacitors value C1 = 51 pF, C2 = 1 000 pF (Bypass), using NEC standard evaluation board) C2 C1 6 IN 5 C1 4 Vcont2 1 G2J Vcont1 OUT1 2 3 OUT2 C1 C2 EVALUATION BOARD Vcont1 OUT1 C1 C2 IN G2J C1 C2 C1 OUT2 6p SMM SPDT SW Vcont2 TRUTH TABLE Vcont1 Vcont2 IN−OUT1 IN−OUT2 Low High High ON OFF Low OFF ON UPG2006TB TYPICAL CHARACTERISTICS (Vcont1/2 = 0 V/1.8 V, Pin = 0 dBm, OUT2 side is 50 Ω termination) ISOLATION vs. FREQUENCY INPUT RETURN LOSS vs. FREQUENCY log MAG CH1 S21 10 dB/ REF 0 dB 1:-26.287 dB 1.0 GHz 2: -30.675 dB 1.5 GHz 3: -34.567 dB 2.0 GHz 4: -27.974 dB 2.5 GHz 5: -21.341 dB 3.0 GHz 0 1 -0 Isolation ISL (dB) Input Return Loss RLin (dB) CH1 S11 log MAG 1: -27.744 dB 1.0 GHz 2: -28.781 dB 1.5 GHz 3: -29.32 dB 2.0 GHz 4: -26.277 dB 2.5 GHz 5: -22.797 dB 3.0 GHz 0 -20 1 5 4 2 -40 2 -40 3 START 0.500 000 000 GHz CH1 S22 1: -0.538 dB 1.0 GHz 2: -0.646 dB 1.5 GHz 3: -0.768 dB 2.0 GHz 4: -0.899 dB 2.5 GHz 5: -1.136 dB 3.0 GHz 1 0 2 3 -2.0 4 5 -4.0 START 0.500 000 000 GHz STOP 3.500 000 000 GHz log MAG 0 ñ20 1 5 2 ñ40 START 0.500 000 000 GHz 0 0.5 dB/ REF 0 dB 1: -0.236 dB 1.0 GHz 2: -0.321 dB 1.5 GHz 3: -0.420 dB 2.0 GHz 4: -0.511 dB 2.5 GHz 5: -0.593 dB 3.0 GHz 1 2 -1.0 3 4 5 -2.0 START 0.500 000 000 GHz STOP 3.500 000 000 GHz Frequency f (GHz) Caution 3 4 STOP 3.500 000 000 GHz Frequency f (GHz) EVALUATION BOARD LOSS vs. FREQUENCY log MAG 10 dB/ REF 0 dB 1: -25.904 dB 1.0 GHz 2: -30.703 dB 1.5 GHz 3: -31.201 dB 2.0 GHz 4: -28.75 dB 2.5 GHz 5: -20.829 dB 3.0 GHz Frequency f (GHz) CH1 S21 STOP 3.500 000 000 GHz OUTPUT RETURN LOSS vs. FREQUENCY 1 dB/ REF 0 dB Output Return Loss RLout (dB) Insertion Loss LINS (dB) log MAG 5 Frequency f (GHz) INSERTION LOSS vs. FREQUENCY CH1 S21 4 3 START 0.500 000 000 GHz STOP 3.500 000 000 GHz Frequency f (GHz) Evaluation Board Loss (dB) 10 dB/ REF 0 dB These characteristics values include the losses of the NEC evaluation board. Remark The graphs indicate nominal characteristics. UPG2006TB TYPICAL CHARACTERISTICS (Vcont1/2 = 0 V/1.8 V, Pin = 0 dBm, OUT2 side is 50 Ω termination) ISOLATION vs. FREQUENCY 0 0 -10 -10 Isolation ISL (dB) Input Return Loss RLin (dB) INPUT RETURN LOSS vs. FREQUENCY -20 -30 -40 -50 -60 0 0.5 1.0 1.5 -40 -60 0 0.5 1.5 Frequency f (GHz) INSERTION LOSS vs. FREQUENCY OUTPUT RETURN LOSS vs. FREQUENCY -0.3 -0.4 -0.5 0.5 1.0 1.5 TA = -45ºC TA = +25ºC TA = +85ºC 2.0 2.5 3.0 Output Return Loss RLout (dB) 0 -0.2 -10 -20 -30 -40 -50 -60 0 0.5 Frequency f (GHz) Caution 1.0 TA = -45ºC TA = +25ºC TA = +85ºC 2.0 2.5 3.0 Frequency f (GHz) -0.1 Insertion Loss LINS (dB) -30 -50 TA = -45ºC TA = +25ºC TA = +85ºC 2.0 2.5 3.0 0 -0.6 0 -20 These characteristics values include the losses of the NEC evaluation board. Remark The graphs indicate nominal characteristics. 1.0 1.5 TA = -45ºC TA = +25ºC TA = +85ºC 2.0 2.5 3.0 Frequency f (GHz) UPG2006TB TYPICAL CHARACTERISTICS (f = 2 GHz, Vcont1/2 = 0 V/1.8 V, OUT2 side is 50 Ω termination) TEMPERATURE CHARACTERISTICS OF INPUT/OUTPUT Output Power Pout (dBm) 0 -10 -20 -30 -40 -50 -60 0 5 10 TA = -45ºC TA = +25ºC TA = +85ºC 20 25 30 15 Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. TYPICAL CHARACTERISTICS (f = 2 GHz, TA = +25ºC, OUT2 side is 50 Ω termination) RELATION BETWEEN CONTROL VOLTAGE OF INPUT/OUTPUT 35 Output Power Pout (dBm) 30 25 20 15 10 Vcont = 1.6 V Vcont = 1.8 V Vcont = 2.8 V Vcont = 5.3 V 5 0 5 10 15 20 25 Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. 30 35 UPG2006TB TYPICAL CHARACTERISTICS (f = 2 GHz, TA = +25ºC, Vcont1/2 = 0 V/1.8 V, OUT2 side is 50 Ω termination) RELATION BETWEEN CONTROL VOLTAGE OF 3rd HARMONICS 0 0 20 20 3rd Harmonics (dBc) 2nd Harmonics (dBc) RELATION BETWEEN CONTROL VOLTAGE OF 2nd HARMONICS 40 60 80 60 80 100 100 120 0 40 Vcont = 1.8 V Vcont = 2.8 V 5 10 15 20 25 30 Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. 120 0 Vcont = 1.8 V Vcont = 2.8 V 5 10 15 20 Input Power Pin (dBm) 25 30 UPG2006TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.1±0.1 0.2+0.1 -0.05 0.65 0.65 1.3 0.15+0.1 -0.05 0 to 0.1 0.7 0.1 MIN. 0.9±0.1 2.0±0.2 1.25±0.1 UPG2006TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below IR260 VPS Peak temperature (package surface temperature) Time at temperature of 200°C or higher Preheating time at 120 to 150°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 215°C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below VP215 Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature : 260°C or below : 10 seconds or less WS260 Preheating temperature (package surface temperature) : 120°C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Partial Heating Caution Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 Do not use different soldering methods together (except for partial heating). Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. 03/08/2004 A Business Partner of NEC Compound Semiconductor Devices, Ltd.