PreliminaryData Sheet μPG2413T6Z GaAs Integrated Circuit SP3T Switch for BluetoothTM and 802.11b/g R09DS0001EJ0100 Rev.1.00 May 20, 2010 DESCRIPTION The μPG2413T6Z is a GaAs MMIC SP3T switch which was developed for Bluetooth, wireless LAN. This device can operate at frequencies from 0.5 to 3.0 GHz, with low insertion loss. This device is housed in a 8-pin plastic TSON (Thin Small Out-line Flat Non-leaded) package and is suitable for highdensity surface mounting. FEATURES • Switch Control voltage • Low insertion loss : Vcont (H) = 3.0 V TYP., Vcont (L) = 0 V TYP. : Lins = 0.35 dB TYP. @ f = 1.0 GHz : Lins = 0.45 dB TYP. @ f = 2.0 GHz : Lins = 0.50 dB TYP. @ f = 2.5 GHz • High isolation : ISL = 26 dB TYP. @ f = 1.0 GHz : ISL = 20 dB TYP. @ f = 2.0 GHz : ISL = 18 dB TYP. @ f = 2.5 GHz • Handling power : Pin (0.1 dB) = +28.0 dBm TYP. @ f = 2.5 GHz, V cont (H) = 3.0 V, Vcont (L) = 0 V • High-density surface mounting : 8-pin plastic TSON package (1.5 × 1.5 × 0.37 mm) APPLICATIONS • Bluetooth and IEEE802.11b/g etc. ORDERING INFORMATION Part Number μPG2413T6Z-E2 Order Number μPG2413T6Z-E2-A Package 8-pin plastic TSON (Pb-Free) Marking G6F Supplying Form • Embossed tape 8 mm wide • Pin 1, 8 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: μPG2413T6Z CAUTION Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 1 of 11 μPG2413T6Z PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) (Top View) 1 G6F 2 3 4 (Bottom View) 8 RFC 1 RF3 8 8 1 7 GND 2 Vcont3 7 7 2 6 Vcont1 3 Vcont2 6 6 3 5 RF1 4 RF2 5 5 4 Pin No. Pin Name 1 2 3 4 5 6 7 8 RFC GND Vcont1 RF1 RF2 Vcont2 Vcont3 RF3 Remark Exposed pad : GND TRUTH TABLE Vcont1 High Low Low Vcont2 Low High Low Vcont3 Low Low High RFC−RF1 ON OFF OFF RFC−RF2 OFF ON OFF RFC−RF3 OFF OFF ON ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Switch Control Voltage Input Power (Vcont (H) = 1.8 V) Input Power (Vcont (H) = 2.3 V) Input Power (Vcont (H) = 3.0 V) Input Power (Vcont (H) = 3.6 V) Operating Ambient Temperature Storage Temperature Note: Symbol Vcont Pin Pin Pin Pin TA Tstg Ratings Note +6.0 +26 +28 +32 +34 −45 to +85 −55 to +150 Unit V dBm dBm dBm dBm °C °C ⎪Vcont (H) − Vcont (L)⎪ ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C) Parameter Operating Frequency Switch Control Voltage (H) Switch Control Voltage (L) Control Voltage Difference (H) Symbol f Vcont (H) Vcont (L) MIN. 0.5 1.8 −0.2 TYP. − 3.0 0 MAX. 3.0 3.6 0.2 Unit GHz V V ΔVcont (H) −0.1 0 0.1 V ΔVcont (L) −0.1 0 0.1 V Note1 Control Voltage Difference (L) Note2 Notes: 1. ΔVcont (H) is a difference between the maximum and the minimum control voltages among Vcont1 (H), Vcont2 (H) and Vcont3 (H). 2. ΔVcont (L) is a difference between the maximum and the minimum control voltages among Vcont1 (L), Vcont2 (L) and Vcont3 (L). R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 2 of 11 μPG2413T6Z ELECTRICAL CHARACTERISTICS 1 (TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, ZO = 50 Ω, DC blocking capacitors = 56 pF, unless otherwise specified) Parameter Insertion Loss Isolation Return Loss (RFC) Return Loss (RF1, 2, 3) 0.1 dB Loss Compression Note 1 Input Power 1 dB Loss Compression Note 2 Input Power Symbol Lins Pass Test Conditions RFC to RF1, 2, 3 f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.0 GHz ISL RFC to RF1, 2, 3 f = 0.5 to 1.0 GHz (OFF) f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.0 GHz RLC f = 0.5 to 3.0 GHz RL1, 2, 3 f = 0.5 to 3.0 GHz Pin (0.1 dB) RFC to RF1, 2, 3 f = 2.5 GHz Pin (1 dB) MIN. − − − − 23 17 15 − 15 15 +25.0 TYP. 0.35 0.45 0.50 0.60 26 20 18 16 20 20 +28.0 MAX. 0.60 0.70 0.75 − − − − − − − − Unit dB dB dB dB dB dB dB dB dB dB dBm RFC to RF1, 2, 3 f = 2.5 GHz, Vcont (H) = 2.3 V − +27.0 − dBm f = 2.5 GHz, Vcont (H) = 3.0 V − +31.0 − dBm f = 2.5 GHz, Vcont (H) = 3.6 V − +33.0 − dBm 2nd Harmonics 2f0 f = 2.5 GHz, Pin = 23 dBm − 75 − dBc 3rd Harmonics 3f0 − 75 − dBc Switch Control Current Switch Control Speed Icont tSW f = 2.5 GHz, Pin = 23 dBm No RF input − 0.1 5.0 μA − 50 − ns 50% CTL to 90/10% RF Notes: 1. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of the linear range. 2. Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the linear range. CAUTION It is necessary to use DC blocking capacitors with this device. R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 3 of 11 μPG2413T6Z ELECTRICAL CHARACTERISTICS 2 (TA = +25°C, Vcont (H) = 1.8 V, Vcont (L) = 0 V, ZO = 50 Ω, DC blocking capacitors = 56 pF, unless otherwise specified) Parameter Insertion Loss Isolation Return Loss (RFC) Return Loss (RF1, 2, 3) 0.1 dB Loss Compression Note 1 Input Power 1 dB Loss Compression Note 2 Input Power 2nd Harmonics Symbol Lins Pass Test Conditions RFC to RF1, 2, 3 f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.0 GHz ISL RFC to RF1, 2, 3 f = 0.5 to 1.0 GHz (OFF) f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.0 GHz RLC f = 0.5 to 3.0 GHz RL1, 2, 3 f = 0.5 to 3.0 GHz Pin (0.1 dB) RFC to RF1, 2, 3 f = 2.5 GHz MIN. − − − − 22.5 16.5 14.5 − 15 15 +19.0 TYP. 0.35 0.45 0.50 0.65 25.5 19.5 17.5 15.5 20 20 +22.0 MAX. 0.65 0.75 0.80 − − − − − − − − Unit dB dB dB dB dB dB dB dB dB dB dBm Pin (1 dB) +21.0 +25.0 − dBm RFC to RF1, 2, 3 f = 2.5 GHz 2f0 f = 2.5 GHz, Pin = 17 dBm − 75 − dBc 3rd Harmonics 3f0 − 75 − dBc Switch Control Current Switch Control Speed Icont tSW f = 2.5 GHz, Pin = 17 dBm No RF input − 0.1 5.0 μA − 50 − ns 50% CTL to 90/10% RF Notes: 1. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of the linear range. 2. Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the linear range. CAUTION It is necessary to use DC blocking capacitors with this device. R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 4 of 11 μPG2413T6Z EVALUATION CIRCUIT 56 pF RFC 8 1 RF3 56 pF 2 7 Vcont3 1 000 pF 3 Vcont1 Vcont2 6 1 000 pF 1 000 pF 4 RF1 5 RF2 56 pF 56 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. APPLICATION INFORMATION CB Switch LESD CB CB • CB are DC blocking capacitors external to the device. A value of 56 pF is sufficient for operation from 500 MHz to 2.5 GHz bands. The value may be tailored to provide specific electrical responses. • The RF ground connections should be kept as short as possible and connected to directly to a good RF ground for best performance. • LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the antenna. R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 5 of 11 μPG2413T6Z TYPICAL CHARACTERISTICS (TA = +25°C, DC blocking capacitors = 56 pF, unless otherwise specified) RFC-RF1/RF2/RF3 ISOLATION vs. FREQUENCY RFC-RF1/RF2/RF3 INSERTION LOSS vs. FREQUENCY 0 –0.1 –5 Isolation ISL (dB) Insertion Loss Lins (dB) –0.2 –0.3 Vcont (H) = 3.0 V –0.4 –0.5 –0.7 0.0 1.8 V –20 –25 3.0 V 0.5 1.0 –35 2.0 1.5 2.5 –40 0.0 3.0 0.5 1.0 2.5 2.0 1.5 3.0 Frequency f (GHz) Frequency f (GHz) RETURN LOSS (RFC) vs. FREQUENCY RETURN LOSS (RF1, 2, 3) vs. FREQUENCY Return Loss (RF1, 2, 3) RL1, 2, 3 (dB) 0 –5 Return Loss (RFC) RLC (dB) Vcont (H) = 1.8 V –15 –30 –0.6 –10 –15 –20 Vcont (H) = 3.0 V –25 –30 –35 –40 1.8 V –45 –50 0.0 0.5 1.0 2.0 1.5 2.5 3.0 0 –5 –10 –15 –20 Vcont (H) = 3.0 V –25 –30 –35 –40 –45 –50 0.0 1.8 V 0.5 1.0 2.0 1.5 2.5 Frequency f (GHz) Frequency f (GHz) RFC-RF1/RF2/RF3 INSERTION LOSS vs. SWITCH CONTROL VOLTAGE (H) RFC-RF1/RF2/RF3 ISOLATION vs. SWITCH CONTROL VOLTAGE (H) –0.1 –5 Isolation ISL (dB) –0.3 f = 1.0 GHz –0.4 –0.5 –10 –15 f = 2.5 GHz –20 –25 1.0 GHz –30 –0.6 –0.7 1.5 3.0 0 –0.2 Insertion Loss Lins (dB) –10 2.5 GHz 2.0 2.5 3.0 –35 3.5 4.0 Switch Control Voltage (H) Vcont (H) (V) –40 1.5 2.0 2.5 3.0 3.5 4.0 Switch Control Voltage (H) Vcont (H) (V) Remark The graphs indicate nominal characteristics. R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 6 of 11 μPG2413T6Z RETURN LOSS (RF1, 2, 3) vs. SWITCH CONTROL VOLTAGE (H) RETURN LOSS (RFC) vs. SWITCH CONTROL VOLTAGE (H) Return Loss (RF1, 2, 3) RL1, 2, 3 (dB) –5 –10 –15 –20 –25 f = 1.0 GHz –30 2.5 GHz –35 –40 1.5 2.0 2.5 3.5 3.0 4.0 –5 –10 –15 –20 f = 2.5 GHz –25 –30 1.0 GHz –35 –40 1.5 2.0 2.5 3.0 3.5 4.0 RFC-RF1/RF2/RF3 INSERTION LOSS, Icont vs. INPUT POWER RFC-RF1/RF2/RF3 Pin (1 dB), Pin (0.1 dB) vs. SWITCH CONTROL VOLTAGE (H) 18 f = 2.5 GHz –0.5 Vcont (H) = 3.0 V Lins –1.0 15 12 1.8 V –1.5 9 –2.0 6 3.0 V –2.5 3 Icont –3.0 10 15 1.8 V 20 25 30 0 35 Input Power Pin (dBm) 1 dB Loss Compression Input Power Pin (1 dB) (dBm) 0.1 dB Loss Compression Input Power Pin (0.1 dB) (dBm) Switch Control Voltage (H) Vcont (H) (V) 0 Insertion Loss Lins (dB) 0 Switch Control Voltage (H) Vcont (H) (V) Switch Control Current Icont (μA) Return Loss (RFC) RLC (dB) 0 34 f = 2.5 GHz 32 30 Pin (1 dB) 28 26 Pin (0.1 dB) 24 22 20 1.5 2.0 2.5 3.0 3.5 4.0 Switch Control Voltage (H) Vcont (H) (V) Remark The graphs indicate nominal characteristics. R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 7 of 11 μPG2413T6Z MOUNTING PAD LAYOUT DIMENSIONS 8-PIN PLASTIC TSON (UNIT: mm) 1.2 0.7 1.1 1.7 0.4 8-0.15 Remark The mounting pad layout in this document is for reference only. When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder bridge and so on, in order to optimize the design. R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 8 of 11 μPG2413T6Z PACKAGE DIMENSIONS 8-PIN PLASTIC TSON (UNIT: mm) (Top View) (Bottom View) (Side View) 0.3±0.07 1.5±0.1 (C0.15) 0.37+0.03 –0.05 A 0.08 MIN. 0.15+0.07 –0.05 A 1.5±0.1 1.2±0.1 0.4±0.06 (0.24) 0.7±0.1 0.2±0.1 Remark A > 0 ( ): Reference value R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 9 of 11 μPG2413T6Z RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Partial Heating Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Condition Symbol IR260 HS350 CAUTION Do not use different soldering methods together (except for partial heating). R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 10 of 11 μPG2413T6Z Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. R09DS0001EJ0100 Rev.1.00 May 20, 2010 Page 11 of 11 μPG2413T6Z Data Sheet Revision History Rev. 1.00 Date May 20, 2010 Description Summary Page − First edition issued Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. All trademarks and registered trademarks are the property of their respective owners. C-1 Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. 2. 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