ROHM BD2232G

Power Management Switch ICs for PCs and Digital Consumer Products
1ch Small Package
High Side Switch ICs
for USB Devices and Memory Cards
BD2232G, BD2233G
No.11029EAT23
●Description
BD2232G and BD2233G are low on-resistance N-channel MOSFET high-side power switches, optimized for Universal
Serial Bus (USB) applications. BD2232G and BD2233G are equipped with the function of over-current detection, thermal
shutdown, under-voltage lockout and soft-start.
●Features
1) Low On-Resistance (Typ. 100mΩ) N-channel MOSFET Built-in
2) Output Discharge Function
3) Over-Current Detection
4) Thermal Shutdown
5) Open-Drain Fault Flag Output
6) Under-Voltage Lockout
7) Soft-Start Circuit
8) Input Voltage Range: 2.7V ~ 5.5V
9) Control Input Logic Active-High (BD2232G), Active-Low (BD2233G)
10) SSOP5 Package
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Ratings
Unit
VIN
-0.3 ~ 6.0
V
VEN(/EN)
-0.3 ~ 6.0
V
/OC voltage
V/OC
-0.3 ~ 6.0
V
/OC sink current
I/OC
5
mA
VOUT voltage
VOUT
-0.3 ~ VIN + 0.3
V
Storage temperature
TSTG
-55 ~ 150
℃
Pd
675 *1
mW
VIN supply voltage
EN(/EN) input voltage
Power dissipation
*1 Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5.4mW per 1℃ above 25℃
* This IC is not designed to be radiation-proof.
●Operating Conditions
Parameter
Symbol
Ratings
Min.
Typ.
Max.
Unit
VIN operating voltage
VIN
2.7
5.0
5.5
V
Operating temperature
TOPR
-40
-
85
℃
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1/12
2011.02 - Rev.A
Technical Note
BD2232G, BD2233G
●Electrical Characteristics
DC Characteristics
(VIN= 5V, Ta= 25℃, unless otherwise specified.)
Parameter
Symbol
Limits
Min.
Typ.
Max.
Unit
Conditions
Operating current
IDD
-
110
160
μA
VEN = 5V (BD2232G)
V/EN = 0V (BD2233G)
VOUT = open
Standby current
ISTB
-
0.01
5
μA
VEN = 0V (BD2232G)
V/EN = 5V (BD2233G)
VOUT = open
VENH(/ENH)
2.0
-
-
V
High input
VENL(/ENL)
-
-
0.8
V
Low input
IEN(/EN)
-1
0.01
1
μA
VEN(/EN) = 0V or 5V
On-resistance
RON
-
100
145
mΩ
IOUT= 500mA
Over-current threshold
ITH
1150
1275
1400
mA
Short circuit output current
ISC
500
-
-
mA
Output discharge resistance
RDISC
30
60
120
Ω
IDISC= 1mA
/OC output low voltage
V/OC
-
-
0.4
V
I/OC= 0.5mA
VTUVH
2.1
2.3
2.5
V
VIN increasing
VTUVL
2.0
2.2
2.4
V
VIN decreasing
EN(/EN) input voltage
EN(/EN) input leakage
UVLO threshold
VOUT= 0V, RMS
AC Characteristics
Parameter
Symbol
Limits
Min.
Typ.
Max.
Unit
Conditions
Output rise time
TON1
-
1
6
ms
RL= 100Ω
Output turn-on time
TON2
-
1.5
10
ms
RL= 100Ω
Output fall time
TOFF1
-
1
20
μs
RL= 100Ω
Output turn-off time
TOFF2
-
3
40
μs
RL= 100Ω
T/OC
10
15
20
ms
/OC delay time
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2/12
2011.02 - Rev.A
Technical Note
BD2232G, BD2233G
●Measurement Circuit
VIN
VIN
A
A
VIN
VOUT
VIN
1µF
RL
GND
VEN(/EN)
VOUT
1µF
GND
VEN(/EN)
/OC
EN(/EN)
Operating current
EN(/EN)
/OC
EN,/EN Input voltage, Output rise/fall time
VIN
VIN
A
A
10kΩ
IOC
VIN
VOUT
1µF
EN(/EN)
VOUT
1µF
IOUT
GND
VEN(/EN)
VIN
GND
VEN(/EN)
/OC
On-resistance, Over-current detection
EN(/EN)
/OC
/OC Output low voltage
Fig.1 Measurement circuit
●Timing Diagram
VEN
50%
50%
TON2
TOFF2
10%
TON1
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TOFF2
90%
90%
V OUT
10%
TOFF1
10%
10%
TON1
TOFF1
Fig.3 Output rise/fall time
(BD2233G)
Fig.2 Output rise/fall time
(BD2232G)
© 2011 ROHM Co., Ltd. All rights reserved.
50%
50%
TON2
90%
90%
VOUT
V/EN
3/12
2011.02 - Rev.A
Technical Note
BD2232G, BD2233G
●Reference Data
140
140
1.0
120
100
80
60
40
20
VIN=5.0V
120
100
80
60
40
20
0
0
2
3
4
5
SUPPLY VOLTAGE : VIN[V]
0.6
0.4
0.2
0.0
1.5
Low to High
High to Low
1.0
0.5
Low to High
1.5
High to Low
1.0
0.5
3
4
5
SUPPLY VOLTAGE : VIN[V]
6
-50
150
1.5
Ta=25°C
50
OVER CURRENT THRESHOLD:ITH[A]
VIN=5.0V
100
100
50
0
0
-50
6
Fig.10 On-resistance
1.2
1.1
1.0
0.9
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.13 Over-current threshold
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1.2
1.1
1.0
0.9
2
3
4
5
SUPPLY VOLTAGE : VIN[V]
6
Fig.12 Over-current threshold
100
/OC OUTPUT LOW VOLTAGE:V/OC[mV]
1.3
/OC OUTPUT LOW VOLTAGE:V/OC[mV]
1.4
1.3
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
100
VIN=5.0V
Ta=25°C
1.4
Fig.11 On-resistance
1.5
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.9 EN,/EN input voltage
Fig.8 EN,/EN input voltage
ON RESISTANCE : RON[mΩ]
ON RESISTANCE : RON[mΩ]
VIN=5.0V
0.0
2
Fig.7 Standby current
EN,/EN disable
150
6
2.0
0.0
-50
3
4
5
SUPPLY VOLTAGE : VIN [V]
Fig.6 Standby current
EN,/EN disable
Ta=25°C
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
3
4
5
SUPPLY VOLTAGE : VIN[V]
0.2
2
ENABLE INPUT VOLTAGE : VEN[V]
ENABLE INPUT VOLTAGE : VEN[V]
STANDBY CURRENT : ISTB[μA]
0.8
2
0.4
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
2.0
VIN=5.0V
200
0.6
Fig.5 Operating current
EN,/EN enable
1.0
-50
0.8
0.0
-50
6
Fig.4 Operating current
EN,/EN enable
OVER CURRENT THRESHOLD:ITH[A]
Ta=25°C
STANDBY CURRENT : ISTB[µA]
OPERATING CURRENT : IDD[μA]
OPERATING CURRENT : IDD[μA]
Ta=25°C
Ta=25°C
80
60
40
20
0
2
3
4
5
SUPPLY VOLTAGE : VIN[V]
6
Fig.14 /OC output low voltage
4/12
VIN=5.0V
80
60
40
20
0
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.15 /OC output low voltage
2011.02 - Rev.A
Technical Note
BD2232G, BD2233G
2.4
2.3
VTUVH
2.2
VTUVL
2.1
2.0
-50
VIN=5.0V
4.0
0.8
0.6
0.4
0.2
0.0
2.0
5.0
VIN=5.0V
4.0
3.0
2.0
1.0
0.0
0.0
Fig.19 Output rise time
3.0
2.0
1.0
3
4
5
SUPPLY VOLTAGE : VIN[V]
6
-50
5.0
6.0
VIN=5.0V
Ta=25°C
4.0
Ta=25°C
2.0
1.0
TURN OFF TIME : TOFF2[μs]
FALL TIME : TOFF1[μs]
4.0
3.0
3.0
2.0
1.0
0.0
0.0
6
Fig.22 Output fall time
1.0
0.0
Fig.25 Output turn-off time
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3
4
5
SUPPLY VOLTAGE : VIN[V]
6
Fig.24 Output turn-off time
20
VIN=5.0V
18
16
14
12
10
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
1.0
2
/OC DDLAY TIME : T/OC [ms]
2.0
2.0
Ta=25°C
/OC DDLAY TIME : T/OC [ms]
3.0
3.0
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
20
4.0
4.0
Fig.23 Output fall time
VIN=5.0V
5.0
5.0
0.0
-50
6.0
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.21 Output turn-on time
Fig.20 Output turn-on time
5.0
-50
4.0
0.0
2
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
6
Fig.18 Output rise time
TURN ON TIME : TON2[ms]
TURN ON TIME : TON2[ms]
3.0
3
4
5
SUPPLY VOLTAGE : VIN [V]
3
4
5
SUPPLY VOLTAGE : VIN [V]
Ta=25°C
1.0
FALL TIME : TOFF1 [µs]
2
5.0
4.0
RISE TIME : TON1[ms]
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.17 UVLO hysteresis voltage
VIN=5.0V
2
2.0
0.0
-50
5.0
-50
3.0
1.0
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.16 UVLO threshold
TURN OFF TIME : TOFF2[μs]
Ta=25°C
RISE TIME : TON1 [ms]
VIN=5.0V
UVLO HYSTERESIS VOLTAGE:VHSY[V]
UVLO THRESHOLD : VTUVH, VTUVL[V]
5.0
1.0
2.5
18
16
14
12
10
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
Fig.26 /OC delay time
5/12
6
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.27 /OC delay time
2011.02 - Rev.A
Technical Note
BD2232G, BD2233G
200
VIN=5.0V
Ta=25°C
DISC ON RESISTANCE : RDISC[Ω]
DISC O N RESISTANCE : RDISC[Ω ]
200
150
100
50
150
100
50
0
0
2
3
4
5
SUPPLY VOLTAGE : V IN[V]
-50
6
Fig.28 Discharge on resistance
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.29 Discharge on resistance
●Waveform Data (BD2232G)
VEN
(5V/div.)
VEN
(5V/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
CL=220uF
CL=100uF
VIN=5V
RL=20Ω
IOUT
(0.5A/div.)
VIN=5V
IOUT
(0.5A/div.)
RL=20Ω
IOUT
(0.2A/div.)
VIN=5V
RL=20Ω
CL=47uF
TIME(1ms/div.)
Fig.30 Output rise characteristic
TIME(1us/div.)
TIME (1ms/div.)
Fig.31 Output fall characteristic
Fig.32 Inrush current response
V/OC
(5V/div.)
VEN
(5V/div.)
VEN
(5V/div.)
VOUT
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
VIN=5V
VIN=5V
TIME (100ms/div.)
TIME (5ms/div.)
TIME (5ms/div.)
Fig.33 Over-current response
ramped load
Fig.34 Over-current response
enable to shortcircuit
VOUT
(5V/div.)
V/OC
(5V/div.)
VIN=5V
Fig.35 Over-current response
enable to shortcircuit
VIN
(5V/div.)
VIN
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VIN=5V
IOUT
(0.2A/div.)
IOUT
(1A/div.)
TIME (5ms/div.)
Fig.36 Over-current response
1 load to enabled device
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RL=20Ω
TIME (10ms/div.)
Fig.37 UVLO response
increasing VIN
6/12
IOUT
(0.2A/div.)
RL=20Ω
TIME (10ms/div.)
Fig.38 UVLO response
decreasing VIN
2011.02 - Rev.A
Technical Note
BD2232G, BD2233G
●Block Diagram
VOUT
VIN
/EN
Under-voltage
Lockout
Charge
Pump
EN(/EN)
Over-current
Protection
Thermal
Shutdown
/OC
Delay
Counter
GND 2
GND
Top View
EN(/EN) 3
Fig.39 Block diagram
●Pin Description
Pin No.
5 VOUT
VIN 1
4 /OC
Fig.40 Pin configuration
Symbol
I/O
1
VIN
-
Switch input and the supply voltage for the IC.
2
GND
-
Ground.
3
EN, /EN
I
Enable input.
EN: High level input turns on the switch. (BD2232G)
/EN: Low level input turns on the switch. (BD2233G)
4
/OC
O
Over-current notification terminal.
Low level output during over-current or over-temperature condition.
Open-drain fault flag output.
5
VOUT
O
Switch output.
●I/O Circuit
Symbol
Pin No.
EN
(/EN)
3
VOUT
5
Function
Equivalent Circuit
EN
(/EN)
VOUT
/OC
/OC
4
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7/12
2011.02 - Rev.A
Technical Note
BD2232G, BD2233G
●Functional Description
1. Switch Operation
VIN terminal and VOUT terminal are connected to the drain and the source of switch MOSFET respectively. And the VIN
terminal is used also as power source input to internal control circuit.
When the switch is turned on from EN,/EN control input, VIN terminal and VOUT terminal are connected by a
100mΩ(Typ.) switch. In on status, the switch is bidirectional. Therefore, when the potential of VOUT terminal is higher
than that of VIN terminal, current flows from VOUT terminal to VIN terminal.
2. Thermal Shutdown Circuit (TSD)
If over-current would continue, the temperature of the IC would increase drastically. If the junction temperature were
beyond 135℃(Typ.) in the condition of over-current detection, thermal shutdown circuit operates and makes power switch
turn off and outputs fault flag (/OC). Then, when the junction temperature decreases lower than 115℃(Typ.), power
switch is turned on and fault flag (/OC) is cancelled. Unless the fact of the increasing chips temperature is removed or the
output of power switch is turned off, this operation repeats.
The thermal shutdown circuit operates when the switch is on (EN,/EN signal is active).
3. Over-Current Detection (OCD)
The over-current detection circuit limits current (ISC) and outputs fault flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. There are three types of response against over-current. The over-current detection
circuit works when the switch is on (EN,/EN signal is active).
3-1. When the switch is turned on while the output is in shortcircuit status
When the switch is turned on while the output is in shortcircuit status or so, the switch gets in current limit status
soon.
3-2. When the output shortcircuits while the switch is on
When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the
over-current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out.
3-3. When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the
over-current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under-Voltage Lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.)
while the switch turns on, then UVLO shuts off the power switch. UVLO has hysteresis of a 100mV(Typ).
Under-voltage lockout circuit works when the switch is on (EN,/EN signal is active).
5. Fault Flag (/OC) Output
Fault flag output is N-MOS open drain output. At detection of over-current, thermal shutdown, low level is output.
Over-current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at
switch on, hot plug from being informed to outside.
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8/12
2011.02 - Rev.A
Technical Note
BD2232G, BD2233G
Over Current
Detection
Over Current
Load Removed
VOUT
ITH
ISC
IOUT
T/OC
V/OC
Fig.41 Over-current detection
VEN
Output Shortcircuit
VOUT
Thermal Shutdown
IOUT
V/OC
Delay
Fig.42 Over-current detection, Thermal shutdown timing (BD2232G)
V/EN
Output Shortcircuit
VOUT
Thermal Shutdown
IOUT
V/OC
Delay
Fig.43 Over-current detection, Thermal shutdown timing (BD2233G)
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9/12
2011.02 - Rev.A
Technical Note
BD2232G, BD2233G
●Typical Application Circuit
5V (Typ.)
10kΩ~
100kΩ
Ferrite
Beads
CIN
VIN
VOUT
GND
Controller
EN(/EN)
CL
+
-
/OC
Fig.44 Typical application circuit
●Application Information
When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC,
and may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor CIN by VIN terminal
and GND terminal of IC. 1μF or higher is recommended. In order to decrease voltage fluctuations of power source line to IC,
connect a low ESR capacitor in parallel with CIN. 10μF ~ 100μF or higher is effective.
Pull up /OC output by resistance 10kΩ ~ 100kΩ.
Set up value which satisfies the application as CL and Ferrite Beads.
This system connection diagram doesn’t guarantee operating as the application.
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external
components including static and transitional characteristics as well as dispersion of the IC.
●Power Dissipation Characteristic
(SSOP5 package)
700
POWER DISSIPATION : Pd [mW]
600
500
400
300
200
100
0
0
25
50
75 85
100
AMBIENT TEMPERATURE : Ta [℃]
125
150
* 70mm x 70mm x 1.6mm Glass Epoxy Board
Fig.45 Power Dissipation Curve (Pd-Ta Curve)
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10/12
2011.02 - Rev.A
Technical Note
BD2232G, BD2233G
●Notes for use
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s
power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be
used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a
switch OFF. The thermal shutdown circuit is aimed at isolating the LSI from thermal runaway as much as possible. Do not
continuously use the LSI with this circuit operating or use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual
states of use.
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11/12
2011.02 - Rev.A
Technical Note
BD2232G, BD2233G
●Ordering part number
B
D
2
Part No.
2
3
2
G
Part No.
2232
2233
-
Package
G: SSOP5
T
R
Packaging and forming specification
TR: Embossed tape and reel
SSOP5
5
4
1
2
0.2Min.
+0.2
1.6 −0.1
2.8±0.2
<Tape and Reel information>
+6°
4° −4°
2.9±0.2
3
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
+0.05
0.13 −0.03
1.25Max.
)
0.05±0.05
1.1±0.05
S
+0.05
0.42 −0.04
0.95
0.1
S
Direction of feed
Reel
(Unit : mm)
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© 2011 ROHM Co., Ltd. All rights reserved.
12/12
∗ Order quantity needs to be multiple of the minimum quantity.
2011.02 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
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The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
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More detail product informations and catalogs are available, please contact us.
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http://www.rohm.com/contact/
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© 2011 ROHM Co., Ltd. All rights reserved.
R1120A