PHILIPS BLF276

DISCRETE SEMICONDUCTORS
DATA SHEET
BLF276
VHF power MOS transistor
Product specification
December 1997
Philips Semiconductors
Product specification
VHF power MOS transistor
FEATURES
BLF276
PIN CONFIGURATION
• High power gain
• Easy power control
• Good thermal stability
DESCRIPTION
Silicon N-channel enhancement
mode vertical D-MOS transistor
designed for large signal amplifier
applications in the VHF frequency
range. The transistor delivers an
output power of 100 W in class-B
operation at a supply voltage of 50 V.
page
1
2
3
4
d
g
MBB072
5
Top view
MSA308
Fig.1 Simplified outline and symbol.
The transistor is encapsulated in a
6-lead, SOT119 pill-package
envelope, with a ceramic cap.
PINNING - SOT119D3
PIN
s
6
CAUTION
The device is supplied in an antistatic package. The gate-source input must
be protected against static charge during transport and handling.
DESCRIPTION
WARNING
1
source
2
source
Product and environmental safety - toxic materials
3
gate
4
drain
5
source
6
source
This product contains beryllium oxide. The product is entirely safe provided
that the BeO disc is not damaged. All persons who handle, use or dispose of
this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to
the regulations applying at the location of the user. It must never be thrown
out with the general or domestic waste.
QUICK REFERENCE DATA
RF performance at Tmb = 25 °C in a common source test circuit.
MODE OF OPERATION
CW, class-B
December 1997
f
(MHz)
VDS
(V)
PL
(W)
GP
(dB)
ηD
(%)
225
50
100
≥ 13
≥ 50
108
50
100
≥ 18
≥ 60
2
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF276
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDS
drain-source voltage
−
110
V
±VGS
gate-source voltage
−
20
V
ID
DC drain current
−
9
A
Ptot
total power dissipation
−
150
W
Tstg
storage temperature
−65
150
°C
Tj
junction temperature
−
200
°C
up to Tmb = 25 °C
THERMAL RESISTANCE
SYMBOL
PARAMETER
CONDITIONS
thermal resistance from junction to
mounting base
Rth j-mb
Ptot = 150 W; Tmb = 25 °C
240
handbook,
halfpage
handbook, halfpage
ID
(A)
max. 1.17 K/W
MRA943
MRA936
10
THERMAL RESISTANCE
Ptot
(W)
200
(1)
(2)
(2)
160
(1)
120
1
80
40
10−1
0
1
10
102
VDS (V)
103
0
(1) Current is this area may be limited by RDS(on).
(2) Tmb = 25 °C.
40
60
80
100
120 140
Tmb (°C)
(1) Continuous operation.
(2) Short-time operation during mismatch.
Fig.2 DC SOAR.
December 1997
20
Fig.3 Power/temperature derating curves.
3
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF276
CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
VGS = 0; ID = 30 mA
110
−
−
V
V(BR)DSS
drain-source breakdown voltage
IDSS
drain-source leakage current
VGS = 0; VDS = 50 V
−
−
1
mA
IGSS
gate-source leakage current
±VGS = 20 V; VDS = 0
−
−
1
µA
VGS(th)
gate-source threshold voltage
ID = 50 mA; VDS = 10 V
2
−
4.5
V
gfs
forward transconductance
ID = 3 A; VDS = 10 V
2.7
−
−
S
RDS(on)
drain-source on-state resistance
ID = 3 A; VGS = 10 V
−
0.4
0.6
Ω
IDSX
on-state drain current
VGS = 10 V; VDS = 10 V
8
12
−
A
Cis
input capacitance
VGS = 0; VDS = 50 V; f = 1 MHz
−
240
−
pF
Cos
output capacitance
VGS = 0; VDS = 50 V; f = 1 MHz
−
95
−
pF
Crs
feedback capacitance
VGS = 0; VDS = 50 V; f = 1 MHz
−
7
−
pF
MRA945
MRA940
handbook,16
halfpage
0
handbook, halfpage
TC
(mV/K)
ID
(A)
−1
12
−2
8
−3
4
−4
−5
10−2
0
10−1
1
ID (A)
0
10
2
VDS = 10 V.
VDS = 10 V.
Fig.4
Fig.5
Temperature coefficient of gate-source
voltage as a function of drain current, typical
values.
December 1997
4
4
6
8
10
12
14
VGS (V)
Drain current as a function of gate-source
voltage, typical values.
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF276
MRA944
1
MRA934
handbook,600
halfpage
handbook, halfpage
C
(pF)
RDS (on)
(Ω)
0.8
500
400
0.6
300
Cis
0.4
200
0.2
Cos
100
0
0
0
20
40
60
80
100
0
120 140
Tj (°C)
10
ID = 3 A; VGS = 10 V.
VGS = 0; f = 1 MHz.
Fig.6
Fig.7
Drain-source on-state resistance as a
function of junction temperature, typical
values.
MRA935
handbook, 50
halfpage
Crs
(pF)
40
30
20
10
0
0
10
20
30
40
50
VDS (V)
VGS = 0; f = 1 MHz.
Fig.8
Feedback capacitance as a function of
drain-source voltage, typical values.
December 1997
5
20
30
40
50
VDS (V)
Input and output capacitance as functions
of drain-source voltage, typical values.
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF276
APPLICATION INFORMATION FOR CLASS-B OPERATION
Tmb = 25 °C unless otherwise specified.
RF performance in CW operation in a common source class-B circuit.
MODE OF OPERATION
f
(MHz)
VDS
(V)
IDQ
(mA)
PL
(W)
GP
(dB)
ηD
(%)
225
50
50
100
≥ 13
typ. 15
≥ 50
typ. 57
108
50
50
100
≥ 18
typ. 22
≥ 60
typ. 75
CW, class-B
Ruggedness in class-B operation
The BLF276 is capable of withstanding a load mismatch
corresponding to VSWR = 8 through all phases under the
following conditions:
VDS = 50 V; f = 225 MHz;
Tmb = 25 °C at rated load power.
MRA937
20 halfpage
handbook,
100
MRA942
140
handbook,
P halfpage
η
gain
(dB)
L
(W)
120
(%)
gain
80
16
100
12
60
η
80
60
40
8
40
20
20
4
0
0
0
20
40
60
80
100
0
0
120
140
PL (W)
2
4
6
PIN (W)
8
Class-B operation; VDS = 50 V; IDQ = 50 mA;
f = 225 MHz.
Class-B operation; VDS = 50 V; IDQ = 50 mA;
f = 225 MHz.
Fig.9
Fig.10 Load power as a function of input power,
typical values.
Power gain and efficiency as functions of
load power, typical values.
December 1997
6
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF276
handbook, full pagewidth
C15
C17
L14
C2
50 Ω
input
C4
C1
C6
DUT
L7
L4
L11
L13
L12
L1
L2
C3
L3
L5
C5
L6
L9 L10
L8
L15
C16
L16
L18
L19
L20
C18
C10
MEA808
C7
R4
C11
C8
L21
C12
C9
C13
R2
R3
C14
+VDD
f = 225 MHz.
Fig.11 Test circuit for class-B operation.
December 1997
50 Ω
output
C19
L17
7
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF276
List of components (class-B test circuit)
COMPONENT
DESCRIPTION
VALUE
C1, C9, C19
multilayer ceramic chip capacitor
(note 1)
680 pF, 500 V
C2
multilayer ceramic chip capacitor
(note 1)
15 pF, 500 V
DIMENSIONS
CATALOGUE NO.
C3, C5, C16, C18
film dielectric trimmer
4 to 40 pF
C4
multilayer ceramic chip capacitor
(note 1)
13 pF, 500 V
C6, C7
multilayer ceramic chip capacitor
(note 1)
62 pF, 500 V
C8, C14
multilayer ceramic chip capacitor
100 nF
C10
multilayer ceramic chip capacitor
(note 1)
100 pF, 500 V
C11
foil capacitor
100 nF, 100 V
C12
multilayer ceramic chip capacitor
10 nF
2222 852 47103
C13
electrolytic capacitor
10 µF, 63 V
2222 030 38109
C15
multilayer ceramic chip capacitor
(note 2)
2 × 33 pF
in parallel,
500 V
C17
multilayer ceramic chip capacitor
(note 1)
18 pF, 500 V
L1
stripline (note 3)
49 Ω
length 8 mm
width 4 mm
L2
stripline (note 3)
49 Ω
length 12 mm
width 4 mm
L3
stripline (note 3)
49 Ω
length 7.5 mm
width 4 mm
L4
2 turns enamelled 1.5 mm copper
wire
18 nH
length 4.2 mm
int. dia. 4 mm
leads 2 × 1 mm
L5
stripline (note 3)
49 Ω
length 15.5 mm
width 4 mm
L6
stripline (note 3)
49 Ω
length 5 mm
width 4 mm
L7
2 turns enamelled 1.5 mm copper
wire
16 nH
length 3.3 mm
int. dia. 3 mm
leads 2 × 4 mm
L8
stripline (note 3)
31 Ω
length 6 mm
width 6 mm
L9
stripline (note 3)
31 Ω
length 9.5 mm
width 6 mm
L10, L11
stripline (note 3)
31 Ω
length 10 mm
width 6 mm
December 1997
8
2222 809 08002
2222 852 47104
2222 368 21204
Philips Semiconductors
Product specification
VHF power MOS transistor
COMPONENT
BLF276
DESCRIPTION
VALUE
DIMENSIONS
CATALOGUE NO.
L12
3 turns enamelled 1.5 mm copper
wire
50 nH
length 4.8 mm
int. dia. 5 mm
leads 2 × 4 mm
L13
stripline (note 3)
31 Ω
length 5 mm
width 6 mm
L14
1 turn enamelled 1.5 mm copper
wire
L15
stripline (note 3)
36 Ω
length 16.5 mm
width 5 mm
L16
stripline (note 3)
36 Ω
length 8 mm
width 5 mm
L17
2 turns enamelled 1.5 mm copper
wire
17 nH
length 4.7 mm
int. dia. 4 mm
leads 2 × 2 mm
L18
stripline (note 3)
36 Ω
length 17.5 mm
width 5 mm
L19, L20
stripline (note 3)
36 Ω
length 8.5 mm
width 5 mm
L21
grade 3B Ferroxcube wide-band RF
choke
R1
1 W metal film resistor
9.09 Ω
R2
10 turns potentiometer
50 kΩ
R3
0.4 W metal film resistor
400 kΩ
2322 151 74024
R4
0.4 W metal film resistor
10 Ω
2322 151 11009
int. dia. 2.8 mm
leads 2 × 1 mm
4312 020 36642
2222 153 59098
Notes
1. American Technical Ceramics (ATC) capacitor, type 100B or other capacitor of the same quality.
2. American Technical Ceramics (ATC) capacitor, type 175B or other capacitor of the same quality.
3. The striplines are on a double copper-clad printed circuit board, with epoxy fibre-glass PTFE dielectric (εr = 4.5);
thickness 1⁄16 inch.
December 1997
9
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF276
R2
handbook, full pagewidth
R3
L20
C2
C1
L1 L2 L3
C4
L4
L6
L7
L5
C3
C10
C8
C9
C6
R1
R4
L8
C13
C14
C11
L12 L15 C15 L17
L9
C5
C12
L14
L13
C7
L10
L11
C15
C16
C17
C19
L18 L19 L20
L16
C18
MEA810
191 mm
handbook, full pagewidth
mounting
screws
(8x)
strap
rivets
(18x)
strap
70 mm
strap
strap
MEA809
The circuit and components are situated on one side of the printed circuit board, the other side being fully
metallized, to serve as a ground plane. Earth connections are made by means of copper straps and hollow rivets
between the upper and lower sheets.
Fig.12 Component layout for 225 MHz class-B test circuit.
December 1997
10
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF276
MRA939
MRA941
handbook, 16
halfpage
8
handbook, halfpage
Zi
(Ω)
ZL
(Ω)
6
12
4
RL
ri
2
8
0
XL
xi
−2
4
−4
−6
0
50
100
0
200
250
f (MHz)
150
0
50
100
150
200
250
f (MHz)
Class-B operation; VDS = 50 V; IDQ = 50 mA;
RGS = 9.1 Ω; PL = 100 W.
Class-B operation; VDS = 50 V; IDQ = 50 mA;
RGS = 9.1 Ω; PL = 100 W.
Fig.13 Input impedance as a function of frequency
(series components), typical values.
Fig.14 Load impedance as a function of frequency
(series components), typical values.
MRA938
handbook, 30
halfpage
gain
(dB)
20
handbook, halfpage
10
Zi
ZL
MBA379
0
0
50
100
150
200
250
f (MHz)
Class-B operation; VDS = 50 V; IDQ = 50 mA;
RGS = 9.1 Ω; PL = 100 W.
Fig.15 Definition of MOS impedance.
December 1997
Fig.16 Power gain as a function of frequency,
typical values.
11
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF276
PACKAGE OUTLINE
Flangeless ceramic package; 6 leads
SOT119D
D
A
A
D1
w2 M A
H1
b2
c
2
4
6
1
3
5
H
b1
Q
w3 M
b
e
0
5
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT
A
b
b1
b2
c
mm
4.53
3.70
5.59
5.33
5.34
5.08
4.07
3.81
0.16
0.10
D1
e
Q
w2
w3
1.71
1.44
0.51
0.26
inches 0.178 0.220 0.210 0.160 0.006 0.506 0.505 0.255 0.865 0.730 0.067
0.146 0.210 0.200 0.150 0.004 0.496 0.495
0.835 0.720 0.057
0.02
0.01
OUTLINE
VERSION
D
12.86 12.83
12.59 12.57
6.48
H
H1
21.97 18.55
21.20 18.28
REFERENCES
IEC
JEDEC
EIAJ
SOT119D
December 1997
EUROPEAN
PROJECTION
ISSUE DATE
97-06-28
12
Philips Semiconductors
Product specification
VHF power MOS transistor
BLF276
DEFINITIONS
Data Sheet Status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
December 1997
13